JPH10270408A - Cleaning method and cleaning apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively utilize a cleaning liq. for cleaning works by recovering and holding the liq. after feeding it to clean the works, removing the gas from the recovered liq. and storing the liq. for utilizing it for cleaning works. SOLUTION: The method comprises recovering a thinner sprayed on both edge end faces of a glass substrate G having a resist film from a removing nozzle 51 in a recovery tube 60 through an exhaust port of the nozzle 51 by a suction mechanism 61 connected to the tube 60 through a switching valve 75, separating the recovered thinner mixed with air through a mist trap 62 into the used thinner A1 and gas, and storing this thinner in an edge remover(ER) tank 70. The stored thinner A1 is re-utilized for cleaning cups of the resist coater and coating film remover by a cleaner, thus effectively utilizing the cleaning liq.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning method and a cleaning apparatus in a processing apparatus for processing a substrate such as a liquid crystal display (LCD) or a semiconductor wafer.

[0002]

2. Description of the Related Art In recent years, there is an urgent need for a processing apparatus, for example, a resist coating apparatus for coating a resist film on an LCD glass substrate or the like, in addition to miniaturization and cost reduction of the apparatus itself, and low running cost when the apparatus is used. It has become.

For example, a resist coating apparatus generally used in a manufacturing process of an LCD or the like performs a resist coating process and a cleaning process on a glass substrate (object to be processed). There is a spray type.

[0004] For example, a spin coating type resist coating apparatus includes a vertically movable and rotatable spin chuck for mounting a glass substrate, a lower portion of a resist droplet for dropping a resist liquid onto a central portion of the glass substrate, and a surface cleaning of the glass substrate. Cleaning nozzle for performing the cleaning, and the inner rotating cup which is disposed so as to surround the periphery of the glass substrate doubly and receives the resist solution and the thinner which flowed out and scattered from the glass substrate by rotating together with the spin chuck and the outside thereof Drain cup.

In this resist coating apparatus, a glass substrate is placed on a vertically movable and rotatable spin chuck, and a resist liquid is dropped on a central portion while being rotated, and the resist coating is uniformly performed by centrifugal force. At this time, the remaining resist liquid that has flowed out or scattered from the glass substrate is received by the rotating cup and discharged. In the next step, the height of the spin chuck is changed and the cleaning liquid is supplied from the cleaning liquid injection nozzle to the end of the glass substrate, the edge of the substrate surface is cleaned, and the drainage is received and discharged by the drain cup. . As the cleaning liquid, a solvent such as thinner is used because of low pollution and high safety.

In the case of this resist coating apparatus, since a large amount of resist material (component) is dissolved in the thinner in the cleaning liquid (waste liquid) after cleaning, it cannot be reused on a glass substrate, and the drain cup cannot be used. From the waste liquid storage section through a waste liquid pipe, and when a certain amount of waste liquid in the waste liquid storage section has accumulated, the waste liquid is discarded.

[0007] Incidentally, since thinner containing a resist component is always flowed into the drain cup, the resist component adheres to and accumulates on the inner wall of the cup as the cleaning process is repeated. If the resist component adheres and deposits on the inner wall of the cup, it eventually causes clogging.
Every certain period, the inner wall of the cup itself was cleaned to remove the deposit. This is the same for the rotating cup that receives the resist solution itself.

However, the conventional resist coating apparatus employs a cleaning mode in which a thinner is sprayed from a nozzle dedicated to cleaning in the cup disposed in the cup toward the inner wall surface of the cup to remove deposits in the cup. This requires a large amount of thinner.

As described above, in the above-described conventional resist coating apparatus, that is, the processing apparatus, dirt such as resist adheres to the inner wall of the cup as the processing is repeated, and a large amount of thinner is required when cleaning the resist. There was a problem that the required cost increased.

Further, once used cleaning liquid cannot be reused for cleaning the glass substrate to be cleaned, it is discarded as a waste liquid, which also causes running cost. .

Further, a process of applying a resist solution to the surface of an object to be processed such as an LCD substrate by a spin coating method is performed. In this application process, since the LCD substrate has a rectangular shape, it is rotated to generate an air flow. There is a problem that disturbance occurs and uniformity of the thickness of the resist film cannot be maintained.

Conventionally, therefore, a spin chuck, which is a holding means for holding an LCD substrate, and sides, upper and lower portions of the LCD substrate are surrounded by a rotating cup with a lid, and above the LCD substrate in the rotating cup with the lid. A straightening plate is attached, and air supplied from an air supply hole provided in a lid portion of the rotating cup with a cover is straightened by the straightening plate and discharged from an exhaust hole provided at the bottom of the rotating cup. Of the resist film due to the turbulence of the resist. In addition, the sides and the lower part of the rotating cup with a lid are surrounded by a fixed cup to prevent the air flow generated by the rotation of the rotating cup from flowing back into the rotating cup.

However, in a resist coating apparatus that applies a resist liquid by this type of spin coating method, since the resist liquid is scattered outward by centrifugal force, the inner surface and the bottom surface of the rotating cup, the back surface of the lid, The resist adheres to the lower surface of the plate and the like.

Further, the resist may adhere to the inner side surface and the bottom surface of the fixed cup. The resist adhered to the inside of the rotating cup, the fixed cup, the lid, the current plate, etc. is dried and generates particles. Therefore, if the particles adhere to the LCD substrate, not only will the circuit pattern, etc. be disturbed, but also the yield will increase. There is a problem that causes a decrease in

[0015]

SUMMARY OF THE INVENTION It is a first object of the present invention to provide a cleaning method and a cleaning apparatus which make effective use of a cleaning solution provided for cleaning an object to be processed. I do.

A second object of the present invention is to provide a processing apparatus which can reuse a cleaning liquid.

A third object of the present invention is to provide a processing apparatus capable of improving the cleaning efficiency of a container.

Further, a fourth object of the present invention is to provide a processing apparatus capable of reducing the running cost of the entire apparatus.

A fifth object of the present invention is to provide a cleaning apparatus and a cleaning method capable of improving a yield by removing a coating liquid, for example, a resist, attached to a rotating cup and a fixed cup in a coating mechanism. .

[0020]

According to a first aspect of the present invention, there is provided a cleaning method comprising the steps of: supplying a cleaning liquid to an object to be cleaned; collecting the cleaning liquid;
The gas is separated and removed from the collected cleaning liquid to store the cleaning liquid, and the stored cleaning liquid is used for cleaning the object to be cleaned.
It is characterized by the following.

[0021] As described in claim 2, in this cleaning method, it is preferable to use the stored cleaning liquid for cleaning the processing apparatus for the object to be processed. Further, as described in claim 3, in the cleaning treatment method of the present invention, a cleaning liquid is replenished to a storage part of the recovered cleaning liquid, and a mixed liquid of the replenished cleaning liquid and the recovered cleaning liquid is used for cleaning the object to be cleaned. It can also be used for cleaning.

According to a fourth aspect of the present invention, there is provided a cleaning apparatus comprising:
First cleaning liquid supply means for supplying a cleaning liquid to the object;
A recovery pipe for collecting the cleaning liquid used for cleaning the object to be processed, a gas-liquid separation unit for separating and removing gas from the collected cleaning liquid, and a cleaning liquid storage unit for storing the cleaning liquid separated by the gas-liquid separation unit And second cleaning liquid supply means for supplying the cleaning liquid in the cleaning liquid storage section to the object to be cleaned. According to a fifth aspect of the present invention, in the cleaning apparatus of the present invention, it is preferable that the second cleaning liquid supply unit is provided in the apparatus for processing the object to be processed. As described in claim 6, in the cleaning apparatus of the present invention, the first cleaning liquid supply means is provided with an appropriate interval for injecting the cleaning liquid toward a portion on both sides of the edge of the treatment target that does not interfere with each other. It is more preferable to provide a plurality of nozzle holes arranged in the above manner and to connect the recovery pipe to the outer side portion. In this case, it is preferable that the opening of the drainage path connected to the recovery pipe is formed, for example, in an expanded tapered shape so as to effectively receive the cleaning liquid ejected from the nozzle hole. That is, it is preferable to arrange a plurality of nozzle holes inside the widened tapered opening of the drainage passage. Further, as described in claim 7, in the cleaning apparatus of the present invention, it is possible to form the cleaning liquid storage section so that the cleaning liquid from the cleaning liquid supply source can be replenished.

According to the present invention described in claims 1 to 7,
After cleaning by supplying a cleaning liquid to the object to be processed, collecting the cleaning liquid, separating and removing the gas from the collected cleaning liquid, storing the cleaning liquid, and using the stored cleaning liquid for cleaning the object to be cleaned. Thereby, the cleaning liquid can be effectively used. Therefore, the amount of cleaning liquid used can be reduced,
The cost can be reduced and the resources can be effectively used.

Further, by using the stored cleaning liquid for cleaning the processing apparatus for the object to be processed, the cleaning liquid can be effectively used in the same processing system, and the piping system for the cleaning liquid can be reduced. Therefore, the size of the device can be reduced.

Further, the cleaning liquid is replenished to the storage portion of the recovered cleaning liquid, and the mixed liquid of the replenished cleaning liquid and the recovered cleaning liquid is used for cleaning the object to be cleaned, thereby further improving the cleaning efficiency. As a result, the reliability of the cleaning apparatus can be improved.

In addition, the first cleaning liquid supply means is provided with a nozzle hole for jetting the cleaning liquid toward a portion of the edge of the object to be processed which does not interfere with each other, and a recovery pipe is connected to the outer side. Since the cleaning liquid supplied from the first cleaning liquid supply unit and supplied for the primary cleaning can be efficiently collected, waste of the cleaning liquid can be omitted, and the cleaning efficiency can be further improved.

According to another aspect of the present invention, there is provided a processing apparatus comprising: a container for collecting a processing liquid flowing out or scattered when a processing object is processed; and a cleaning liquid supplied to the container. A washing unit for washing the inner wall surface; and a circulating system for collecting a discharged liquid discharged from the container when the inner wall surface of the container is washed by the washing unit and supplying the discharged liquid to the washing unit.

In the case of the present invention described in claim 8, the drainage discharged from the container when the inner wall surface of the container is cleaned by the cleaning unit is recovered by the circulating system and used for the cleaning unit for cleaning the inside of the container. Since the cleaning liquid is supplied, the cleaning liquid can be reused. As a result, it is possible to reduce the amount of the cleaning liquid used and to reduce the running cost of the entire apparatus.

According to a ninth aspect of the present invention, in the above-mentioned processing apparatus, the circulating system includes a new cleaning liquid storage section for storing unused cleaning liquid, and a discharge liquid discharged from the container. Either a waste liquid storage part to be stored, a waste liquid stored in the waste liquid storage part, and an unused cleaning liquid stored in the new cleaning liquid storage part are selected or mixed with each other to the cleaning means. Cleaning liquid supply means for supplying.

In the case of the present invention according to the ninth aspect, one of the discharged liquid stored in the discharged liquid storage section and the unused cleaning liquid stored in the new cleaning liquid storage section is selected or mixed with each other. Since it is supplied to the cleaning means, it does not hinder cup cleaning.

According to another aspect of the present invention, in the above processing apparatus, the circulating system is collected in the container when at least a part of the processed object is washed. A first discharged liquid storage unit for storing the first discharged liquid discharged and discharged, and a second discharged liquid storage unit for storing the second discharged liquid collected and discharged in the container when cleaning the inner wall surface of the container. A effluent storage section, and either one of a first effluent stored in the first effluent storage section and a second effluent stored in the second effluent storage section, or And a cleaning liquid supply means for mixing and supplying the cleaning liquid to the cleaning means.

In the case of the present invention described in claim 10, the first
Since either one of the first effluent stored in the effluent reservoir and the second effluent stored in the second effluent reservoir is selected or mixed with each other and supplied to the cleaning means. In addition, the cleaning liquid used once can be efficiently used.

Further, in another processing apparatus according to the present invention, the cleaning liquid supply means may include:
An unused cleaning liquid for cleaning at least a part of the processed object is replenished to at least one of the first discharge liquid storage section or the second discharge liquid storage section, and each of the first and second discharge liquid storage sections is replenished. It is characterized in that one of the stored discharged liquids is selected or mixed with each other and supplied to the cleaning means.

In the case of the present invention described in claim 11, the first
Alternatively, at least one of the second drainage storage units is replenished with an unused cleaning liquid, that is, a new liquid, the drainage liquid stored in each storage unit is diluted, and any one of these is selected or Since the cleaning liquid is mixed and supplied to the cleaning means, the cleaning liquid once used can be efficiently used without deteriorating the cleaning performance.

According to a twelfth aspect of the present invention, in the processing apparatus, the circulating system includes a new cleaning liquid storage unit for storing an unused cleaning liquid, and a processing unit for storing the processed object. A first effluent storage portion for storing the first effluent collected and discharged in the container when at least a part thereof is washed, and collected and discharged in the container when the inner wall surface of the container is washed The second storing the second discharged liquid
Drain storage unit, the first drain storage unit and the second drain storage unit.
Cleaning liquid supply means for replenishing at least one of the discharged liquid storage sections with unused cleaning liquid in the new cleaning liquid storage section and supplying the unused cleaning liquid to the cleaning means.

In the case of the present invention described in claim 12, the first
By replenishing at least one of the drainage storage section and the second drainage storage section with the unused cleaning liquid in the new cleaning liquid storage section and supplying it to the cleaning means, the cup can be reused even when the cleaning liquid is reused. This does not hinder the cleaning, improves the cleaning efficiency of the cup cleaning without deteriorating the cleaning performance, and improves the reliability in performing the cup cleaning.

According to still another aspect of the present invention, in the processing apparatus, the circulating system includes a new cleaning liquid storage section for storing unused cleaning liquid, and a cleaning liquid storage section for storing the processing object. A first effluent storage portion for storing the first effluent collected and discharged in the container when at least a part thereof is washed, and collected and discharged in the container when the inner wall surface of the container is washed The second storing the second discharged liquid
Unused liquid storage section, the first discharged liquid stored in the first discharged storage section, the second discharged liquid stored in the second discharged liquid storage section, and unused state of the new cleaning liquid storage section. And a cleaning liquid supply means for selecting one of the cleaning liquids or mixing them and supplying them to the cleaning means.

In the case of the present invention described in claim 13, the first
Or one of the first effluent stored in the effluent storage part, the second effluent stored in the second effluent storage part, and the unused cleaning liquid in the new cleaning liquid storage part. Since the respective components are mixed and supplied to the cleaning means, the inside of the container can be efficiently cleaned by the cleaning means.

According to another aspect of the present invention, there is provided the above processing apparatus, wherein the cleaning liquid supply means comprises:
Detecting means for detecting the amount of the cleaning liquid or the effluent stored in each of the storing units, and the amount of the cleaning liquid or the effluent to be taken in from each of the storing units based on the respective amounts of the liquid detected by the detecting means. And control means for controlling In the case of the present invention according to claim 14, when the amount of the cleaning liquid or the drainage liquid stored in each storage part is detected, the control means controls the cleaning liquid or the drainage taken from each storage part based on each liquid amount. Since the amount of the liquid is controlled, it is possible to optimize the supply of the cleaning liquid to each part.

According to another aspect of the present invention, there is provided the above processing apparatus, wherein the cleaning means injects a cleaning liquid toward an inner wall portion of the container near the object to be processed.
An injection unit, and a second injection unit that injects the cleaning liquid toward the inner wall portion of the container away from the object to be processed and discharged,
The circulating system is characterized in that a discharge liquid, which is a used cleaning liquid, is supplied to the second injection section, and an unused cleaning liquid is supplied to the first injection section.

In the case of the present invention according to the fifteenth aspect, the used cleaning liquid is supplied to the second injection section, and the unused cleaning liquid is supplied to the first injection section. The cleaning solution can be used efficiently.

According to another aspect of the present invention, there is provided a processing apparatus for recovering a processing liquid which flows out or scatters when a processing object is processed, and a container formed on an inner wall surface of the container. And an ethylene fluoride-based resin layer.

In the case of the present invention according to the sixteenth aspect, since the fluorinated ethylene-based resin layer is formed on the inner wall surface of the container, the processing liquid which has flowed out or scattered when the object is processed is treated. Adhesion to the inner wall surface is reduced.

In another preferred embodiment of the present invention, in the above processing apparatus, the fluorinated ethylene-based resin layer is formed on a recovery path in the container capable of recovering the processing liquid. It is characterized by. In the case of the present invention according to claim 17, by limiting the portion for forming the fluorinated ethylene-based resin layer in the container, the amount of the fluorinated ethylene-based resin used is minimized, and the adhesion of the processing liquid is reduced. Can be obtained.

In the cleaning apparatus of the present invention, the holding means for holding the object to be processed and the side and top of the object to be processed are provided.
A rotatable rotating cup with a lid surrounding the lower part, a fixed cup surrounding the side and lower part of the rotating cup with the lid, and a rectifying plate mounted in the rotating cup with the lid to cover above the object to be processed A cleaning device for a cup of a coating mechanism, comprising: a first supply port for supplying a cleaning liquid onto the current plate through a supply hole provided at the center of a lid of the rotary cup with the lid.
A second cleaning nozzle which is disposed below the holding means and supplies a cleaning liquid toward the lower surface of the outer periphery of the current plate, the inner surface of the rotating cup with a lid, and the bottom surface of the fixed cup. It is characterized by having.

According to a nineteenth aspect of the present invention, in the cleaning apparatus according to the present invention, the cleaning liquid which is disposed in the fixed cup and supplies the cleaning liquid toward the lower surface of the outer periphery of the rotating cup with the lid and the inner surface of the fixed cup is provided. It is preferable to provide the cleaning nozzle of No. 3. In this case, as described in claim 20,
A method in which the lower portion of the inner surface of the fixed cup is bent outward and opened downward, and the cleaning liquid is supplied from the third cleaning nozzle toward the bent portion of the inner surface of the fixed cup. Is preferred.

According to a twenty-first aspect of the present invention, there is provided a cleaning method according to the present invention, wherein a holding means for holding an object to be processed, a rotatable rotary cup with a lid surrounding the side, upper and lower sides of the object to be processed, A cleaning method for a cup having a high coating thickness, comprising: a fixed cup surrounding the side and bottom of the rotating cup; and a rectifying plate attached to the inside of the rotating cup with a lid and covering a top of the object to be processed, While the rotating cup with the lid is rotated, the cleaning liquid is supplied from the center of the lid of the rotating cup with the lid toward the rectifying plate and supplied to the lower surface of the lid by centrifugal force, and the outer peripheral lower surface of the rectifying plate, Supplying the cleaning liquid toward the inner surface of the rotating cup with the lid and the bottom surface of the fixed cup,
It is characterized by the following.

As described in claim 22, in the cleaning method of the present invention, it is preferable to supply a cleaning liquid to the outer peripheral lower surface of the rotating cup with the lid and the inner surface of the fixed cup. According to a twenty-third aspect of the present invention, in the cleaning method of the present invention, the rotating cup with the lid is rotated at the first rotation speed so that the center of the lid of the rotating cup with the lid is directed toward the rectifying plate. Supplying a cleaning liquid, rotating at a second rotation speed higher than the first rotation speed, and supplying the cleaning liquid toward the lower surface of the outer periphery of the rectifying plate and the inner surface of the rotating cup with the lid; Rotating at a third rotation speed slower than the rotation speed of
It is preferable to supply the cleaning liquid to the bottom of the rotating cup with a lid. In this case, as described in claim 24, for example, the first rotation speed can be 350 to 650 rpm, the second rotation speed can be 700 to 1300 rpm, and the third rotation speed can be 14 to 26 rpm. .

According to the present invention, while the rotating cup with the lid is rotated, the cleaning liquid is supplied from the center of the lid of the rotating cup toward the rectifying plate, and the rectifying plate is rotated. By supplying the cleaning liquid to the outer peripheral lower surface, the inner surface of the rotating cup with a lid, and the bottom surface of the fixed cup,
The cleaning liquid supplied from the center of the lid of the rotating cup is scattered outward by the centrifugal force of the rotating current plate, and removes the coating liquid attached to the lower surface of the lid.
The coating liquid adhering to the inner surface of the rotating cup and the cleaning liquid supplied to the bottom surface of the fixed cup can be removed.

Further, by supplying the cleaning liquid to the outer peripheral lower surface of the rotating cup with the lid and to the inner surface of the fixed cup, it is possible to remove the coating liquid adhering to the outer peripheral lower surface of the rotating cup and the inner surface of the fixed cup. In this case, claim 20
As described in the above, the lower portion of the inner surface of the fixed cup is bent outward to form a stagnation portion of the air flowing between the rotating cup and the fixed cup. The backflow can be prevented by receiving the application liquid scattered on the inner surface of the fixing cup, and the cleaning liquid is supplied from the third cleaning nozzle toward the bent portion of the inner surface of the fixed cup as described in claim 19. By supplying the coating liquid, the coating liquid adhering to the fixed cup can be removed.

Further, as described in claim 24, the rotating cup with a lid is rotated at a first rotation speed (for example, 350 to 650 rpm).
m), the cleaning liquid is supplied from the center of the lid portion of the lid with the lid toward the rectifying plate, and the centrifugal force of the rectifying plate rotating with the rotation of the rotating cup causes the cleaning liquid to flow onto the outer peripheral lower surface of the lid. The coating liquid adhering to the lower surface of the lid by collision can be removed, and the liquid is rotated at a second rotation speed (for example, 700 to 1300 rpm) higher than the first rotation speed to rotate the outer peripheral lower surface of the rectifying plate and the rotation with the lid. By supplying the cleaning liquid toward the inner surface of the cup, the cleaning liquid can be efficiently supplied to the outer peripheral lower surface of the current plate and the large area of the inner surface of the rotating cup, and the third rotation speed that is slower than the first rotation speed. By rotating at a rotation speed (for example, 14 to 26 rpm) and supplying the cleaning liquid to the bottom surface of the rotating cup with the lid, the cleaning liquid is moved from the inner peripheral side to the outer peripheral side of the bottom surface of the rotating cup, and the coating liquid adhered to the bottom surface. Remove Rukoto can.

[0052]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows an LCD substrate coating / developing processing system (hereinafter referred to as LC) according to a first embodiment of the processing apparatus of the present invention.
FIG. 1 is a diagram illustrating a configuration of a D substrate processing system).

As shown in the figure, the LCD substrate processing system includes a loader section 90 for loading / unloading a target object, for example, a rectangular LCD glass substrate G (hereinafter, referred to as a glass substrate G), and a glass substrate G Processing unit 91 that processes
A second processing unit 92 connected to the first processing unit 91 via a relay unit 93, and a second processing unit 92 and other devices;
For example, it includes a transfer unit 94 for exchanging the glass substrate G with the exposure device 95 or the like.

The loader section 90 includes a cassette stage 98.
Is provided. A plurality of cassettes 96 and 97 are mounted on the cassette stage 98. The cassette 97 stores a plurality of unprocessed glass substrates G. The loader unit 90 includes a loading / unloading tweezers 99 for loading or unloading the unprocessed glass substrate G.
Is provided.

The first processing section 91 includes the brush cleaning device 12
0, jet water cleaning device 130, adhesion treatment device 105, cooling treatment device 106, two resist coating /
It comprises coating film removing devices 107 and 108 and the like. This first
In the central passage of the processing section 91, 80a is provided so as to run and stop freely.

The second processing section 92 includes a plurality of heat treatment apparatuses 1
09 and two developing devices 110. A main arm 80b is also provided in the central passage of the second processing section 92 so as to be able to run and stop. This second processing unit 92
Is provided with a loading / unloading tweezers 112 for loading and unloading the glass substrate G. In the relay unit 93,
A table 93a for transferring the glass substrate G is provided. The table 113 for transferring the glass substrate G is also provided in the transfer section 94.
Is provided. The exposure device 95 exposes a predetermined fine pattern on the resist film.

As shown in FIG. 2, each of the resist coating / coating film removing apparatuses 107 and 108 supplies a coating liquid, for example, a resist liquid from the coating liquid supply nozzle 1a to the surface of the glass substrate G to apply the resist liquid. And an edge removing mechanism 2 that removes an unnecessary coating film formed on the peripheral edge of the glass substrate G by, for example, integrally disposing them in the same atmosphere, and removing the edge. The cleaning liquid used in the mechanism 2, for example, a thinner which is a solvent of the resist solution, is collected, and the thinner is coated by the cleaning device 4 as a circulation system for circulating the thinner for cleaning the cup of the coating mechanism 1. And a transport mechanism 3 for transporting the glass substrate G to the edge removing mechanism 2. A guide rail 53 provided to extend in the X or Y direction and a plurality of slide members 54 slidably attached to the guide rail 53 are provided on the edge removing mechanism 2 side.
The slide member 54 is configured to be reciprocally movable in the X or Y direction by a moving mechanism (not shown) using a wire, a chain, a belt ball screw, a stepping motor, an air cylinder, and the like. Each slide member 54 has a removal nozzle 51 which is one component of the edge removal mechanism 2.
Is attached. In the vicinity of the intersection of the guide rails 53, there is provided a sensor 55 for detecting the proximity position of the removal nozzles 51 so that adjacent removal nozzles 51 do not interfere with each other, that is, do not collide with each other. This sensor 5
5 detects that one of the adjacent removal nozzles 51 approaches the other removal nozzle 51, transmits a detection signal to a control unit described later, and stops driving of the moving mechanism by a control signal from the control unit. By doing so, interference between adjacent removal nozzles 51, that is, collision can be prevented. As shown in FIGS. 2 and 3, the coating mechanism 1 is a spin chuck 10 that holds the glass substrate G by suction by a vacuum device (not shown) and rotates in the horizontal direction (θ direction).
A low-opening cylindrical rotating cup 12 having an open upper portion having a processing chamber 20 surrounding the upper and outer peripheral portions of the spin chuck 10, and an opening 12a of the rotating cup 12
The main part is constituted by a lid 16 which can be attached (detachable) so as to be openable and closable, and a hollow ring-shaped drain cup 14 arranged so as to surround the outer peripheral side of the rotating cup 12. The drain cup 14 is for collecting waste discharged from the rotating cup 12. The processing chamber 20, the rotating cup 12, the lid 16, the drain cup 14, and the like constitute a container for collecting a processing liquid, a cleaning liquid, and the like.

The spin chuck 10 has a rotating shaft 22 which is rotated by driving a drive motor 21 disposed below.
, And can be rotated (rotated) in the horizontal direction, and can be moved in the vertical direction by driving a lifting cylinder 23 connected to the rotating shaft 22. In this case, the rotating shaft 22 is rotatably mounted on the inner peripheral surface of the fixed collar 24 via a bearing 25a.
Is slidably connected to a spline bearing 27 fitted on the inner peripheral surface of the spline bearing. The driven pulley 2 is attached to the spline bearing 27.
8a, a belt 29a is stretched between the driven pulley 28a and a driving pulley 21b mounted on a driving shaft 21a of the driving motor 21. Therefore,
The rotation of the rotation shaft 22 via the belt 29a by the driving of the drive motor 21 rotates the spin chuck 10.
The lower portion of the rotating shaft 22 is disposed in a cylinder (not shown). The rotating shaft 22 is connected to the lifting cylinder 23 via a vacuum seal 30 in the cylinder, and the rotating shaft 23 is driven by the lifting cylinder 23. 22 can move up and down.

The rotating cup 12 is fixed to the fixed collar 2.
4 is mounted via a connecting cylinder 31 fixed to the upper end of a rotating outer cylinder 26b mounted on the outer peripheral surface of the spinning cup 12 via a bearing 25b, and between the bottom 12b of the rotating cup 12 and the lower surface of the spin chuck 10. , A bearing 32 having a sealing function is interposed and is rotatable relative to the spin chuck 10. Then, a belt 29b which is stretched over a driven pulley 28b mounted on the rotating outer cylinder 26b and a driving pulley 21b mounted on the driving motor 24.
As a result, the drive from the drive motor 21 is transmitted to the rotating cup 12, and the rotating cup 12 is rotated. In this case, the diameter of the driven pulley 28b is formed to be the same as the diameter of the driven pulley 28a mounted on the rotating shaft 22, and the same drive motor 21 belts 29a and 29b are stretched. The spin chuck 10 rotates the same. A labyrinth seal portion (not shown) is formed on the opposing surfaces of the fixed collar 24 and the rotating inner cylinder 28a and the rotating outer cylinder 26b, so that dust enters the rotating cup 12 from the lower drive system during the rotation process. Is prevented from doing so. The driven pulleys 28a and 28b have different diameters,
You may make it rotate at a different rotational speed.

As shown in FIGS. 3 and 4, the rotating cup 12 has a tapered surface in which the inner surface of the side wall is reduced in diameter toward the upper side. This is because the air flow supplied from the air supply hole 34 provided at the center of the lid 46 is
The air is exhausted from the exhaust hole 35 formed on the lower peripheral portion, that is, at an appropriate position in the circumferential direction on the lower side of the side wall, along the tapered surface through the flow straightening plate 33 disposed below the lid 16. It is like that.

By providing the air supply hole 34 and the exhaust hole 35 in this manner, when the rotating cup 42 rotates, the air flowing into the processing chamber 20 from the air supply hole 34 flows to the outside through the exhaust hole 35, When the rotation of the processing chamber 20
It is possible to prevent the inside from becoming a negative pressure more than necessary.
In addition, the lid 16 can be easily opened without requiring a large force when the lid 16 is opened from the rotating cup 12 after the processing.

On the other hand, as shown in FIG.
4, an annular passage 14 a is provided. At an appropriate position (for example, four positions in the circumferential direction) of the outer peripheral wall of the annular passage 14 a, an exhaust port 36 connected to an exhaust device (not shown) is provided. A radial exhaust passage 37 (see FIG. 3) communicating with the exhaust port 36 is formed in an upper portion on the inner peripheral side of the drain cup 14.

As described above, the exhaust port 36 is provided in the outer peripheral portion of the drain cup 14 and the exhaust passage 37 communicating with the exhaust port 36 is formed in the upper portion on the inner peripheral side of the drain cup 14. Mist scattered by the centrifugal force inside 20 and flowing into the drain cup 14 through the exhaust hole 35 is prevented from rising to the upper side of the rotary cup 12, and can be discharged from the exhaust port 36 to the outside.

The annular passage 14a is connected to the drain cup 14
The wall 44b rising from the bottom of the drain cup 14 and the wall 14c hanging down from the ceiling of the drain cup 14 are detoured so that the exhaust can be performed uniformly.
A drain hole 14e is provided at an appropriate interval in the circumferential direction in the bottom portion 14d located between the two.

The lid 16 is fixed to the opening 12a of the rotating cup 12 during the rotation process and needs to be rotated. Therefore, for example, a fixing pin (not shown) protruding above the rotating cup 12 is provided. The cover 16 can be fixed to the rotating cup 12 by fitting a fitting recess (not shown) fitted to the fixing pin to each other.

When the lid 16 is opened and closed, as shown by the imaginary line in FIG. 3, the robot arm 40 is inserted under the bulging head 18 protruding from the upper surface of the lid 46 to bulge. The robot arm 40 is inserted into the locking groove 18a provided in the head 18.
After engaging the locking pin 41 protruding from the robot arm, the robot arm 40 can be moved up and down. The position of the locking groove 18a of the bulging head 18 when the cover 16 is opened and the position of the locking pin 41 of the robot arm 40, and the position of the fixing pin and the fitting recess when the cover 16 is closed. Can be performed by controlling the rotation angle of the drive motor 21 formed by a servomotor or the like.

On the other hand, as shown in FIGS. 3 and 4, a first injection in which a cleaning liquid, for example, a thinner or the like is injected (supplied) to the inner wall surface 12c of the rotating cup 12 is injected into the processing chamber 20. A thinner supply nozzle 15d as a unit is attached. The bottom horizontal piece 14f of the drain cup 14 extending below the rotating cup 12 includes an outer lower surface of the rotating cup 12 and an inner wall 14c of the drain cup 14.
A thinner supply nozzle 15c is attached as a second injection unit for injecting (supplying) thinner toward the inner side surface of the thinner. Further, a thinner supply nozzle 15a as a second injection unit for injecting (supplying) a cleaning liquid, for example, recycled thinner, etc., toward the outer surface of the rotary cup 12 is attached to the wall 14c of the drain cup 14. . A thinner supply nozzle 15b is attached to the wall 14b of the drain cup 14 as a second injection unit for injecting (supplying) a cleaning liquid, for example, recycled thinner toward the outer surface of the wall 14c and the inner surface of the wall 14b. Have been. A plurality of these thinner supply nozzles 15a, 15b, 15c are attached at appropriate intervals in the circumferential direction.

For the rotating cup 12, the drain cup 14, and the like, a plate material such as stainless steel (SUS304) is used. In addition, although this plate material selected SUS304 in forming a coating material shown below, in order to use it as a base material of the coating portion, for example, a resin or metal other than stainless steel may be used, and only SUS304 is limited. is not.

As shown in FIG. 5, the surfaces (hatched portions) of the processing chamber 20 and the annular passage 14a which are in contact with the processing liquid and the cleaning liquid, that is, for example, the inner wall surfaces 12a and 4a of the rotating cup 12
2b, the inner surface of the lid 16, the front and back surfaces of the current plate 33, and the wall surface (walls 14b, 44c) in the annular passage 14a of the drain cup 14.
On both sides, the inner surface of the bottom 14d and the inner surface of the drain hole 14e), a coating material of a fluoroethylene resin,
For example, polytetrafluoroethylene (PTFE) or the like is formed to a thickness of, for example, about 60 pm.

[0071]

[Table 1]

[Table 2] Table 1 shows the adhesion test (contact angle of pure water), the resist adhesion test, the wiping test (magic contamination), and the chemical resistance for each combination example of the plate material and the coating material (Examples 1 to 12). It is a table in which a test, a hardness test, and the like are performed, and the respective test results and prices are corresponded. From Table 1, the results of selecting Example 6 as the best combination of a plate material and a coating material are shown.

The sixth embodiment uses SUS30 as a plate material.
This is an example in which PTFE was formed as a coating material on the surface of No. 4 with a thickness of 60 μm. In this case, the contact angle of pure water was the largest at 125.3 ° and the resist adhesion was 4
It was confirmed that the adhesiveness (adhesion) of the resist was remarkably low as compared with the other examples, as small as about -5 grains.

In addition to Example 6, as in Example 5, a copolymer resin of PTFE and ethylene (PTFE + PFA) is applied to
Although a film formed to a thickness of about μm was slightly inferior to Example 6 in the adhesiveness test (contact angle of pure water), good results were obtained in the resist adhesion test and the wiping test (magic contamination). May be used. In other words, it was confirmed that when the inside of the processing chamber 20 or the wall of the annular passage 14a was coated with the fluorinated ethylene resin, the amount of the resist remaining on the coated portion was small, and good results were obtained. The edge removing mechanism 2 shown in FIG. 2 includes a mounting table 50 that sucks and holds the glass substrate G by a vacuum device (not shown), and upper and lower surfaces of four edges of the glass substrate G held by the mounting table 50. Four removal nozzles 51 for spraying a cleaning liquid, for example, a solvent for a resist, that is, thinner
And

As shown in FIG. 6, a plurality of, for example, nine copying pads 52 for holding the glass substrate G are attached to the upper surface of the mounting table 50.

As shown in FIG. 7, the pad 52 is provided in a vacuum hole 50a provided in the mounting table 50 and a stepped recess 50b on the outer periphery of the vacuum hole 50a.
A substantially crown-shaped oil seal 52c fixed by a pressed ring screw 52b via a 2a, and a top pad 52e having a suction hole 52f at a center portion movably fitted to the crown portion 52d of the oil seal 52c. It is configured. With such a configuration, when the vacuum device is operated and sucked in a state where the glass substrate G is placed on the top pad 52e, the top pad 52e follows and adheres to the inclination and deformation of the glass substrate G, The substrate G can be reliably held by suction.

As shown in FIG. 9, the removal nozzle 51
Is an upper horizontal piece 56a covering the upper surface of the edge of the glass substrate G.
And a lower horizontal piece 5 protruding outward from the upper horizontal piece 56a.
6b and a jetting head 56 having a substantially U-shaped cross section.
b, a thinner supply path 56c for removing the resist on the front surface and a thinner supply path 56d for removing the resist on the rear surface are provided. These thinner supply paths 56c and 56d
Are connected to a plurality of nozzle holes 51a for cleaning the front surface and nozzle holes 51b for cleaning the back surface, respectively. Also,
The vertical part 56e of the jet head 56 is provided with a drainage path 56f connected to a collecting pipe 60 described later along the center line C. The opening width of the opening 56g on the substrate edge side of the drainage path 56f is formed in a tapered shape expanding toward the front end.

The nozzle hole 51a is provided with the removal nozzle 51.
Are arranged in a straight line position orthogonal to the center line C at appropriate intervals. In this case, the nozzle holes 51a are arranged at positions deviated from the center line C, and are arranged inside the expanding tapered opening 56g of the drainage passage 56f.

On the other hand, as shown in FIG.
b is the nozzle hole 51a on a straight line facing the nozzle hole 51a.
a and an appropriate distance from each other so as not to interfere with each other,
A plurality of openings are arranged inside the expanding tapered openings 56g, and are arranged at appropriate intervals on the center line C of the distal end extending portion. Here, the reason why the nozzle holes 51a and 51b are provided so as to be shifted from each other is that when thinners ejected from the nozzle holes 51a and 51b collide near the nozzle, the thinner scattered due to the collision is formed on the surface of the glass substrate G. This is to prevent adverse effects such as making the film thickness of the resist film non-uniform by adhering to the resist film. Further, by arranging the nozzle holes 51a and 51b inside the expanding tapered opening 56g, the thinner sprayed (supplied) from the nozzles 51a and 51b is efficiently collected from the drainage passage 56f without scattering to the outside. It can be collected in tube 60.

As shown in FIG. 11, the cleaning device 4
Is a collection pipe 60 for collecting thinner spouted from the removal nozzle 51 toward both sides of the edge of the glass substrate G on which the resist film is formed, through the drainage path 56f of the removal nozzle 51.
A suction mechanism 61 connected from the collection pipe 60 via a switching valve 75, a mist trap 62 as gas-liquid separation means for gas-liquid separation of a mixture of thinner and air collected by the suction mechanism 61, An edge remover tank 70 (hereinafter, referred to as an ER tank 70) as a first discharged liquid storage section for storing used (recycled) thinner A1 separated from the mist trap 62, and replenished supply to the ER tank 70 Valve 64 connected via tube 63a
and an unused thinner A connected to the valve 64a.
New liquid tank 71 storing O (new liquid) and ER tank 7
0 through thinner supply nozzles 15a through valve 64b.
Thinner resupply pipe 65 for supplying used (recycled) thinner A1 to 15c, and new liquid supply pipe 6 for supplying unused thinner AO from new liquid tank 71 to removal nozzle 51
6, a DR tank 72 serving as a second discharged liquid storage unit for storing the used (recycled) thinner A2 (discharge liquid) discharged from the drain hole 14e, and the DR tank 7
2 and a valve 64a, and a replenishment supply pipe 63b for replenishing unused thinner AO (new liquid) from the new liquid tank 71.
A valve 64c interposed between the DR tank 72 and the thinner resupply pipe 65, and the tanks 70, 71, 72
And a liquid level sensor 74 for detecting the liquid level of the thinner stored in each of them, and each of the valves 64a to 64c based on the liquid level information detected by the liquid level sensor 74.
And the switching valve 75 are controlled to control the tanks 70 and 7 respectively.
The control unit 68 controls a movement mechanism (not shown) based on detection information from the sensor 55 that detects the position of the removal nozzle 51 while adjusting the amount of thinner taken from the nozzles 1 and 72.

The ER tanks 70 and DR tanks 72 and the thinner supply nozzles 15a to 15c for cup cleaning are connected by thinner resupply pipes 65, and are supplied from an inert gas supply source (not shown) into the tanks 70 and 72. Inert gas supplied, for example, nitrogen gas (hereinafter referred to as N ₂ gas)
As a result, the thinners A1 and A2 in the tanks 70 and 72 are changed according to the opening degrees of the valves 64b and 64c.
From a to 15c, the fuel is injected (supplied) to the inside of the processing chamber 20, the inner and outer walls of the rotary cup 12, and each wall of the drain cup 14. Note that the thinners A1 and A2 of the tanks 70 and 72 are connected to the thinner supply nozzle 15 using a pump without using the N ₂ gas.
a to 15c.

The liquid level sensor 74 is connected to the ER tank 70, DR
When the amount of thinner in the tank 72 becomes equal to or more than a predetermined amount, the liquid level information is detected and sent to the control unit 68 as a liquid level detection signal. The openings 64a to 84c are respectively controlled.
The control unit 68 controls the switching valve 75 to discharge the used thinner (thinner having a relatively high resist concentration) which has begun to be collected from the removal nozzle 51 of the edge removal mechanism 2 from the drain pipe 76. By switching the switching valve 75, the thinner is sent to the suction mechanism 61 side, and only those suitable for reuse are collected. Here, a schematic operation of the LCD substrate processing system will be described.

In the case of this LCD substrate processing system, the unprocessed glass substrate G accommodated in the cassette 96 is taken out by the loading / unloading tweezers 99 of the loader unit 90 and then passed through the transport path 102 of the first processing unit 91. Delivered to the moving main arm 80a, and
It is transported within 0. The glass substrate G that has been brush-cleaned in the brush cleaning device 120 is subsequently cleaned with high-pressure jet water in the jet water cleaning device 130.
Thereafter, the glass substrate G is placed on the adhesion processing device 10.
5, after being subjected to a hydrophobizing treatment and cooled by a cooling treatment device 106, each of the resist coating / coated film removing devices 107,
A resist film is applied and formed by the application mechanism 1 of 108.
Subsequently, the glass substrate G is transferred to the adjacent edge removing mechanism 2 side, and the unnecessary resist film on the side of the glass substrate G is removed by the edge removing mechanism 2. Therefore, when the glass substrate G is carried out thereafter, since the resist film at the edge is removed, the resist does not adhere to the main arms 80a, 80b and the like. The contaminated effluent containing the resist, which is used for removing the unnecessary resist by the edge removing mechanism 2, is collected in the mist trap 62 through the collection pipe 60 as described above, and is separated into gas and liquid by the mist trap 62. Only the liquid component, that is, thinner, is stored in the ER tank 70. Then, ER tank 70 and D
The thinner stored in the R tank or the like is reused by the cleaning processing device 4 for cleaning the cups of the resist coating / coating film removing devices 107 and 108.

Resist coating / coating film removing device 107, 1
The glass substrate G from which the unnecessary resist has been removed in step 08 is transferred to the heat treatment apparatus 109, heated and baked by the heat treatment apparatus 109, and then exposed to the exposure apparatus 95.
A predetermined pattern is exposed on the surface of the glass substrate G.
Then, the glass substrate G after exposure is received by the main arm 80b moving on the transfer path 102a of the second processing unit 92, transferred to the developing device 110, developed by the developer, and rinsed by the rinsing liquid. The developing solution is washed away to complete the developing process. The processed glass substrate G that has been subjected to the development processing is accommodated in the cassette 97 of the loader unit 90, and then carried out and transported to the next processing step.

Next, the operation (washing and circulation action) of the above-mentioned washing apparatus 4 will be described. First, the glass substrate G that has been coated by the coating mechanism 1 is transported by the transport mechanism 3 onto the mounting table 50 of the edge removing mechanism 2 and is mounted thereon, and is suction-held by vacuum.

Next, the moving mechanism of the removing nozzle 51 is driven to move the removing nozzle 51 along each side of the glass substrate G in the X or Y direction, and the thinner AO supplied from the new liquid tank 71 is supplied to the nozzle hole. Unnecessary resist adhering to both sides of the edge of the glass substrate G is dissolved and removed by spraying (supplying) from 51a and 51b. The thinner used for cleaning is
The drainage path 56f is generated by the airflow caused by suction of the suction mechanism 61.
Through the recovery path 60, the switching valve 75, the suction mechanism 61
Through the mist trap 62. In this case, the thinner used at the beginning of cleaning is discharged from the drain pipe 76 by switching the switching valve 75.

Since the thinner (discharge) collected in the mist trap 62 contains air (gas) together with the dirty thinner, only the air (gas) is removed to the outside by the exhaust action of the mist trap 62. (Exhaust), and only the liquid component is stored in the ER tank 70 by its own weight.

Then, the amount of thinner stored in the ER tank 70 increases, and the liquid level of the thinner rises to some extent.
When the liquid level is detected by the liquid level sensor 74 provided above the zero, the control unit 68 is notified of the detection.

Then, the control unit 68 sends a control signal to the valve 64b to open the valve 64b, and at the same time, supplies N2 gas into the ER tank 70 from an N2 gas supply source (not shown). The thinner A1 in the ER tank 70 is supplied to the thinner supply nozzles 15a to 15c through the thinner resupply pipe 65, and injected (supplied) from the thinner supply nozzles 15a to 15c to the outer surface of the rotary cup 12 and the inner surface of the drain cup 14, respectively. Then, cup cleaning is performed.

As a result, the processing chamber 20, the rotating cup 12 and the drain cup 1
The resist slightly adhered to the wall surface of No. 4 can be dissolved and removed. In addition, since the PTFE is previously coated on the wall surfaces of the processing chamber 20, the rotary cup 12, and the drain cup 14, the resist is not attached as compared with the related art, so that the cleaning interval (period) can be made longer. .

When the cup is washed, the thinner is discharged from the drain hole 14 e of the drain cup 14 and stored in the DR tank 72.

When the amount of the thinners A1 and A2 in the ER tank 70 and the DR tank 72 becomes small, the amount is detected by the respective liquid level sensors 74, the valve 64a is controlled by the control unit 68, and the N2 gas (not shown) The new liquid tank 7 is controlled by the gas pressure of the N2 gas supplied from the supply source.
1 unused thinner AO is supplied to the replenishing supply pipes 63a, 63b.
Through the ER tank 70 and the DR tank 72.

Thus, the cup cleaning is not hindered, the cleaning efficiency of the cup cleaning can be improved, and the reliability of the cleaning apparatus can be improved.

As described above, the LCD of the first embodiment
According to the substrate processing system, the thinner A1 used for removing the unnecessary resist attached to the edge of the glass substrate G by the edge removing mechanism 2 is stored in the ER tank 70, and the thinner A2 used for cleaning the cup is stored in the DR tank 72. By reusing the thinners A1 and A2 stored in the tanks 70 and 72 for cup cleaning, the thinner conventionally discarded can be effectively used. As a result, waste of thinner can be reduced and running cost can be reduced.

In the same processing system of the resist coating mechanism 1 and the edge removing mechanism 2, the thinner used in the edge removing mechanism 2 is reused for cleaning the cup of the coating mechanism 1, so that the piping is commonly used. The number of systems can be reduced, and the size of the device can be reduced. Furthermore, the ER tank 70,
When the liquid level of the thinner stored in the DR tank 72 becomes low, this is detected by the liquid level sensor 74, and the control means 68 receives the notification from the liquid level center 74 and outputs the new liquid tank 7.
Since the valve 64a is controlled so as to replenish the new liquid from 1 to each of the tanks 70 and 72, there is no trouble in cleaning the cup. Further, it is possible to optimize the reuse of the used thinner.

Next, another embodiment of the present invention will be described.

The first embodiment shown in FIG. 4 is an example of a container provided outside the annular passage 14a of the drain cup 14 and the outer peripheral surface of the rotary cup 12, but other various containers may be used. Shape is conceivable.

For example, the annular passage 14a of the drain cup 14
Of these, the exhaust passage may be provided directly below the rotating cup 12.

In this case, as shown in FIG. 12, the annular passage 14a is formed by the wall 1 hanging from the ceiling of the drain cup 14.
4c to the drain hole 14e, the wall 14c and the rotating cup 1
2 to form an upper clearance 14f with the outer peripheral surface of
By providing an inner ring 17 between the hill portion 14g of the drain cup 14 and the bottom portion 12b of the rotating cup 12, a clearance 14h is formed between the bottom portion 12b of the rotating cup 12 and the inner ring 17, and the inner ring and the drain cup 14 An exhaust guide passage 14i is formed between the hill 14g and a filter 19 at the inlet (upstream opening) of the exhaust guide passage 14i, and air (gas) separated from the thinner is formed.
Through the filter 19 to the exhaust passage 14j. In this case, the inner ring 17
The thinner supply nozzles 15a, 15b, 15c, and 15d are provided on the hill portion 14e and the wall 14c, respectively, and the thinner is sprayed (supplied) toward each wall surface to be cleaned.
The filter 19 is made of, for example, a corrosion-resistant wire such as stainless steel arranged in a mesh form, separates gas and liquid from the discharged material, discharges mist to the exhaust passage 14j, and discharges thinner to the drain hole 14e. I do. Also in the container configured in this way, PTFE of 60 μm
The film is formed with a thickness of about m.

Further, as shown in FIG.
4, an exhaust port 36a is provided at the upper part of the outer wall.
14k and drain cup 14 protruding from the side wall below
There is also a configuration in which a circular passage 14a is formed by being detoured by a wall 14c hanging down from a ceiling portion and a drain hole 141 having a tapered shape expanding upward is provided to improve the discharge efficiency of the discharged liquid. . In this case, the drain cup 14
Inside, a plurality of thinner supply nozzles 15a, 15b, 15
c and 15e are provided, and thinner is injected (supplied) toward each wall surface to be cleaned. Also in the container configured in this way, PTFE of 60 μm
The film is formed with a thickness of about m.

Further, as shown in FIG. 14, an exhaust port 36a is provided at the upper part of the outer wall of the drain cup 14, and a wall 14b rising from the bottom 14d of the drain cup 14 and a wall 14c hanging from the ceiling of the drain cup 14 are provided. Annular path 14a
Are formed in a detour shape so as to form two discharge paths, while two bottoms defined by the wall 14b are provided with tapered drain holes 14m and 14n, respectively, which expand upward, and the drain holes 14m and 14n are contaminated. There is a configuration in which each of the discharged liquids is used for a different purpose by discharging different discharged liquids. In this case, a plurality of thinner supply nozzles 15a, 15b, 15c,
158 is provided, and thinner is sprayed (supplied) toward each wall surface to be cleaned. Also in the container configured in this way, a film of PTFE having a thickness of about 60 μm is formed on the wall surface in contact with the discharged liquid. In the above embodiment, the thinner used for removing the unnecessary resist on the edge of the glass substrate G is applied to the resist coating / removing devices 107 and 10.
Although the case of reusing for cleaning the rotating cup 12 and the drain cup 14 in the processing chamber 20 of No. 8 has been described, it is needless to say that the same can be reused for cleaning of another type of cup. Also, the object of reuse of the cleaning liquid does not necessarily need to be the cups of the resist coating / removing devices 107 and 108, but may be other devices such as a cleaning device for a developing device or the like, or a device other than the cup. For example, a main arm or a mounting table may be used.

Further, in the first embodiment, the case where the present invention is applied to an LCD substrate coating / developing processing system has been described. However, the present invention is also applied to a system other than the LCD substrate, for example, a system for processing a semiconductor wafer or the like. can do.

Referring to FIG. 15, a second cleaning apparatus according to the present invention will be described. FIG. 15 is a diagram showing a configuration of an LCD substrate coating / developing processing system.

FIG. 15 differs from the cleaning apparatus of the embodiment of FIG. 11 in that the new liquid tank 71 is connected to a thinner resupply pipe 65 via valves 64a and 64c. Used thinner A1 in ER tank 70
Is not present or when the liquid volume is not enough,
An unused thinner in the new liquid tank is directly used for cleaning the rotating cup 12 and the drain cup 14.

With reference to FIG. 16, a third cleaning apparatus according to the present invention will be described.

This cleaning apparatus differs from the cleaning apparatus of the embodiment shown in FIG. 11 in that two ER tanks 70a and 70
b and the ER tank 7 that supplies unused thinner A13 to the removal nozzle 51 or the rotating cup 12.
0c is provided.

First, the spent thinner A is supplied from the mist trap 62 to the ER tank 70a via the three-way valve 64d.
Recover 11. When the ER tank 70a is full, the valve 64d is switched, and then the ER tank 70b
To collect used thinner A12. ER tank 70b
While the used thinner A12 is being collected, the rotating cup 12 and the drain cup 14 are washed using the thinner A11 in the ER tank 70a. Next, the ER tank 70b
Is full, the valve 64d is switched, the used thinner is collected in the ER tank 70a, and the ER is used for cleaning.
The thinner A12 of the cup 70b is used. Thus 2
By using the ER cups 70a and 70b alternately, the used thinner can be continuously used for cleaning.

The ER cup 70c has an ER cup 7
Used thinners A13 supplied from Oa and 70b are accumulated. This used thinner A13 is
3c, it is supplied to the removal nozzle 51 via the valve 64e, and is ejected to both sides of the edge of the glass substrate G. Alternatively, the used thinner A13 is provided with a supply pipe 63c and a valve 64.
It is used to clean the inside of the rotating cup 12 via f. In order to remove the unnecessary coating film applied to the peripheral portion of the glass substrate G or to clean the inside of the rotating cup 12, the concentration of the resist contained in the thinner A13 in the ER tank 70c is required. Must be diluted below a certain value. Therefore, a concentration sensor 77 is provided in the ER tank 70c, and when the concentration of the thinner is equal to or more than a predetermined value, the unused thinner A
Dilute thinner A13 with O.

Another embodiment of the present invention will be described in detail with reference to the drawings. Here, a case where the cleaning apparatus according to the present invention is applied to a resist coating apparatus for an LCD substrate will be described.

As shown in FIG. 17, the above-mentioned resist coating apparatus has a rectangular object to be processed, for example, a rectangular LCD substrate G.
Coating liquid supply nozzle 301 on the surface of the substrate (hereinafter referred to as substrate)
a coating mechanism 301 that supplies a coating liquid, for example, a resist liquid from a, and applies the resist liquid; an edge removing mechanism 302 that removes an unnecessary coating film applied and formed on the peripheral edge of the substrate G;
A transport mechanism 303 for transporting the substrate G applied by the application mechanism 301 to the edge removing mechanism 302 is provided.

As shown in FIG. 17, the coating mechanism 301 is a spin chuck 310 which is a holding means for holding the substrate G by a vacuum device (not shown) and rotating in the horizontal direction (θ direction), and the spin chuck 310. A low-opening cylindrical rotating cup 312 having an upper opening and a processing chamber 320 surrounding the upper and outer peripheral portions of the rotating cup 312, and an opening 312a of the rotating cup 312 are openably and closably attached (detachable).
And a substrate G attached below the cover 316 and held by the spin chuck 310.
The main part is composed of a straightening plate 317 that covers the upper part of the rotating cup 312 and a hollow ring-shaped fixed cup 314 that is arranged so as to surround the outer peripheral side of the rotating cup 312. Further, the coating mechanism 301 is provided with a cleaning device 304 for cleaning the inner surface and bottom surface of the rotating cup 312, the back surface of the lid 316, the outer lower surface of the current plate 317, and the inner surface of the fixed cup.

The spin chuck 310 is rotated by a drive motor 321 disposed below.
22, and can be rotated (rotated) in the horizontal direction via a rotary shaft 322.
Can be moved in the vertical direction by the drive of. In this case, the rotating shaft 322 is slidably connected to a spline bearing 327 fitted on the inner peripheral surface of a rotating inner cylinder 326a rotatably mounted on the inner peripheral surface of the fixed collar 324 via a bearing 325a. Have been. A driven pulley 328a is mounted on the spline bearing 327, and the driven shaft 321a of the drive motor 321 is mounted on the driven pulley 328a.
Belt 329 between the driving pulley 321b attached to the
a. Therefore, the drive motor 321
, The rotation shaft 322 rotates via the belt 329a, and the spin chuck 310 rotates. The lower side of the rotating shaft 322 is disposed in a cylinder (not shown). The rotating shaft 322 is connected to the lifting cylinder 323 via a vacuum seal 330 in the cylinder, and the rotating shaft 322 is driven by the driving of the lifting cylinder 323. Can move up and down.

The rotating cup 312 is connected to an outer peripheral surface of the fixed collar 324 via a bearing 325b via a bearing 325b.
A bearing 332 having a sealing function is interposed between the bottom 312b of the rotating cup 312 and the lower surface of the spin chuck 310 so as to be rotatable relative to the spin chuck 310. Then, a driven pulley 328b mounted on the rotating outer cylinder 326b
And a drive pulley 321 mounted on the drive motor 321
b driven by the belt 329b
The drive from 21 is transmitted to the rotating cup 312, and the rotating cup 312 is rotated. In this case, the driven pulley 328
b is the diameter of the driven pulley 3 mounted on the rotary shaft 322.
Drive motor 32 which is formed identically to the diameter of
Since the belts 329a and 329b are stretched around 1, the rotating cup 342 and the spin chuck 310 rotate the same. In addition, a labyrinth seal portion (not shown) is formed on the opposing surfaces of the fixed collar 324 and the rotating inner cylinder 326a and the rotating outer cylinder 326b, so that dust enters the rotating cup 312 from the lower drive system during the rotation processing. Is prevented from doing so. The driven pulleys 328a and 328b may have different diameters and rotate at different rotation speeds.

The rotating cup 312 is formed by forming a tapered surface in which the inner surface of the side wall is reduced in diameter toward the upper side, and the packing 31 is formed in the opening 312a of the rotating cup 312.
The air flow supplied from the air supply hole 334 provided on the center side of the lid 316 closed via 8 passes along the taper surface through the rectifying plate 317 disposed below the lid 316. Thus, the gas is exhausted from an exhaust hole 335 provided at an appropriate position in the peripheral direction on the lower peripheral portion, that is, on the lower side of the side wall. Thus, the air supply hole 334 and the exhaust hole 33
When the rotating cup 312 rotates, the air flowing into the processing chamber 320 from the air supply hole 334 flows to the outside through the exhaust hole 335 when the rotating cup 312 rotates. A negative pressure can be prevented, and the lid 316 can be easily opened without requiring a large force when opening the lid 316 from the rotating cup 312 after the processing.

On the other hand, inside the fixed cup 314, an annular passage 314a is provided.
An exhaust port 336 connected to an exhaust device (not shown) is provided at an appropriate location (for example, four locations in the circumferential direction) of the outer peripheral wall of the fixed cup 314, and an exhaust port 336 is provided at an upper portion on the inner peripheral side of the fixed cup 314.
A radial exhaust passage 337 that communicates with the air is formed (see FIGS. 18 and 19). Thus, the fixed cup 31
4 and an exhaust passage 337 communicating with the exhaust port 336 is formed in the upper part on the inner peripheral side of the fixed cup 314, so that the processing chamber 3
The mist scattered by centrifugal force in the inside 20 and flowing into the fixed cup 314 through the exhaust hole 335 is
Can be prevented from rising to the upper side, and can be discharged outside through the exhaust port 336.

The annular passage 314a is connected to the fixed cup 31.
4 and an outer wall 314b rising from the bottom of the fixing cup 31
4 is detoured by an inner wall 314c that hangs down from the ceiling, so that exhaust can be performed uniformly, and the bottom 31 that is located between the outer wall 314b and the inner wall 314c.
4d is provided with drain holes 314e at appropriate intervals in the circumferential direction. A bent portion 314g that bends in a crank shape toward the outer side is provided in a lower open side on a lower side of the inner wall 314c, that is, a portion facing the lower side of the rotating cup 312. By providing the bent portion 314g in this manner, a stagnant portion of the air flowing downward from above during the resist coating process can be formed, and the upward flow of the resist scattered outside can be prevented.

Since the lid 316 needs to be fixed to the opening 312a of the rotating cup 312 and rotated integrally during the rotation process, for example, a fixing pin (not shown) protruding above the rotating cup 312, The fitting recess (not shown) fitted to the fixing pin is fitted to the
6 is fixed to the rotating cup 312. The lid is opened and closed by a robot arm (not shown).

On the other hand, as shown in FIG. 18 and FIG. 19, the cleaning device 304 uses the air supply hole 334 provided at the center of the lid 316 as a supply hole and inserts a gap into the supply hole 334 with a gap. Then, the first cleaning nozzle 3 that sprays (supplies) a cleaning liquid, for example, thinner B, on the upper surface of the rectifying plate 317
05 and a bracket 319 attached to the rotating shaft 322 of the spin chuck 310, and apply a cleaning liquid, for example, thinner B, to the lower surface of the outer periphery of the current plate 317, the inner surface of the rotating cup 312, or the bottom surface of the rotating cup 312. The second cleaning nozzle 306 to be sprayed (supplied) and the horizontal piece 314f extending inward from the bottom 314d of the fixed cup 314 are attached to the rotating cup 3
There is provided a third cleaning nozzle 307 for spraying (supplying) a cleaning liquid, for example, a thinner B, toward the outer lower surface of the inner surface 12 or the inner surface of the fixed cup 314, that is, the inner wall 314c.
These first to third cleaning nozzles 305, 306, 307
Is connected to thinner tanks 370 and 371, and N
The thinner B is configured to be independently injected (supplied) by the gas pressures of the two gases. The thinner tank 370 is the ER tank described in the first to third cleaning apparatuses, and contains the collected used thinner A1. The thinner tank 371 is a tank containing a new liquid.
A concentration sensor 377 is provided to detect the concentration in the ER tank 370. The concentration of the resist in the ER tank 370 is measured by the concentration sensor 377, and when the node exceeds a certain value, a new solution is supplied from the new solution tank 371 to the ER tank to dilute the solution.

With this configuration, the thinner B sprayed from the first cleaning nozzle 305 onto the rectifying plate 317 is scattered in the radial direction by the centrifugal force of the rotating rectifying plate 317 and is shown in FIG. Thus, the resist A that collides with the lower surface of the lid 316 and adheres to the lower surface of the lid 316 can be dissolved and removed.

Further, as shown in FIG. 21, the second cleaning nozzle 306 includes a nozzle body 306A having a nozzle hole 306a for spraying a thinner B toward the outer peripheral lower surface of the current plate 317, and a rotating cup 312. Nozzle body 30 having nozzle hole 306b for injecting thinner B toward the side surface
6B and a nozzle body 306C having a nozzle hole 306c for injecting the thinner B toward the inner peripheral side portion of the bottom surface of the rotating cup 312. It is arranged in.
The direction of the outer peripheral lower surface of the rectifying plate 317 that rotates from the nozzle holes 306a, 306b, and 306c of the nozzle bodies 306A, 306B, and 306C (the direction (2) in FIGS. 20 and 21), and the direction of the inner surface of the rotating cup 312 (FIG. And FIG.
By spraying the thinner 8 in the direction (1) (3) and the bottom direction of the rotating cup 312 (direction (4) in FIGS. 20 and 21), it is possible to dissolve and remove the resist adhering to the corresponding portions. it can. Note that the second cleaning nozzle 306 has at least three types of nozzle bodies 306A and 306.
B and 306C, and a plurality of sets of three types of nozzle bodies 306A, 306B and 306C may be arranged.

Further, the third cleaning nozzle 307 is provided as shown in FIG.
, A nozzle body 307A having a nozzle hole 307a for injecting the thinner B toward the outer peripheral lower surface of the rotating cup 312, and a thinner B toward the inner wall 314c (specifically, the bent portion 344g) of the fixed cup 314. The nozzle body 307B has a nozzle hole 307B having a nozzle hole 307b for jetting the nozzles, and is disposed at an appropriate interval in the circumferential direction, for example, at an interval of 180 degrees. These nozzle bodies 307
A, 307B from the nozzle holes 307a, 307b to the outer peripheral lower surface of the rotating cup 312 (direction (5) in FIGS. 20 and 24) and the inner wall 314f of the fixed cup 314.
(Specifically, the bent portion 314g) direction (FIGS. 20 and 25)
By spraying the thinner B in the direction (6), the resist adhering to each corresponding portion can be dissolved and removed. Note that the third cleaning nozzle 307 only needs to be composed of at least two types of nozzle bodies 307A and 308B, and a plurality of sets of two types of nozzle bodies 307A and 307B may be arranged.

Note that the edge removing mechanism 302 operates as shown in FIG.
As shown in FIG. 7, a mounting table 350 for sucking and holding the substrate G by a vacuum device (not shown), and a cleaning liquid, for example, a resist solvent (thinner) is applied to the upper and lower surfaces of the four edges of the substrate G held by the mounting table 350. The main part is constituted by the four removal nozzles 351 which are the first cleaning liquid supply means for spraying.

The removal nozzle 351 is provided with a guide rail 353 provided to extend in the X or Y direction in FIG.
Is attached to a slide member 354 slidably mounted on the slide. The slide member 354 is moved by a moving mechanism (not shown) using a wire, a chain, a belt, a ball screw, a stepping motor, an air cylinder, and the like.
It is configured to be able to reciprocate in the X or Y direction. Also,
A sensor 355 for detecting the proximity position of the removal nozzle 351 is provided so that adjacent removal nozzles 351 do not interfere with each other, that is, collide with each other. By this sensor 355, one of the adjacent removal nozzles 351 is connected to the other removal nozzle 3
By detecting the approach to the 51 side, transmitting the detection signal to a control unit (not shown), and stopping the driving of the moving mechanism by the control signal from the control unit, interference between adjacent removal nozzles 351, that is, collision Can be prevented.

Next, the cleaning operation of the cleaning device 304 will be described. First, after the resist is applied to the substrate G by the coating mechanism 301, the lid 316 is opened, the spin chuck 310 is raised, and the substrate G is taken out by a transfer arm (not shown). Then, the lid 316
Is closed, and the rotating cup 3 is rotated together with the spin chuck 310.
12 and the lid 316 are rotated (for example, 350 to 630 rpm).
m) and the first cleaning nozzle 305 inserted into the supply hole 334 (air supply hole) with a gap.
The thinner B is jetted onto the upper surface of the center of the current plate 317 which rotates from. Then, thinner B sprayed on current plate 317
Are scattered in the radial direction by centrifugal force, collide with the outer peripheral lower surface of the lid 316, and dissolve and remove the resist A attached to the outer peripheral lower surface of the lid 316 (see (1) of FIGS. 19 and 20). .

Next, the rotation of the spin chuck 310 and the rotation cup 312 is rotated at a high speed (for example, 700 to 1300 rpm).
m) and the second cleaning nozzle 30
The thinner B is sprayed from the nozzle bodies 306A and 308B of No. 6 toward the lower surface of the outer periphery of the current plate 317 and the inner surface of the rotating cup. Then, the thinner B collides with the outer lower surface of the rotating current plate 317 and the inner surface of the rotating cup 312 to dissolve and remove the resist A attached thereto ((2), (3) in FIGS. 19 and 20). reference). In addition, this current plate 31
7 and the nozzle body 307A, 3 of the third cleaning nozzle 307 at the same time as cleaning the inner surface of the rotating cup 312.
07B to the inner lower surface of the rotating cup 312 and the inner surface of the fixed cup, ie, the inner wall 314f (specifically, the bent portion 3
14g), the thinner B is sprayed toward the outer peripheral lower surface of the rotating cup 312 and the inner wall 31 of the fixed cup.
4f (specifically, the bent portion 314g) dissolves and removes the resist A (FIGS. 19 and 20 (5),
(6)).

Next, the rotation of the spin chuck 310 and the rotation cup 312 is rotated at a low speed (for example, at a rotation speed of 14 to 26 rpm), and the bottom surface of the rotation cup 312 is rotated from the nozzle body 306C of the second cleaning nozzle 306. Is sprayed with thinner B. Then, the thinner B sprayed on the bottom surface of the rotating cup 312 is rotated by the centrifugal force.
The resist A attached to the bottom surface by moving to the outer peripheral side on the bottom surface of the second 2 is dissolved and removed (see (4) of FIGS. 19 and 20).
5 is dissolved and removed.

In the above embodiment, the outer peripheral lower surface of the lid 316 is cleaned ((1) in FIG. 20) → the outer peripheral lower surface of the rectifying plate 317, the inner surface of the rotating cup 312, the outer peripheral lower surface of the rotating cup 312, and the fixed cup. Cleaning of inner wall 314f (specifically, bent portion 314g) of 314 ((2) in FIG. 19,
(3), (5), (6)) → The case where cleaning is performed in the order of cleaning the bottom surface of the rotating cup 312 and the exhaust hole 335 (see (4) in FIG. 20) has been described. It is not necessary to carry out in such order, and the order of cleaning can be appropriately selected. The timing of this cleaning operation is arbitrary. For example, after a predetermined number of resists are applied to the substrate G, for example, one lot, the cleaning operation can be performed periodically.

In the above embodiment, the case where the cleaning apparatus and the cleaning method according to the present invention are applied to an LCD substrate coating apparatus has been described. However, the present invention can be similarly applied to a processing apparatus other than the coating apparatus, for example, a developing apparatus. , And L
The present invention can also be applied to cleaning of a cup other than a CD substrate, for example, a coating apparatus or a developing apparatus of an object to be processed such as a semiconductor wafer.

[0128]

As described above in detail, according to the first to seventh aspects of the present invention, after a cleaning liquid is supplied to an object to be processed and cleaned, the cleaning liquid is recovered, and the cleaning liquid is recovered. The cleaning liquid can be effectively used by separating and removing the gas from the cleaning liquid and storing the cleaning liquid, and using the stored cleaning liquid for cleaning the body to be cleaned. Accordingly, the amount of the cleaning liquid used can be reduced, so that the cost can be reduced and the resources can be effectively used.

Further, by using the stored cleaning liquid for cleaning the processing apparatus for the object to be processed, the cleaning liquid can be effectively used in the same processing system, and the piping system for the cleaning liquid can be reduced. Therefore, the size of the device can be reduced.

Further, the cleaning liquid is replenished to the reservoir of the recovered cleaning liquid, and the mixed liquid of the replenished cleaning liquid and the recovered cleaning liquid is used for cleaning the object to be cleaned, thereby further improving the cleaning efficiency. As a result, the reliability of the cleaning apparatus can be improved.

In addition, the first cleaning liquid supply means is provided with a nozzle hole for jetting the cleaning liquid toward a portion of the edge of the object to be processed which does not interfere with each other, and a recovery pipe is connected to the outer side. Since the cleaning liquid supplied from the first cleaning liquid supply unit and supplied for the primary cleaning can be efficiently collected, waste of the cleaning liquid can be omitted, and the cleaning efficiency can be further improved.

According to the eighth aspect of the present invention, the discharged liquid discharged from the container when the inner wall surface of the container is cleaned by the cleaning means is recovered by the circulating system to be cleaned by the cleaning means. Since the cleaning liquid is supplied, the cleaning liquid can be reused. As a result, it is possible to reduce the amount of the cleaning liquid used and to reduce the running cost of the entire apparatus. According to the ninth aspect of the present invention, one of the drainage liquid stored in the drainage liquid storage section and the unused cleaning liquid stored in the new cleaning liquid storage section is selected or mixed with each other to provide the cleaning means. The supply does not hinder cup cleaning.

According to the tenth aspect of the present invention, of the first discharged liquid stored in the first discharged liquid storing section and the second discharged liquid stored in the second discharged liquid storing section, Since one of them is selected or mixed with each other and supplied to the cleaning means, the cleaning liquid once used can be efficiently used.

According to the eleventh aspect of the present invention, at least one of the first and second discharged liquid storage sections is replenished with an unused cleaning liquid, that is, a new liquid, and stored in each of the storage sections. Since the discharged liquid is diluted and one of them is selected or mixed with each other and supplied to the cleaning means, the cleaning liquid once used can be efficiently used without deteriorating the cleaning performance.

According to the twelfth aspect of the present invention, at least one of the first discharge liquid storage section and the second discharge liquid storage section is replenished with the unused cleaning liquid in the new cleaning liquid storage section to provide a cleaning means. By supplying the water to the cleaning solution, the cleaning of the cleaning liquid is not hindered even when the cleaning liquid is reused, and the cleaning efficiency of the cup cleaning can be improved without deteriorating the cleaning performance, and the cleaning of the cup can be performed. Reliability can be improved.

According to the thirteenth aspect of the present invention, the first discharge liquid stored in the first discharge liquid storage section, the second discharge liquid stored in the second discharge liquid storage section, and the new cleaning liquid. Since any one of the unused cleaning liquids in the storage section is selected or mixed and supplied to the cleaning means, the inside of the container can be efficiently cleaned by the cleaning means.

According to the fourteenth aspect of the present invention, when the amount of the washing liquid or the discharged liquid stored in each storage section is detected, the control means takes in the liquid from each storage section based on each liquid amount. Since the amount of the cleaning liquid or the discharged liquid is controlled, it is possible to optimize the supply of the cleaning liquid to each unit.

According to the fifteenth aspect of the present invention, the used cleaning liquid is supplied to the second injection section, and the unused cleaning liquid is supplied to the first injection section. The cleaning solution can be used efficiently.

According to the sixteenth aspect of the present invention, since the fluorinated ethylene-based resin layer is formed on the inner wall surface of the container, the processing liquid which has flowed out or scattered when the object is processed is treated. Adhesion to the inner wall surface is reduced.

According to the seventeenth aspect of the present invention, by limiting the portion of the container in which the fluorinated ethylene resin layer is formed, the amount of the fluorinated ethylene resin used is minimized, and The effect that adhesion is reduced can be obtained.

According to the present invention described in claims 18 to 24,
While the rotating cup with the lid is rotated, the cleaning liquid is supplied from the center of the lid of the rotating cup toward the current plate,
By supplying the cleaning liquid to the outer peripheral lower surface of the current plate, the inner surface of the rotating cup with the lid, and the bottom surface of the fixed cup, the cleaning liquid supplied from the center of the lid of the rotating cup rotates outward due to the centrifugal force of the rotating plate. The coating liquid scattered on the lower surface of the lid is removed, and the cleaning liquid supplied to the outer lower surface of the current plate, the inner surface of the rotating cup, and the bottom surface of the fixed cup is removed. can do.

Further, by supplying the cleaning liquid to the outer peripheral lower surface of the rotating cup with the lid and the inner surface of the fixed cup, the coating liquid adhering to the outer lower surface of the rotating cup and the inner surface of the fixed cup can be removed. In this case, claim 20
As described in the above, the lower portion of the inner surface of the fixed cup is bent outward to form a stagnation portion of the air flowing between the rotating cup and the fixed cup. The backflow can be prevented by receiving the application liquid scattered on the inner surface of the fixing cup, and the cleaning liquid is supplied from the third cleaning nozzle toward the bent portion of the inner surface of the fixed cup as described in claim 19. By supplying the coating liquid, the coating liquid adhering to the fixed cup can be removed.

Further, as described in claim 24, the rotating cup with a lid is rotated at a first rotation speed (for example, 350 to 650 rpm).
m), the cleaning liquid is supplied from the center of the lid portion of the lid with the lid toward the rectifying plate, and the centrifugal force of the rectifying plate rotating with the rotation of the rotating cup causes the cleaning liquid to flow onto the outer peripheral lower surface of the lid. The coating liquid adhering to the lower surface of the lid by collision can be removed, and the liquid is rotated at a second rotation speed (for example, 700 to 1300 rpm) higher than the first rotation speed to rotate the outer peripheral lower surface of the rectifying plate and the rotation with the lid. By supplying the cleaning liquid toward the inner surface of the cup, the cleaning liquid can be efficiently supplied to the outer peripheral lower surface of the current plate and the large area of the inner surface of the rotating cup, and the third rotation speed that is slower than the first rotation speed. By rotating at a rotation speed (for example, 14 to 26 rpm) and supplying the cleaning liquid to the bottom surface of the rotating cup with the lid, the cleaning liquid is moved from the inner peripheral side to the outer peripheral side of the bottom surface of the rotating cup, and the coating liquid adhered to the bottom surface. Remove Rukoto can.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an LCD substrate processing system according to one embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a resist coating / coating film removing apparatus of the LCD substrate processing system.

FIG. 3 is a sectional view showing a coating mechanism of the resist coating / coating film removing apparatus.

FIG. 4 is an enlarged cross-sectional view of a container (a processing chamber, a rotating cup, and a drain cup) of a third coating mechanism.

FIG. 5 is a diagram showing a state in which the container of FIG. 4 is coated with a fluorinated ethylene resin.

FIG. 6 is a schematic perspective view showing the upper surface of the mounting table.

FIG. 7 is an enlarged view of a main part of FIG. 6;

FIG. 8 is a diagram showing an edge removing mechanism.

FIG. 9 is a plan view showing a nozzle hole for a surface of the edge removing mechanism of FIG. 8;

FIG. 10 is a plan view showing a nozzle hole for the back surface of the edge removing mechanism of FIG. 8;

FIG. 11 is a diagram showing a first cleaning apparatus.

FIG. 12 is a view showing a modified example of the container.

FIG. 13 is a view showing another modified example of the container.

FIG. 14 is a view showing still another modified example of the container.

FIG. 15 is a view showing a second cleaning apparatus of the present invention.

FIG. 16 is a view showing a third cleaning apparatus of the present invention.

FIG. 17 is a schematic plan view of a resist coating apparatus provided with a fourth cleaning apparatus according to the present invention.

FIG. 18 is a schematic sectional view showing a fourth cleaning apparatus according to the present invention.

FIG. 19 is an enlarged cross-sectional view showing the main part of the cleaning device.

FIG. 20 is a schematic sectional view specifically showing a cleaning unit.

FIG. 21 is a schematic sectional view showing another type of the second cleaning nozzle in the present invention.

FIG. 22 is a schematic sectional view showing another type of the second cleaning nozzle in the present invention.

FIG. 23 is a schematic sectional view showing another type of the second cleaning nozzle in the present invention.

FIG. 24 is a schematic sectional view showing another type of the third cleaning nozzle in the present invention.

FIG. 25 is a schematic sectional view showing another type of the third cleaning nozzle in the present invention.

[Explanation of symbols]

 G Glass substrate 60 Recovery pipe 62 Mist trap 64 Valve 70 ER tank 71 New liquid tank 72 DR tank 74 Liquid level sensor 75 Switching valve 16 Lid 51 Nozzle 56 Thinner supply path 12 Rotating cup 14 Drain cup 120 Brush cleaning device

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kiyohisa Tateyama 272, Heisei, Takao, Otsu-cho, Kikuchi-gun, Kumamoto Prefecture 4 Tokyo Electron Kyushu Co., Ltd. Otsu Office

Claims (24)

[Claims] A cleaning liquid is supplied to a target object to be cleaned, the cleaning liquid is collected, the gas is separated and removed from the collected cleaning liquid, the cleaning liquid is stored, and the stored cleaning liquid is removed from the cleaning target. A cleaning method, which is used for cleaning. 2. The cleaning method according to claim 1, wherein the stored cleaning liquid is used for cleaning a processing unit of the processing body. 3. The cleaning processing method according to claim 1, wherein a cleaning liquid is replenished to a storage portion of the recovered cleaning liquid, and a mixed liquid of the replenished cleaning liquid and the recovered cleaning liquid is used for cleaning an object to be cleaned. A cleaning treatment method characterized by using. 4. A first cleaning liquid supply means for supplying a cleaning liquid to an object to be processed, a recovery pipe for recovering the cleaning liquid used for cleaning the object to be processed, and a gas for separating and removing gas from the collected cleaning liquid. A liquid separating unit; a cleaning liquid storage unit for storing the cleaning liquid separated by the gas-liquid separation unit; and a second supplying the cleaning liquid in the cleaning liquid storage unit to the body to be cleaned.
A cleaning liquid supply unit. 5. The cleaning apparatus according to claim 4, wherein the second cleaning liquid supply unit is provided in the processing apparatus for the object to be processed. 6. The cleaning apparatus according to claim 4, wherein
The first cleaning liquid supply means includes a plurality of nozzle holes arranged at appropriate intervals for spraying the cleaning liquid toward portions on both sides of the edge of the object that do not interfere with each other, and the outer side portion includes the nozzle holes. A cleaning treatment device comprising a collection pipe connected to the cleaning treatment device. 7. The cleaning apparatus according to claim 4, wherein the cleaning liquid storage section is formed so as to be capable of replenishing a cleaning liquid from a cleaning liquid supply source. 8. A container for collecting a processing liquid flowing out or scattered when the object is processed, a cleaning unit for supplying a cleaning liquid into the container and cleaning an inner wall surface thereof, and A treatment system, comprising: a circulation system that collects a discharged liquid discharged from the container when the inner wall surface of the container is cleaned and supplies the discharged liquid to the cleaning unit. 9. The processing apparatus according to claim 8, wherein the circulating system includes: a new cleaning liquid storage unit that stores unused cleaning liquid; a discharge liquid storage unit that stores discharge liquid discharged from the container; Cleaning liquid supply means for selecting one of the discharge liquid stored in the discharge liquid storage section and the unused cleaning liquid stored in the new cleaning liquid storage section or mixing them with each other and supplying the selected cleaning liquid to the cleaning means; A processing device characterized in that: 10. The processing apparatus according to claim 8, wherein the circulating system is configured to remove the first discharged liquid collected and discharged in the container when at least a part of the processed object is washed. A first effluent storage unit for storing, a second effluent storage unit for storing a second effluent collected and discharged in the container when the inner wall surface of the container is washed, and the first effluent storage unit; Either the first effluent stored in the effluent storage unit or the second effluent stored in the second effluent storage unit is selected or mixed with each other and supplied to the cleaning unit. A processing apparatus, comprising: a cleaning liquid supply unit. 11. The processing apparatus according to claim 10, wherein the cleaning liquid supply unit is configured to store an unused cleaning liquid for cleaning at least a part of the processed object to be processed in the first drainage storage unit. Alternatively, replenishing at least one of the second discharged liquid storage sections, and selecting one of the stored discharged liquids or mixing them with each other and supplying the cleaning liquid to the cleaning means. apparatus. 12. The processing apparatus according to claim 8, wherein the circulation system is configured to store a new cleaning liquid for storing unused cleaning liquid, and to clean at least a part of the processed object to be processed. A first effluent storage portion for storing the first effluent collected and discharged in the container, and a second effluent collected and discharged in the container when the inner wall surface of the container is washed The second cleaning liquid storage section, and the cleaning means by replenishing at least one of the first cleaning liquid storage section and the second cleaning liquid storage section with the unused cleaning liquid of the new cleaning liquid storage section. A cleaning liquid supply means for supplying the cleaning liquid to the processing apparatus. 13. The processing apparatus according to claim 8, wherein the circulation system is configured to store a new cleaning liquid for storing unused cleaning liquid, and to clean at least a part of the processed object after the processing. A first effluent storage portion for storing the first effluent collected and discharged in the container, and a second effluent collected and discharged in the container when the inner wall surface of the container is washed A second effluent reservoir, a first effluent stored in the first effluent reservoir, a second effluent stored in the second effluent reservoir, and the new cleaning fluid storage And a cleaning liquid supply unit for selecting one of the unused cleaning liquids from the unused cleaning liquids or mixing them, and supplying the selected cleaning liquid to the cleaning unit. 14. The processing apparatus according to claim 9, wherein the cleaning liquid supply unit detects a cleaning liquid or a discharged liquid amount stored in each of the storage units; Control means for controlling the amount of the washing liquid or the discharged liquid to be taken in from each of the storage units based on the amount of each liquid detected by the means. 15. The processing apparatus according to claim 9, wherein the cleaning unit includes: a first injection unit configured to inject a cleaning liquid toward an inner wall portion of the container near the processing target; and a discharge port separated from the processing target. A second injection unit for injecting the cleaning liquid toward the inner wall of the container close to the container, wherein the circulating system supplies a discharged liquid that is a used cleaning liquid to the second injection unit, and supplies an unused cleaning liquid. A processing device for supplying the liquid to the first injection unit. 16. A container for collecting a processing liquid which flows out or scatters when an object to be processed is processed, and an ethylene fluoride resin layer formed on an inner wall surface of the container. Processing equipment. 17. The processing apparatus according to claim 16, wherein said fluorinated ethylene-based resin layer is formed on a recovery path in said container capable of recovering said processing liquid. 18. A holding means for holding an object to be processed, a rotatable rotating cup with a lid surrounding the side, upper and lower portions of the object to be processed, and a fixing surrounding the side and lower part of the rotating cup with the lid. What is claimed is: 1. A cup cleaning device for a coating mechanism, comprising: a cup; and a rectifying plate mounted in the lid-mounted rotary cup and covering an upper portion of the object to be processed, provided at a center of a lid part of the lid-mounted rotary cup. A first cleaning nozzle for supplying a cleaning liquid onto the rectifying plate through the supply hole, a lower surface of an outer peripheral surface of the rectifying plate, an inner surface of a rotating cup with a lid, and a fixed cup disposed below the holding means. A second cleaning nozzle for supplying a cleaning liquid toward a bottom surface of the cleaning device. 19. The cleaning device according to claim 18, further comprising a third cleaning nozzle disposed in the fixed cup and configured to supply a cleaning liquid toward an outer lower surface of the rotating cup with a lid and an inner surface of the fixed cup. A cleaning device comprising: 20. The cleaning device according to claim 19, wherein a lower portion of the inner surface of the fixed cup is bent outward and opened downward, and the lower portion of the inner surface of the fixed cup is bent toward the bent portion of the inner surface of the fixed cup. A cleaning apparatus characterized in that a cleaning liquid is supplied from a third cleaning nozzle. 21. A holding means for holding an object to be processed, a rotatable rotary cup with a lid surrounding the side, upper and lower parts of the object to be processed, and a fixed member surrounding the side and lower part of the rotary cup with the lid. A cleaning method for a cup of an application mechanism, comprising: a cup; and a rectifying plate attached to the inside of the rotating cup with a cover and covering an upper portion of the object to be processed, wherein the rotating cup with the lid is rotated. The cleaning liquid is supplied from the center of the lid of the rotating cup with the lid toward the rectifying plate and supplied to the lower surface of the lid by centrifugal force, and the lower peripheral surface of the rectifying plate, the inner surface of the rotating cup with the lid, and the fixed cup. A cleaning method, comprising: supplying a cleaning liquid toward a bottom surface of the substrate. 22. The cleaning method according to claim 21, wherein a cleaning liquid is supplied to an outer lower surface of the rotating cup with a lid and an inner surface of the fixed cup. 23. The cleaning method according to claim 21 or 22, wherein the rotating cup with the lid is rotated at a first rotation speed, and the cleaning liquid is applied from the center of the lid of the rotating cup with the lid toward the rectifying plate. Rotating at a second rotation speed higher than the first rotation speed to supply the cleaning liquid to the outer lower surface of the rectifying plate and the inner surface of the rotating cup with the lid; and the first rotation A cleaning method, comprising: rotating at a third rotation speed lower than the number of rotations to supply a cleaning liquid to the bottom surface of the rotating cup with a lid. 24. The cleaning method according to claim 23, wherein the first rotation speed is 350 to 650 rpm, the second rotation speed is 700 to 1300 rpm, and the third rotation speed is 14 to 26 rpm. A cleaning method characterized by the above-mentioned.