JP2015023138A - Spinner cleaning apparatus - Google Patents

Spinner cleaning apparatus Download PDF

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Publication number
JP2015023138A
JP2015023138A JP2013149666A JP2013149666A JP2015023138A JP 2015023138 A JP2015023138 A JP 2015023138A JP 2013149666 A JP2013149666 A JP 2013149666A JP 2013149666 A JP2013149666 A JP 2013149666A JP 2015023138 A JP2015023138 A JP 2015023138A
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Prior art keywords
fan member
holding table
chamber
wafer
cleaning
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Japanese (ja)
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優爾 中西
Yuji Nakanishi
優爾 中西
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2013149666A priority Critical patent/JP2015023138A/en
Priority to TW103118278A priority patent/TWI664029B/en
Priority to CN201410335934.0A priority patent/CN104289463A/en
Priority to KR1020140090226A priority patent/KR20150010630A/en
Publication of JP2015023138A publication Critical patent/JP2015023138A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a spinner cleaning apparatus that can prevent spray and washing water contaminated in cleaning from being attached again to a wafer in spinner cleaning.SOLUTION: A spinner cleaning apparatus 1 includes: a holding table 10 for holding a wafer W; a holding table rotation part 15; washing water spray means 50; a chamber 30 for storing the holding table 10; a duct 45 for discharging a gas from the chamber 30; a fan member 20 formed in an annular shape so as to cover an outer peripheral space surrounding the holding table 10 from a surface position of the holding table 10 to an opening 33 of the chamber 30; and a fan member rotation part 25 for rotating the fan member 20. The fan member 20 is rotated by the fan member rotation part 25 to generate an air flow from an annular-shaped inner peripheral part 36 of the fan member 20 to an outer peripheral part 37 of the fan member 20, so that washing water and spray in cleaning is discharged to the outside of the fan member 20 and is introduced to the duct 45.

Description

本発明は、回転させた半導体ウェーハ等のワークに洗浄水を供給することによってワークを洗浄するスピンナ洗浄装置に関する。   The present invention relates to a spinner cleaning apparatus for cleaning a work by supplying cleaning water to the work such as a rotated semiconductor wafer.

半導体デバイス製造工程では、略円板形状である半導体ウェーハの表面に格子状に配列された分割予定ラインによって多数の領域が区画され、区画された各領域にＩＣやＬＳＩなどの半導体デバイスが形成される。そして、分割予定ラインに沿って半導体ウェーハをダイシングすることによって各領域を分割することにより、個々の半導体デバイスが製造される。半導体ウェーハの表面には、ダイシングの際に生成された切削屑などの汚れが付着することがある。このため、半導体ウェーハは、ダイシング終了後、回転させた半導体ウェーハに洗浄水を供給することによって半導体ウェーハを洗浄するスピンナ洗浄装置によって洗浄される。   In the semiconductor device manufacturing process, a large number of regions are partitioned by dividing lines arranged in a lattice pattern on the surface of a substantially disk-shaped semiconductor wafer, and semiconductor devices such as IC and LSI are formed in each partitioned region. The And each semiconductor device is manufactured by dividing | segmenting each area | region by dicing a semiconductor wafer along the division | segmentation planned line. Dirt such as cutting waste generated during dicing may adhere to the surface of the semiconductor wafer. For this reason, after the dicing is completed, the semiconductor wafer is cleaned by a spinner cleaning device that cleans the semiconductor wafer by supplying cleaning water to the rotated semiconductor wafer.

ところで、スピンナ洗浄装置によって半導体ウェーハを洗浄する際、スピンナ洗浄装置から巻き起こった汚れた噴霧がスピンナ洗浄装置のチャンバー内に広がることで、噴霧が半導体ウェーハ表面に再付着することがある。そこで、従来のスピンナ洗浄装置においては、チャンバー内にダウンフローを発生させることによって、噴霧がチャンバー内へ広がることを抑制し、半導体ウェーハへの汚れの再付着を抑制するものが提案されている（特許文献１参照）。   By the way, when the semiconductor wafer is cleaned by the spinner cleaning apparatus, the dirty spray wound from the spinner cleaning apparatus spreads in the chamber of the spinner cleaning apparatus, so that the spray may reattach to the surface of the semiconductor wafer. Therefore, in the conventional spinner cleaning apparatus, by generating a downflow in the chamber, it is proposed that the spray is prevented from spreading into the chamber and the reattachment of dirt to the semiconductor wafer is suppressed ( Patent Document 1).

特開２０１２−９４６５９号公報JP 2012-94659 A

しかし、ダウンフローによりウェーハへの噴霧の再付着は防げるが、飛散した汚染水がチャンバー内壁等で跳ね返り、ウェーハへ再付着することを防ぐことができないという問題がある。   However, the downflow prevents the spray from re-adhering to the wafer, but there is a problem that the scattered contaminated water cannot be prevented from splashing back on the inner wall of the chamber and reattaching to the wafer.

本発明は、上記に鑑みてなされたものであって、その目的は、スピンナ洗浄において、洗浄時の汚染された噴霧及び洗浄水がウェーハへ再付着することを防止可能なスピンナ洗浄装置を提供することにある。   The present invention has been made in view of the above, and an object of the present invention is to provide a spinner cleaning apparatus capable of preventing contaminated spray and cleaning water from being reattached to a wafer during cleaning. There is.

上述した課題を解決し、目的を達成するために、本発明に係るスピンナ洗浄装置は、板状物を保持する円盤形状の保持テーブルと、該保持テーブルを鉛直方向を回転軸として回転させる保持テーブル回転部と、該保持テーブルの上面に保持された前記板状物上に向けて洗浄水を噴射する洗浄水噴射手段と、を有するスピンナ洗浄装置であって、前記保持テーブルを収容し上面が開口している円筒形状のチャンバーと、該チャンバーの側壁に配設され該チャンバー内から気体を排出するダクトと、洗浄時において該保持テーブルの表面位置から該チャンバーの開口部までの該保持テーブルを囲繞する外周空間を覆って円環形状に形成されたファン部材と、該ファン部材を鉛直方向を回転軸として回転させるファン部材回転部と、を備え、該ファン部材は、該ファン部材回転部により回転することにより、該保持テーブルの上部で且つ該ファン部材の該円環形状内周部から該ファン部材の外周部へ空気の流れを発生させ、洗浄時の洗浄水及び噴霧を該ファン部材の外部へ強制排気し該ダクトへ導くこと、を特徴とする。   In order to solve the above-described problems and achieve the object, a spinner cleaning apparatus according to the present invention includes a disk-shaped holding table that holds a plate-like object, and a holding table that rotates the holding table around a vertical direction as a rotation axis. A spinner cleaning device having a rotating portion and cleaning water spraying means for spraying cleaning water toward the plate-like object held on the upper surface of the holding table, the spinner cleaning device accommodating the holding table and opening the upper surface A cylindrical chamber, a duct disposed on the side wall of the chamber for exhausting gas from the chamber, and surrounding the holding table from the surface position of the holding table to the opening of the chamber during cleaning A fan member formed in an annular shape so as to cover the outer peripheral space to be rotated, and a fan member rotating unit that rotates the fan member about a vertical direction as a rotation axis. The member is rotated by the fan member rotating unit to generate an air flow at the upper part of the holding table and from the annular inner peripheral part of the fan member to the outer peripheral part of the fan member. The cleaning water and the spray are forcibly exhausted to the outside of the fan member and guided to the duct.

また、上記スピンナ洗浄装置において、前記ファン部材は前記保持テーブル回転部の外周に固定され、該保持テーブル回転部が該ファン部材回転部を兼ね、該保持テーブルの回転とともに該ファン部材が回転することが好ましい。   Further, in the spinner cleaning apparatus, the fan member is fixed to an outer periphery of the holding table rotating unit, the holding table rotating unit also serves as the fan member rotating unit, and the fan member rotates with the rotation of the holding table. Is preferred.

本発明に係るスピンナ洗浄装置は、保持テーブルの外周を開口まで覆う円環形状のファン部材で囲繞して、洗浄時に回転させることで、強制的にウェーハ上面の噴霧及び洗浄水をファン部材の外周部へ排気させダクトへ導くので、汚染された洗浄水や噴霧がウェーハ上面に再付着することを防ぐことができる。   The spinner cleaning apparatus according to the present invention surrounds the outer periphery of the holding table with an annular fan member that covers the opening and rotates it during cleaning, thereby forcibly spraying the wafer upper surface and cleaning water on the outer periphery of the fan member. Since the air is exhausted to the part and guided to the duct, it is possible to prevent the contaminated cleaning water or spray from reattaching to the upper surface of the wafer.

図１は、実施形態１に係るスピンナ洗浄装置の斜視図である。FIG. 1 is a perspective view of the spinner cleaning apparatus according to the first embodiment. 図２は、図１に示すスピンナ洗浄装置の鉛直方向断面図である。2 is a vertical sectional view of the spinner cleaning apparatus shown in FIG. 図３は、実施形態２に係るスピンナ洗浄装置の断面図である。FIG. 3 is a cross-sectional view of the spinner cleaning apparatus according to the second embodiment.

以下に、本発明に係るスピンナ洗浄装置の実施形態を図面に基づいて詳細に説明する。なお、この実施形態によりこの発明が限定されるものではない。また、下記実施形態における構成要素には、当業者が置換可能かつ容易なもの、或いは実質的に同一のものが含まれる。   Hereinafter, embodiments of a spinner cleaning apparatus according to the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same.

〔実施形態１〕
図１は、実施形態１に係るスピンナ洗浄装置の斜視図である。図２は、図１に示すスピンナ洗浄装置の鉛直方向断面図である。同図に示すスピンナ洗浄装置１は、半導体材料からなる円形の薄い板状物であるウェーハＷに対して所定の加工を施した後に、当該ウェーハＷを洗浄する装置になっており、図示しない加工装置に具備されるか、或いは単独の状態で用いられる。ウェーハＷに施す加工としては、例えば、切削ブレードによる切削やレーザー光線照射によってウェーハＷを分割する分割加工、エキスパンドによる分割加工、レーザー光線照射による孔あけ加工、研削加工、研磨加工等が挙げられる。 Embodiment 1
FIG. 1 is a perspective view of the spinner cleaning apparatus according to the first embodiment. 2 is a vertical sectional view of the spinner cleaning apparatus shown in FIG. A spinner cleaning apparatus 1 shown in the figure is an apparatus for cleaning a wafer W, which is a circular thin plate-shaped object made of a semiconductor material, and then cleaning the wafer W. It is provided in the apparatus or used alone. Examples of the processing to be performed on the wafer W include division processing for dividing the wafer W by cutting with a cutting blade or laser beam irradiation, division processing by expanding, drilling processing by laser beam irradiation, grinding processing, polishing processing, and the like.

本実施形態１に係るスピンナ洗浄装置１は、上面に設けられる保持面１１でウェーハＷを保持する円盤形状の保持テーブル１０と、保持テーブル１０を、鉛直方向を回転軸として回転させる保持テーブル回転部１５と、保持テーブル１０の保持面１１に保持されたウェーハＷ上に向けて洗浄水を噴射する洗浄水噴射手段５０とを備えている。また、スピンナ洗浄装置１は、保持テーブル１０を収容し上面が開口している円筒形状のチャンバー３０を備えており、チャンバー３０の側壁３４には、チャンバー３０内から気体を排出するダクト４５が配設されている。   The spinner cleaning apparatus 1 according to the first embodiment includes a disk-shaped holding table 10 that holds a wafer W on a holding surface 11 provided on an upper surface, and a holding table rotating unit that rotates the holding table 10 around a vertical direction as a rotation axis. 15 and cleaning water spraying means 50 for spraying cleaning water onto the wafer W held on the holding surface 11 of the holding table 10. In addition, the spinner cleaning apparatus 1 includes a cylindrical chamber 30 that houses the holding table 10 and has an open upper surface, and a duct 45 that discharges gas from the chamber 30 is disposed on the side wall 34 of the chamber 30. It is installed.

チャンバー３０の内部には保持テーブル回転部１５を介して保持テーブル１０が、チャンバー３０に対して同心状に配設されている。保持テーブル１０は、ウェーハＷの保持面１１とされる水平な上面に負圧を発生させて、保持面１１にウェーハＷを吸着して保持する一般周知の真空チャック式のものになっている。また、保持テーブル１０には、ウェーハＷの加工時にウェーハＷに取り付けられてウェーハＷを保持するフレーム（図示省略）を保持するクランプ１２が配設されている。   Inside the chamber 30, the holding table 10 is disposed concentrically with respect to the chamber 30 via the holding table rotating unit 15. The holding table 10 is a generally well-known vacuum chuck type that generates negative pressure on a horizontal upper surface, which is the holding surface 11 of the wafer W, and sucks and holds the wafer W on the holding surface 11. The holding table 10 is provided with a clamp 12 that holds a frame (not shown) that is attached to the wafer W and holds the wafer W when the wafer W is processed.

保持テーブル１０を回転させる保持テーブル回転部１５は、保持テーブル１０よりも径が大きい円盤形状に形成されて保持テーブル１０を支持する保持テーブル支持部１６と、鉛直方向を回転軸として保持テーブル支持部１６を回転させる保持テーブル回転軸１７と、保持テーブル１０が回転する際における動力源である保持テーブル用モータ６０と、を有している。このうち、保持テーブル支持部１６は、保持テーブル１０の下面側、即ち、保持テーブル１０における保持面１１が位置する側の反対側に配設されている。保持テーブル１０は、この保持テーブル支持部１６と一体となって回転可能に、保持テーブル支持部１６の上面に連結されている。   The holding table rotating unit 15 that rotates the holding table 10 is formed in a disk shape having a larger diameter than the holding table 10 and supports the holding table 10, and the holding table support unit using the vertical direction as a rotation axis. A holding table rotating shaft 17 that rotates 16 and a holding table motor 60 that is a power source when the holding table 10 rotates are included. Among these, the holding table support part 16 is arrange | positioned on the lower surface side of the holding table 10, ie, the opposite side to the side in which the holding surface 11 in the holding table 10 is located. The holding table 10 is coupled to the upper surface of the holding table support 16 so as to rotate together with the holding table support 16.

また、保持テーブル回転軸１７は、上端が、保持テーブル支持部１６における保持テーブル１０が位置する面側の反対側の面に連結されており、保持テーブル支持部１６から鉛直方向下方に向かって延在している。つまり、保持テーブル回転軸１７は、保持テーブル支持部１６と一体回転可能に保持テーブル支持部１６に連結されている。保持テーブル回転軸１７の下端側は、保持テーブル用モータ６０の出力軸に連結されている。これにより、保持テーブル１０は、保持テーブル用モータ６０で発生する動力により、保持テーブル回転軸１７や保持テーブル支持部１６と共に回転可能になっている。   The upper end of the holding table rotating shaft 17 is connected to the surface of the holding table support 16 opposite to the surface on which the holding table 10 is located, and extends downward from the holding table support 16 in the vertical direction. Exist. In other words, the holding table rotating shaft 17 is connected to the holding table support 16 so as to rotate integrally with the holding table support 16. The lower end side of the holding table rotating shaft 17 is connected to the output shaft of the holding table motor 60. Thus, the holding table 10 can be rotated together with the holding table rotating shaft 17 and the holding table support portion 16 by the power generated by the holding table motor 60.

チャンバー３０は、上端部分に側壁３４から筒の内側方向に水平方向に形成される板状の上面部３１を有している。上面部３１は、保持テーブル１０の径と同程度の径の円形で開口しており、上面部３１における、この開口している部分には、下方に向かって折り返された折返し部３２が設けられている。折返し部３２において、円筒形状のチャンバー３０の軸心に面する部分は、開口部３３になっており、開口部３３は、チャンバー３０の開口部分になっており、円形に開口する状態になっている。   The chamber 30 has a plate-like upper surface portion 31 formed in the horizontal direction from the side wall 34 toward the inner side of the cylinder at the upper end portion. The upper surface portion 31 is opened in a circular shape having a diameter similar to the diameter of the holding table 10, and a folded portion 32 that is folded downward is provided in the opened portion of the upper surface portion 31. ing. In the folded portion 32, a portion facing the axial center of the cylindrical chamber 30 is an opening portion 33, and the opening portion 33 is an opening portion of the chamber 30 and is in a state of opening in a circular shape. Yes.

洗浄水噴射手段５０は、鉛直方向に延在する軸部５６を有しており、軸部５６がチャンバー３０の上面部３１の表面側に配設されることにより、洗浄水噴射手段５０は回動自在にチャンバー３０に取り付けられている。軸部５６には、軸部５６に対して鉛直方向を軸方向として回動可能で、且つ、軸部５６に対して鉛直方向に相対移動可能な昇降部５５が連結されている。即ち、昇降部５５は、チャンバー３０に対して鉛直方向に昇降自在にチャンバー３０の上端側に配設されている。   The cleaning water ejecting means 50 has a shaft portion 56 extending in the vertical direction, and the cleaning water ejecting means 50 is rotated by arranging the shaft portion 56 on the surface side of the upper surface portion 31 of the chamber 30. It is attached to the chamber 30 in a movable manner. The shaft portion 56 is connected to an elevating portion 55 that can rotate with respect to the shaft portion 56 with the vertical direction as an axial direction and can move relative to the shaft portion 56 in the vertical direction. That is, the elevating part 55 is disposed on the upper end side of the chamber 30 so as to be vertically movable with respect to the chamber 30.

昇降部５５からは、水平方向に配管部５２が延びており、その先端、即ち、配管部５２における昇降部５５に接続されている側の端部の反対側の端部には、洗浄水ノズル５１が設けられている。詳しくは、配管部５２は、軸部５６に対して昇降部５５が回動することにより配管部５２がチャンバー３０の軸心に向かう向きになった際におけるチャンバー３０の軸心付近の位置で、下方に折り曲げられている。洗浄水ノズル５１は、配管部５２における折り曲げられている部分の先端に、洗浄水を下方に噴射することができる向きで取り付けられている。   A piping portion 52 extends in the horizontal direction from the lifting / lowering portion 55, and a cleaning water nozzle is provided at the tip of the piping portion 52, i. 51 is provided. Specifically, the piping unit 52 is located at a position near the axis of the chamber 30 when the piping unit 52 is directed toward the axis of the chamber 30 as the elevating unit 55 rotates with respect to the shaft unit 56. It is bent downward. The cleaning water nozzle 51 is attached to the tip of the bent portion of the piping portion 52 in a direction that allows the cleaning water to be jetted downward.

さらに、チャンバー３０内には、保持テーブル１０の表面位置からチャンバー３０の開口部３３までの保持テーブル１０を囲繞する外周空間を覆って円環形状に形成されたファン部材２０と、ファン部材２０を鉛直方向を回転軸として回転させるファン部材回転部２５とが配設されている。   Furthermore, in the chamber 30, a fan member 20 formed in an annular shape covering the outer peripheral space surrounding the holding table 10 from the surface position of the holding table 10 to the opening 33 of the chamber 30, and the fan member 20 are provided. A fan member rotating unit 25 that rotates about the vertical direction as a rotation axis is disposed.

このうち、ファン部材２０は、保持テーブル１０、或いは保持テーブル支持部１６の周囲に複数配設される羽２１によって構成されている。この羽２１は、それぞれ保持テーブル１０や保持テーブル支持部１６の径方向と周方向との双方に対して傾斜し、鉛直方向に延在する向きで形成される板状の形状で形成されている。複数の羽２１は、全て同じ形状で形成され、保持テーブル１０や保持テーブル支持部１６の周方向にそれぞれ離間して、これらの周囲に配設されている。また、複数の羽２１は、保持テーブル１０や保持テーブル支持部１６の径方向と周方向との双方に対する相対的な傾斜の向きや角度が、全て同じ方向で同じ角度になっている。   Among these members, the fan member 20 is constituted by a plurality of blades 21 arranged around the holding table 10 or the holding table support portion 16. Each of the wings 21 is formed in a plate shape that is inclined with respect to both the radial direction and the circumferential direction of the holding table 10 and the holding table support portion 16 and extends in the vertical direction. . The plurality of wings 21 are all formed in the same shape, and are spaced apart from each other in the circumferential direction of the holding table 10 and the holding table support 16 and are disposed around these. Further, the plurality of wings 21 have the same inclination direction and angle in the same direction with respect to both the radial direction and the circumferential direction of the holding table 10 and the holding table support portion 16.

ファン部材回転部２５は、鉛直方向を回転軸としてファン部材支持部２６を回転させるファン部材軸部２７と、ファン部材２０が回転する際における動力源であるファン部材用モータ６１と、を有している。   The fan member rotating section 25 includes a fan member shaft section 27 that rotates the fan member support section 26 with the vertical direction as a rotation axis, and a fan member motor 61 that is a power source when the fan member 20 rotates. ing.

ファン部材支持部２６は、保持テーブル支持部１６の下面側、即ち、保持テーブル支持部１６における保持テーブル１０が連結されている面側の反対側に配設されており、ファン部材支持部２６には、ファン部材２０を構成する複数の羽２１が連結されている。   The fan member support portion 26 is disposed on the lower surface side of the holding table support portion 16, that is, on the opposite side of the holding table support portion 16 to the surface side to which the holding table 10 is connected. Are connected to a plurality of wings 21 constituting the fan member 20.

詳しくは、各羽２１は下端部が、リング形状のファン部材支持部２６の外周端付近に連結されており、これにより複数の羽２１は、リング形状の軸心を中心とする周方向に並んだ状態で互いに離間して配設されている。   Specifically, the lower ends of the wings 21 are connected to the vicinity of the outer peripheral end of the ring-shaped fan member support portion 26, whereby the plurality of wings 21 are arranged in the circumferential direction around the ring-shaped axis. In this state, they are spaced apart from each other.

また、ファン部材支持部２６は、径が開口部３３の径よりも大きくなっており、このため、羽２１は、ファン部材支持部２６から、チャンバー３０の上面部３１に向かって延在している。さらに、羽２１の上端は、チャンバー３０の折返し部３２の下端よりも上方に位置している。これにより、複数の羽２１を有するファン部材２０は、保持テーブル１０の保持面１１である保持テーブル１０の表面位置から、鉛直方向においてチャンバー３０の開口部３３が位置する部分までの空間を含んで、保持テーブル１０の回転軸を中心とする周方向において保持テーブル１０を囲繞する外周空間を覆って、ファン部材２０全体として円環形状に形成されている。また、ファン部材２０は、羽２１の上端が折返し部３２の上方に位置しているため、ファン部材２０は、当該ファン部材２０を支持するファン部材支持部２６とにより、チャンバー３０内におけるファン部材２０の内周側の空間と外周側の空間とを、概ね隔離している。   In addition, the fan member support portion 26 has a diameter larger than the diameter of the opening 33, and thus the wing 21 extends from the fan member support portion 26 toward the upper surface portion 31 of the chamber 30. Yes. Further, the upper end of the wing 21 is located above the lower end of the folded portion 32 of the chamber 30. Thereby, the fan member 20 having the plurality of wings 21 includes a space from the surface position of the holding table 10 which is the holding surface 11 of the holding table 10 to a portion where the opening 33 of the chamber 30 is positioned in the vertical direction. The fan member 20 as a whole is formed in an annular shape so as to cover the outer peripheral space surrounding the holding table 10 in the circumferential direction around the rotation axis of the holding table 10. In addition, since the fan member 20 has the upper end of the wing 21 positioned above the folded portion 32, the fan member 20 is connected to the fan member in the chamber 30 by the fan member support portion 26 that supports the fan member 20. The inner peripheral space 20 and the outer peripheral space are generally separated from each other.

チャンバー３０に設けられるダクト４５は、鉛直方向において、ファン部材２０やファン部材支持部２６が位置する高さとなってチャンバー３０の側壁３４の外周面に設けられており、チャンバー３０の内側空間に連通している。このダクト４５は、スピンナ洗浄装置１からの排気の処理を行う処理設備（図示省略）まで延びており、ダクト４５の途中、または当該処理設備には、チャンバー３０内の空気を吸引してダクト４５に流入させる排気ファン（図示省略）が装備されている。   The duct 45 provided in the chamber 30 is provided at the outer peripheral surface of the side wall 34 of the chamber 30 at a height where the fan member 20 and the fan member support portion 26 are located in the vertical direction, and communicates with the inner space of the chamber 30. doing. The duct 45 extends to a processing facility (not shown) for processing the exhaust from the spinner cleaning apparatus 1, and air in the chamber 30 is sucked into the duct 45 in the middle of the duct 45 or in the processing facility. An exhaust fan (not shown) that is allowed to flow into is installed.

また、ファン部材軸部２７は、上端が、ファン部材支持部２６における保持テーブル１０が位置する面側の反対側の面に連結されており、ファン部材支持部２６から鉛直方向下方に向かって延在している。これらのファン部材支持部２６とファン部材軸部２７とには、軸心付近に、保持テーブル回転軸１７の径よりも大きい径で鉛直方向にあけられた孔である挿通孔２８が形成されている。つまり、ファン部材軸部２７は、円筒形状で形成されており、その上端がファン部材支持部２６に連結されている。保持テーブル支持部１６から下方に向かって形成されている保持テーブル回転軸１７は、挿通孔２８に挿入されて鉛直方向に延在している。   The upper end of the fan member shaft portion 27 is connected to the surface of the fan member support portion 26 opposite to the surface on which the holding table 10 is located, and extends downward from the fan member support portion 26 in the vertical direction. Exist. In the fan member support portion 26 and the fan member shaft portion 27, an insertion hole 28 is formed in the vicinity of the shaft center. The insertion hole 28 is a hole opened in the vertical direction with a diameter larger than the diameter of the holding table rotating shaft 17. Yes. That is, the fan member shaft portion 27 is formed in a cylindrical shape, and its upper end is connected to the fan member support portion 26. The holding table rotating shaft 17 formed downward from the holding table support portion 16 is inserted into the insertion hole 28 and extends in the vertical direction.

ファン部材２０を支持するファン部材支持部２６は、ファン部材用モータ６１で発生する動力によって回転することにより、ファン部材２０を一体回転させることが可能になっている。詳しくは、ファン部材用モータ６１の出力軸には、動力の伝達に用いるファン部材用駆動側プーリ６２が連結されており、ファン部材用モータ６１は、ファン部材用モータ６１の駆動時に、ファン部材用モータ６１の出力軸と一体となって回転可能に設けられている。   The fan member support portion 26 that supports the fan member 20 can rotate integrally with the fan member 20 by rotating by the power generated by the fan member motor 61. More specifically, a fan member drive pulley 62 used for power transmission is connected to the output shaft of the fan member motor 61, and the fan member motor 61 is operated when the fan member motor 61 is driven. It is provided so as to be integrated with the output shaft of the motor 61 for rotation.

また、ファン部材軸部２７の下端には、ファン部材軸部２７と一体となって回転するファン部材用従動側プーリ６３が連結されている。ファン部材用従動側プーリ６３には、ファン部材軸部２７と同様に、軸心の中心付近に、保持テーブル回転軸１７の径よりも大きい径で鉛直方向に孔があけられており、保持テーブル回転軸１７は、この孔も通って鉛直方向に延在している。   A fan member driven pulley 63 that rotates integrally with the fan member shaft portion 27 is connected to the lower end of the fan member shaft portion 27. In the fan member driven pulley 63, as in the fan member shaft portion 27, a hole is formed in the vertical direction in the vicinity of the center of the shaft with a diameter larger than the diameter of the holding table rotating shaft 17. The rotating shaft 17 extends through the hole in the vertical direction.

これらのファン部材用駆動側プーリ６２とファン部材用従動側プーリ６３とには、双方のプーリ間での動力の伝達に用いるベルト６５が掛け回されており、ファン部材用モータ６１で発生した動力は、ファン部材用駆動側プーリ６２、ベルト６５、ファン部材用従動側プーリ６３を介してファン部材軸部２７に伝達可能になっている。ファン部材支持部２６は、ファン部材用モータ６１で発生してファン部材軸部２７に伝達する動力により、ファン部材２０と一体となって回転することが可能になっている。   The fan member driving pulley 62 and the fan member driven pulley 63 are wound around a belt 65 used to transmit power between the pulleys, and the power generated by the fan member motor 61 is Can be transmitted to the fan member shaft portion 27 via the fan member driving pulley 62, the belt 65, and the fan member driven pulley 63. The fan member support portion 26 can rotate integrally with the fan member 20 by the power generated by the fan member motor 61 and transmitted to the fan member shaft portion 27.

また、チャンバー３０の内側には、保持テーブル１０が配設されている側の空間と、保持テーブル用モータ６０やファン部材用モータ６１が配設されている側の空間とを仕切る隔壁部４０が設けられている。   Further, inside the chamber 30, there is a partition 40 that partitions the space on the side where the holding table 10 is disposed and the space on the side where the holding table motor 60 and the fan member motor 61 are disposed. Is provided.

隔壁部４０は、ファン部材支持部２６における保持テーブル支持部１６が位置する側の反対側に位置しており、外周部分がチャンバー３０の側壁３４の内周面に連結される、リング形状で形成されている。   The partition wall portion 40 is located on the opposite side of the fan member support portion 26 from the side where the holding table support portion 16 is located, and the outer peripheral portion is formed in a ring shape connected to the inner peripheral surface of the side wall 34 of the chamber 30. Has been.

隔壁部４０には、ファン部材軸部２７の径よりも大きい径で鉛直方向にあけられた孔をチャンバー３０の軸心付近に有する孔部４１が設けられている。孔部４１は、円筒形状に形成されることにより、内側に孔を有しており、ファン部材軸部２７は、孔部４１の内側の孔を通って、鉛直方向に延在している。また、孔部４１は、隔壁部４０から鉛直方向上方に突出しており、上端がファン部材支持部２６の近傍下方に位置している。即ち、孔部４１は、ファン部材軸部２７の周囲を覆って、隔壁部４０からファン部材支持部２６の近傍にかけて設けられている。   The partition wall portion 40 is provided with a hole portion 41 having a hole formed in the vertical direction with a diameter larger than the diameter of the fan member shaft portion 27 in the vicinity of the axial center of the chamber 30. The hole portion 41 is formed in a cylindrical shape so as to have a hole on the inner side, and the fan member shaft portion 27 extends in the vertical direction through the hole on the inner side of the hole portion 41. Further, the hole portion 41 protrudes upward in the vertical direction from the partition wall portion 40, and the upper end is located near the lower portion of the fan member support portion 26. That is, the hole 41 covers the periphery of the fan member shaft portion 27 and is provided from the partition wall portion 40 to the vicinity of the fan member support portion 26.

隔壁部４０における保持テーブル用モータ６０やファン部材用モータ６１が配設されている空間側の面には、軸受支持部材４２が設けられている。軸受支持部材４２は、隔壁部４０からファン部材軸部２７の方向に向かって設けられており、ファン部材軸部２７側の端部で、ファン部材回転部ベアリング６８を支持している。ファン部材回転部ベアリング６８は、ファン部材軸部２７を回転可能に支持するベアリングになっており、軸受支持部材４２は、このファン部材軸部２７用のベアリングであるファン部材回転部ベアリング６８を支持している。   A bearing support member 42 is provided on the space-side surface of the partition 40 where the holding table motor 60 and the fan member motor 61 are disposed. The bearing support member 42 is provided from the partition wall portion 40 toward the fan member shaft portion 27, and supports the fan member rotating portion bearing 68 at the end portion on the fan member shaft portion 27 side. The fan member rotating portion bearing 68 is a bearing that rotatably supports the fan member shaft portion 27, and the bearing support member 42 supports the fan member rotating portion bearing 68 that is a bearing for the fan member shaft portion 27. doing.

さらに、この隔壁部４０とファン部材支持部２６とには、洗浄水の一部を排水する排水孔が形成されている。具体的には、ファン部材支持部２６には、ファン部材支持部２６の外周付近、即ち、羽２１が連結されている部分付近に、当該ファン部材支持部２６を鉛直方向に貫通する孔が形成されており、この孔によって排水孔２９が形成されている。また、隔壁部４０には、隔壁部４０における外周付近に、当該隔壁部４０を鉛直方向に貫通する孔が形成されており、この孔によって排水孔４３が形成されている。   Further, the partition wall 40 and the fan member support 26 are formed with drain holes for draining a part of the cleaning water. Specifically, a hole penetrating the fan member support portion 26 in the vertical direction is formed in the fan member support portion 26 in the vicinity of the outer periphery of the fan member support portion 26, that is, in the vicinity of the portion where the wings 21 are connected. The drainage hole 29 is formed by this hole. In addition, a hole penetrating the partition wall 40 in the vertical direction is formed in the partition wall 40 in the vicinity of the outer periphery of the partition wall 40, and a drain hole 43 is formed by the hole.

この実施形態１に係るスピンナ洗浄装置１は、以上のごとき構成からなり、以下、その作用について説明する。スピンナ洗浄装置１でウェーハＷの洗浄を行う際には、軸部５６を中心として洗浄水噴射手段５０を回動させて、洗浄水噴射手段５０を開口部３３に対して鉛直方向において重ならない位置である退避位置に移動させる。その際に、洗浄水噴射手段５０は、昇降部５５を上昇させることにより、洗浄水ノズル５１がチャンバー３０の上面部３１よりも上方に位置するように洗浄水噴射手段５０全体を上方に移動させた状態で、退避位置に移動させる。   The spinner cleaning apparatus 1 according to the first embodiment is configured as described above, and the operation thereof will be described below. When the wafer W is cleaned by the spinner cleaning apparatus 1, the cleaning water ejecting means 50 is rotated about the shaft portion 56 so that the cleaning water ejecting means 50 does not overlap the opening 33 in the vertical direction. It moves to the retracted position. At that time, the cleaning water ejecting unit 50 moves the entire cleaning water ejecting unit 50 upward so that the cleaning water nozzle 51 is positioned above the upper surface portion 31 of the chamber 30 by raising the elevating unit 55. In this state, move it to the retracted position.

次に、加工を行って洗浄前のウェーハＷを、開口部３３からチャンバー３０内に入れて、保持テーブル１０の保持面１１上に載置する。保持テーブル１０は、ウェーハＷと保持面１１との間を負圧にすることによってウェーハＷを吸着し、また、ウェーハＷを保持するフレームをクランプ１２で保持することにより、ウェーハＷを保持面１１上に保持する。さらに、チャンバー３０内の空気を吸引する排気ファンを作動させてチャンバー３０内の空気を、ダクト４５を経て外部に排出することにより、洗浄の準備を行う。   Next, the wafer W before processing and cleaning is put into the chamber 30 from the opening 33 and placed on the holding surface 11 of the holding table 10. The holding table 10 sucks the wafer W by applying a negative pressure between the wafer W and the holding surface 11, and holds the frame holding the wafer W with the clamp 12, thereby holding the wafer W on the holding surface 11. Hold on. Further, the exhaust fan that sucks the air in the chamber 30 is operated to discharge the air in the chamber 30 to the outside through the duct 45 to prepare for cleaning.

この状態で、保持テーブル用モータ６０を作動させることにより、保持テーブル回転軸１７及び保持テーブル支持部１６と一体に保持テーブル１０を回転させ、保持テーブル１０を、例えば、８００ｒｐｍ程度の回転速度で回転させる。また、ファン部材用モータ６１も作動させて、ファン部材用モータ６１で発生した動力をベルト６５を介してファン部材軸部２７に伝達し、ファン部材軸部２７及びファン部材支持部２６と一体にファン部材２０を回転させる。その際の回転方向は、傾斜している羽２１の回転によって、ファン部材２０の内側から外側に向かって気流が発生する方向に、回転軸を中心として回転させる。   In this state, by operating the holding table motor 60, the holding table 10 is rotated integrally with the holding table rotating shaft 17 and the holding table support portion 16, and the holding table 10 is rotated at a rotation speed of about 800 rpm, for example. Let Further, the fan member motor 61 is also operated, and the power generated by the fan member motor 61 is transmitted to the fan member shaft portion 27 via the belt 65, and is integrated with the fan member shaft portion 27 and the fan member support portion 26. The fan member 20 is rotated. The rotation direction at that time is rotated around the rotation axis in a direction in which an air flow is generated from the inside to the outside of the fan member 20 by the rotation of the inclined wing 21.

これにより、ファン部材２０を構成する各羽２１は、ファン部材２０の形状である円環形状の内側から外側方向へ流れる気流を発生させ、保持テーブル１０の上部の空気を、ファン部材２０の円環形状の外側へ流す。このように、ファン部材２０は、ファン部材回転部２５によって回転することにより、保持テーブル１０の上部で、且つ、ファン部材２０の円環形状内周部３６からファン部材２０の外周部３７へ空気の流れを発生させる。   Thereby, each wing | blade 21 which comprises the fan member 20 generate | occur | produces the airflow which flows into the outer side from the inner side of the annular shape which is the shape of the fan member 20, and the air of the upper part of the holding table 10 is made into the circle | round | yen of the fan member 20. Flow outside the ring shape. As described above, the fan member 20 is rotated by the fan member rotating portion 25, so that air is supplied from the annular inner peripheral portion 36 of the fan member 20 to the outer peripheral portion 37 of the fan member 20. Generate a flow of

保持テーブル１０やファン部材２０を回転させることにより、ウェーハＷを洗浄させる準備ができたら、軸部５６を中心として洗浄水噴射手段５０を回動させることにより、洗浄水ノズル５１を、保持テーブル１０で保持しているウェーハＷの上方に位置させる。さらに、昇降部５５を下降させることにより、洗浄水ノズル５１をウェーハＷに近付ける。   When the wafer W is ready to be cleaned by rotating the holding table 10 and the fan member 20, the cleaning water nozzle 51 is moved to the holding table 10 by rotating the cleaning water ejecting means 50 about the shaft portion 56. Is positioned above the wafer W held by the Furthermore, the cleaning water nozzle 51 is brought closer to the wafer W by lowering the elevating unit 55.

この状態で、洗浄水ノズル５１から洗浄水を下方に噴出することにより、ウェーハＷに向けて洗浄水を噴出する。その際に、洗浄水ノズル５１がウェーハＷの上方に位置する範囲内で、軸部５６を中心として洗浄水噴射手段５０を回動させながら噴出する。洗浄水の噴出中も保持テーブル１０は回転し続けているため、洗浄水は、ウェーハＷの上面全面に供給され、切削屑や研削屑等のウェーハＷに付着している汚れ成分は、洗浄水によって洗い流される。   In this state, the cleaning water is jetted toward the wafer W by jetting the cleaning water downward from the cleaning water nozzle 51. At this time, the cleaning water nozzle 51 is ejected while rotating the cleaning water ejecting means 50 around the shaft portion 56 within a range where the cleaning water nozzle 51 is located above the wafer W. Since the holding table 10 continues to rotate even while the cleaning water is ejected, the cleaning water is supplied to the entire upper surface of the wafer W, and dirt components adhering to the wafer W such as cutting scraps and grinding scraps are cleaned water. Washed away by.

ウェーハＷの洗浄時は、このようにウェーハＷの汚れ成分を洗浄水によって洗い流すため、チャンバー３０内には、この汚れ成分によって汚染された洗浄水や噴霧が発生するが、これらの洗浄水や噴霧は、回転するファン部材２０で発生する気流により、ウェーハＷの上方から除去される。つまり、汚染された洗浄水や噴霧は、保持テーブル１０の上方から、ファン部材２０の円環形状における外側に排出される。   When cleaning the wafer W, since the dirt component of the wafer W is washed away by the cleaning water in this way, cleaning water and spray contaminated by the dirt component are generated in the chamber 30. These cleaning water and spray are generated. Is removed from above the wafer W by the airflow generated by the rotating fan member 20. That is, the contaminated cleaning water or spray is discharged from above the holding table 10 to the outside of the fan member 20 in the annular shape.

ファン部材２０の外側に排出された洗浄水や噴霧は、チャンバー３０内の空気を吸引する排気ファンにより、空気と共にチャンバー３０を通ってダクト４５に流れ、チャンバー３０内から排出される。つまり、ファン部材２０は、回転して保持テーブル１０の上部の空気をファン部材２０の円環形状内周部３６からファン部材２０の外周部３７へ流すことにより、ウェーハＷの洗浄時の洗浄水及び噴霧を、ファン部材２０の外部へ強制排気し、ダクト４５へ導く。換言すると、ファン部材２０は、ファン部材２０の外周部３７側の空間に位置する空気に対して圧縮力を付与し、排気ファンは、この空気を吸引するため、ファン部材２０の外周部３７側に排出された洗浄水や噴霧は、この圧縮力と吸引力とにより、ファン部材２０の外周部３７側の空間に位置する空気と共にチャンバー３０内を流れてダクト４５から排出される。   The cleaning water or spray discharged to the outside of the fan member 20 flows to the duct 45 through the chamber 30 together with the air by the exhaust fan that sucks the air in the chamber 30 and is discharged from the chamber 30. That is, the fan member 20 rotates and causes the air above the holding table 10 to flow from the annular inner peripheral portion 36 of the fan member 20 to the outer peripheral portion 37 of the fan member 20, thereby cleaning water when cleaning the wafer W. The spray is forcibly exhausted to the outside of the fan member 20 and guided to the duct 45. In other words, the fan member 20 applies a compressive force to the air located in the space on the outer peripheral portion 37 side of the fan member 20, and the exhaust fan sucks this air. The washing water and the spray discharged to the air flow in the chamber 30 together with the air located in the space on the outer peripheral portion 37 side of the fan member 20 and are discharged from the duct 45 by the compression force and the suction force.

所定の洗浄時間が経過したら、洗浄水噴射手段５０からの洗浄水の噴射は停止するが、保持テーブル１０は回転を継続し、ウェーハＷに付着している洗浄水を遠心力で吹き飛ばす。その際に、保持テーブル１０は、３０００ｒｐｍ程度まで回転速度を上昇させることにより遠心力を増大させ、洗浄水を速やかに吹き飛ばして洗浄後のウェーハＷを乾燥させる。   When the predetermined cleaning time has elapsed, the cleaning water spraying from the cleaning water spraying unit 50 stops, but the holding table 10 continues to rotate, and the cleaning water adhering to the wafer W is blown off by centrifugal force. At that time, the holding table 10 increases the centrifugal force by increasing the rotational speed to about 3000 rpm, and blows the cleaning water quickly to dry the cleaned wafer W.

また、この乾燥過程では、ファン部材２０も回転を継続するが、ファン部材２０は保持テーブル１０とは異なり、回転速度を上昇させることなく、洗浄時の回転速度と同じ回転速度を維持して回転を継続する。これにより、ファン部材２０は、洗浄時と同様の気流を発生させ、ウェーハＷの遠心力によって吹き飛んだ洗浄水を、ファン部材２０の外部に排出する。   In this drying process, the fan member 20 also continues to rotate. However, unlike the holding table 10, the fan member 20 rotates while maintaining the same rotational speed as that during cleaning without increasing the rotational speed. Continue. As a result, the fan member 20 generates an air flow similar to that at the time of cleaning, and discharges the cleaning water blown off by the centrifugal force of the wafer W to the outside of the fan member 20.

また、乾燥過程では、チャンバー３０内の空気を吸引する排気ファンも継続して運転するため、ファン部材２０の外部に排出された洗浄水は、チャンバー３０内を通ってダクト４５へ導かれる。これにより、ファン部材２０から吹き飛んだ洗浄水は、ウェーハＷ側に戻ることなくダクト４５から排出され、ウェーハＷは乾燥する。   Further, in the drying process, the exhaust fan that sucks the air in the chamber 30 is continuously operated, so that the cleaning water discharged to the outside of the fan member 20 is guided to the duct 45 through the chamber 30. Thereby, the cleaning water blown off from the fan member 20 is discharged from the duct 45 without returning to the wafer W side, and the wafer W is dried.

また、汚染された洗浄水のうち、ファン部材２０によって外周部３７側に排出されなかった洗浄水は、保持テーブル１０や保持テーブル回転部１５の下方に位置するファン部材支持部２６上に流れる。ファン部材支持部２６上に流れた洗浄水は、排水孔２９から排出され、隔壁部４０側に流れる。隔壁部４０側に流れた洗浄水のうち、一部は、ファン部材２０と排気ファンとによる空気の流れにより、ダクト４５に向かって流れ、ダクト４５から排出される。また、ダクト４５から排出されずに隔壁部４０上に残った洗浄水は、隔壁部４０の排水孔４３から排出される。   Of the contaminated cleaning water, the cleaning water that has not been discharged to the outer peripheral portion 37 side by the fan member 20 flows on the fan member support portion 26 located below the holding table 10 and the holding table rotating portion 15. The washing water that has flowed onto the fan member support portion 26 is discharged from the drain hole 29 and flows toward the partition wall 40 side. Part of the washing water that has flowed to the partition wall 40 side flows toward the duct 45 and is discharged from the duct 45 by the air flow caused by the fan member 20 and the exhaust fan. Further, the cleaning water remaining on the partition wall 40 without being discharged from the duct 45 is discharged from the drain hole 43 of the partition wall 40.

所定の乾燥時間が経過したら、保持テーブル１０とファン部材２０の回転を停止し、洗浄水噴射手段５０を退避位置に戻す。その後、保持テーブル１０でのウェーハＷの保持を解除し、ウェーハＷを保持テーブル１０から取り上げて次の工程に移す。   When the predetermined drying time has elapsed, the rotation of the holding table 10 and the fan member 20 is stopped, and the cleaning water ejecting means 50 is returned to the retracted position. Thereafter, the holding of the wafer W on the holding table 10 is released, and the wafer W is picked up from the holding table 10 and moved to the next step.

以上の実施形態１に係るスピンナ洗浄装置１は、円周方向に並ぶ複数の羽２１によって、保持テーブル１０を囲繞する外周空間を覆って円環形状に形成されたファン部材２０を設け、ファン部材回転部２５によりファン部材２０を回転させることにより、保持テーブル１０の上部で、ファン部材２０の円環形状内周部３６側から外周部３７へ空気の流れを発生させることができる。これにより、洗浄時の洗浄水や噴霧を、ウェーハＷの上方から強制的に排出し、ダクト４５に導くことができる。この結果、スピンナ洗浄において、洗浄時の汚染された噴霧及び洗浄水がウェーハＷへ再付着することを防止することができる。   The spinner cleaning apparatus 1 according to the first embodiment includes the fan member 20 formed in an annular shape so as to cover the outer peripheral space surrounding the holding table 10 by the plurality of blades 21 arranged in the circumferential direction. By rotating the fan member 20 by the rotating portion 25, it is possible to generate an air flow from the annular inner peripheral portion 36 side of the fan member 20 to the outer peripheral portion 37 at the upper portion of the holding table 10. Thereby, the cleaning water and spray at the time of cleaning can be forcibly discharged from above the wafer W and guided to the duct 45. As a result, in the spinner cleaning, the contaminated spray and cleaning water during cleaning can be prevented from reattaching to the wafer W.

また、ファン部材２０を、保持テーブル１０とは独立して回転させることができるので、ウェーハＷの洗浄時や乾燥時に、保持テーブル１０とファン部材２０とをそれぞれ必要に応じた適切な回転数で回転させることができる。例えば、ウェーハＷの洗浄過程において、保持テーブル１０の回転速度を段階的に変化させる場合でも、ファン部材２０の回転速度を一定にすることができ、ファン部材２０で発生する外側方向への吸引力を一定にすることができる。この結果、洗浄時の汚染された噴霧及び洗浄水がウェーハＷへ再付着することを防止しつつ、ウェーハＷの洗浄性能や乾燥性能を向上させることができる。   Further, since the fan member 20 can be rotated independently of the holding table 10, the holding table 10 and the fan member 20 can be rotated at an appropriate number of rotations as necessary when the wafer W is cleaned or dried. Can be rotated. For example, even when the rotational speed of the holding table 10 is changed stepwise in the cleaning process of the wafer W, the rotational speed of the fan member 20 can be made constant, and the suction force in the outward direction generated by the fan member 20 can be maintained. Can be made constant. As a result, the cleaning performance and the drying performance of the wafer W can be improved while preventing the contaminated spray and cleaning water during the cleaning from reattaching to the wafer W.

〔実施形態２〕
実施形態２に係るスピンナ洗浄装置７０は、実施形態１に係るスピンナ洗浄装置１と略同様の構成であるが、保持テーブルがファン部材回転部を兼ねている点に特徴がある。他の構成は実施形態１と同様なので、その説明を省略すると共に、同一の符号を付す。 [Embodiment 2]
The spinner cleaning device 70 according to the second embodiment has substantially the same configuration as the spinner cleaning device 1 according to the first embodiment, but is characterized in that the holding table also serves as a fan member rotating portion. Since other configurations are the same as those of the first embodiment, the description thereof is omitted and the same reference numerals are given.

図３は、実施形態２に係るスピンナ洗浄装置の断面図である。本実施形態２に係るスピンナ洗浄装置７０は、実施形態１に係るスピンナ洗浄装置１と同様に、ウェーハＷを保持する保持テーブル１０と、保持テーブル１０を回転させる保持テーブル回転部７１と、ウェーハＷ上に向けて洗浄水を噴射する洗浄水噴射手段５０とを備えており、さらに、保持テーブル１０を収容し、側壁３４にダクト４５が配設されたチャンバー３０を備えている。このうち、保持テーブル回転部７１は、保持テーブル１０を支持する保持テーブル支持部７２と、鉛直方向を回転軸として保持テーブル支持部７２を回転させる保持テーブル回転軸７３と、保持テーブル１０が回転する際における動力源であるモータ７８と、を有している。   FIG. 3 is a cross-sectional view of the spinner cleaning apparatus according to the second embodiment. Similar to the spinner cleaning apparatus 1 according to the first embodiment, the spinner cleaning apparatus 70 according to the second embodiment includes a holding table 10 that holds the wafer W, a holding table rotating unit 71 that rotates the holding table 10, and a wafer W. A cleaning water injection means 50 for injecting the cleaning water upward is provided, and further, a chamber 30 that houses the holding table 10 and in which a duct 45 is disposed on the side wall 34 is provided. Among these, the holding table rotating unit 71 rotates the holding table supporting unit 72 that supports the holding table 10, the holding table rotating shaft 73 that rotates the holding table supporting unit 72 about the vertical direction as the rotation axis, and the holding table 10. And a motor 78 which is a power source at the time.

また、本実施形態２に係るスピンナ洗浄装置７０は、実施形態１に係るスピンナ洗浄装置１と同様に、保持テーブル１０の周囲に複数配設される羽２１によって構成されるファン部材２０を備えている。このファン部材２０は、実施形態１に係るスピンナ洗浄装置１とは異なり、保持テーブル回転部７１が有する保持テーブル支持部７２に連結され、支持されている。つまり、ファン部材２０は、保持テーブル支持部７２の外周に固定され、保持テーブル回転部７１が、ファン部材２０を鉛直方向を回転軸として回転させるファン部材回転部７５を兼ねている。このため、ファン部材２０は、保持テーブル１０の回転とともに回転する。詳しくは、ファン部材２０を構成する複数の羽２１は、保持テーブル支持部７２において保持テーブル１０が連結される面である上面に、各羽２１の下端部が連結されている。   Further, the spinner cleaning device 70 according to the second embodiment includes the fan member 20 including a plurality of blades 21 arranged around the holding table 10, similarly to the spinner cleaning device 1 according to the first embodiment. Yes. Unlike the spinner cleaning apparatus 1 according to the first embodiment, the fan member 20 is connected to and supported by a holding table support portion 72 included in the holding table rotating portion 71. That is, the fan member 20 is fixed to the outer periphery of the holding table support portion 72, and the holding table rotating portion 71 also serves as the fan member rotating portion 75 that rotates the fan member 20 about the vertical direction as the rotation axis. For this reason, the fan member 20 rotates with the rotation of the holding table 10. Specifically, in the plurality of wings 21 constituting the fan member 20, the lower end portions of the wings 21 are connected to the upper surface which is the surface to which the holding table 10 is connected in the holding table support portion 72.

また、保持テーブル支持部７２は、径がチャンバー３０の開口部３３の径よりも大きくなっており、このため、羽２１は、保持テーブル支持部７２から、チャンバー３０の上面部３１に向かって延在している。さらに、羽２１の上端は、チャンバー３０の折返し部３２の下端よりも上方に位置している。これにより、複数の羽２１を有するファン部材２０は、保持テーブル１０の保持面１１である保持テーブル１０の表面位置から、鉛直方向においてチャンバー３０の開口部３３が位置する部分までの空間を含んで、保持テーブル１０の回転軸を中心とする周方向において保持テーブル１０を囲繞する外周空間を覆って、ファン部材２０全体として円環形状に形成されている。   In addition, the holding table support portion 72 has a diameter larger than the diameter of the opening 33 of the chamber 30, so that the wings 21 extend from the holding table support portion 72 toward the upper surface portion 31 of the chamber 30. Exist. Further, the upper end of the wing 21 is located above the lower end of the folded portion 32 of the chamber 30. Thereby, the fan member 20 having the plurality of wings 21 includes a space from the surface position of the holding table 10 which is the holding surface 11 of the holding table 10 to a portion where the opening 33 of the chamber 30 is positioned in the vertical direction. The fan member 20 as a whole is formed in an annular shape so as to cover the outer peripheral space surrounding the holding table 10 in the circumferential direction around the rotation axis of the holding table 10.

また、ファン部材２０は、羽２１の上端が折返し部３２の下端よりも上方に位置しているため、ファン部材２０は、当該ファン部材２０を支持する保持テーブル支持部７２とにより、チャンバー３０内におけるファン部材２０の内周側の空間と外周側の空間とを、概ね隔離している。   In addition, since the fan member 20 has the upper end of the wing 21 positioned above the lower end of the folded portion 32, the fan member 20 is connected to the inside of the chamber 30 by the holding table support portion 72 that supports the fan member 20. The space on the inner peripheral side of the fan member 20 and the space on the outer peripheral side are generally separated from each other.

この実施形態２に係るスピンナ洗浄装置７０は、以上のごとき構成からなり、以下、その作用について説明する。スピンナ洗浄装置７０でウェーハＷの洗浄を行う際には、洗浄前のウェーハＷを保持テーブル１０の保持面１１で保持した状態で、チャンバー３０内の空気を吸引する排気ファンを作動させて、チャンバー３０内の空気を、ダクト４５を経て外部に排出することにより、洗浄の準備を行う。   The spinner cleaning apparatus 70 according to the second embodiment is configured as described above, and the operation thereof will be described below. When the wafer W is cleaned by the spinner cleaning apparatus 70, the exhaust fan that sucks air in the chamber 30 is operated while the wafer W before cleaning is held by the holding surface 11 of the holding table 10, and the chamber The air in 30 is discharged to the outside through the duct 45 to prepare for cleaning.

この状態で、モータ７８を作動させることにより、保持テーブル回転軸７３及び保持テーブル支持部７２と一体に保持テーブル１０を回転させ、保持テーブル１０は、例えば、８００ｒｐｍ程度の回転速度で回転させる。また、このように保持テーブル支持部７２が回転することにより、ファン部材２０も回転する。つまり、ファン部材２０は、保持テーブル１０と一体となって回転する。保持テーブル１０の回転時に、保持テーブル１０と共にファン部材２０も回転することにより、ファン部材２０は、保持テーブル１０の上部で、且つ、ファン部材２０の円環形状内周部３６からファン部材２０の外周部３７へ空気の流れを発生させる。   In this state, by operating the motor 78, the holding table 10 is rotated integrally with the holding table rotating shaft 73 and the holding table support 72, and the holding table 10 is rotated at a rotation speed of about 800 rpm, for example. Further, as the holding table support portion 72 rotates in this way, the fan member 20 also rotates. That is, the fan member 20 rotates integrally with the holding table 10. When the holding table 10 is rotated, the fan member 20 is also rotated together with the holding table 10, so that the fan member 20 is located above the holding table 10 and from the annular inner peripheral portion 36 of the fan member 20. An air flow is generated on the outer peripheral portion 37.

保持テーブル１０とファン部材２０とを回転させることにより、ウェーハＷを洗浄させる準備ができたら、洗浄水噴射手段５０を作動させて、洗浄水ノズル５１を、ウェーハＷの上方に位置させ、且つ、ウェーハＷに近付ける。この状態で、洗浄水噴射手段５０を回動させながら、洗浄水ノズル５１からウェーハＷに向けて洗浄水を噴出することにより、ウェーハＷに付着している切削屑や研削屑等の汚れ成分を、洗浄水によって洗い流す。   When the wafer W is ready to be cleaned by rotating the holding table 10 and the fan member 20, the cleaning water injection means 50 is operated so that the cleaning water nozzle 51 is positioned above the wafer W, and Approach the wafer W. In this state, the cleaning water jetting means 50 is rotated, and cleaning water is ejected from the cleaning water nozzle 51 toward the wafer W, thereby removing dirt components such as cutting scraps and grinding scraps adhering to the wafer W. Rinse with wash water.

ウェーハＷの洗浄時における汚染された洗浄水や噴霧は、回転するファン部材２０で発生する気流により、保持テーブル１０の上方から、ファン部材２０の円環形状における外側に排出され、ウェーハＷの上方から除去される。ファン部材２０の外側に排出された洗浄水や噴霧は、チャンバー３０内の空気を吸引する排気ファンにより、空気と共にチャンバー３０を通ってダクト４５に流れ、チャンバー３０内から排出される。   Contaminated cleaning water or spray during cleaning of the wafer W is discharged from the upper side of the holding table 10 to the outside of the annular shape of the fan member 20 by the airflow generated by the rotating fan member 20 and above the wafer W. Removed from. The cleaning water or spray discharged to the outside of the fan member 20 flows to the duct 45 through the chamber 30 together with the air by the exhaust fan that sucks the air in the chamber 30 and is discharged from the chamber 30.

所定の洗浄時間が経過したら、洗浄水噴射手段５０からの洗浄水の噴射は停止し、保持テーブル１０の回転速度を上昇させることにより遠心力を増大させて、洗浄水を吹き飛ばしてウェーハＷを乾燥させる。この場合、保持テーブル支持部７２に連結されるファン部材２０の回転速度も上昇するため、ファン部材２０で発生する気流も、洗浄時よりも強くなる。これにより、ウェーハＷの遠心力によって吹き飛んだ洗浄水は、この強くなった気流により、ファン部材２０の外部に勢い良く排出される。   When a predetermined cleaning time has elapsed, the injection of the cleaning water from the cleaning water injection means 50 is stopped, the rotational speed of the holding table 10 is increased, the centrifugal force is increased, and the cleaning water is blown away to dry the wafer W. Let In this case, since the rotational speed of the fan member 20 connected to the holding table support portion 72 also increases, the airflow generated in the fan member 20 becomes stronger than during cleaning. As a result, the cleaning water blown off by the centrifugal force of the wafer W is vigorously discharged to the outside of the fan member 20 by the strengthened airflow.

ファン部材２０の外部に排出された洗浄水はダクト４５から排出され、ファン部材２０から吹き飛んだ洗浄水は、ウェーハＷ側に戻ることがないため、ウェーハＷは乾燥する。所定の乾燥時間が経過したら、保持テーブル１０とファン部材２０との回転を停止して洗浄水噴射手段５０を退避位置に戻し、ウェーハＷを保持テーブル１０から取り上げて次の工程に移す。   The cleaning water discharged to the outside of the fan member 20 is discharged from the duct 45, and the cleaning water blown off from the fan member 20 does not return to the wafer W side, so the wafer W is dried. When the predetermined drying time has elapsed, the rotation of the holding table 10 and the fan member 20 is stopped, the cleaning water ejecting means 50 is returned to the retracted position, and the wafer W is picked up from the holding table 10 and moved to the next step.

以上の実施形態２に係るスピンナ洗浄装置７０は、ファン部材２０は保持テーブル回転部７１に固定されて、保持テーブル回転部７１がファン部材回転部７５を兼ねているため、ファン部材２０を回転可能に支持するための部材や機構を新たに設けることなく、ファン部材２０を回転させることができる。これにより、構造を複雑化させることなく、ウェーハＷの上方から外側方向への気流を発生させるファン部材２０を設けることができる。この結果、汚染された噴霧及び洗浄水がウェーハＷへ再付着することを防止する際の製造コストを抑えることができる。   In the spinner cleaning device 70 according to the second embodiment described above, the fan member 20 is fixed to the holding table rotating unit 71, and the holding table rotating unit 71 also serves as the fan member rotating unit 75. Therefore, the fan member 20 can rotate. The fan member 20 can be rotated without newly providing a member or mechanism for supporting the fan member 20. Thereby, the fan member 20 which generates the airflow from the upper direction to the outer side of the wafer W can be provided without complicating the structure. As a result, the manufacturing cost for preventing the contaminated spray and cleaning water from reattaching to the wafer W can be suppressed.

〔変形例〕
なお、実施形態１に係るスピンナ洗浄装置１では、ウェーハＷの洗浄後の乾燥時は、保持テーブル１０は回転速度を洗浄時の回転速度よりも高くしているのに対し、ファン部材２０の回転速度を洗浄時の回転速度と同じ回転速度にして回転させているが、乾燥時にファン部材２０の回転速度を変化させてもよい。例えば、乾燥時には、ファン部材２０の回転速度を保持テーブル１０の回転速度と同程度にしてもよく、または、ファン部材２０の回転速度を保持テーブル１０の回転速度よりも高くしてもよい。 [Modification]
In the spinner cleaning apparatus 1 according to the first embodiment, when the wafer W is dried after cleaning, the rotation speed of the holding table 10 is higher than the rotation speed during cleaning, whereas the rotation of the fan member 20 is performed. Although the rotation speed is set to the same rotation speed as that at the time of cleaning, the rotation speed of the fan member 20 may be changed during drying. For example, at the time of drying, the rotation speed of the fan member 20 may be approximately the same as the rotation speed of the holding table 10, or the rotation speed of the fan member 20 may be higher than the rotation speed of the holding table 10.

また、実施形態１に係るスピンナ洗浄装置１では、ファン部材２０の回転速度は、保持テーブル１０の回転速度に対して独立して変化させることができるため、ウェーハＷの洗浄時や乾燥時に、保持テーブル１０の回転速度に関わらず、必要に応じてファン部材２０の回転速度を変化させてもよい。また、ファン部材２０の回転方向は、保持テーブル１０の回転方向に対して同じ方向以外でもよく、反対方向に回転させてもよい。ファン部材２０は、ウェーハＷの大きさや洗浄時の温度等に応じて回転速度や回転方向を設定することにより、汚染された洗浄水や噴霧を保持テーブル１０の上方から、より適切に排出することができる。   In the spinner cleaning apparatus 1 according to the first embodiment, the rotation speed of the fan member 20 can be changed independently of the rotation speed of the holding table 10, so that the wafer W is held during cleaning or drying. Regardless of the rotational speed of the table 10, the rotational speed of the fan member 20 may be changed as necessary. Further, the rotation direction of the fan member 20 may be other than the same direction as the rotation direction of the holding table 10 or may be rotated in the opposite direction. The fan member 20 sets the rotation speed and the rotation direction in accordance with the size of the wafer W, the temperature at the time of cleaning, and the like, thereby more appropriately discharging contaminated cleaning water and spray from above the holding table 10. Can do.

１、７０ スピンナ洗浄装置
１０ 保持テーブル
１１ 保持面（上面）
１５、７１ 保持テーブル回転部
１６、７２ 保持テーブル支持部
１７、７３ 保持テーブル回転軸
２０ ファン部材
２１ 羽
２５、７５ ファン部材回転部
２６ ファン部材支持部
２７ ファン部材軸部
３０ チャンバー
３３ 開口部
３４ 側壁
４５ ダクト
５０ 洗浄水噴射手段
５１ 洗浄水ノズル
６０ 保持テーブル用モータ
６１ ファン部材用モータ
７８ モータ
Ｗ ウェーハ（板状物） 1, 70 Spinner cleaning device 10 Holding table 11 Holding surface (upper surface)
15, 71 Holding table rotating part 16, 72 Holding table supporting part 17, 73 Holding table rotating shaft 20 Fan member 21 Wings 25, 75 Fan member rotating part 26 Fan member supporting part 27 Fan member shaft part 30 Chamber 33 Opening part 34 Side wall 45 Duct 50 Washing water injection means 51 Washing water nozzle 60 Motor for holding table 61 Motor for fan member 78 Motor W Wafer (plate-shaped object)

Claims (2)

板状物を保持する円盤形状の保持テーブルと、該保持テーブルを鉛直方向を回転軸として回転させる保持テーブル回転部と、該保持テーブルの上面に保持された前記板状物上に向けて洗浄水を噴射する洗浄水噴射手段と、を有するスピンナ洗浄装置であって、
前記保持テーブルを収容し上面が開口している円筒形状のチャンバーと、
該チャンバーの側壁に配設され該チャンバー内から気体を排出するダクトと、
洗浄時において該保持テーブルの表面位置から該チャンバーの開口部までの該保持テーブルを囲繞する外周空間を覆って円環形状に形成されたファン部材と、
該ファン部材を鉛直方向を回転軸として回転させるファン部材回転部と、
を備え、
該ファン部材は、該ファン部材回転部により回転することにより、該保持テーブルの上部で且つ該ファン部材の該円環形状内周部から該ファン部材の外周部へ空気の流れを発生させ、洗浄時の洗浄水及び噴霧を該ファン部材の外部へ強制排気し該ダクトへ導くこと、
を特徴とするスピンナ洗浄装置。 A disc-shaped holding table for holding a plate-like object, a holding table rotating unit for rotating the holding table about a vertical direction as a rotation axis, and washing water toward the plate-like object held on the upper surface of the holding table A cleaning water spraying means for spraying
A cylindrical chamber containing the holding table and having an open top surface;
A duct disposed on the side wall of the chamber for exhausting gas from the chamber;
A fan member formed in an annular shape covering the outer peripheral space surrounding the holding table from the surface position of the holding table to the opening of the chamber at the time of cleaning;
A fan member rotating unit that rotates the fan member about a vertical direction as a rotation axis;
With
The fan member is rotated by the fan member rotating unit to generate an air flow from the annular inner peripheral part of the fan member to the outer peripheral part of the fan member at the upper part of the holding table. Forcibly exhausting the washing water and spray from the outside to the outside of the fan member and guiding it to the duct;
Spinner cleaning device characterized by this. 前記ファン部材は前記保持テーブル回転部の外周に固定され、該保持テーブル回転部が該ファン部材回転部を兼ね、該保持テーブルの回転とともに該ファン部材が回転することを特徴とする請求項１記載のスピンナ洗浄装置。   2. The fan member is fixed to an outer periphery of the holding table rotating portion, the holding table rotating portion also serves as the fan member rotating portion, and the fan member rotates with the rotation of the holding table. Spinner cleaning device.
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