JP2014098593A - Dimensional measuring apparatus for metal sheets, and dimensional measuring method for metal sheets - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dimensional measuring apparatus for metal sheets and a dimensional measuring method for metal sheets that can accurately measure dimensions of metal sheets.SOLUTION: A dimensional measuring apparatus for metal sheets comprises a mounting plate 21 on which a metal sheet is mounted, a pair of holding mechanisms 22a and 22b that hold each pair of opposing edges of the metal sheet mounted on the mounting plate, a tension mechanism 23 that gives tensile force to the metal sheet by expanding the mutual distance between the holding mechanisms 22a and 22b, a guide member that guides the mounted posture of the metal sheet on the mounting plate in the direction of the tensile force given by the tension mechanism on the basis of a desired tensile direction of the metal sheet, an adsorbing mechanism that causes the metal sheet in the state of being subjected to the tensile force to be adsorbed to the mounting plate 21, and a measuring mechanism 13 that measures at least one dimension of the metal sheet in the state of being adsorbed to the mounting plate 21.

Description

  The present invention relates to a metal thin plate dimension measuring apparatus and a metal thin plate dimension measuring method.

  For example, a metal mask used for a deposition mask for organic EL (Electro Luminescence), etc. is formed by etching (drilling) a desired pattern on a metal thin plate having a thickness of several tens to several hundreds of μm. It is produced by. The metal mask is welded to a rigid frame in a stretched state for easy handling.

  In order to reduce work defects when welding the metal mask to the frame, various dimensions of the metal mask, such as the outer dimensions, the dimensions of the openings, the pitch interval of the openings, etc. are measured using a dimension measuring device. Yes.

  For example, Patent Document 1 (Japanese Patent Laid-Open No. 2011-237394) discloses a conventional example of such a dimension measuring method. This dimension measuring method relates to a method for correcting a measured value by a two-dimensional length measuring machine.

JP 2011-237394 A

  However, in the dimension measurement method of Patent Document 1, when the metal thin plate is curved or lifted when placed on the placement plate, the variation in the measured value becomes too large and sufficient correction is made. Cannot be realized, and the measurement error is too large.

  The present invention has been made in view of the above points, and provides a metal thin plate dimension measuring apparatus and a metal thin plate dimension measuring method capable of accurately measuring the metal thin plate dimensions. Objective.

  The present invention includes a mounting plate on which the metal thin plate is mounted, and a pair of holding mechanisms configured to hold the respective edge regions facing each other of the metal thin plate mounted on the mounting plate, Based on a desired tensile direction of the thin metal sheet, a tensile mechanism configured to apply a tensile force to the thin metal sheet by increasing the distance between the pair of holding mechanisms relative to each other. A guide member configured to guide the mounting posture of the thin metal plate on the mounting plate with respect to a direction, and the thin metal plate in a state where the tensile force is applied are attracted to the mounting plate. An apparatus for measuring a size of a thin metal plate, comprising: a suction mechanism, and a measurement mechanism for measuring at least one dimension of the thin metal plate that is adsorbed to the mounting plate.

  According to the present invention, at least one dimension is measured in a state where the metal thin plate is held by the pair of holding mechanisms and pulled by the pulling mechanism. Therefore, even if the metal thin plate is curved or lifted when placed on the mounting plate, the dimension of the metal thin plate is measured in a state where such deformation state is removed or relaxed, Measurement accuracy is improved. Moreover, even if a disturbance (vibration, wind) occurs around the dimension measuring device, the movement of the metal thin plate is suppressed, and this also improves the measurement accuracy. Furthermore, since the placement posture of the metal thin plate on the placement plate with respect to the direction of the tensile force by the tension mechanism is guided based on the desired tensile direction of the metal thin plate, the tensile force is applied in an appropriate direction with respect to the metal thin plate. Can be given.

  Preferably, the guide member includes a guide pin that contacts an edge region on one side of the metal thin plate on the placement plate, and the guide pin depends on a desired tension direction of the metal thin plate and the tension mechanism. It is movable so that the direction of the tensile force matches. In this case, the mounting posture of the metal thin plate on the mounting plate can be easily guided.

  Preferably, the guide pin includes a plurality of pins that are independently movable. In this case, by changing the arrangement direction of the plurality of guide pins, the placement posture of the metal thin plate on the placement plate can be easily guided.

  Preferably, the measurement mechanism includes a measurement camera that captures an image of the thin metal plate that is adsorbed to the mounting plate, and an image processing device that processes the captured image. In this case, the dimension of the metal thin plate can be easily measured.

  Preferably, the suction mechanism sucks air between the thin metal plate in the state where the tensile force is applied and the mounting plate to suck the thin metal plate and the mounting plate. It has become. In this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Preferably, the adsorption mechanism is configured to electrostatically adsorb the thin metal plate and the mounting plate in a state where the tensile force is applied. Also in this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Preferably, the adsorption mechanism is configured to adsorb the thin metal plate in a state where the tensile force is applied and the mounting plate by a magnetic force. Also in this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Preferably, the mounting plate is separated into at least two mounting plate portions, and each of the pair of holding mechanisms is provided on a different mounting plate portion. In this case, when a tension is applied to the metal thin plate, the mounting plate and the metal thin plate are prevented from sliding with each other in the vicinity of the holding mechanism to which the tension is applied, so that a local stress is generated on the metal thin plate. Is suppressed, and the measurement accuracy is improved.

  Alternatively, according to the present invention, each pair holds a plurality of mounting plates on which the metal thin plates are mounted, and each edge region of the metal thin plates that are mounted on the mounting plate. A plurality of pairs of holding mechanisms, a plurality of tensioning mechanisms adapted to apply a tensile force to the metal sheet by increasing the distance of each pair of holding mechanisms relative to each other, and a desired tension direction of the sheet metal Based on a guide member adapted to guide the mounting posture of the thin metal plate on the plurality of mounting plates with respect to the direction of the tensile force by the plurality of pulling mechanisms, and in a state where the tensile force is applied. A plurality of adsorption mechanisms configured to adsorb the metal thin plates to the plurality of mounting plates; and a measurement mechanism for measuring at least one dimension of the metal thin plates in a state of being adsorbed to the plurality of mounting plates; With the features A dimension measuring apparatus that the sheet metal.

  According to the present invention, since a tensile force is given to the metal thin plate two-dimensionally (planarly), the deformation state of the metal thin plate is two-dimensionally removed or relaxed, and the measurement accuracy is further improved.

  Alternatively, the present invention provides a guide member that guides the mounting posture of the thin metal plate on the mounting plate based on the step of determining a desired tensile direction of the thin metal plate and the desired tensile direction of the thin metal plate. Positioning the metal thin plate on the mounting plate according to the guide by the guide member, and opposing edges of the metal thin plate mounted on the mounting plate by a pair of holding mechanisms A region holding step, a step of applying a tensile force to the metal thin plate by increasing a distance between the pair of holding mechanisms in a state where the metal thin plate is held by the tension mechanism, and a suction mechanism to reduce the tensile force. A step of adsorbing the metal thin plate in a given state to the mounting plate, and measuring at least one dimension of the metal thin plate in a state of being adsorbed to the mounting plate by a measurement mechanism; A dimension measuring method for sheet metal, characterized in that it comprises a step.

  According to the present invention, the metal thin plate is held by the pair of holding mechanisms and is attracted to the mounting plate while being pulled by the pulling mechanism, and at least one dimension is measured while being attracted to the mounting plate. Therefore, even when the metal thin plate is curved or lifted when placed on the mounting plate, the dimension of the metal thin plate can be measured in a state where such deformation state is removed or relaxed. Accuracy is improved. Moreover, even if disturbance (vibration, wind) occurs around the thin metal plate whose dimensions are to be measured, the movement of the thin metal plate is suppressed, and this also improves the measurement accuracy. Furthermore, in order to guide the mounting posture of the metal thin plate on the mounting plate with respect to the direction of the tensile force by the tension mechanism based on the desired tensile direction of the metal thin plate, a tensile force is applied to the metal thin plate in an appropriate direction. be able to.

  Preferably, the guide member includes a guide pin that contacts an edge region on one side of the thin metal plate on the placement plate, and the positioning step includes a desired pulling direction of the thin metal plate and the pulling mechanism. And a step of moving the guide pin so that the direction of the tensile force by is aligned. In this case, the mounting posture of the metal thin plate on the mounting plate can be easily guided.

  Preferably, the step of measuring includes a step of taking an image of the thin metal plate adsorbed on the mounting plate and a step of processing the taken image. In this case, the dimension of the metal thin plate can be easily measured.

  Preferably, the dimension measuring method according to the present invention further includes a step of reducing a tensile force applied to the metal thin plate by the tension mechanism after the step of adsorbing the metal thin plate to the mounting plate. . In this case, the tensile force applied via the pair of holding mechanisms for removing or alleviating the deformation state and the tensile force applied via the pair of holding mechanisms for the subsequent dimension measurement are independent of each other. Therefore, the measurement accuracy is improved.

  Preferably, in the step of adsorbing the metal thin plate to the mounting plate, the air between the metal thin plate in a state where the tensile force is applied and the mounting plate is sucked, and the metal thin plate and Adhere the mounting plate. In this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Alternatively, the present invention provides a step of determining a desired tensile direction of the thin metal plate and guides the placement posture of the thin metal plate on a plurality of placement plates based on the desired tensile direction of the thin metal plate. A step of positioning a member, a step of placing the metal thin plate on the plurality of placement plates according to guidance by the guide member, and a plurality of pairs of holding mechanisms placed on the plurality of placement plates. The step of holding the opposing edge regions of the thin metal plate, and the thin metal plate by extending the distance of each pair of the plurality of pairs of holding mechanisms in a state of holding the thin metal plate by a plurality of tension mechanisms A step of applying a tensile force to the metal, a step of adsorbing the metal thin plate in a state where the tensile force is applied to the plurality of mounting plates, and the metal in a state of being adsorbed to the plurality of mounting plates by a measurement mechanism A dimension measuring method for sheet metal, characterized in that it comprises the steps of measuring at least one dimension of the plate, the.

  According to the present invention, since the tensile force is applied to the metal thin plate two-dimensionally (planar), the deformation state of the metal thin plate is removed or relaxed two-dimensionally, and the measurement accuracy is further improved.

  Preferably, the dimension measuring method according to the present invention further includes a step of reducing a tensile force applied to the metal thin plate by the plurality of tension mechanisms after the step of adsorbing the metal thin plate to the plurality of mounting plates. ing. In this case, the tensile force applied via the pair of holding mechanisms for removing or alleviating the deformation state and the tensile force applied via the pair of holding mechanisms for the subsequent dimension measurement are independent of each other. Therefore, the measurement accuracy is improved.

  Alternatively, the present invention provides a pair of holding mechanisms configured to hold the mounting plate on which the metal thin plate is mounted and the respective edge regions of the metal thin plate mounted on the mounting plate. And a tension mechanism configured to apply a tensile force to the metal thin plate by increasing a distance between the pair of holding mechanisms relative to each other, and a desired tension direction of the metal thin plate. A position changing mechanism configured to change the position of the pair of holding mechanisms with respect to the mounting posture of the thin metal plate, and the placement plate to attract the thin metal plate to which the tensile force is applied. An apparatus for measuring a size of a thin metal plate, comprising: a suction mechanism configured as described above; and a measurement mechanism that measures at least one dimension of the thin metal plate in a state of being sucked by the mounting plate.

  According to the present invention, at least one dimension is measured in a state where the metal thin plate is held by the pair of holding mechanisms and pulled by the pulling mechanism. Therefore, even if the metal thin plate is curved or lifted when placed on the mounting plate, the dimension of the metal thin plate is measured in a state where such deformation state is removed or relaxed, Measurement accuracy is improved. Moreover, even if a disturbance (vibration, wind) occurs around the dimension measuring device, the movement of the metal thin plate is suppressed, and this also improves the measurement accuracy. Furthermore, in order to change the position of the pair of holding mechanisms with respect to the mounting posture of the metal thin plate on the mounting plate based on the desired tensile direction of the metal thin plate, a tensile force is applied to the metal thin plate in an appropriate direction. Can do.

  Preferably, the position changing mechanism rotates each holding mechanism around a predetermined rotation center. In this case, it is easy to match the direction of the pulling force by the pulling mechanism with a desired pulling direction.

  Preferably, the position changing mechanism is configured to translate the pair of holding mechanisms relative to each other. Also in this case, it is easy to align the direction of the tensile force by the tension mechanism with a desired tension direction.

  Preferably, the measurement mechanism includes a measurement camera that captures an image of the thin metal plate that is adsorbed to the mounting plate, and an image processing device that processes the captured image. In this case, the dimension of the metal thin plate can be easily measured.

  Preferably, the suction mechanism sucks air between the thin metal plate in the state where the tensile force is applied and the mounting plate to suck the thin metal plate and the mounting plate. It has become. In this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Preferably, the adsorption mechanism is configured to electrostatically adsorb the thin metal plate and the mounting plate in a state where the tensile force is applied. Also in this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Preferably, the adsorption mechanism is configured to adsorb the thin metal plate in a state where the tensile force is applied and the mounting plate by a magnetic force. Also in this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Preferably, the mounting plate is separated into at least two mounting plate portions, and each of the pair of holding mechanisms is provided on a different mounting plate portion. In this case, when a tension is applied to the metal thin plate, the mounting plate and the metal thin plate are prevented from sliding with each other in the vicinity of the holding mechanism to which the tension is applied, so that a local stress is generated on the metal thin plate. Is suppressed, and the measurement accuracy is improved.

  Alternatively, according to the present invention, each pair holds a plurality of mounting plates on which the metal thin plates are mounted, and each edge region of the metal thin plates that are mounted on the mounting plate. A plurality of pairs of holding mechanisms, a plurality of tensioning mechanisms adapted to apply a tensile force to the metal sheet by increasing the distance of each pair of holding mechanisms relative to each other, and a desired tension direction of the sheet metal Based on a plurality of position change mechanisms adapted to change the position of each pair of holding mechanisms with respect to the mounting posture of the metal thin plate on the plurality of mounting plates; A plurality of adsorption mechanisms configured to adsorb the metal thin plates to the plurality of mounting plates; and a measurement mechanism for measuring at least one dimension of the metal thin plates in a state of being adsorbed to the plurality of mounting plates; , Characterized by having gold Is the dimension measuring device of the thin plate.

  According to the present invention, since a tensile force is given to the metal thin plate two-dimensionally (planarly), the deformation state of the metal thin plate is two-dimensionally removed or relaxed, and the measurement accuracy is further improved.

  Alternatively, the present invention provides a step of determining a desired tensile direction of the thin metal plate, a step of placing the thin metal plate on the placement plate, and the thin metal plate placed on the placement plate by a pair of holding mechanisms. Holding the opposing edge regions, applying a tensile force to the metal sheet by increasing the distance between the pair of holding mechanisms in a state where the metal sheet is held by a tension mechanism, and suction A step of adsorbing the metal thin plate in a state where the tensile force is given by a mechanism to the mounting plate, and a step of measuring at least one dimension of the metal thin plate in a state of being adsorbed to the mounting plate by a measuring mechanism The pair of holding machines with respect to the mounting posture of the thin metal plate on the mounting plate based on a desired tensile direction of the thin metal plate before the step of holding the thin metal plate A dimension measuring method for sheet metal, characterized in that it includes a step of changing the position.

  According to the present invention, the metal thin plate is held by the pair of holding mechanisms and is attracted to the mounting plate while being pulled by the pulling mechanism, and at least one dimension is measured while being attracted to the mounting plate. Therefore, even when the metal thin plate is curved or lifted when placed on the mounting plate, the dimension of the metal thin plate can be measured in a state where such deformation state is removed or relaxed. Accuracy is improved. Moreover, even if disturbance (vibration, wind) occurs around the thin metal plate whose dimensions are to be measured, the movement of the thin metal plate is suppressed, and this also improves the measurement accuracy. Furthermore, in order to change the position of the pair of holding mechanisms with respect to the mounting posture of the metal thin plate on the mounting plate based on the desired tensile direction of the metal thin plate, a tensile force is applied to the metal thin plate in an appropriate direction. Can do.

  Preferably, the step of measuring includes a step of capturing an image of the thin metal plate that is adsorbed to the mounting plate, and a step of processing the captured image. In this case, the dimension of the metal thin plate can be easily measured.

  Preferably, the dimension measuring method according to the present invention further includes a step of reducing a tensile force applied to the metal thin plate by the tension mechanism after the step of adsorbing the metal thin plate to the mounting plate. . In this case, the tensile force applied via the pair of holding mechanisms for removing or alleviating the deformation state and the tensile force applied via the pair of holding mechanisms for the subsequent dimension measurement are independent of each other. Therefore, the measurement accuracy is improved.

  Preferably, in the step of adsorbing the metal thin plate to the mounting plate, the air between the metal thin plate in a state where the tensile force is applied and the mounting plate is sucked, and the metal thin plate and Adhere the mounting plate. In this case, the metal thin plate can be easily adsorbed to the mounting plate.

  Alternatively, the present invention includes a step of determining a desired tensile direction of the thin metal plate, a step of placing the thin metal plate on a plurality of placement plates, and a pair of holding mechanisms. A step of holding the opposing edge regions of the placed thin metal plate, and a step of extending the distance of each pair of the plurality of pairs of holding mechanisms in a state of holding the thin metal plate by a plurality of pulling mechanisms. A step of applying a tensile force to the metal thin plate, a step of adsorbing the metal thin plate in a state where the tensile force is applied to the plurality of mounting plates, and a state of being adsorbed to the plurality of mounting plates by a measurement mechanism Measuring at least one dimension of the thin metal plate, and before the step of holding the thin metal plate, based on a desired tensile direction of the thin metal plate, Loading metal sheets A dimension measuring method for sheet metal, characterized in that it includes a step of changing the positions of the pair of holding mechanisms for attitude.

  According to the present invention, since the tensile force is applied to the metal thin plate two-dimensionally (planar), the deformation state of the metal thin plate is removed or relaxed two-dimensionally, and the measurement accuracy is further improved.

  Preferably, the dimension measuring method according to the present invention further includes a step of reducing a tensile force applied to the metal thin plate by the plurality of tension mechanisms after the step of adsorbing the metal thin plate to the plurality of mounting plates. ing. In this case, the tensile force applied via the pair of holding mechanisms for removing or alleviating the deformation state and the tensile force applied via the pair of holding mechanisms for the subsequent dimension measurement are independent of each other. Therefore, the measurement accuracy is improved.

  According to the present invention, at least one dimension is measured in a state where the metal thin plate is held by the pair of holding mechanisms and pulled by the pulling mechanism. Therefore, even if the metal thin plate is curved or lifted when placed on the mounting plate, the dimension of the metal thin plate is measured in a state where such deformation state is removed or relaxed, Measurement accuracy is improved. Moreover, even if a disturbance (vibration, wind) occurs around the dimension measuring device, the movement of the metal thin plate is suppressed, and this also improves the measurement accuracy. Furthermore, since the placement posture of the metal thin plate on the placement plate with respect to the direction of the tensile force by the tension mechanism is guided based on the desired tensile direction of the metal thin plate, the tensile force is applied in an appropriate direction with respect to the metal thin plate. Can be given.

FIG. 1 is a perspective view schematically showing a dimension measuring apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic diagram for explaining an example of the dimension of the thin metal plate measured by the dimension measuring apparatus. FIG. 3 is a schematic diagram for explaining an example of the dimension of the thin metal plate measured by the dimension measuring apparatus. FIG. 4 is a plan view schematically showing a mounting plate, a holding mechanism, and a tension mechanism in the dimension measuring apparatus according to the first embodiment of the present invention. FIG. 5 is a side view schematically showing the mounting plate and the suction mechanism in the dimension measuring apparatus according to the first embodiment of the present invention. FIG. 6 is a side view schematically showing a holding mechanism in the dimension measuring apparatus according to the first embodiment of the present invention. 7A and 7B are diagrams schematically showing a tension mechanism in the dimension measuring apparatus according to the first embodiment of the present invention, in which FIG. 7A shows a state before a tensile force is applied, and FIG. The state when power is applied is shown. FIG. 8 is a diagram schematically showing a guide member in the dimension measuring apparatus according to the first embodiment of the present invention, in which (a) is a plan view showing how the guide pin is moved; ) Shows how to move the guide pin in a side view. FIG. 9 is a schematic diagram for explaining an example of a desired tensile direction of the metal thin plate. FIG. 10 is a schematic diagram for explaining the mounting posture of the metal thin plate on the mounting plate so that the desired tensile direction of the thin metal plate shown in FIG. 9 matches the direction of the tensile force by the tension mechanism. is there. FIG. 11 is a schematic diagram for explaining an example of the direction of the tensile force by the tension mechanism. FIG. 12 is a diagram for explaining a method of detecting the direction of the tensile force by the tension mechanism, in which the tension mechanism before the air cylinder extends is shown by a solid line, and the tension after the air cylinder extends. The mechanism is indicated by a two-dot chain line. FIG. 13 is a plan view schematically showing a placement plate, a holding mechanism, and a tension mechanism in the dimension measuring apparatus according to the second embodiment of the present invention. FIG. 14 is a plan view schematically showing a placement plate, a holding mechanism, and a tension mechanism in a dimension measuring apparatus according to the third embodiment of the present invention. FIG. 15 is a plan view schematically showing a mounting plate, a holding mechanism, and a tension mechanism in a dimension measuring apparatus according to a fourth embodiment of the present invention, in which FIG. The state before the position of the tension mechanism is changed is shown, and (b) shows the state when the positions of the holding mechanism and the tension mechanism are changed. FIG. 16 is a side view schematically showing a position changing mechanism in the dimension measuring apparatus according to the fourth embodiment of the present invention. FIG. 17 is a plan view schematically showing a mounting plate, a holding mechanism, and a tension mechanism in a dimension measuring apparatus according to a fifth embodiment of the present invention, in which FIG. The state before the position of the tension mechanism is changed is shown, and (b) shows the state when the positions of the holding mechanism and the tension mechanism are changed.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view schematically showing an example of a dimension measuring apparatus according to an embodiment of the present invention. As shown in FIG. 1, the dimension measuring apparatus 11 according to the present embodiment is configured so that the mounting plate 21 on which the metal thin plate 31 is mounted and the opposing edges of the metal thin plate 31 mounted on the mounting plate 21. A pair of holding mechanisms 22a, 22b configured to hold the partial area, and a tension mechanism configured to apply a tensile force to the metal thin plate 31 by increasing the distance between the pair of holding mechanisms 22a, 22b relative to each other. 23 and guide members 80a and 80b adapted to guide the mounting posture of the metal thin plate 31 on the mounting plate 21 with respect to the direction of the tensile force by the pulling mechanism 23 based on the desired pulling direction of the metal thin plate 31. And at least one dimension of the adsorption mechanism 41 configured to adsorb the metal thin plate 31 in a state where a tensile force is applied to the mounting plate 21 and the metal thin plate 31 adsorbed to the mounting plate 21. Measurement That the measuring mechanism 13, and a. In the example of FIG. 1, seven mounting plates 21 are arranged in parallel.

  In the present embodiment, the measurement mechanism 13 includes a measurement camera 131 that captures an image of the thin metal plate 31 that is attracted to the mounting plate 21, and an image processing device 132 that processes the captured image. Have. The measurement camera 131 can move in the vertical direction, the vertical direction in the horizontal plane, and the horizontal direction on the thin metal plate 31 adsorbed by the mounting plate 21.

  The dimension of the metal thin plate 31 measured by the measurement mechanism 13 is, for example, when the metal thin plate 31 is used for producing a metal mask used for a vapor deposition mask for organic EL or the like, as shown in FIG. The width a of the metal mask production region 33 that is the region to be produced, and the horizontal width b to the vertical width c of each metal mask 34. Alternatively, as shown in FIG. 3, the width d to the vertical width e of the metal mask opening 35, the horizontal pitch interval f to the vertical pitch interval g of the metal mask opening 35, and the like. At the time of image processing, each dimension is determined (measured) by determining the center position of the measurement mark 32 attached to the thin metal plate 31.

  Further, as shown in FIG. 4, the mounting plate 21 on which the thin metal plate 31 is mounted has mounting plate edge portions 212 a, 212 a, 212b and a mounting plate central portion 211 disposed between the mounting plate edge portions 212a and 212b.

  As shown in FIGS. 4 and 5, the mounting plate central portion 211 is provided with an air suction hole 411 that penetrates the mounting plate central portion 211 from the front surface to the back surface (in the vertical direction in FIG. 5). In addition, the back surface (the lower surface in FIG. 5) of the mounting plate central portion 211 is provided between the mounting plate 21 and the metal thin plate 31 mounted on the mounting plate 21 through the air suction hole 411. An air suction part 412 for sucking air is provided.

  The air suction hole 411 and the air suction part 412 constitute the suction mechanism 41. That is, the air suction unit 412 sucks air between the mounting plate 21 and the metal thin plate 31 mounted on the mounting plate 21 through the air suction hole 411, so that the metal thin plate 31 is mounted. It is attracted to the mounting plate 21.

  In addition, the dimension measuring apparatus 11 of the present embodiment is provided with an adsorption signal detector 51 that detects a signal (adsorption signal) indicating that the metal thin plate 31 is sufficiently adsorbed to the mounting plate 21.

  The suction signal detector 51 of the present embodiment is a flow meter that is provided between the air suction hole 441 and the air suction part 412 and detects the flow rate of air flowing to the air suction part 412 via the air suction hole 411. And when the value of the air flow rate detected by the flow meter after the start of air suction by the air suction unit 412 becomes constant, it is considered that the metal thin plate 31 is sufficiently adsorbed by the mounting plate 21 An adsorption signal is detected. That is, when the suction of air between the mounting plate 21 and the metal thin plate 31 placed on the mounting plate 21 is started by the air suction unit 412, the metal thin plate 31 is gradually attracted to the mounting plate 21. The air suction hole 441 is gradually closed. Therefore, the opening rate of the air suction hole 441 gradually decreases, and thereby the flow rate of air flowing into the air suction part 412 via the air suction hole 441 also gradually decreases. After that, when the metal thin plate 31 is sufficiently adsorbed to the mounting plate 21, the opening ratio of the air suction holes 441 becomes constant, and the flow rate of air flowing into the air suction part 412 through the air suction holes 441 becomes constant. Therefore, when the value of the air flow rate detected by the flow meter becomes constant, it can be considered that the metal thin plate 31 is sufficiently adsorbed by the mounting plate 21.

  As is apparent from FIG. 4, the sides of the mounting plate edges 212a and 212b and the clamp bases 221a and 221b described later that face each other are formed in a wave shape. Thereby, even if the mounting plate edge portions 212a and 212b and the clamp bases 221a and 221b are separated from each other, the metal thin plate 31 mounted on the mounting plate 21 may hang down from the mounting plate 21. It is suppressed.

  On both sides in the longitudinal direction of the mounting plate 21, a pair of holding mechanisms 22 a and 22 b are provided so as to hold the opposite sides of the opposing metal thin plates 31 mounted on the mounting plate 21. .

  As shown in FIGS. 4 and 6, each holding mechanism 22 a, 22 b includes a clamp base 221 a, 221 b, a clamp part 222 that sandwiches the metal thin plate 31 together with the clamp bases 221 a, 221 b, and a clamp part 222. It has a pressing lever 223 that presses against the clamp bases 221a and 221b, and a washer 224 and a coil spring 225 adapted to provide pressing force to the pressing lever 223.

  The holding mechanisms 22a and 22b are slidably mounted on rails 61a and 61b provided so as to extend in the longitudinal direction of the mounting plate 21, respectively.

  Returning to FIG. 4, the tension for applying a tensile force to the metal thin plate 31 by increasing the distance of the pair of holding mechanisms 22a and 22b from each other on the side opposite to the mounting plate 21 of one holding mechanism 22a. A mechanism 23 is provided.

  Specifically, as shown in FIG. 7, the tension mechanism 23 of the present embodiment includes a tension traction portion 231 fixed to the holding mechanism 22 a and a tensile force applied to the metal thin plate 31 by the tension traction portion 231. 4, a tension traction arm 232 connected to the tension traction portion 231 via the load cell 71, and pressing the tension traction arm 232 causes the tension traction portion 231 to move to the left in FIG. And an air cylinder 233 that can move the holding mechanisms 22a and 22b apart from each other.

  The air cylinder 233 is fixed to the end of the rail 61a on the side of the tension mechanism 23, and is movable in the direction opposite to the holding mechanism 22a (the left direction in FIG. 7) when the air cylinder 233 extends. A head 234 is provided.

  The pulling and pulling arm 232 has a curved shape as shown in FIG. 4, and one end is brought into contact with the air cylinder head 234. When the air cylinder 233 extends and the air cylinder head 234 moves, the left side of FIG. To be pushed.

  The pulling / pulling part 231 is connected to the other end of the pulling / pulling arm 232 via the load cell 71, and the end of the rail 61 a on the pulling mechanism 23 side (air cylinder 233) as the air cylinder head 234 moves. The fixed portion is moved to the left side of FIG.

  The load cell 71 has one end (upper end in FIG. 4) connected to the pulling / pulling arm 232 and the other end (lower end in FIG. 4) connected to the pulling / pulling portion 231. The pulling force applied to the pulling / pulling part 231 by the pulling arm 232, and hence the pulling force applied to the metal thin plate 31 by the pulling / pulling part 231 can be detected.

  Returning to FIG. 4, in the dimension measuring apparatus 11 of the present embodiment, the other holding mechanism 22 b is held on the side opposite to the mounting plate 21 by the pair of holding mechanisms 22 a and 22 b and is pulled by the tension mechanism 23. The metal thin plate 31 to which the tensile force is applied is shaken in the longitudinal direction of the mounting plate 21 so that the tensile force applied to the metal thin plate 31 can be “familiarized” with the metal thin plate 31 (made uniform throughout). The swing mechanism 24 is provided.

  Specifically, the swing mechanism 24 of the present embodiment includes a swing traction portion 241 fixed to the holding mechanism 22b and a micrometer that can swing the swing traction portion 241 in the left-right direction in FIG. 243.

  The micrometer 243 is fixed to the rail 61b, and has a micrometer head 244 that can swing in the longitudinal direction (left and right direction in FIG. 4) of the mounting plate 21 by extending and retracting the micrometer 243. Yes.

  The swing pulling portion 241 has a curved shape as shown in FIG. 4 and is integrated with a swing pulling arm 242 that is in contact with the micrometer head 244. As the micrometer head 244 swings, Similarly, the micrometer 243 on the rail 61b is rocked from the fixed point.

  In this embodiment, the guide members 80a and 80b include guide pins 81a and 81b for guiding the mounting posture of the thin metal plate 31 on the mounting plate 21, as shown in FIG. The guide pins 81a and 81b are provided so as to protrude from the surfaces of the mounting plate edge portions 212a and 212b on the side on which the metal thin plate 31 is mounted. The guide members 80a and 80b further include cylinders 82a and 82b for moving the guide pins 81a and 81b. The cylinders 82 a and 82 b can extend in a direction parallel to the plane of the mounting plate 21 and perpendicular to the longitudinal axis of the mounting plate 21. Accordingly, the guide pins 81a and 81b can be moved along the extending direction of the cylinder 82. The positions where the guide pins 81a and 81b are provided may be other positions as long as they can guide the mounting posture of the thin metal plate 31 on the mounting plate 21, and as a method of moving the guide pins 81a and 81b, The method is not limited to using a cylinder. Furthermore, the guide pins 81a and 81b are not limited to the shape of the pins as long as they can guide the placement posture of the thin metal plate 31 on the placement plate 21.

  The dimension measuring apparatus 11 according to the present embodiment has a control mechanism 85 that determines the extension of each of the cylinders 82a and 82b. The control mechanism 85 determines the positions of the individual guide pins 81a and 81b, that is, the extent of expansion of the individual cylinders 82a and 82b, based on the desired pulling direction of the thin metal plate 31. Specifically, when the thin metal plate 31 is placed on the placement plate 21 with the edge region on one side of the thin metal plate 31 being in contact with the guide pins 81a and 81b, the control mechanism 85 is configured to The extension of the cylinders 82a and 82b is determined so that the guide pins 81a and 81b are arranged at positions where the desired tension direction of 31 and the direction of the tensile force by the tension mechanism 23 are aligned. ing.

For example, a direction as indicated by arrows in different 9 and the desired pulling direction is the longitudinal direction of the sheet metal 31 of the sheet metal 31 (the direction of extension of the center line L ₁ of the sheet metal 31), and a tensile mechanism 23 When the direction of the tensile force due to is parallel to the longitudinal direction of the mounting plate 21, the metal thin plate 31 needs to be mounted on the mounting plate 21 in a posture as shown in FIG. 10. In this case, when the metal thin plate 31 is placed on the placement plate 21 with the edge region on one side of the metal thin plate 31 being in contact with the guide pins 81a and 81b, the control mechanism 85 causes the metal thin plate 31 to move. In order to move the guide pins 81a and 81b so as to have a posture as shown in FIG. 10, the extent of extension of the cylinders 82a and 82b is determined.

Further, for example, the desired tensile direction of the thin metal plate 31 is the longitudinal direction of the thin metal plate 31, and the direction of the tensile force by the tension mechanism 23 is the longitudinal direction of the mounting plate 21 (the center line L ₂ of the mounting plate 21 extends). Even when the direction is different from the direction (direction) shown in FIG. 11, the metal thin plate 31 needs to be placed on the placement plate 21 in the posture shown in FIG. 10. Therefore, also in this case, the control mechanism 85 is configured such that when the metal thin plate 31 is placed on the placement plate 21 in a state where the edge region on one side of the metal thin plate 31 is in contact with the guide pins 81a and 81b. In order to move the guide pins 81a and 81b so that the thin plate 31 is in the posture shown in FIG. 10, the extent of extension of the cylinders 82a and 82b is determined.

In the case shown in FIG. 11, preferably, when the metal thin plate 31 is placed on the placement plate 21 with the edge region on one side of the metal thin plate 31 being in contact with the guide pins 81 a and 81 b, FIG. tensile force and the line parallel to the direction of the by the fixing portion of the center point a as tensioning mechanism 23 of the air cylinder 233 shown in 11, the center line L ₁ of the sheet metal 31, so that the match, the cylinder 82a, 82b of the Determine the size of the extension.

  In the present embodiment, the dimension measuring device 11 has input means 86 for inputting information necessary for determining a desired tensile direction of the thin metal plate 31, and the control mechanism 85 is obtained from the input means 86. Based on the obtained information, the desired tensile direction of the thin metal plate 31 is determined. Here, the information necessary for determining the desired tension direction of the thin metal plate 31 is, for example, the deformation state of the thin metal plate 31, the direction of the tensile force by the tension mechanism 23, the positions of the guide pins 81a and 81b, and the like. . Such information may be obtained by processing the image of the thin metal plate 31 or the air cylinder 233 acquired by the measurement camera 131 of the measurement mechanism 13 by the image processing device 132, or may be stored in advance in a storage device. It may be.

  When detecting the direction of the tensile force by the tensile mechanism 23 by the measurement camera 131 and the image processing device 132, for example, as shown in FIG. 12, the clamp base 221a is provided with a tensile direction detection mark 28, and the measurement is performed. The camera 131 acquires images of the tensile direction detection mark 28 before and after the air cylinder 233 is extended. The image processing device 132 detects the tensile direction detected by the measurement camera 131. The moving direction of the tensile direction detection mark before and after the air cylinder 233 is extended, that is, the direction of the tensile force by the tensile mechanism 23 is detected from the image of the mark 28 for use.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, when the thin metal plate 31 is placed on the placement plate 21, the air cylinder head 234 of the tension mechanism 23 and the tension pulling arm 232 are in contact with each other, and the micrometer head 244 of the swing mechanism 24 is The swinging traction arm 242 is in contact.

  When information necessary for determining the desired tension direction of the thin metal plate 31 is input by the input means 86, the desired tension direction of the thin metal plate 31 is determined by the control mechanism 85. Then, based on the desired pulling direction of the thin metal plate 31, the size of the extension of each of the cylinders 82a and 82b is determined.

  The cylinders 82a and 82b are extended according to the extension magnitude determined by the control mechanism 85, respectively. As a result, the guide pins 81a and 81b are formed on the metal thin plate 31 when the metal thin plate 31 is placed on the placement plate 21 with the edge region on one side of the metal thin plate 31 being in contact with the guide pins 81a and 81b. It is moved to a position where the desired tension direction of 31 and the direction of the tensile force by the tension mechanism 23 are aligned.

  And the metal thin plate 31 is mounted on the mounting plate 21 in a state where the edge region on one side thereof is in contact with the guide pins 81a and 81b, and each edge region facing the metal thin plate 31 is a pair. Are held by the holding mechanisms 22a and 22b. Specifically, in each of the holding mechanisms 22a and 22b, a pressing force is provided to the pressing lever 223 by the washer 224 and the spring 225, and the clamp portion 222 is pressed against the clamp bases 221a and 221b by the pressing lever 223. Thus, the opposing edge regions of the thin metal plate 31 are sandwiched and held between the clamp bases 221a and 221b and the clamp portion 222.

  When the metal thin plate 31 is held by the pair of holding mechanisms 22a and 22b, the distance between the pair of holding mechanisms 22a and 22b is expanded by the tension mechanism 23, and a tensile force is applied to the metal thin plate 31.

  Specifically, when the air cylinder 233 is extended, the air cylinder head 234 is moved in the direction opposite to the holding mechanism 22a (the left direction in FIG. 7), and one end of the pulling / pulling arm 232 is moved to the air cylinder. The head 234 is pushed in the same direction as the moving direction. In this way, when one end of the pulling / pulling arm 232 is pushed by the air cylinder head 234, the pulling / pulling unit 231 is based on the end of the rail 61a on the pulling mechanism 23 side (fixed part of the air cylinder 233). Thus, the pair of holding mechanisms 22a and 22b are moved away from each other in the left direction in FIG. That is, when the pulling / pulling part 231 is moved in the direction opposite to the holding mechanism 22a, one holding mechanism 22a is moved along with the pulling / pulling part 231 on the rail 61a, and the pair of holding mechanisms 22a and 22b with respect to each other. Increase the distance.

  The tensile force applied to the thin metal plate 31 is detected by the load cell 71, and the degree of extension of the air cylinder 233 is controlled based on the detection result. Thereby, the tensile force given to the metal thin plate 31 can be adjusted.

  In the present embodiment, the thin metal plate 31 is swung in the longitudinal direction of the mounting plate 21 by the swing mechanism 24 in a state where a tensile force is applied to the thin metal plate 31. As a result, the tensile force applied to the thin metal plate 31 can be “familiarized” (made uniform throughout) to the thin metal plate 31.

  Specifically, when the micrometer 243 extends and retracts, the micrometer head 244 is swung in the longitudinal direction of the mounting plate 21 (the left-right direction in FIG. 4). As the micrometer head 244 swings, the swinging traction portion 241 is similarly swung from the fixing point of the micrometer 243 on the rail 61b, and the other holding mechanism 22b is moved on the rail 61b. Is swung together with the swinging towing unit 241. As a result, the metal thin plate 31 is swung in the longitudinal direction of the mounting plate 21 as a result.

  After the metal thin plate 31 is swung, air between the placement plate 21 and the metal thin plate 31 placed on the placement plate 21 is sucked by the air suction part 412 through the air suction hole 411, The thin plate 31 is attracted to the mounting plate 21.

  When the metal thin plate 31 is sufficiently adsorbed to the mounting plate 21, the adsorption signal is detected by the adsorption signal detector 51. When the suction signal is detected, the air cylinder 233 is gradually retracted due to the air being gradually extracted, and the tensile force applied to the metal thin plate 31 is gradually reduced to finally become zero.

  As described above, after the tensile force applied to the thin metal plate 31 becomes zero, an image of the thin metal plate 31 that is attracted to the mounting plate 21 is acquired by the measurement camera 131, and the captured image is an image. Processed by the processing device 132, at least one dimension of the sheet metal 31 is measured. As a result, even when the thin metal plate 31 is curved or lifted when placed on the placement plate 21, such a deformed state is removed or alleviated and the deformed state is removed. In addition, various dimensions of the thin metal plate 31 are measured in a state where the tensile force applied for relaxation is removed. Thereby, the measurement accuracy is significantly improved. Furthermore, even if a disturbance (vibration, wind) occurs around the dimension measuring device 11, the movement of the thin metal plate 31 is suppressed by the adsorption mechanism 41, which also improves the measurement accuracy.

  As described above, according to the present embodiment, at least one dimension of the thin metal plate 31 is measured while being held by the pair of holding mechanisms 22a and 22b and pulled by the pulling mechanism 23. Therefore, even when the metal thin plate 31 is curved or lifted when placed on the placement plate 21, the dimension of the metal thin plate 31 is measured in a state where such a deformed state is removed or relaxed. Therefore, the measurement accuracy is improved. Even if disturbance (vibration, wind) occurs around the dimension measuring device 11, the movement of the thin metal plate 31 is suppressed by the adsorption mechanism 41, which also improves the measurement accuracy. Furthermore, since the mounting posture of the thin metal plate 31 on the mounting plate 21 with respect to the direction of the tensile force by the pulling mechanism 23 is guided based on the desired pulling direction of the thin metal plate 31, it is appropriate for the thin metal plate 31. A tensile force can be applied in the direction.

  Further, the guide members 80 a and 80 b include guide pins 81 a and 81 b that abut on the edge region on one side of the metal thin plate 31 on the mounting plate 21, and the guide pins 81 a and 81 b are provided for a desired tension of the metal thin plate 31. The direction is movable so that the direction of the tensile force by the pulling mechanism 23 matches. Therefore, the mounting posture of the thin metal plate 31 on the mounting plate 21 can be easily guided.

  Furthermore, the guide pins 81a and 81b can be moved independently of each other. Therefore, by changing the arrangement direction of the guide pins 81a and 81b, the placement posture of the metal thin plate 31 on the placement plate 21 can be easily guided.

  Further, the measurement mechanism 13 includes a measurement camera 131 that captures an image of the thin metal plate 31 that is attracted to the mounting plate, and an image processing device 132 that processes the captured image. Therefore, the dimension of the metal thin plate 31 can be easily measured.

  Further, the suction mechanism 41 sucks air between the metal thin plate 31 and the mounting plate 21 in a state where a tensile force is applied, and causes the metal thin plate 31 and the mounting plate 21 to be sucked. . Therefore, the metal thin plate 31 can be easily adsorbed to the mounting plate 21.

  In addition, the adsorption | suction mechanism 41 may adsorb | suck the metal thin plate 31 and the mounting plate 21 of the state to which the tensile force was given, and may adsorb | suck with magnetic force. Also in this case, the metal thin plate 31 can be easily adsorbed to the mounting plate 21.

  In addition, after the metal thin plate 31 is attracted to the mounting plate 21, the tensile force applied to the metal thin plate 31 by the tension mechanism 23 is reduced by retracting the air cylinder 233. In this case, a tensile force applied via the pair of holding mechanisms 22a and 22b for removing or easing the deformed state, and a tensile force applied via the pair of holding mechanisms 22a and 22b for subsequent dimension measurement. Can be determined independently of each other, so that the measurement accuracy is improved.

  Further, the mounting plate 21 may be separated into two mounting plate portions, and each holding mechanism 22a, 22b may be provided in each mounting plate portion. In this case, when tension is applied to the metal thin plate 31, the placement plate 21 and the metal thin plate 31 are prevented from sliding with each other in the vicinity of the holding mechanisms 22a and 22b. Further, local stress is suppressed from being generated in the metal thin plate 31, and the measurement accuracy is improved.

  Alternatively, a hole for positioning may be provided in the thin metal plate 31, and the thin metal plate 31 may be placed on the placement plate 21 while aligning the positions of the holes and the guide pins 81a and 81b.

  The holding mechanisms 22a and 22b are of a type that holds the metal thin plate 31 between the clamp part 222 and the clamp bases 221a and 221b by pressing the clamp part 222 against the clamp bases 221a and 221b with screws or air. It may be.

  Further, the pulling mechanism 23 may pull the holding mechanism 22a with a weight, a motor, a spring, or the like.

  Next, a second embodiment of the dimension measuring apparatus according to the present invention will be described with reference to FIG.

  FIG. 13 is a plan view schematically showing a placement plate, a holding mechanism, and a tension mechanism in the dimension measuring apparatus according to the second embodiment of the present invention. As shown in FIG. 13, the dimension measuring device 11 of the present embodiment is different from the dimension measuring device of the first embodiment in that a plurality of mounting plates 21 on which the metal thin plates 31 are mounted, A plurality of pairs of holding mechanisms 22a and 22b each holding the opposing edge regions of the thin metal plate 31 placed on the plate 21 and each pair of holding mechanisms 22a and 22b with respect to each other. Based on the desired tension direction of the metal thin plate 31, a plurality of tension mechanisms 23 configured to give a tensile force to the metal thin plate 31 by extending the distance, and 23 in the direction of the tensile force by the plurality of tension mechanisms 23. Guide members 80a and 80b adapted to guide the mounting posture of the thin metal plate 31 on the plurality of mounting plates, and the thin metal plate 31 in a state where a tensile force is applied are adsorbed to the plurality of mounting plates 21. Multiple A suction mechanism 41, and a measuring mechanism 13 for measuring at least one dimension of the sheet metal 31 in a state of being attracted to the plurality of mounting plate 21, a point having a is different. In addition, the dimension measuring apparatus 11 of the present embodiment has a plurality of swing mechanisms 24 for “fitting” (making uniform throughout) the tensile force applied to the thin metal plate 31. doing.

  Other configurations are substantially the same as those of the first embodiment shown in FIGS. In FIG. 13, the same parts as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the dimension measuring apparatus 11 of the present embodiment, as shown in FIG. 13, a plurality of placement plates 21 are provided in parallel in a direction perpendicular to the longitudinal direction of the placement plate 21 (up and down direction in FIG. 13). A pair of holding mechanisms 22a and 22b, a pulling mechanism 23, and a swinging mechanism 24 are provided on both sides of each mounting plate 21 in substantially the same manner as in the first embodiment. In the present embodiment, the guide mechanisms 80 a and 80 b are provided only on one placement plate 21, but may be provided on both placement plates 21.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, when the metal thin plate 31 is placed on the plurality of placement plates 21, the air cylinder head 234 of the tension mechanism 23 provided on each placement plate 21 and the tension pulling arm 232 are brought into contact with each other. The micrometer head 244 of the swing mechanism 24 provided for each mounting plate 21 and the swing pull arm 242 are in contact with each other.

  Next, the guide pins 81 a and 81 b are moved by the control mechanism 85 based on the desired pulling direction of the thin metal plate 31. Specifically, when the metal thin plate 31 is placed on the plurality of placement plates 21 with the edge region on one side of the metal thin plate 31 being in contact with the guide pins 81a and 81b, The desired pulling direction and the direction of the resultant force of the pulling force by the plurality of pulling mechanisms 23 are moved to a position where they match.

  Then, the thin metal plate 31 is placed on the plurality of placement plates 21 in a state in which the edge region on one side thereof is in contact with the guide pins 81a and 81b, and each pair of the holding mechanisms 22a and 22b is paired. Thus, the opposing edge regions of the thin metal plate 31 placed on the plurality of placement plates 21 are held.

  After the metal thin plate 31 is held by the plurality of pairs of holding mechanisms 22a and 22b, the distance between the plurality of pairs of holding mechanisms 22a and 22b with respect to each other is increased by the plurality of pulling mechanisms 23. Thereby, a tensile force is given to the metal thin plate 31 two-dimensionally (planarly).

  With the tensile force applied to the thin metal plate 31, the thin metal plate 31 is swung in the longitudinal direction of each mounting plate 21 (left and right direction in FIG. 13) by the plurality of swing mechanisms 24. Accordingly, the tensile force applied two-dimensionally to the metal thin plate 31 can be “familiarized” (made uniform throughout) the metal thin plate 31 two-dimensionally.

  After the metal thin plate 31 is swung, the metal thin plate 31 is attracted to the plurality of mounting plates 21 by the plurality of suction mechanisms 41, and thereafter, the tensile force applied to the metal thin plate 31 by the plurality of tension mechanisms 23 is reduced. .

  As described above, after the tensile force applied to the thin metal plate 31 becomes zero, an image of the thin metal plate 31 that is attracted to the mounting plate 21 is acquired by the measurement camera 131, and the captured image is an image. Processed by the processing device 132, at least one dimension of the sheet metal 31 is measured.

  As described above, according to the present embodiment, a tensile force is given to the metal thin plate two-dimensionally (planarly), so that the deformation state of the metal thin plate is two-dimensionally removed or relaxed, and measurement accuracy is improved. Is further improved.

  Next, a third embodiment of the dimension measuring apparatus according to the present invention will be described with reference to FIG.

  FIG. 14 is a plan view schematically showing a placement plate, a holding mechanism, and a tension mechanism in a dimension measuring apparatus according to the third embodiment of the present invention. As shown in FIG. 14, the dimension measuring apparatus 11 of the present embodiment is the same as the second embodiment shown in FIG. 13 except that the mounting plate 21 is not divided into a plurality of parts.

  In FIG. 14, the same parts as those in the embodiment shown in FIG.

  Also in the present embodiment, as in the embodiment shown in FIG. 13, a tensile force is given to the metal thin plate two-dimensionally (in a plane), so that the state of deformation of the metal thin plate is removed two-dimensionally. The measurement accuracy is further improved.

  Next, a fourth embodiment of the dimension measuring apparatus according to the present invention will be described with reference to FIG.

  FIG. 15 is a plan view schematically showing a mounting plate, a holding mechanism, and a tension mechanism in a dimension measuring apparatus according to the fourth embodiment of the present invention. As shown in FIG. 15, the dimension measuring apparatus 11 according to the present embodiment changes the positions of the pair of holding mechanisms 22a and 22b instead of the guide members 80a and 80b with respect to the dimension measuring apparatus according to the first example. The difference is that a position changing mechanism 90 is provided. Specifically, the position changing mechanism 90 changes the positions of the pair of holding mechanisms 22a and 22b with respect to the mounting posture of the thin metal plate 31 on the mounting plate 21 based on the desired pulling direction of the thin metal plate 31. Yes. Other configurations are substantially the same as those of the first embodiment. In FIG. 15, the same parts as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the present embodiment, as shown in FIG. 16, the position changing mechanism 90 is provided below the holding mechanism 22a and the pulling mechanism 23, and rotates and moves in parallel with the holding mechanism 22a and the pulling mechanism 23. A mechanism 92a is included. The rotation mechanism 91a is configured to rotate the holding mechanism 22a and the pulling mechanism 23 as a unit around a predetermined rotation center in a horizontal plane. Further, the translation mechanism 92a is configured to translate the holding mechanism 22a and the pulling mechanism 23 as one body within a horizontal plane.

  The position changing mechanism 90 further includes a rotation mechanism 91b and a translation mechanism 92b that are provided below the holding mechanism 22b and the swinging mechanism 24 and move the holding mechanism 22b and the swinging mechanism 24 together. The rotation mechanism 91b is configured to rotate the holding mechanism 22b and the swing mechanism 24 as a unit around a predetermined rotation center in a horizontal plane. Further, the translation mechanism 92b is configured to translate the holding mechanism 22b and the swing mechanism 24 as one body within a horizontal plane.

  In the present embodiment, the control mechanism 85 is configured such that the rotation angle of the rotation mechanisms 91a and 91b with respect to the mounting posture of the metal thin plate 31 on the mounting plate, and the translation mechanism 92a based on the desired tensile direction of the metal thin plate 31. , 92b and the translation distance are determined.

  For example, the desired tensile direction of the thin metal plate 31 is a direction as indicated by an arrow in FIG. 9 different from the longitudinal direction of the thin metal plate 31, and the thin metal plate 31 is placed on the placement plate 21 in the longitudinal direction axis. In the case where the holding mechanism 22a and the pulling mechanism 23 are placed in parallel with each other, it is necessary to move the holding mechanism 22a and the pulling mechanism 23 to positions as shown in FIG. In this case, the control mechanism 85 determines the rotation angle of the rotation mechanism 91a and the translation direction and translation of the translation mechanism 92a so that the positions after the movement of the holding mechanism 22a and the tension mechanism 23 are the positions shown in FIG. The distance is determined.

  Further, when the holding mechanism 22a and the pulling mechanism 23 are moved, the holding mechanism 22b and the swinging mechanism 24 also need to be moved corresponding to the position of the pulling mechanism 23 after the movement. Specifically, the holding mechanism 22b and the swing mechanism 24 are arranged so that the direction of the tensile force by the pulling mechanism 23 after movement matches the swing direction of the metal thin plate 31 by the swing mechanism 24 after movement. Needs to be moved. Therefore, when the holding mechanism 22a and the pulling mechanism 23 are moved to the positions shown in FIG. 15B, the control mechanism 85 has the positions after the movement of the holding mechanism 22b and the swinging mechanism 24 shown in FIG. The rotation angle of the rotation mechanism 91b and the translation direction and translation distance of the translation mechanism 92b are determined so as to be in the position.

  Next, the operation of the present embodiment having such a configuration will be described. In the present embodiment, the thin metal plate 31 is placed on the placement plate 21 in parallel with the longitudinal axis of the placement plate 21.

  First, when the thin metal plate 31 is placed on the placement plate 21, the air cylinder head 234 of the tension mechanism 23 and the tension pulling arm 232 are in contact with each other, and the micrometer head 244 of the swing mechanism 24 is The swinging traction arm 242 is in contact.

  When information necessary for determining the desired tension direction of the thin metal plate 31 is input by the input means 86, the desired tension direction of the thin metal plate 31 is determined by the control mechanism 85. And based on the desired tension | pulling direction of the metal thin plate 31, the rotation angle of each rotation mechanism 91a, 91b with respect to the mounting attitude | position of the metal thin plate 31 on the mounting plate 21, and the translation direction and translation distance of each translation mechanism 92a, 92b. Is determined. Specifically, the rotation angle of the rotation mechanism 91a and the translation direction and translation distance of the translation mechanism 92a are such that the direction of the tensile force by the tension mechanism 23 after rotation and translation matches the desired tension direction of the thin metal plate 31. To be determined. Further, the rotation angle of the rotation mechanism 91b and the translation direction and translation distance of the translation mechanism 92b are the same as the direction of the tensile force by the tension mechanism 23 after the rotation and translation. To be decided.

  The holding mechanism 22 a and the pulling mechanism 23 are rotated by the rotation mechanism 91 a according to the rotation angle determined by the control mechanism 85. Further, the holding mechanism 22 a and the pulling mechanism 23 are translated by the translation mechanism 92 a according to the translation direction and the translation distance determined by the control mechanism 85. Thereby, the holding mechanism 22a and the pulling mechanism 23 are moved so that the direction of the pulling force by the pulling mechanism 23 after the movement matches the desired pulling direction.

  Further, the holding mechanism 22 b and the swing mechanism 24 are rotated by the rotation mechanism 91 b according to the rotation angle determined by the control mechanism 85. Further, the holding mechanism 22 b and the swing mechanism 24 are translated by the translation mechanism 92 b according to the translation direction and the translation distance determined by the control mechanism 85. Thereby, the holding mechanism 22b and the swing mechanism 24 are moved so that the swing direction of the swing mechanism 24 after the movement is aligned with the direction of the tensile force by the tension mechanism 23 after the movement.

  When the metal thin plate 31 is placed on the placement plate 21 in parallel with the longitudinal axis of the placement plate 21, the opposing edge regions of the metal thin plate 31 are held by the pair of holding mechanisms 22a and 22b. The

  When the metal thin plate 31 is held by the pair of holding mechanisms 22a and 22b, the distance between the pair of holding mechanisms 22a and 22b is expanded by the tension mechanism 23, and a tensile force is applied to the metal thin plate 31.

  With the tensile force applied to the metal thin plate 31, the metal thin plate 31 is swung in the extending and retracting directions of the micrometer 243 by the swing mechanism 24.

  After the metal thin plate 31 is swung, air between the placement plate 21 and the metal thin plate 31 placed on the placement plate 21 is sucked by the air suction part 412 through the air suction hole 411, The thin plate 31 is attracted to the mounting plate 21.

  When the metal thin plate 31 is sufficiently adsorbed to the mounting plate 21, the adsorption signal is detected by the adsorption signal detector 51. When the suction signal is detected, the air cylinder 233 is gradually retracted due to the air being gradually extracted, and the tensile force applied to the metal thin plate 31 is gradually reduced to finally become zero.

  As described above, after the tensile force applied to the thin metal plate 31 becomes zero, an image of the thin metal plate 31 that is attracted to the mounting plate 21 is acquired by the measurement camera 131, and the captured image is an image. Processed by the processing device 132, at least one dimension of the sheet metal 31 is measured. As a result, even when the thin metal plate 31 is curved or lifted when placed on the placement plate 21, such a deformed state is removed or alleviated and the deformed state is removed. In addition, various dimensions of the thin metal plate 31 are measured in a state where the tensile force applied for relaxation is removed. Thereby, the measurement accuracy is significantly improved. Furthermore, even if a disturbance (vibration, wind) occurs around the dimension measuring device 11, the movement of the thin metal plate 31 is suppressed by the adsorption mechanism 41, which also improves the measurement accuracy.

  As described above, according to the present embodiment, the positions of the pair of holding mechanisms 22a and 22b with respect to the mounting posture of the thin metal plate 31 on the mounting plate 21 are changed based on the desired tensile direction of the thin metal plate 31. Therefore, a tensile force can be applied to the metal thin plate 31 in an appropriate direction.

  Further, since the position changing mechanism 90 rotates each holding mechanism 22a, 22b around a predetermined rotation center, it is easy to align the direction of the tensile force by the tension mechanism 23 with a desired tension direction. is there.

  Further, since the position changing mechanism 90 is configured to translate the pair of holding mechanisms 22a and 22b with respect to each other, this also matches the direction of the tensile force by the tension mechanism 23 with the desired tension direction. Is easy.

  Instead of changing the position of the pair of holding mechanisms 22a and 22b, the position of the mounting plate 21 may be changed.

  Moreover, the dimension measuring apparatus 11 may further include guide members 80a and 80b in the dimension measuring apparatus according to the first embodiment of the present invention. In this case, by adjusting both the mounting posture of the thin metal plate guided by the guide members 80a and 80b and the moved position of the pair of holding mechanisms 22a and 22b, the desired tension direction of the thin metal plate 31 can be adjusted. The tensile force by the tension mechanism 23 can be more flexibly matched.

  Next, a fifth embodiment of the dimension measuring apparatus according to the present invention will be described with reference to FIG.

  FIG. 17 is a plan view schematically showing a placement plate, a holding mechanism, and a tension mechanism in a dimension measuring apparatus according to the fifth embodiment of the present invention. As shown in FIG. 17, the dimension measuring apparatus 11 of this embodiment is different from the dimension measuring apparatus of the embodiment shown in FIG. 15 and FIG. A plurality of pairs of holding mechanisms 22a and 22b configured to hold the opposing edge regions of the thin metal plate 31 mounted on the mounting plate 21 and each pair of holding mechanisms 22a and 22b. The metal on the plurality of mounting plates 21 is based on a plurality of pulling mechanisms 23 configured to apply a tensile force to the metal thin plate 31 by increasing the distance to each other and the desired pulling direction of the metal thin plate 31. A plurality of position changing mechanisms 90 adapted to change the position of each pair of holding mechanisms 22a and 22b with respect to the mounting posture of the thin plate 31, and a plurality of mounting plates including the metal thin plate 31 in a state where a tensile force is applied. 21 to adsorb And a plurality of suction mechanism 41 has a point with a are different. In addition, the dimension measuring apparatus 11 of the present embodiment has a plurality of swing mechanisms 24 for “fitting” (making uniform throughout) the tensile force applied to the thin metal plate 31. doing.

  Other configurations are substantially the same as those of the embodiment shown in FIGS. In FIG. 17, the same parts as those of the embodiment shown in FIGS. 15 and 16 are denoted by the same reference numerals, and detailed description thereof is omitted.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, when the metal thin plate 31 is placed on the placement plate 21, the air cylinder head 234 and the tension pulling arm 232 of the tension mechanism 23 provided on each placement plate 21 are in contact with each other. The micrometer head 244 of the swing mechanism 24 provided on the mounting plate 21 and the swing pull arm 242 are in contact with each other.

  When information necessary for determining the desired tension direction of the thin metal plate 31 is input by the input means 86, the desired tension direction of the thin metal plate 31 is determined by the control mechanism 85. Then, based on the desired tensile direction of the thin metal plate 31, the rotation angle of each of the rotation mechanisms 91a and 91b and the translation direction and translation distance of each of the translation mechanisms 92a and 92b are determined. Specifically, the rotation angle of the rotation mechanism 91a and the translation direction and translation distance of the translation mechanism 92a are such that the direction of the resultant force of the plurality of tension mechanisms 23 after rotation and translation matches the desired tension direction. To be determined. In addition, the rotation angle of the rotation mechanism 91b and the translation direction and translation distance of the translation mechanism 92b are determined by the direction in which the metal thin plate 31 is swung by the plurality of swing mechanisms 24 after the rotation and translation. It is determined so as to match the direction of the resultant force of the tensile force by the mechanism 23.

  Each holding mechanism 22 a and each pulling mechanism 23 are rotated by each rotation mechanism 91 a according to the rotation angle determined by the control mechanism 85. Further, each holding mechanism 22 a and each pulling mechanism 23 are translated by each translation mechanism 92 a according to the translation direction and the translation distance determined by the control mechanism 85. Thereby, the plurality of holding mechanisms 22a and the plurality of pulling mechanisms 23 are moved so that the resultant direction of the tensile force by the plurality of pulling mechanisms 23 after the movement matches the desired pulling direction.

  Each holding mechanism 22b and each swinging mechanism 24 are rotated by each rotation mechanism 91b according to the rotation angle determined by the control mechanism 85. Further, each holding mechanism 22b and each swinging mechanism 24 are translated by each translation mechanism 92b according to the translation direction and translation distance determined by the control mechanism 85. As a result, the plurality of holding mechanisms 22b and the plurality of swing mechanisms 24 are arranged such that the swing directions of the plurality of swing mechanisms 24 after the movement match the direction of the resultant tensile force of the plurality of pull mechanisms 23 after the movement. Moved to.

  When the thin metal plate 31 is placed on the plurality of placement plates 21 in parallel with the longitudinal axes of the plurality of placement plates 21, the opposing edge regions of the thin metal plates 31 are a plurality of pairs of holding mechanisms 22a. , 22b.

  When the metal thin plate 31 is held by each pair of the plurality of pairs of holding mechanisms 22a and 22b, the distance between the plurality of pairs of holding mechanisms 22a and 22b with respect to each other is increased by the plurality of pulling mechanisms 23. Thereby, a tensile force is given to the metal thin plate 31 two-dimensionally (planarly).

  With the tensile force applied to the thin metal plate 31, the thin metal plate 31 is swung in the extending and retracting directions of the micrometer 243 by the plurality of swing mechanisms 24. Accordingly, the tensile force applied two-dimensionally to the metal thin plate 31 can be “familiarized” (made uniform throughout) the metal thin plate 31 two-dimensionally.

  After the metal thin plate 31 is swung, air between the placement plate 21 and the metal thin plate 31 placed on the placement plate 21 is sucked by the air suction part 412 through the air suction hole 411, The thin plate 31 is attracted to the mounting plate 21.

  When the metal thin plate 31 is sufficiently adsorbed to the mounting plate 21, the adsorption signal is detected by the adsorption signal detector 51. When the suction signal is detected, the air cylinder 233 is gradually retracted due to the air being gradually extracted, and the tensile force applied to the metal thin plate 31 is gradually reduced to finally become zero.

  As described above, after the tensile force applied to the thin metal plate 31 becomes zero, an image of the thin metal plate 31 that is attracted to the mounting plate 21 is acquired by the measurement camera 131, and the captured image is an image. Processed by the processing device 132, at least one dimension of the sheet metal 31 is measured.

  As described above, according to the present embodiment, a tensile force is given to the metal thin plate two-dimensionally (planarly), so that the deformation state of the metal thin plate is two-dimensionally removed or relaxed, and measurement accuracy is improved. Is further improved.

DESCRIPTION OF SYMBOLS 11 Dimension measuring apparatus 13 Measuring mechanism 131 Measuring camera 132 Image processing apparatus 21 Mounting board 211a Mounting board center part 211b Mounting board center part 212a Mounting board edge part 212b Mounting board edge part 213 Mounting board frame body 214 Bearing 215 Eccentric bar 216 Mounting plate lowering mechanism 22a One holding mechanism 22b The other holding mechanism 221a Clamp base 221b Clamp base 222 Clamp part 223 Pressing lever 224 Washer 225 Spring 23 Tension mechanism 231 Tension pulling part 232 Tension pulling arm 233 Air cylinder 234 Air cylinder head 24 Oscillating mechanism 241 Oscillating towing unit 242 Oscillating towing arm 243 Micrometer 244 Micrometer head 31 Metal thin plate 32 Measurement mark 33 Metal mask manufacturing region 34 Metal mask 35 Metal mask opening 41 Adsorption mechanism 411 air引孔 412 air suction unit 51 suction signal detector 61a rail 61b rails 71 load cell 80a guide member 80b guides 81a guide pin 81b guide pin 82a cylinder 82b cylinder 85 control mechanism 86 input means 90 position changing mechanism 91 rotating mechanism 92 translation mechanism

Claims (31)

A mounting plate on which a metal thin plate is mounted;
A pair of holding mechanisms adapted to hold the opposing edge regions of the thin metal plate placed on the placement plate;
A tension mechanism configured to give a tensile force to the metal sheet by increasing the distance between the pair of holding mechanisms relative to each other;
Based on a desired tension direction of the metal thin plate, a guide member adapted to guide the mounting posture of the metal thin plate on the placement plate with respect to the direction of the tensile force by the tension mechanism;
An adsorption mechanism adapted to adsorb the metal thin plate in a state where the tensile force is applied to the mounting plate;
A measuring mechanism for measuring at least one dimension of the thin metal plate in a state of being adsorbed to the mounting plate;
An apparatus for measuring a dimension of a thin metal plate, comprising: The guide member includes a guide pin that contacts an edge region on one side of the thin metal plate on the placement plate,
The dimension of the thin metal sheet according to claim 1, wherein the guide pin is movable so that a desired tensile direction of the thin metal sheet and a direction of a tensile force by the tension mechanism are aligned. measuring device. The apparatus for measuring a dimension of a thin metal plate according to claim 2, wherein the guide pin includes a plurality of pins that can move independently of each other. The measurement mechanism includes a measurement camera that captures an image of the thin metal plate that is adsorbed to the mounting plate, and an image processing device that processes the captured image. The apparatus for measuring a dimension of a thin metal plate according to any one of claims 1 to 3. The suction mechanism is configured to suck air between the thin metal plate and the mounting plate in a state where the tensile force is applied, thereby sucking the thin metal plate and the mounting plate. The apparatus for measuring a dimension of a thin metal plate according to any one of claims 1 to 4. 5. The metal according to claim 1, wherein the adsorption mechanism is configured to electrostatically adsorb the metal thin plate in a state where the tensile force is applied and the mounting plate. Thin plate dimension measuring device. 5. The metal according to claim 1, wherein the adsorption mechanism is configured to adsorb the metal thin plate in a state where the tensile force is applied and the mounting plate by a magnetic force. Thin plate dimension measuring device. 8. The mounting plate according to claim 1, wherein the mounting plate is divided into at least two mounting plate portions, and each of the pair of holding mechanisms is provided on a different mounting plate portion. Measuring device for metal thin plate. A plurality of mounting plates on which the metal thin plates are mounted;
A plurality of pairs of holding mechanisms configured to hold each edge region of the metal thin plate placed on the placing plate, the pairs facing each other;
A plurality of tensioning mechanisms adapted to impart a tensile force to the sheet metal by increasing the distance of each pair of retaining mechanisms relative to each other;
A guide member configured to guide a mounting posture of the thin metal plate on the plurality of mounting plates with respect to a direction of a tensile force by the plurality of pulling mechanisms based on a desired pulling direction of the thin metal plate;
A plurality of adsorption mechanisms adapted to adsorb the metal thin plate in a state of being given the tensile force to the plurality of mounting plates;
A measurement mechanism for measuring at least one dimension of the metal thin plate in a state of being adsorbed to the plurality of mounting plates;
An apparatus for measuring a dimension of a thin metal plate, comprising: Determining a desired tensile direction of the sheet metal;
Positioning the guide member so as to guide the mounting posture of the metal thin plate on the mounting plate based on a desired tensile direction of the metal thin plate;
Placing the thin metal plate on the mounting plate according to guidance by the guide member;
A step of holding the opposing edge regions of the thin metal plate placed on the placement plate by a pair of holding mechanisms;
Applying a tensile force to the metal thin plate by expanding the distance between the pair of holding mechanisms in a state where the metal thin plate is held by a tension mechanism;
A step of adsorbing the metal thin plate in a state where the tensile force is given by an adsorption mechanism to the mounting plate;
Measuring at least one dimension of the metal thin plate in a state of being adsorbed to the mounting plate by the measurement mechanism;
A method for measuring a dimension of a thin metal plate, comprising: The guide member includes a guide pin that contacts an edge region on one side of the thin metal plate on the placement plate,
The positioning step includes a step of moving the guide pin so that a desired pulling direction of the metal sheet matches a direction of a pulling force by the pulling mechanism. A method for measuring a dimension of the thin metal sheet described. The step of measuring includes a step of capturing an image of the thin metal plate that is adsorbed to the mounting plate, and a step of processing the captured image. 11. A method for measuring a dimension of a thin metal plate according to 11. The method according to any one of claims 10 to 12, further comprising a step of reducing a tensile force applied to the metal thin plate by the tension mechanism after the step of adsorbing the metal thin plate to the mounting plate. A method for measuring a dimension of the thin metal sheet described. In the step of adsorbing the metal thin plate to the mounting plate, the air between the metal thin plate and the mounting plate in a state where the tensile force is applied is sucked, and the metal thin plate and the mounting plate are The method for measuring a dimension of a thin metal sheet according to any one of claims 10 to 13, wherein the metal is adsorbed. Determining a desired tensile direction of the sheet metal;
Positioning the guide member so as to guide the mounting posture of the metal thin plate on a plurality of mounting plates based on a desired tensile direction of the metal thin plate;
Placing the thin metal plate on the plurality of placement plates according to the guidance by the guide member;
Holding each edge region facing each of the metal thin plates placed on the plurality of placement plates by each pair of a plurality of pairs of holding mechanisms;
Applying a tensile force to the metal sheet by increasing the distance of each of the pairs of holding mechanisms in a state in which the metal sheet is held by a plurality of tension mechanisms;
Adsorbing the metal thin plate in a state where the tensile force is applied to the plurality of mounting plates;
Measuring at least one dimension of the metal sheet in a state of being adsorbed to the plurality of mounting plates by a measurement mechanism;
A method for measuring a dimension of a thin metal plate, comprising: 16. The method according to claim 15, further comprising a step of reducing a tensile force applied to the metal thin plate by the plurality of tension mechanisms after the step of adsorbing the metal thin plate to the plurality of mounting plates. For measuring the dimensions of thin metal sheets. A mounting plate on which a metal thin plate is mounted;
A pair of holding mechanisms adapted to hold the opposing edge regions of the thin metal plate placed on the placement plate;
A tension mechanism configured to give a tensile force to the metal sheet by increasing the distance between the pair of holding mechanisms relative to each other;
A position changing mechanism adapted to change the position of the pair of holding mechanisms with respect to the mounting posture of the metal thin plate on the mounting plate based on a desired pulling direction of the metal thin plate;
An adsorption mechanism adapted to adsorb the metal thin plate in a state where the tensile force is applied to the mounting plate;
A measuring mechanism for measuring at least one dimension of the thin metal plate in a state of being adsorbed to the mounting plate;
An apparatus for measuring a dimension of a thin metal plate, comprising: The metal position measuring apparatus according to claim 17, wherein the position changing mechanism is configured to rotate each holding mechanism around a predetermined rotation center. The apparatus for measuring a size of a thin metal plate according to claim 17 or 18, wherein the position changing mechanism is configured to translate the pair of holding mechanisms relative to each other. The measurement mechanism includes a measurement camera that captures an image of the thin metal plate that is adsorbed to the mounting plate, and an image processing device that processes the captured image. The apparatus for measuring a dimension of a thin metal plate according to any one of claims 17 to 19. The suction mechanism is configured to suck air between the thin metal plate and the mounting plate in a state where the tensile force is applied, thereby sucking the thin metal plate and the mounting plate. The apparatus for measuring a dimension of a thin metal plate according to any one of claims 17 to 20. 21. The metal according to claim 17, wherein the adsorption mechanism is configured to electrostatically adsorb the metal thin plate in a state where the tensile force is applied and the mounting plate. Thin plate dimension measuring device. 21. The metal according to claim 17, wherein the adsorption mechanism is configured to adsorb the thin metal plate in a state where the tensile force is applied and the mounting plate by a magnetic force. Thin plate dimension measuring device. The said mounting plate is isolate | separated into the at least 2 mounting plate part, and each of a pair of holding | maintenance mechanism is provided in a different mounting plate part. Measuring device for metal thin plate. A plurality of mounting plates on which the metal thin plates are mounted;
A plurality of pairs of holding mechanisms configured to hold each edge region of the metal thin plate placed on the placing plate, the pairs facing each other;
A plurality of tensioning mechanisms adapted to impart a tensile force to the sheet metal by increasing the distance of each pair of retaining mechanisms relative to each other;
A plurality of position changing mechanisms adapted to change the position of each pair of holding mechanisms with respect to the mounting posture of the metal thin plate on the plurality of mounting plates based on a desired pulling direction of the metal thin plate;
A plurality of adsorption mechanisms adapted to adsorb the metal thin plate in a state of being given the tensile force to the plurality of mounting plates;
A measurement mechanism for measuring at least one dimension of the metal thin plate in a state of being adsorbed to the plurality of mounting plates;
An apparatus for measuring a dimension of a thin metal plate, comprising: Determining a desired tensile direction of the sheet metal;
Placing the metal thin plate on a placement plate;
A step of holding the opposing edge regions of the thin metal plate placed on the placement plate by a pair of holding mechanisms;
Applying a tensile force to the metal thin plate by expanding the distance between the pair of holding mechanisms in a state where the metal thin plate is held by a tension mechanism;
A step of adsorbing the metal thin plate in a state where the tensile force is given by an adsorption mechanism to the mounting plate;
Measuring at least one dimension of the metal thin plate in a state of being adsorbed to the mounting plate by the measurement mechanism;
With
Before the step of holding the metal thin plate, including a step of changing the positions of the pair of holding mechanisms with respect to the mounting posture of the metal thin plate on the mounting plate based on a desired tensile direction of the metal thin plate. A method for measuring a dimension of a thin metal sheet, characterized by 27. The method according to claim 26, wherein the measuring step includes a step of capturing an image of the metal thin plate that is adsorbed to the mounting plate, and a step of processing the captured image. A method for measuring a dimension of the thin metal sheet described. 28. The metal according to claim 26, further comprising a step of reducing a tensile force applied to the metal thin plate by the tension mechanism after the step of adsorbing the metal thin plate to the mounting plate. Thin plate dimension measurement method. In the step of adsorbing the metal thin plate to the mounting plate, the air between the metal thin plate and the mounting plate in a state where the tensile force is applied is sucked, and the metal thin plate and the mounting plate are The method for measuring a dimension of a thin metal plate according to any one of claims 26 to 28, wherein: Determining a desired tensile direction of the sheet metal;
Placing the metal thin plate on a plurality of placement plates;
Holding each edge region facing each of the thin metal plates placed on the placement plate by each pair of a plurality of pairs of holding mechanisms;
Applying a tensile force to the metal sheet by increasing the distance of each of the pairs of holding mechanisms in a state in which the metal sheet is held by a plurality of tension mechanisms;
Adsorbing the metal thin plate in a state where the tensile force is applied to the plurality of mounting plates;
Measuring at least one dimension of the metal sheet in a state of being adsorbed to the plurality of mounting plates by a measurement mechanism;
With
Before the step of holding the metal thin plate, a step of changing the position of each pair of holding mechanisms with respect to the mounting posture of the metal thin plate on the plurality of mounting plates based on a desired tensile direction of the metal thin plate A method for measuring a dimension of a thin metal sheet, comprising: 31. The method according to claim 30, further comprising a step of reducing a tensile force applied to the metal thin plate by the plurality of tension mechanisms after the step of attracting the metal thin plate to the plurality of mounting plates. For measuring the dimensions of thin metal sheets.

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