JP2013115234A - Washing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a wafer from falling from a spinner table which rotates at a high speed together with a frame.SOLUTION: Frame holding means 30 included in a washing device 2A cleaning a wafer W includes a frame support part 31 which supports a lower part 4b of a frame 4, and a plurality of frame press parts 32 which press an upper part 4a of the frame 4, and are arranged at equal angle intervals around the center of rotation of a spinner table 20. Each of the frame press parts 32 includes an arm part 300, a claw part 310 formed at an upper part 301 and pressing the frame 4, a weight part 320 formed at a low part 302, and a fulcrum shaft 330 supporting the arm part 300 rotatably so that the claw part 310 presses the upper part 4a of the frame 4. The weight part 320 has a blade 321 formed so as to generate lift force during rotation of the spinner table 20 in addition to centrifugal force, and the frame press part 32 presses the frame 4 to prevent the wafer W from falling from the spinner table 20.

Description

  The present invention relates to a cleaning apparatus that performs cleaning while supplying a cleaning liquid to a wafer held on a rotatable spinner table.

  A wafer on which a device such as an IC or LSI is divided and formed on a surface by dividing lines is divided into individual devices by a dicing apparatus and used for various electric devices such as a mobile phone and a personal computer.

  A dicing apparatus includes a chuck table that is rotatable while holding a wafer supported by a frame, a cutting unit that cuts the wafer held by the chuck table, and a cleaning unit that cleans and dries the wafer cut by the cutting unit. Thus, the wafer can be efficiently divided into individual devices.

  The cleaning means includes a spinner table that can hold and rotate a wafer, a frame holding means that is disposed on the outer periphery of the spinner table and holds a frame that rotates together with the spinner table, and a rotation that drives and rotates the spinner table and the frame holding means. Means. In order to prevent the wafer together with the frame from dropping off from the spinner table during the cleaning, the frame holding means holds the frame support part supporting the lower part of the frame and the upper part of the frame supported by the frame support part so that the rotation center And a plurality of frame pressing portions arranged at equal angles to each other, and can effectively clean and dry the cut wafer (see, for example, Patent Document 1 below).

JP 2006-128359 A

  However, since the frame holding means needs to rotate at a high speed of, for example, 3000 rpm together with the spinner table, if the frame deviates from the frame support portion with respect to the frame pressing portion, the spinner table There is a problem that the wafer, together with the frame, falls off the spinner table against the pressing force of the frame pressing portion due to the centrifugal force generated by the rotation.

  The present invention has been made in view of the above circumstances, and there is a problem to be solved by preventing the wafer from dropping off together with the frame from the spinner table rotating at high speed.

The present invention relates to a cleaning device for cleaning a plate-like object supported by a frame via an adhesive tape, the spinner table holding and rotating the plate-like object, and disposed on the outer periphery of the spinner table. Frame holding means for holding a frame rotating with the spinner table;
Rotating means for rotationally driving the spinner table and the frame holding means, and cleaning liquid supply means for supplying a cleaning liquid to the plate-like object held by the spinner table,
The frame holding means includes a frame support portion that supports a lower portion of the frame, and a plurality of frame pressing portions that are disposed at an equal angle with respect to the rotation center while pressing the upper portion of the frame supported by the frame support portion. The frame pressing portion includes an arm portion, a claw portion formed on the upper portion of the arm portion and pressing the frame, a weight portion formed on the lower portion of the arm portion, and a rotation of the spinner table. And a fulcrum shaft that rotatably supports the arm portion so that the weight portion is pulled to the outer periphery by centrifugal force and the claw portion presses the upper portion of the frame, and the weight portion is lifted in addition to centrifugal force The wings are formed so that.

  In the present invention, the frame pressing part provided in the cleaning device includes an arm part, a claw part formed on the upper part of the arm part to press the frame, a weight part formed on the lower part of the arm part, and a centrifugal force due to rotation. And a fulcrum shaft that rotatably supports the arm portion so that the claw portion presses the upper portion of the frame, and the weight portion is lifted in addition to centrifugal force. Since the wings are formed so as to be generated, the frame pressing portion rotates about the fulcrum shaft by the resultant force of the centrifugal force and the lifting force, and the claw portion descends toward the frame and can press the frame. . Therefore, it is possible to prevent the wafer from dropping off together with the frame from the spinner table rotating at high speed.

It is a perspective view which shows a dicing apparatus. It is a perspective view which shows an example of a washing | cleaning apparatus. It is a perspective view which shows the 1st example of a frame holding | suppressing part. It is sectional drawing which shows the state before the flame | frame holding | suppressing part of a 1st example hold | maintains a flame | frame. It is sectional drawing which shows the state in which the flame | frame holding | suppressing part of a 1st example hold | maintains a flame | frame. It is a perspective view which shows the 2nd example of a flame | frame holding | suppressing part. It is sectional drawing which shows the state before the flame | frame holding | suppressing part of a 2nd example hold | maintains a flame | frame. It is sectional drawing which shows the state in which the flame | frame holding | suppressing part of a 2nd example hold | maintains a flame | frame.

  In the dicing apparatus 1 shown in FIG. 1, a cleaning apparatus 2A that is a first example of the cleaning apparatus shown in FIG. 2 is mounted in a cleaning region P formed in the center of the upper surface. As shown in FIG. 1, a wafer W that is a plate-like object to be diced and cleaned is supported integrally with a frame 4 via an adhesive tape 3.

  A plurality of wafers W integrated with the frame 4 are accommodated in the wafer cassette 5 shown in FIG. In the vicinity of the wafer cassette 5, carry-in / out means 6 for taking out the wafer W together with the frame 4 from the wafer cassette 5 is disposed. The carry-in / out means 6 includes a holding portion 6a that holds the end portion of the frame 4, and the holding portion 6a can hold the end portion of the frame 4 and reciprocate in the Y-axis direction.

  In the vicinity of the carry-in / out means 6, a first transport means 7 capable of rotating is disposed. The first transport means 7 can suck the wafer W taken out by the carry-in / out means 6 and transport it to the chuck table 8 that can rotate. The chuck table 8 can reciprocate in the X-axis direction, and a cutting means 10 including an alignment camera 9 and a cutting blade 10a for detecting a division line of the wafer W is disposed on the movement path. ing.

  Above the cleaning region P, a second transport unit 11 that is movable in the Y-axis direction is disposed. After the wafer W is cut by the cutting means 10, the second transport means 11 moves in the Y-axis direction, and adsorbs the wafer W after cutting integrated with the frame 4 to be positioned in the cleaning region P. To the cleaning device 2A. Below, the detailed apparatus structure of the washing | cleaning apparatus 2A mounted in the dicing apparatus 1 comprised as mentioned above is demonstrated.

  A cleaning device 2A shown in FIG. 2 has a spinner table 20 that holds and rotates a wafer W integrated with a frame 4 via an adhesive tape 3, and is disposed on the outer peripheral side of the spinner table 20 together with the spinner table 20. Frame holding means 30 for holding the rotating frame 4, rotating means 40 for rotationally driving the spinner table 20 and the frame holding means 30, and a cleaning liquid supply means 50 for supplying a cleaning liquid to the wafer W held on the spinner table 20 , At least.

  As shown in FIG. 2, the spinner table 20 is supported by a shaft portion 21 having a vertical axis, and includes a holding surface 22 that sucks and holds the wafer W. The spinner table 20 includes a porous member, and the surface thereof serves as a holding surface 22 that adsorbs the wafer W. The lower surface side of the wafer W integrated with the frame 4 can be sucked and held by the holding surface 22 via the adhesive tape 3 by a suction force transmitted from a suction source (not shown).

  The spinner table 20 is connected to the rotating means 40 via the shaft portion 21. The rotating means 40 includes a motor 41 and a plurality of air pistons 42 disposed on the outer periphery of the motor 41, and the spinner table 20 is configured to be rotatable by driving the motor 41. Further, the reciprocating motion of the air piston 42 can raise and lower the motor 41 in the vertical direction, and the spinner table 20 can also be raised and lowered in the vertical direction.

  As shown in FIG. 2, cleaning liquid supply means 50 is disposed near the outer periphery of the spinner table 20. The cleaning liquid supply means 50 is configured to be capable of swiveling, and moves above the spinner table 20 and supplies the cleaning liquid to the wafer W during wafer cleaning. An air nozzle 23 for removing the cleaning liquid is disposed near the outer periphery of the spinner table 20.

  A cleaning liquid cover 24 is disposed around the shaft 21, and a plate-shaped cleaning liquid receiving portion 25 that receives the cleaning liquid is formed above the motor 41 and below the cleaning liquid cover 24. A drain outlet 26 is formed in the cleaning liquid receiver 25, and the drain outlet 26 communicates with a drain hose 27 that discharges the used cleaning liquid to the outside.

  The frame holding means 30 shown in FIG. 2 holds the ring-shaped frame support part 31 that supports the lower part 4 b of the frame 4 and the upper part 4 a of the frame 4 supported by the frame support part 31 against the rotation center of the spinner table 20. And a plurality of frame pressing portions 32 arranged at equal angles.

  As shown in FIGS. 2 and 3, the frame pressing portion 32 is formed on the arm portion 300, a claw portion 310 formed on the upper portion 301 of the arm portion 300 to press the frame 4, and a lower portion 302 of the arm portion 300. The weight portion 320 having a weight of λ and the centrifugal force caused by the rotation of the spinner table 20 causes the weight portion 320 to be pulled in the outer peripheral direction of the spinner table 20 so that the claw portion 310 presses the upper portion 4 a of the frame 4. And a fulcrum shaft 330 that is rotatably supported. The fulcrum shaft 330 is inserted into an insertion hole 330 b formed in the arm unit 300.

  As shown in FIG. 3, the claw portion 310 is formed by bending the upper portion 301 of the arm portion 300, and the tip of the claw portion 310 comes into contact with the upper portion 4 a of the frame 4.

  As shown in FIG. 3, the frame pressing portion 32 is formed with wings 321 whose upper surface 321 a is curved at the side portion of the weight portion 320 and whose lower surface 321 b is a horizontal surface, and the wing 321 is formed on the spinner table 20. The lift can be generated in the weight part 320 by the rotation of.

  In order to generate lift in the weight part 320, it is necessary to rotate the spinner table 20 at a high speed. When the spinner table 20 rotates at a high speed, the pressure on the curved upper surface 321a side of the wing 321 decreases and the pressure on the lower surface 321b side increases, lift is generated in the wing 321 and the weight unit integrated with the wing 321 320 also generates lift.

  As described above, in the frame pressing portion 32, the frame pressing portion 32 rotates with the fulcrum shaft 330 as a fulcrum by the resultant force of the centrifugal force generated by the high-speed rotation of the spinner table 20 and the lifting force generated in the blade 321, and the claw portion 310. Is lowered toward the frame 4, the claw portion 310 can press the upper portion 4 a of the frame 4.

Hereinafter, an operation example of the cleaning apparatus 2A will be described.
After the wafer W is held on the chuck table 8 shown in FIG. 1, the chuck table 8 is moved below the alignment camera 9 on the movement path in the X-axis direction, and a planned division line formed on the wafer W is detected. Is done. Then, the chuck table 8 is further moved in the X-axis direction, and the cutting means 10 is lowered while the cutting blade 10a is rotated at a high speed, thereby cutting the detected divisional line. In the same way, after cutting all the division lines that are oriented in the X-axis direction, the chuck table 8 is rotated by 90 degrees, and the wafer W that is oriented in the Y-axis direction is directed in the X-axis direction to perform the same cutting as described above. As a result, all the lines to be divided are cut and diced, and the wafer W is divided into individual devices.

  After the wafer W is cut by the cutting means 10, the cut wafer W is transferred to the cleaning device 2 </ b> A by the second transfer means 11. At this time, the cleaning device 2A shown in FIG. 4 raises the spinner table 20 in the direction of the arrow A1 by the air piston 42 shown in FIG. 2 while the second transport means 11 lowers the wafer W. Then, the frame 4 is placed on the ring-shaped frame support portion 31 and the wafer W is sucked and held on the holding surface 22 of the spinner table 20.

  As shown in FIG. 4, the weight part 320 is heavier than the claw part 310. Therefore, when the spinner table 20 is stationary, the weight part 320 and the wing 321 are located below and the claw part 310 is located above. Yes.

  After the wafer W is sucked and held on the spinner table 20, the cleaning device 2A lowers the spinner table 20 in the arrow A2 direction by the air piston 42 shown in FIG. Then, as shown in FIG. 5, the motor 41 is driven to rotate the spinner table 20 in the arrow B direction. The rotation speed of the spinner table 20 is preferably set to 3000 rpm, for example, in order to generate lift in the blade 321.

  The arm portion 300 of the frame pressing portion 32 rotates about the fulcrum shaft 330 as a fulcrum when the weight portion 320 is pulled in the outer peripheral direction of the spinner table 20 by the centrifugal force generated by the rotation of the spinner table 20. Then, as shown in FIG. 5, the weight part 320 and the wing 321 move to the outer peripheral side, and the claw part 310 moves to the inner peripheral side.

  At this time, lift force is generated on the blade 321, so that a resultant force obtained by adding this lift force to the centrifugal force generated by the rotation of the spinner table 20 is applied to one end of the arm unit 300. Therefore, the claw portion 310 can press the upper portion 4 a of the frame 4, and the frame 4 can be held between the frame support portion 31. In order to generate a stable lifting force on the wing 321, it is desirable that the wing 321 is stable in the horizontal direction when the claw portion 310 presses the upper portion 4 a of the frame 4. In this way, the frame pressing portion 32 causes lift to the weight portion 320 due to the lift generated on the wings 321, and the claw portion 310 strongly presses the upper portion 4 a of the frame 4, so that the wafer W together with the frame 4 is spinner. It is possible to prevent the table 20 from falling off.

  As shown in FIG. 5, while the spinner table 20 is rotating at high speed, the cleaning liquid supply means 50 is swung to discharge the cleaning liquid from the supply port 51. The discharged cleaning liquid removes cutting waste adhering to the upper surface of the wafer W.

  After the cutting waste adhering to the upper surface of the wafer W is removed with the cleaning liquid, the air nozzle 23 is swung to move the air supply port above the wafer W, and the air is ejected. As a result, the cleaning liquid adhering to the upper surface of the wafer W is removed and dried.

  A frame pressing portion 32a shown in FIG. 6 is a second example of the frame pressing portion. The cleaning device 2B shown in FIGS. 7 and 8 is applied to the cleaning device 2A in place of the frame pressing portion 32a instead of the frame pressing portion 32. The cleaning device 2B can be mounted on the dicing device 1 shown in FIG.

  As shown in FIGS. 6 and 7, the frame pressing portion 32a is formed on the arm portion 300a, a claw portion 310a formed on the upper portion 301a of the arm portion 300a and pressing the frame 4, and a weight formed on the lower portion 302a of the arm portion 300a. The wing 322 having the function of the part and the centrifugal force generated by the rotation of the spinner table 20 causes the wing 322 to be pulled in the outer peripheral direction of the spinner table 20 so that the claw 310a presses the upper part 4a of the frame 4 to rotate the arm part 300a. And a fulcrum shaft 330a that supports it. The fulcrum shaft 330a is inserted into an insertion hole 330bb formed in the arm portion 300a.

  Unlike the frame pressing portion 32, the frame pressing portion 32a is directly formed with wings 322 formed by curving the upper surface 322a in the lower portion 302a of the arm portion 300a. On the other hand, the lower surface 322b of the wing 322 is a horizontal plane similarly to the lower surface 321b of the wing 321. In the wing 322 having such a configuration, the wing 322 itself has a predetermined weight to be a weight and can generate lift. In order to make the wing 322 stable in the horizontal direction when the claw portion 310a presses the upper portion 4a of the frame 4, in the frame pressing portion 32a shown in FIG. On the other hand, it is formed with an inclination.

  Also in the frame pressing portion 32a configured as described above, the pressure on the curved upper surface 322a side of the blade 322 decreases when the spinner table 20 rotates, and the pressure on the lower surface 322b side of the blade 322 decreases. As a result, lift occurs in the wing 322. Therefore, also in the frame pressing portion 32 a, the claw portion 310 a can press the upper portion 4 a of the frame 4 using the resultant force of the centrifugal force generated by the high speed rotation of the spinner table 20 and the lift generated in the wing 322.

Below, the operation example of the washing | cleaning apparatus 2B is demonstrated.
After the wafer W is cut by the cutting means 10 of the dicing apparatus 1 shown in FIG. 1, the cut wafer W is transferred to the cleaning apparatus 2B by the second transfer means 11. At this time, the cleaning device 2B shown in FIG. 7 raises the spinner table 20 in the direction of the arrow A1 by the air piston 42 shown in FIG. 2 while the second transport means 11 lowers the wafer W. Then, the frame 4 is placed on the ring-shaped frame support portion 31 and the wafer W is sucked and held on the holding surface 22 of the spinner table 20.

  As shown in FIG. 7, the wing 322 is heavier than the claw portion 310 a, so that when the spinner table 20 is stationary, the wing 322 is located below and the claw portion 310 a is located above.

  After the wafer W is sucked and held on the spinner table 20, the cleaning device 2B lowers the spinner table 20 in the arrow A2 direction by the air piston 42 shown in FIG. Then, as shown in FIG. 8, the spinner table 20 is rotated in the arrow B direction by driving the motor 41. The rotation speed of the spinner table 20 is preferably set to 3000 rpm, for example, in order to generate lift in the blade 322.

  The arm portion 300a of the frame pressing portion 32a rotates around the fulcrum shaft 330a as a result of the wing 322 being pulled in the outer circumferential direction of the spinner table 20 by the centrifugal force generated by the rotation of the spinner table 20. Then, as shown in FIG. 8, the wing 322 moves to the outer peripheral side, and the claw portion 310a moves to the inner peripheral side.

  At this time, since lift is generated on the blade 322, a resultant force obtained by adding this lift to the centrifugal force generated by the rotation of the spinner table 20 is applied to one end of the arm portion 300a. Therefore, the claw portion 310 a can press the upper portion 4 a of the frame 4, and the frame 4 can be held between the frame support portion 31. In order to generate a stable lift force on the wing 322, it is desirable that the wing 322 be in a stable state in the horizontal direction when the claw portion 310a presses the upper portion 4a of the frame 4. In this way, the frame pressing portion 32a prevents the wafer W from dropping from the spinner table 20 together with the frame 4 by strongly pressing the upper portion 4a of the frame 4 by the claw portion 310a by the lift generated in the wing 322. be able to.

1: Dicing device 2A, 2B: Cleaning device 20: Spinner table 21: Shaft portion 22: Holding surface 23: Air nozzle 24: Cleaning liquid cover 25: Cleaning liquid receiving portion 26: Drain port 27: Drain hose 30: Frame holding means 31: Frame support part 32, 32a: Frame pressing part 300, 300a: Arm part 301, 301a: Upper part 302, 302a: Lower part 310, 310a: Claw part 320: Weight part 321, 322: Wing 321a, 322a: Upper surface 321b, 322b: Lower surface 330, 330a: fulcrum shaft 40: rotating means 41: motor 42: air piston 50: cleaning liquid supply means 51: supply port 3: adhesive tape 4: frame 4a: upper part 4b: lower part 5: wafer cassette 6: carry-in / out means 6a : Nipping part 7: First conveying means 8: Chuck table 9: Ara Instruments camera 10: cutting means 10a: cutting blade 11: second transport means W: wafer P: washing zone

Claims (1)

A cleaning device for cleaning a plate-like object supported by a frame via an adhesive tape,
A spinner table that holds the plate and is rotatable;
A frame holding means arranged on the outer periphery of the spinner table to hold a frame rotating with the spinner table;
Rotating means for rotationally driving the spinner table and the frame holding means;
Cleaning liquid supply means for supplying a cleaning liquid to the plate-like object held by the spinner table,
The frame holding means includes a frame support portion that supports a lower portion of the frame;
A plurality of frame pressing portions disposed at equal angles with respect to the rotation center while holding the upper portion of the frame supported by the frame supporting portion;
The frame pressing portion includes an arm portion,
A claw portion that is formed on an upper portion of the arm portion and presses the frame;
A weight portion formed at a lower portion of the arm portion;
A fulcrum shaft that rotatably supports the arm portion such that the weight portion is pulled to the outer periphery by centrifugal force due to rotation of the spinner table and the claw portion presses the upper portion of the frame;
The weight part is a cleaning device in which wings are formed so that lift is generated in addition to centrifugal force.

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