CN115178557A - Wafer cutting machine belt cleaning device - Google Patents
Wafer cutting machine belt cleaning device Download PDFInfo
- Publication number
- CN115178557A CN115178557A CN202210841110.5A CN202210841110A CN115178557A CN 115178557 A CN115178557 A CN 115178557A CN 202210841110 A CN202210841110 A CN 202210841110A CN 115178557 A CN115178557 A CN 115178557A
- Authority
- CN
- China
- Prior art keywords
- cutting machine
- cleaning
- cleaning device
- wafer cutting
- bucket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to the technical field of wafer cutting machines, in particular to a cleaning device of a wafer cutting machine; the cleaning device comprises a cleaning barrel, a top cover is arranged at the upper end of the cleaning barrel, the top cover is provided with an opening, a bracket is arranged at the lower end of the cleaning barrel, a material seat is arranged in the cleaning barrel, a rotating motor is arranged at the lower end of the cleaning barrel, and the rotating motor drives the material seat to rotate; the wafer is put into the cleaning barrel from the opening of top cap, is driven by the rotating electrical machines to rotate, realizes rotary cleaning and rotary spin-drying, can directly install in the cutting machine, and is small in size, simple in structure, low in manufacturing cost, and saved production processes moreover, improves production efficiency.
Description
Technical Field
The invention relates to the technical field of wafer cutting machines, in particular to a cleaning device of a wafer cutting machine.
Background
The existing wafer cutting machine is provided with a cutter and is used for cutting a wafer, after the wafer is cut, the wafer needs to be cleaned, and scraps generated by cutting are cleaned.
Therefore, in view of the above-mentioned drawbacks of the existing wafer cutting machine cleaning apparatus, it is necessary to improve the existing wafer cutting machine cleaning apparatus.
Disclosure of Invention
The invention aims to provide a cleaning device of a wafer cutting machine aiming at the defects of the prior art, which solves the problems of the prior wafer cleaning equipment that: high cost, complex structure and the like.
In order to realize the purpose, the invention is realized by the following technical scheme: wafer cutting machine belt cleaning device, including wasing the bucket, the upper end top cap of wasing the bucket, the top cap has the opening, and the support is installed to the lower extreme of wasing the bucket, has the material seat in the washing bucket, and the rotating electrical machines is installed to the lower extreme of wasing the bucket, and the rotating electrical machines drive the material seat rotatory.
Furthermore, the lower extreme of washing bucket install the jacking cylinder, the telescopic link of jacking cylinder and the bottom surface movable contact of material seat.
Furthermore, the upper end of the material seat is provided with a plurality of fixing positions.
Furthermore, the lower extreme of washing bucket have the washing motor, vertically install the fixed axle in the washing bucket, washing motor drive fixed axle, the upper end of fixed axle is connected with the installation pole, the installation pole is fixed with the cleaning head.
Further, the mounting rod is horizontally arranged.
The invention has the beneficial effects that: the wafer is put into the cleaning barrel from the opening of top cap, is driven by the rotating electrical machines to rotate, realizes rotary cleaning and rotary spin-drying, can directly install in the cutting machine, and is small in size, simple in structure, low in manufacturing cost, and saved production processes moreover, improves production efficiency.
Drawings
FIG. 1 is a schematic view of the present invention.
Fig. 2 is a schematic view of a wafer cutting machine according to the present invention.
Labeling and description:
the device comprises a feeding area 1, a feeding area 2 formed on the other side of the feeding area, a control area 3, an electric area 4, a wafer 5, a cleaning barrel 6, a material seat 7, a rotating motor 8, a top cover 9, a support 10, a fixing position 11, a jacking cylinder 12, a cleaning motor 13, a fixing shaft 14, an installation rod 15 and a cleaning head 16.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1-2, the main body of the wafer cutting machine of the invention is square, one side of the front end of the main body forms a feeding area 1, the other side of the main body forms a feeding area 2, the feeding area 2 is provided with a movable door, the rear end of the main body is provided with an access door for cutter replacement, the left side of the main body is provided with a control area 3 for operation control of the cutting machine, the rear end of the right side of the main body is provided with an electrical area 4, and main electrical devices of the cutting machine are all arranged on the electrical area 4, so that the wafer cutting machine is convenient for unified management and is very convenient.
The wafer cutting machine cleaning device of the invention comprises: wash bucket 6, the lateral wall of washing bucket 6 is not shown in the figure, the upper end top cap 9 of washing bucket 6, and support 10 is installed to the lower extreme of washing bucket 6, and support 10 installs in the cutting machine, and further, material loading district 2 includes two parts that set up side by side, and one is that the cutting material loading moves the track region, and another is belt cleaning device promptly.
A material seat 7 is arranged in a cleaning barrel 6, a rotating motor 8 and a jacking cylinder 12 are mounted at the lower end of the cleaning barrel 6, the rotating motor 8 drives the material seat 7 to rotate, a telescopic rod of the jacking cylinder 12 is movably contacted with the bottom surface of the material seat 7, the jacking cylinder 12 can jack the material seat 7 upwards, a wafer is sent into the material seat 7 from an opening of a top cover 9, and the jacking cylinder is reset downwards, so that the material seat 7 drives the wafer downwards to enter the cleaning barrel 6 for cleaning.
The upper end of the material seat 7 of the invention is provided with a plurality of fixing positions 11 for positioning the wafer.
The lower end of a cleaning barrel 6 is provided with a cleaning motor 13, the cleaning motor 13 drives a fixed shaft 14 positioned in the cleaning barrel 6 to rotate, the upper end of the fixed shaft 14 is connected with an installation rod 15, a cleaning head 16 is fixed on the installation rod 15, the cleaning motor 13 drives the fixed shaft 14 to rotate, the installation rod 15 drives the cleaning head 16 to rotate, the cleaning head 16 cleans a wafer 5, and meanwhile, the rotating motor 8 drives an animal material seat 7 to rotate so as to spin-dry water on the surface of the wafer 5.
The cutting machine applied by the invention can be directly cleaned after cutting is finished, and is very convenient to clean without taking external cleaning equipment.
Claims (5)
1. Wafer cutting machine belt cleaning device, its characterized in that: including wasing the bucket, the upper end top cap of wasing the bucket, the top cap has the opening, and the support is installed to the lower extreme of wasing the bucket, has the material seat in the washing bucket, and the rotating electrical machines is installed to the lower extreme of wasing the bucket, and the rotating electrical machines drive material seat is rotatory.
2. The wafer cutting machine cleaning device according to claim 1, characterized in that: the lower end of the cleaning barrel is provided with a jacking cylinder, and a telescopic rod of the jacking cylinder is movably contacted with the bottom surface of the material seat.
3. The wafer cutting machine cleaning device according to claim 1, characterized in that: the upper end of the material seat is provided with a plurality of fixing positions.
4. The wafer cutting machine cleaning device according to claim 1, characterized in that: the lower extreme of washing bucket have the cleaning motor, vertically install the fixed axle in the washing bucket, cleaning motor drive fixed axle, the upper end of fixed axle is connected with the installation pole, the installation pole is fixed with the cleaning head.
5. The wafer cutting machine cleaning device according to claim 5, characterized in that: the mounting rod is horizontally arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210841110.5A CN115178557A (en) | 2022-07-18 | 2022-07-18 | Wafer cutting machine belt cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210841110.5A CN115178557A (en) | 2022-07-18 | 2022-07-18 | Wafer cutting machine belt cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115178557A true CN115178557A (en) | 2022-10-14 |
Family
ID=83519094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210841110.5A Pending CN115178557A (en) | 2022-07-18 | 2022-07-18 | Wafer cutting machine belt cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115178557A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002066865A (en) * | 2000-09-01 | 2002-03-05 | Disco Abrasive Syst Ltd | Cutting device |
| JP2006128359A (en) * | 2004-10-28 | 2006-05-18 | Disco Abrasive Syst Ltd | Spinner cleaning device and dicing device |
| JP2013115234A (en) * | 2011-11-29 | 2013-06-10 | Disco Abrasive Syst Ltd | Washing device |
| CN212421825U (en) * | 2020-04-13 | 2021-01-29 | 争丰半导体科技(苏州)有限公司 | Full-automatic cutting and cleaning integrated machine for wafer |
-
2022
- 2022-07-18 CN CN202210841110.5A patent/CN115178557A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002066865A (en) * | 2000-09-01 | 2002-03-05 | Disco Abrasive Syst Ltd | Cutting device |
| JP2006128359A (en) * | 2004-10-28 | 2006-05-18 | Disco Abrasive Syst Ltd | Spinner cleaning device and dicing device |
| JP2013115234A (en) * | 2011-11-29 | 2013-06-10 | Disco Abrasive Syst Ltd | Washing device |
| CN212421825U (en) * | 2020-04-13 | 2021-01-29 | 争丰半导体科技(苏州)有限公司 | Full-automatic cutting and cleaning integrated machine for wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108214083A (en) | A kind of lathe scrap cleaning device | |
| CN216095062U (en) | Belt cleaning device is used in bearing processing | |
| CN115178557A (en) | Wafer cutting machine belt cleaning device | |
| CN104723057A (en) | Bearing supply unit | |
| CN215919205U (en) | Washing machine door production device with conversion driving mechanism | |
| CN213196136U (en) | Marking device for switch production | |
| CN211990851U (en) | Device is maintained to BN composite ceramic nozzle for amorphous strip | |
| CN211760375U (en) | Valve gap injection base burr remove device | |
| CN216930289U (en) | Charging probe wiping arrangement of earphone | |
| CN211523063U (en) | Cleaning, cleaning machine angularly adjustable water spray mechanism | |
| CN210164501U (en) | Monitoring facilities is used in colliery control that dustproof effectual | |
| CN113275628A (en) | Motor frame part drilling processing equipment | |
| CN219169020U (en) | Display glass belt type rotary grinding and cleaning device | |
| KR100706754B1 (en) | Stator varnish cleaner machine | |
| CN218085446U (en) | Novel single swing arm car washer of long service life | |
| CN215693733U (en) | Balling disk of convenient clearance | |
| CN220259608U (en) | Drilling device for automobile automatic production | |
| CN116632680B (en) | Power distribution cabinet | |
| CN204545826U (en) | Bearing feed unit | |
| CN219005448U (en) | Automatic tool changing device of vertical lifting table milling machine | |
| CN215619905U (en) | Bottle blowing device of bottle blowing machine | |
| CN215764158U (en) | Novel building electromechanical installation with supplementary mounting bracket | |
| CN205033369U (en) | Limit machine is washed to chain formula | |
| CN216044501U (en) | Double-end air suspension blower motor | |
| CN217616343U (en) | Rotary flushing equipment with rotary carrier positioning function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |