JP2019062043A - Substrate processing device - Google Patents

Abstract

To provide a substrate processing device capable of recovering predetermined process liquid subjected to substrate treatment in a predetermined recovery tank.SOLUTION: Disclosed is a substrate processing device for supplying process liquid onto a surface of a substrate 12 to perform substrate processing. This processing device includes: a rotor part for holding the substrate; a drive motor 35 for rotating the rotor part; a nozzle 23 for supplying process liquid onto the surface of the substrate 12; a ring body 21 which is relatively rotatably provided to the rotor part having a radius of rotation which is longer than that of the substrate 12 retained by the rotor part; and a ring body rotation mechanism enabling rotation of the ring body 21 at a rotational speed different from a rotational speed of the substrate 12.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate processing apparatus that supplies a processing liquid to a rotated substrate to perform substrate processing.

  As a surface treatment apparatus for semiconductor wafers and glass substrates for photomasks, a single-wafer method in which substrates are treated one by one is widely adopted from the viewpoint of improvement in uniformity and reproducibility of surface treatment. In a single wafer processing type substrate processing apparatus, a horizontally held substrate is rotated (spin) about its central axis to flow the processing solution on the surface of the center of the substrate and cause the processing solution to flow outward by centrifugal force. Advance the processing of the entire substrate. Then, when the predetermined substrate processing is completed, the rinse processing for washing away the liquid remaining on the substrate surface is performed in the same manner, and after stopping the supply of the rinse liquid, the substrate is dried by high speed rotation to finish the processing.

  In the above-described single-wafer substrate processing apparatus, the processing solution having flowed on the substrate of the rotating substrate is scattered by centrifugal force from the outer peripheral end of the substrate or the outer peripheral end of the rotating body that rotates the substrate. It is collected in a predetermined area to be a waste solution, or recovered for reuse. For example, a waste liquid tank and a recovery tank are disposed on the inner side so as to surround the periphery of a rotating body that rotates the substrate, and the outer processing tank is used for collecting waste processing liquid as waste liquid. Are collected in the recovery tank located in the above, and recovery of the treatment liquid that prevents mixing with the waste liquid is performed.

  In addition, a plurality of recovery tanks are provided concentrically so as to surround the periphery of the rotating body that holds the substrate, and a fence provided with a top portion is opened and closed, and a predetermined recovery tank is provided for processing liquid scattered from the substrate. There has been proposed a substrate processing apparatus having a structure in which the top portion of another recovery tank is closed to prevent the mixing of other processing solutions. (See Patent Document 1).

Unexamined-Japanese-Patent No. 2004-31400

  In the above-mentioned substrate processing apparatus, in the case of the number of rotations where it is difficult to scatter the processing solution from the outer peripheral end of the substrate or the outer peripheral end of the rotating body to the recovery tank outside the substrate, that is, the low rotational number of several tens of rpm When the substrate processing is performed, the processing liquid is not scattered to the collection tank of the processing liquid for collection, and it is difficult to collect the processing liquid in the collection tank.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing apparatus capable of recovering a predetermined processing liquid subjected to substrate processing into a predetermined recovery tank.

In order to solve the above problems, a substrate processing apparatus according to the present invention is a substrate processing apparatus that supplies a processing liquid to the surface of a substrate to process the substrate, and includes a rotating body portion that holds the substrate and the rotating body portion. A rotational drive unit to be rotated, and a processing liquid supply means for supplying the processing liquid to the surface of the substrate;
A ring body provided rotatably relative to the rotating body portion, the ring body having a rotation radius larger than the rotation radius of the substrate held by the rotating body portion, and rotation of the ring body different from the rotation speed of the substrate And a ring body rotation mechanism that enables rotation at a speed.

  According to the substrate processing apparatus of the present invention, the processing liquid supplied to the substrate can be collected in a predetermined collection tank.

It is a longitudinal cross-sectional view of the substrate processing apparatus concerning a 1st embodiment of the present invention. It is a longitudinal cross-sectional view of the substrate processing apparatus in the state which made the movable liquid receiving part of the substrate processing apparatus shown in FIG. 1 fall. It is a top view of the substrate processing apparatus shown in FIG. It is a perspective view of the ring body shown in FIG. It is an expanded sectional view of the A section shown to FIG. 4A. It is XX sectional drawing shown in FIG. FIG. 7 is a partial cross-sectional view showing the scattering state of the processing liquid when the number of rotations of the ring body shown in FIG. 1 is higher than the number of rotations of the substrate. FIG. 7 is a partial cross-sectional view showing the outflow state of the processing liquid when the number of rotations of the ring body shown in FIG. 1 is lower than the number of rotations of the substrate. It is sectional drawing of the substrate processing apparatus which concerns on 2nd Embodiment of this invention. It is cross-sectional explanatory drawing of the synchronous rotary body and synchronous rotary body stop pin which are shown in FIG. It is cross-sectional explanatory drawing of the state which the synchronous rotary body stop pin shown to FIG. 8A operate | moves to a synchronous rotary body.

First Embodiment
Hereinafter, a first embodiment of the present invention will be described using the drawings.

  The basic structure of the substrate processing apparatus according to the first embodiment of the present invention is shown in FIGS. Hereinafter, a substrate processing apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 6.

  As shown in FIG. 1, the substrate processing apparatus 11 mainly covers a disk-shaped rotating body 13 for rotating a substrate 12 such as a semiconductor wafer transferred by a transfer robot (not shown) and the rotating body 13. As shown in FIG. 1, a disc-shaped cover portion 15 positioned at the upper part and rotating with the rotating body 13 and six clamp pins 25 provided at intervals of 60 degrees in the circumferential direction near the outer periphery of the surface of the cover portion 15 (3), the ring body 21 rotatably provided on the upper surface of the outer peripheral end of the rotary body 13, the drive motor 35 (rotation drive unit) which is a power source of the rotation of the rotary body 13, and the drive motor A cylindrical power transmission body 36 for transmitting the rotation of the rotor 34a of 35 to the rotary body 13 and the cover portion 15 and rotating the same, and a treatment liquid (etching liquid, rinse liquid, etc.) on the surface of the substrate 12 (upper surface in FIG. 1) To supply) With 23 (23a, 23b), arranged around the ring body 21, a movable liquid receiving portion 22 for receiving the treatment liquid scattered from the ring member 21, and a control unit 100 for controlling each section. Furthermore, the upper surface of the ring body 21 is located below the surface of the substrate 12 so that the processing liquid flows from the substrate 12 into the ring body 21, and the outer peripheral end of the ring body 21 is outside the outer peripheral end of the substrate 12 It is provided to be located. The upper surface of the ring body 21 may be provided flush with the surface of the substrate 12.

  The cylindrical rotor 34 a is provided through a circular through hole 14 provided in a base plate 30 located at the lower part of the substrate processing apparatus 11. At the lower part of the base plate 30, a cylindrical stator 34b is provided so as to cover the periphery of the rotor 34a. The rotor 34 a and the stator 34 b constitute a main part of a drive motor 35 that rotates the rotating body 13. The upper end of the cylindrical rotor 34 a is connected to the lower end of the cylindrical power transmission body 36, and the upper end of the power transmission body 36 is connected to the rotary body 13 and the cover portion 15. The rotating body 13 and the cover portion 15 are configured as a rotating body portion. The rotor 34 a of the drive motor 35 is configured to rotate the rotating body 13, the cover portion 15, and the substrate 12 held by the clamp pins 25 on the cover portion 15 through the power transmission body 36. The drive motor 35 is electrically connected to the control unit 100, and the drive thereof is controlled by the control unit 100.

  In the hollow interior of the rotor 34a and the power transmission body 36, a non-rotating holding cylinder 37 coaxial with the same (axis A) is provided, and at the upper end of the holding cylinder 37, a nozzle head 38 is provided. ing. The nozzle head 38 is provided with a nozzle 24 (24a, 24b) for jetting a treatment liquid (etching solution, rinse liquid, etc.) on the back surface (bottom surface in FIG. 1) of the substrate 12; It is connected to a unit (not shown). One end of the hollow tubular body 39 penetrates the nozzle head 38 and is connected to the bottom of the recess formed in the nozzle head 38, and the other end is directed to a waste liquid tank or the like (not shown). Are arranged coaxially (axis A). The nozzle 24 is provided to process the back surface of the substrate 12 with a chemical solution, and in the case of double-sided processing using the nozzle 24, the nozzle 23 and the nozzle 24 constitute processing liquid supply means. The supply of the processing liquid by the processing liquid supply means is controlled by the control unit 100. At the center of the cover portion 15, an opening 15a is formed to allow the processing liquid jetted from the nozzles 24 (24a, 24b) to the back surface of the substrate 12 to pass.

  A downwardly extending sidewall portion 13a having a predetermined length is provided so as to hang around the outer peripheral end of the rotating body 13, and the lower end portion of the sidewall portion 13a surrounds the outer periphery of the rotating body 13 so as to surround the base It is in the position inserted in the waste liquid tank 51 provided on the plate 30. The waste liquid tank 51 is a container formed in an annular shape having an upper portion as an opening. The partition wall 51 b on the outer peripheral side of the waste liquid tank 51 is formed higher than the inner wall 51 a on the inner peripheral side, and the tip thereof is in a position close to the outer peripheral end of the rotary body 13. To the bottom 51 c of the waste liquid tank 51, a waste liquid pipe 53 for connecting the waste liquid flowing into the waste liquid tank 51 to the outside is connected. On the outer side of the waste liquid tank 51, there is provided a collection tank 52 formed in an annular shape with an upper opening, which comprises the above-mentioned partition wall 51b, an outer wall 52a located on the outer peripheral side of the partition wall 51b, and a bottom 52c. A recovery pipe 55 for recovering the recovery liquid flowing into the recovery tank 52 is connected to the bottom 52 b of the recovery tank 52. In the present embodiment, although one waste liquid tank 51 and one collection tank 52 are provided, a plurality of collection tanks can be installed in the radial direction of the substrate processing apparatus 11.

  Above the recovery tank 52, an annular movable liquid receiver 22 capable of moving up and down is provided. The movable liquid receiving portion 22 has a liquid receiving portion 22a comprising a standing peripheral wall and an inclined wall whose upper side is inclined obliquely inward and upward, and a double wall portion 22b in which the lower portion of the liquid receiving portion is a double wall It is possible to move up and down by means of a liquid receiver elevating drive mechanism (not shown). The liquid receiving unit lifting and lowering drive mechanism is controlled by the control unit 100. In addition, the movable liquid receiving portion 22 has the outer wall 52a of the recovery tank 52 inserted between the double wall portions 22b at each position of vertical movement so that the scattered processing liquid is not splashed out of the recovery tank 52. It has become. The movable liquid receiver 22 receives the processing liquid splashed from the rotating substrate 12 at the raised position, and drops it in the recovery tank 52 (see FIG. 1), and the fork of the transport robot (not shown) at the lowered position. The upper and lower positions are set so that the substrate 12 can be exchanged and the like while avoiding contact with the illustration (see FIG. 2). In the position where the movable liquid receiver 22 is lowered, the movable liquid receiver 22 covers the opening of the recovery tank 52 to prevent the treatment liquid from flowing into the recovery tank 52.

  In the cover portion 15, six upper disk members 18 (see FIG. 3), which are first disk members, are rotatably disposed at intervals of 60 degrees in the circumferential direction on the outer peripheral side in the cover portion 15. The outer periphery of the upper disk 18 engages with the engagement groove 21a of the inner side surface of the ring body 21 (see FIG. 4B), and the central portion of the upper disk 18 is a disk shaft 27 (six And the second disk member (only two are shown in FIG. 1) coaxially and integrally coupled with the central portion of the lower disk 61 (only two are shown in FIG. 1). The disc shaft 27 is rotatably positioned on the outer peripheral side of the rotary body 13 by six cylindrical support cylinders 60 provided at intervals of 60 degrees in the circumferential direction (only two are shown in FIG. 2). ). The lower disc 61 is engaged with the outer peripheral end of the synchronous rotating body 63 via the synchronous rotating body bearing 62 on the outer periphery of the power transmission body 36.

  The synchronous rotary body 63 is provided to the power transmission body 36 which is a rotation shaft of the rotary body 13 via the synchronous rotary body bearing 62. Thereby, when the rotary body 13 rotates, the rotation interlocked with the lower disc 61 engaged becomes possible. The synchronous rotary body 63 is provided with a convex portion 63 a that engages with the rotary plate 65 a of the drive motor 65 provided on the base plate 30. By driving the drive motor 65, the synchronous rotary body 63 is rotated to a predetermined rotation number. The drive motor 65 is electrically connected to the control unit 100, and the drive thereof is controlled by the control unit 100. When the synchronous rotor 63 is rotated by driving the drive motor 65, the disc shaft 27 and the upper disc 18 are rotated via the lower disc 61 engaged with the synchronous rotor 63, and further engaged with the upper disc 27 described later. The mating ring body 21 rotates. The rotation direction of the drive motor 65 is such that the ring body 21 rotates in the same direction as the rotation direction of the substrate 12. Furthermore, the drive motor 65 can shift and rotate in the forward and reverse directions, and can rotate the ring body 21 at a predetermined rotational speed in a direction different from the rotation direction of the substrate 12. The drive motor 65 corresponds to a rotatable drive unit capable of shifting, and the upper disc 18, the disc shaft 27, the lower disc 61, and the synchronous rotor 63 constitute an interlocking mechanism, and the ring body rotating mechanism as a whole Configure

  As shown in FIG. 1, FIG. 3, FIG. 4A and FIG. 4B, the ring body 21 which is an annular member having a rectangular cross section and rotatably provided at the outer peripheral end of the upper surface of the rotary body 13 It is provided coaxially with the rotation axis (axis A) and has a rotation radius larger than that of the substrate 12. The ring body 21 has a flat upper surface, and an annular engagement groove 21a is formed along the inner side surface, and the upper disc 18 (see FIG. 3) engages with the engagement groove 21a. Thereby, the rotation (rotation) of the upper disk 18 can rotate the ring body 21 via the engagement groove 21a. Therefore, by controlling the number of rotations of the drive motor 65 by the control unit 100, the number of rotations of the ring body 21 can be controlled, so the number of rotations of the substrate 12 different from the number of rotations The ring body 21 can be rotated at a rotation speed higher or lower than the rotation speed. Furthermore, since the rotation of the drive motor can be reversed, it is also possible to rotate the ring body 21 in the direction opposite to the rotation of the substrate 12. Further, in the ring body 21 in the present embodiment, a plurality of V-shaped grooves 21 b are formed along the outer peripheral side surface. This is because the droplets dropped on the outer peripheral surface of the ring body 21 are collected in the V-shaped groove 21b, and the collected liquid droplets are scattered as a large droplet by the centrifugal force due to the rotation of the ring body 21. In addition, depending on the properties (hydrophobicity, hydrophilicity, etc.) of the treatment liquid, the treatment liquid can be effectively scattered to the recovery tank 52 by selecting the shape of the surface (side surface, upper surface, etc.) of the ring body 21. Can. In addition to providing a plurality of V-shaped grooves 21, a wedge-shaped member is provided along the outer peripheral surface of the ring body 21 so that droplets dripped from the outer peripheral surface of the ring body 21 are scattered from the ring body 21. It is good.

  Next, the holding mechanism of the substrate 12 will be described with reference to FIGS. 3 and 5 in which the cross section of the substrate processing apparatus 11 is viewed from different positions. The six rotary plates 17 are arranged rotatably with respect to the cover portion 15 between the six upper disks 18 arranged at intervals of 60 degrees in the circumferential direction on the outer peripheral side in the cover portion 15 (See Figure 3). Clamp pins 25 are provided on the rotary plate 17 at positions eccentric to the rotation center of the rotary plate 17, respectively. The clamp pin 25 is configured as a substrate holder. The clamp pin 25 is integrally coupled by the rotary plate 17, a pin rotary body 29 provided below the central portion of each rotary plate 17, and a slave gear 31 provided below the pin rotary body 29. Each slave gear 31 meshes with a parent gear 32 provided coaxially with the rotary body 13 (axis A). The parent gear 32 is provided on the outer periphery of the power transmission body 36 via a parent gear bearing 41.

  A clamp spring (torsion coil spring) 42 as a biasing means is mounted on the parent gear 32. The clamp spring 42 has one end engaged with the rotary body 13 and the other end engaged with the parent gear 32 to bias the parent gear 32 in the rotational direction (counterclockwise direction). As a result, since the slave gear 31 is urged clockwise, the pin rotor 29 and the rotary plate 17 interlock with the rotation of the slave gear 31, and the clamp pin 25 eccentrically rotates in the central direction of the rotor 13. As a result, it abuts on the outer peripheral surface of the substrate 12 to be held (locked). At this time, the substrate 12 is set to be centered at a position centered on the substrate rotation axis A.

  When the substrate 12 is released from the locked state by the clamp pin 25, the drive motor 35 clamps the rotating body 13 in a state where the counterclockwise rotation of the master gear 32 is blocked by the chuck release cylinder 43. It is turned counterclockwise against the biasing force of the spring 42. (About 20 degrees) in the counterclockwise direction, the respective sub gears 31 meshed with the parent gear 32 rotate in the counterclockwise direction. As a result, since the clamp pin 25 is eccentrically rotated in the direction away from the outer peripheral surface of the substrate 12, the holding state due to the contact of the head of the clamp pin 25 with the end of the substrate 12 is released. Are placed on the shoulders of the clamp pins 25 so that the substrate 12 can be taken out by the transfer robot. The rotor 13, crank pin 25, cover 15, rotor plate 17, pin rotor 29, child gear 31, parent gear 32, and clamp spring 42 constitute a substrate holding means. Further, the substrate holding means is configured in the rotating body portion.

  The ring body 21 can be adjusted to an optimal rotational speed by controlling the rotational speed and rotational direction of the drive motor 65 by the control unit 100 regardless of the rotational speed of the rotary body 13. The control unit 100 includes a microcomputer that centrally controls each unit, and a storage unit that stores substrate processing information related to substrate processing, various programs, and the like. The control unit 100 controls the drive motor 35 and the drive motor 65 based on the substrate processing information and various programs, and supplies the processing liquid to the substrate 12 being rotated from the nozzles 23 and 24 to be supplied. Control the process.

  Next, the procedure of processing the substrate 12 using the substrate processing apparatus 11 according to the present embodiment will be described below. In the substrate processing apparatus 11, the processing liquid A (etching liquid: phosphoric acid solution) supplied from the nozzle 23a and the processing liquid B (rinsing liquid: pure water) supplied from the nozzle 23b are used as the processing liquid to be used. The movable liquid receiver 22 of the substrate processing apparatus 11 is lowered to a predetermined position by a liquid receiver elevating drive mechanism (not shown) in order to prevent contact with the substrate transfer robot (not shown) (FIG. 2). Then, the unprocessed substrate 12 is carried into the substrate processing apparatus 11 by the substrate transfer robot, which is an external device, and placed on the clamp pin 25. After the substrate 12 is carried in, when the transport robot retracts to the standby position, the movable liquid receiving portion 22 is returned to the raised position to prevent the processing liquid from scattering out of the apparatus due to the rotation of the substrate 12 (FIG. 1) .

  Before the substrate 12 is supplied to the substrate processing apparatus 11 by the transfer robot, the clamp pins 25 are in the unlocked state. That is, it is located at a position radially outward of the outer peripheral surface of the substrate 12 by a predetermined dimension. When the clamp pin 25 is in the unlocked state, the unprocessed substrate 12 is placed on the shoulder of the clamp pin 25 by the transfer bot not shown. When the substrate 12 is supplied to and disposed at the clamp pin 25, the head at the upper end of the clamp pin 25 is eccentrically rotated in the direction to abut the outer peripheral surface of the substrate 12 and the substrate 12 is held by the clamp pin 25.

  The nozzle 23a for supplying the processing solution A, which has been at the standby position, is moved to the upper part of the surface center of the substrate 12. Then, the substrate 12 is rotated by the drive motor 35 at a rotational speed (for example, several tens to 100 rpm) suitable for chemical treatment on the substrate 12 by the treatment liquid A which is an etching liquid. At this time, the ring body 21 is rotated by the driving of the drive motor 65 at a rotation number (for example, 500 rpm) higher than the rotation number of the substrate 12 in the same direction as the rotation direction of the substrate 12. When the substrate 12 and the ring body 21 are respectively rotated, the processing liquid A is supplied to the central portion of the substrate 12 which is rotated from the nozzle 23a. The supplied processing solution A is diffused from the central portion of the substrate 12 to the periphery by centrifugal force on the rotating substrate 12. The treatment liquid A having reached the end of the substrate 12 flows out from the end of the substrate 12 to the cover portion 15 and further flows out to the ring body 21 at the outer peripheral position of the cover portion 15. Since the ring body 21 is rotated at a rotation speed higher than the rotation speed of the substrate 12 as described above, a centrifugal force larger than the centrifugal force on the substrate 12 acts on the treatment liquid A, The waste liquid tank 51 is scattered to the collection tank 52 (FIG. 6A). Further, the processing liquid A is supplied to the front surface of the substrate 12 from the nozzle 23a and at the same time the processing liquid A is supplied to the back surface of the substrate 12 by the nozzle 24a. The processing solution A supplied to the back surface of the substrate 12 flows out to the cover portion 15 and further flows out to the ring body 21 at the outer peripheral position of the cover portion 15 and scatters into the collection tank 52 by the ring body 21. Thereby, when the substrate 12 has a low rotational speed (for example, several tens to 100 rpm), the processing liquid A falling into the waste liquid tank 51 between the side wall 13a and the partition wall 51b is reduced because the centrifugal force is small. In the embodiment, the processing liquid A can be collected in the collection tank 52 by rotating the ring body 21 at a higher speed than the substrate.

  Next, when the treatment of the substrate 12 with the treatment liquid A is completed, the supply of the treatment liquid A from the nozzles 23a and the nozzles 24a is stopped, and the nozzles 23a are retracted from the center upper portion of the substrate 12 to the standby position. At this time, the movable liquid receiver 22 is lowered to a position where the opening of the recovery tank 52 is closed (the state shown in FIG. 2). Then, the nozzle 23 b is moved from the standby position to the upper center of the substrate 12. The processing liquid B which is a rinse liquid (pure water) for cleaning the substrate 12 is supplied from the nozzles 23 b and the nozzles 24 b. In the cleaning with the processing solution B, the rotation speed of the substrate 12 is set to a medium rotation speed (for example, 500 rpm). At this time, the drive motor 65 is driven to set the ring body 21 to a rotational speed (for example, several tens to 100 rpm) lower than the rotational speed of the substrate 12. The processing liquid B that has reached the end of the substrate 12 may be scattered into the waste liquid tank located on the outer periphery of the movable liquid receiving portion 22 (not shown) beyond the movable liquid receiving portion 22 located at the lowered position from the end of the substrate 12 it can. Further, a part of the processing liquid B scattered from the end of the substrate 12 falls between the side wall 13 a and the partition wall 13 and flows to the waste liquid tank 51. At this time, since the movable liquid receiving portion 22 is lowered to a position where the opening of the recovery tank 52 is closed, it is possible to prevent the processing liquid B from flowing into the recovery tank 52. The treatment liquid B supplied to the back surface of the substrate 12 flows out of the cover portion 15 into the ring body 21. Since the rotation speed of the ring body 21 is lower than that of the substrate 12, the centrifugal force acting on the processing solution B that has flowed out of the cover portion 15 to the ring body 21 is smaller than when flowing over the cover 15. Therefore, the processing liquid B scattered from the ring body 21 flows between the side wall 13a and the partition wall 51b and flows into the waste liquid tank 52 without exceeding the movable liquid receiving portion 22 at the lowered position (see FIG. 6B). Thus, the processing solution A attached to the side wall portion 13a and the partition wall 51b in the previous processing can be washed away by the processing solution B, and the processing solution A as the etching solution at high speed rotation of the substrate 12 in the drying process described later. It is possible to suppress the mist from scattering.

  Next, when the cleaning processing of the substrate 12 by the processing liquid B is completed, the supply of the processing liquid B from the nozzle 23 b and the nozzle 24 b is stopped, and the nozzle 23 b is retracted from the center upper portion of the substrate 12 to the standby position. Then, the substrate 12 is rotated at a high rotational speed (for example, 1000 to 1500 rpm) by the drive motor 35, the rotating body 13 or the like, and the processing liquid B is scattered from above the substrate 12 to dry the substrate 12. At this time, the treatment liquid B is scattered to the waste liquid tank located on the outer periphery of the movable liquid receiving portion 22 (not shown) beyond the movable liquid receiving portion 22 at the lowered position. The ring body 21 has the same so-called high speed rotation speed as the substrate 12. Further, since the movable liquid receiving portion 22 is at the lowered position closing the opening of the recovery tank 52, the processing liquid B can be prevented from flowing into the recovery tank 52.

  After the predetermined time, when the drying process is completed, the holding (locking) state of the substrate 12 by the clamp pin 25 is released. After the holding state of the substrate 12 is released, the processed substrate 12 is transferred to the outside by the transfer robot (not shown). At this time, since the movable liquid receiving portion 22 is at the lowered position closing the opening of the recovery tank 52, contact with the transport robot can be avoided.

  In the present embodiment, when the substrate processing with the processing liquid is performed at a low rotational speed, the ring body 21 provided in the vicinity of the outer periphery of the substrate 12 has a rotational speed higher than the rotational speed of the substrate 12. The processing solution that has flowed into the ring body 21 can be scattered into the recovery tank 52 with a larger centrifugal force than when rotating at low speed. That is, since the ring body 21 can be rotated at a rotation number different from the rotation number of the substrate 12, the substrate 12 can maintain the optimum rotation number for substrate processing, and the rotation number of the ring body 21 It is possible to set the number of rotations optimum for the collection, disposal and the like of the above, and to effectively reuse or discard the treated processing solution. In addition, the number of rotations and the rotation direction of the ring body 21 can be arbitrarily set in accordance with the recovery of the processing liquid and the waste liquid.

Second Embodiment
Next, a substrate processing apparatus 11a according to a second embodiment of the present invention will be described with reference to FIGS. 7 to 8B. The differences from the first embodiment will be mainly described, and the common points will be simplified or omitted as appropriate. In addition, components common to the first embodiment will be described using common names and reference numerals.

  The present embodiment is characterized in that the drive motor 65 for rotating the synchronous rotating body 63 in the first embodiment is not disposed, and a cylinder 75 is provided instead (FIG. 7). The cylinder 75 is provided on the base plate 30, and has a function of pressing the synchronous rotary member 63 located on the upper side by extending the upper cylinder rod 75a and stopping its rotation. The cylinder 75 is electrically connected to the control unit 100, and the drive thereof is controlled by the control unit 100. As shown in FIG. 8A, the cylinder 75 is not in contact with the synchronous rotor 63 before the cylinder rod 75a extends. The synchronous rotor bearing 62 is provided on the power transmission 36 via a low dusting sliding member 77. The sliding member 77 allows the synchronous rotor bearing 62 to move up and down. The synchronous rotary body 63 is engaged with the lower disc 61, and further, the power transmission body 36 is provided via the sliding member 77 and the synchronous rotary body bearing 62, and the low dusting connection member 76 is interposed therebetween. Is connected via. When the rotary body 13 rotates, the disc shaft 27 and the lower disc 61 positioned on the rotary body 13 and the synchronous rotary body 63 also rotate together with the rotary body 13.

  As shown in FIG. 8B, when the cylinder rod 75a of the cylinder 75 is extended and the tip end thereof is pressed against the synchronous rotating body 63, the joint between the synchronous rotating body 63 and the sliding plate 76 on the power transmission body 36 side is separated. The rotor bearing 62 enables rotation. Thereby, the rotation of the synchronous rotor 63 is stopped. At this time, the lower disc 61 rotates with the rotary body 13 while rotating around the engaging synchronous rotary body 63. At this time, the lower disc 61 rotates in the same direction as the substrate 12. As the lower disc 61 rotates, the upper disc 18 also rotates, and the ring body 21 engaged with the upper disc 18 rotates. As a result, the ring body 21 is rotated in the rotational direction of the lower disk 61, that is, in the rotational direction of the substrate. In addition, since the ring body 21 rotates around the rotating body 13 that rotates, the ring body 21 rotates at a rotational speed higher than that of the rotating body 13.

  In the present embodiment, as in the first embodiment, although it is not possible to freely change the rotational speed and rotational direction of the ring body 21 using the drive motor 65, in the present embodiment, by using a cylinder mechanism, Since the ring body 21 can be set to a rotation speed higher than the rotation speed of the substrate, the processing liquid can be scattered and collected in the collection tank 52 when the substrate 12 has a low rotation speed. In the present embodiment, the cylinder 75 corresponds to a cylinder mechanism, and the upper disc 18, the disc shaft 27, the lower disc 61, and the synchronous rotor 63 constitute an interlocking mechanism, and the ring body rotating mechanism Configure.

  Next, the procedure of the process of the board | substrate 12 using the substrate processing apparatus 11a which concerns on this embodiment is demonstrated below. As in the first embodiment, the processing solution to be used is the processing solution A (etching solution: phosphoric acid solution) supplied from the nozzle 23a and the nozzle 24a, and the processing solution B (rinsing solution: supplied from the nozzle 23b and the nozzle 24b). Pure water) is used.

  The movable liquid receiver 22 is lowered by the liquid receiver elevating drive mechanism (not shown). The unprocessed substrate 12 is carried into the substrate processing apparatus 11 by a substrate transfer robot (not shown) and placed on the clamp pin 25. After the substrate 12 is carried in, when the transport robot retracts to the standby position, the movable liquid receiving portion 22 is returned to the raised position to prevent the processing liquid from scattering out of the apparatus due to the rotation of the substrate 12.

  After the substrate 12 is disposed on the clamp pin 25, the head at the upper end of the clamp pin 25 provided on the rotary plate 17 is eccentrically rotated in a direction in which it abuts on the outer peripheral surface of the substrate 12. Will be held by

  The nozzle 23a for supplying the processing solution A is moved from the standby position to the top of the surface center of the substrate 12. Then, the substrate 12 is rotated by the drive motor 35 at a rotational speed (for example, several tens to 100 rpm) suitable for chemical treatment on the substrate 12 by the treatment liquid A which is an etching liquid. At this time, when the cylinder rod 75a of the cylinder 75 is extended and the tip thereof is brought into contact with the synchronous rotating body 63 and the joint between the synchronous rotating body 63 and the power transmission body 36 is released, the ring body 21 The substrate rotates at a rotational speed higher than the rotational speed of the substrate 12. Then, the processing liquid A is supplied from the nozzle 23 a to the central portion of the rotating substrate 12. The supplied processing solution A spreads uniformly from the central portion of the substrate 12 around the rotating substrate 12 by centrifugal force. The treatment liquid A having reached the end of the substrate 12 flows out from the end of the substrate 12 to the cover portion 15 and further flows out to the ring body 21 at the outer peripheral position. Since the ring body 21 is rotated at a rotation speed higher than the rotation speed of the substrate 12 as described above, a centrifugal force larger than the centrifugal force on the substrate 12 acts on the treatment liquid A, Most are scattered over the waste liquid tank 51 to the recovery tank 52 located outside (FIG. 7A). In addition, the processing liquid A is supplied to the front surface of the substrate 12 by the nozzle 23 a and at the same time the processing liquid A is supplied to the back surface of the substrate 12 by the nozzle 24 a. The processing solution A supplied to the back surface of the substrate 12 flows out to the cover portion 15 and further flows out to the ring body 21 at the outer peripheral position of the cover portion 15 and scatters into the collection tank 52 by the ring body 21. Thereby, when the substrate 12 has a low rotational speed (for example, several tens to 100 rpm), the processing liquid A which has been dropped into the waste liquid tank 51 between the side wall 13a and the partition wall 51b because the centrifugal force is small conventionally. In the present embodiment, by rotating the ring body 21 at a speed higher than that of the substrate, the processing solution A can be scattered to the recovery tank 52, so recovery separate from other processing solutions is possible.

  Next, when the processing of the substrate 12 by the processing liquid A is completed, the supply of the processing liquid A from the nozzles 23a and 24a is stopped, and the nozzle 23a retracts from the central upper portion of the substrate 12 to the standby position, and the movable liquid receiver is further received. The portion 22 descends to a position where the opening of the recovery tank 52 is closed. Then, the nozzle 23 b is moved from the standby position to the upper center of the substrate 12. In order to effectively clean the substrate 12 with the processing liquid B, the number of rotations of the substrate 12 is set to a medium rotation number (for example, 500 rpm). At this time, since the treatment liquid B contains the treatment liquid A, the cylinder rod 75a of the cylinder 75 is not extended so that the number of rotations of the ring body 21 is also set to the same number of medium rotations as the number of rotations of the substrate 12. And (Fig. 8A). Then, the processing solution B is supplied from the nozzle 23 b and the nozzle 24 b to the center of the substrate 12 and is diffused uniformly from the center of the substrate 12 by centrifugal force to uniformly clean the substrate. The processing solution B that has reached the end of the substrate 12 flows out from the end of the substrate 12 to the cover portion 15 and further flows out to the ring body 21 at the outer peripheral position. Since the ring body 21 has the same medium-speed rotational speed as the rotational speed of the substrate 12, the processing liquid B scatters over the movable liquid receiving portion 22 by centrifugal force, so the processing liquid B flows into the recovery tank 52. Can be prevented. At this time, the processing liquid B is scattered to the waste liquid tank located on the outer periphery of the movable liquid receiving portion 22 (not shown) beyond the movable liquid receiving portion 22 at the lowered position, and a part of the processing liquid B is the side wall portion 13a. And the partition wall 13 and flows to the waste liquid tank 51.

  Next, when the cleaning processing of the substrate 12 by the processing liquid B is completed, the supply of the processing liquid B is stopped and the nozzles 23 b and the nozzles 24 b are retracted to the standby position. At this time, the movable liquid receiver 22 is maintained in the state of being lowered to the position at which the opening of the recovery tank 52 is closed. Then, the nozzle 23 c is moved from the standby position to the upper center of the substrate 12.

  Then, the substrate 12 is rotated at a high rotational speed (for example, 1000 to 1500 rpm) by the drive motor 35, the rotating body 13 or the like, and the processing liquid B is scattered from above the substrate 12 to dry the substrate 12. In order to make the ring body 21 have the same rotational speed as the base plate 12, the cylinder rod 75a of the cylinder 75 is not extended but is in the retracted position. The treatment liquid B scatters due to centrifugal force, but since the movable liquid receiver 22 is lowered to a position where the opening of the recovery tank 52 is closed, the inflow of the treatment liquid B into the recovery tank 52 is prevented. At this time, the treatment liquid B is scattered to the waste liquid tank located on the outer periphery of the movable liquid receiving portion 22 (not shown) beyond the movable liquid receiving portion 22 at the lowered position.

  After the predetermined time has elapsed, when the drying process is completed, the rotation of the rotating body 13 is stopped, and the holding (locked) state of the substrate 12 by the clamp pin 25 is released. After the holding state of the substrate 12 is released, the processed substrate 12 is transferred to the outside by the transfer robot (not shown).

  As described above, in the substrate processing apparatus 11a of the present embodiment, it is possible to make the number of rotations of the ring body 21 equal to or higher than the number of rotations of the substrate 12 with a simple device configuration. That is, when the rotation speed of the substrate 12 is a low speed rotation, the ring body 21 can be set to a rotation speed higher than the rotation speed of the substrate 12, so the centrifugal force of the ring body 21 rotating the processing liquid Can be scattered. In addition, since the cylinder mechanism is used in the present embodiment, the configuration can be simplified as compared with the first embodiment using the drive motor.

  As mentioned above, although the modification of some embodiments and each part of the present invention was described, the modification of this embodiment or each part is shown as an example, and limiting the scope of the present invention is not intended. . These novel embodiments described above can be implemented in other various forms, and various omissions, substitutions, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are included in the invention described in the claims.

11 and 11a Substrate processing apparatus 12 Substrate 13 Rotator 15 Cover 17 Rotor plate 18 Upper disc 21 Ring body 22 Ring body 22 Movable liquid receiver 23 Nozzle 25 Clamp pin 27 Disc axis 29 Pin rotor 30 Base plate 31 Child gear 32 Gear 33 (33a to 33f) Support cylinder 34a Rotor 34b Stator 35 Drive motor 36 Power transmission body 41 Parent gear bearing 42 Clamp spring 43 Chuck open cylinder 51 Waste tank 52 Collection tank 53 Waste piping 55 Collection piping 60 Support cylinder 61 lower disc 62 synchronous rotor bearing 63 synchronous rotor 65 drive motor 75 ring accelerating cylinder 75a cylinder rod 76 connecting member

Claims (7)

In a substrate processing apparatus that supplies a processing liquid to the surface of a substrate to process the substrate,
A rotating body unit that holds the substrate;
A rotation drive unit that rotates the rotating body unit;
Treatment liquid supply means for supplying the treatment liquid to the surface of the substrate;
A ring body rotatably provided relatively to the rotating body portion, having a radius of rotation larger than the radius of rotation of the substrate held by the rotating body portion;
And a ring body rotating mechanism capable of rotating the ring body at a rotational speed different from that of the substrate.   The substrate processing apparatus according to claim 1, wherein the ring body is an annular member having a flat upper surface.   The substrate processing apparatus according to claim 1, wherein the ring body has a plurality of grooves formed on an outer surface thereof.   The substrate processing apparatus according to any one of claims 1 to 3, wherein the ring body rotation mechanism includes a rotation drive portion capable of shifting, and an interlock mechanism portion interlocking the rotation drive portion and the ring body.   The interlocking mechanism portion is rotatably mounted on the rotating body portion, and a first disc member engaged with a groove formed on an inner side surface of the ring body, the first disc member, and a connecting shaft 5. The disk drive according to claim 4, further comprising: a second disc member coaxially connected by the second disc member; and a synchronous rotor engaged with the second disc member, wherein the synchronous rotor is rotated by the rotation driving unit. Substrate processing equipment. The ring body rotation mechanism has a cylinder mechanism portion having a cylinder rod that can expand and contract, and an interlock mechanism portion whose rotation is stopped by extension of the cylinder rod of the cylinder mechanism portion,
The interlocking mechanism portion is rotatably mounted on the rotating body portion, and a first disc member engaged with a groove formed on an inner side surface of the ring body, the first disc member, and a connecting shaft The substrate processing apparatus according to any one of claims 1 to 3, further comprising: a second disc member coaxially connected by the second disc member; and a synchronous rotating body engaged with the second disc member.   The substrate processing apparatus according to claim 5, wherein the synchronous rotating body is provided on a rotating shaft of the rotating body portion via a bearing portion.

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