KR101223354B1 - Substrate processing device - Google Patents

Abstract

TECHNICAL FIELD This invention relates to the substrate processing apparatus which wash | cleans with high washing efficiency and high efficiency, when wash | cleaning the process liquid adhered to a container.

The resist coating apparatus includes a cleaning jig 20 adsorbed and held by the spin chuck, a container surrounding the spin chuck and the cleaning jig 20, and a cleaning liquid supply nozzle for spraying the cleaning liquid on the back surface of the cleaning jig 20. The cleaning jig 20 has a main body 50 having a flat surface. Protruding portions 51 protruding outward are formed on the outer circumference of the main body portion 50, and the main body portion 50 and the protruding portions 51 are formed integrally. The protrusion part 51 is curved outward so that it may continue from the front surface 50a and the back surface 50b of the main-body part 50. FIG. The position of the vertex part T of the protrusion part 51 is continuously changing in the thickness direction of the said cleaning jig 20 along the outer periphery of the cleaning jig 20.

Description

[0001] SUBSTRATE PROCESSING DEVICE [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating processing apparatus for supplying a processing liquid to a substrate while rotating the substrate and applying a predetermined treatment, and more particularly, to a coating processing apparatus capable of washing a container with a processing liquid scattered by rotation. .

For example, in the photolithography process in the manufacture of a semiconductor device, a resist coating process is performed, for example, by applying a resist liquid onto a semiconductor wafer (hereinafter referred to as "wafer") to form a resist film. Generally as a coating process, the spin coating method is employ | adopted.

The spin coating method is a method in which the resist liquid is supplied to the center of the surface of the wafer while the wafer is adsorbed and held on the spin chuck, and the spin chuck is rotated to spread the resist liquid toward the radially outer side of the wafer by centrifugal force. The excess resist liquid is scattered from the outer rim of the wafer by centrifugal force and is taken in a cup-shaped container covering the wafer's periphery. In this method, since the resist liquid scattered from the wafer adheres to the inner surface of the container, it is necessary to clean the container as necessary.

Therefore, conventionally, it is proposed to use the cleaning jig 102 held by the spin chuck 101 when cleaning the container 100 as shown in FIG. 14. In this prior art, the cleaning liquid supply nozzle 103 for supplying the cleaning liquid on the cleaning jig 102 is provided above the cleaning jig 102. The cleaning jig 102 has a disk-shaped main body 110 and rising pins 111 provided on the main body 110 at predetermined intervals along the circumferential direction as shown in FIGS. 14 and 15. The pin 111 is formed so that height may gradually become high toward radial direction outer side. Then, while the cleaning liquid is supplied from the cleaning liquid supply nozzle 103 onto the cleaning jig 102, the cleaning jig 102 is rotated to diffuse the cleaning liquid on the cleaning jig 102 outward in the radial direction by centrifugal force. The cleaning liquid flows branched to the pin 111 and the portion where the pin 111 is not installed, and the cleaning liquid guided to the pin 111 is guided upwardly along the pin 111 to be oblique from the edge of the pin 111. Scatter upwards. On the other hand, the cleaning liquid guided to the portion where the pin 111 is not installed is scattered in the horizontal direction from the edge of the upper surface of the main body 110. Thus, the washing | cleaning liquid scattered from the edge of the main body 110 or the pin 111 of the washing | cleaning jig 102 is sprayed on the inner surface of the container 100, and the container 100 is wash | cleaned.

(Patent Document 1).

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2000-315671

However, in the case where the container 100 is cleaned using the cleaning jig 102 described above, the portion to which the cleaning liquid is injected is the portion to which the cleaning liquid is scattered from the edge of the main body 110 as shown in FIG. 120 and the part 121 into which the cleaning liquid scattered from the edge of the fin 111 is injected, and the cleaning liquid is not directly ejected to the region 122 therebetween. Therefore, this area 122 is cleaned by the cleaning liquid which conveys the inner surface of the container 100 by its own weight. However, since the cleaning was carried out by the cleaning liquid which was transmitted, the cleaning effect was low, and it took time to clean the inner surface of the container 100, and a large amount of the cleaning liquid was required. Moreover, when the washing | cleaning liquid which falls down becomes linear, the part in which the washing | cleaning liquid is not transmitted in the area | region 122 arises.

This invention is made | formed in view of the related point, and when wash | cleaning the process liquid adhering to a container, it aims at performing the washing | cleaning effect which is higher than before, and is efficient.

In order to achieve the above object, the present invention provides a rotation holding member for holding and rotating a substrate, and a container for covering the periphery of the substrate held by the rotating holding member and preventing scattering of the processing liquid supplied on the substrate. And a cleaning jig held by the rotation holding member for cleaning the inner surface of the container, and a cleaning liquid provided around the cleaning jig and supplied to the cleaning jig by rotating the cleaning jig. It has a scattering guide part for flying to an inner side surface, The position of the said scattering guide part is changing continuously in the thickness direction of a cleaning jig according to the outer periphery of the said cleaning jig.

According to the present invention, the cleaning jig is held by the rotation holding member, and the scattering guide of the cleaning liquid is provided on the outer circumference of the cleaning jig, so that the cleaning liquid supplied to the cleaning jig diffuses outward in the radial direction by centrifugal force caused by the rotation of the cleaning jig. Fly from the scattering guide to the inner side of the container. And since the position of a scattering guide part changes continuously in the thickness direction of a washing jig according to the outer periphery of a washing jig, the washing | cleaning liquid scattered from a scattering guide part is sprayed continuously in the perpendicular direction with respect to the inner surface of a container. In this way, since the cleaning liquid can be directly sprayed on the inner surface of the container with no spots and uniformly sprayed, it is not necessary to wait for the cleaning liquid to transfer and fall as before, and the cleaning effect is higher than before. Can be cleaned in a short time. Moreover, the quantity of the washing | cleaning liquid consumed at the time of washing | cleaning can also be reduced than before, and a container can be cleaned efficiently.

It has a cleaning liquid supply nozzle which supplies a cleaning liquid to at least the surface or the back surface of the said cleaning jig | tool hold | maintained by the said rotation holding member, The protrusion which protruded outward from the front and back of the cleaning jig was formed in the outer periphery of the said cleaning jig | tool. The scattering guide may be at the apex of the protrusion.

And a cleaning liquid supply nozzle for supplying a cleaning liquid to a storage portion in the cleaning jig held in the rotation holding member, wherein a plurality of discharge holes through the storage portion are formed at an outer periphery of the cleaning jig, and the scattering guide portion is discharged. You can stay in the hole.

According to the present invention, the cleaning effect is higher than before, the container is cleaned in a short time, and the amount of the cleaning liquid consumed is also reduced, so that the container can be efficiently cleaned.

Hereinafter, preferred embodiments of the present invention will be described. FIG. 1: is a longitudinal cross-sectional view which shows the outline of the structure of the resist coating apparatus 1 as a substrate processing apparatus which concerns on this embodiment.

The resist coating apparatus 1 has the casing 10 which can seal the inside as shown in FIG. As shown in FIG. 2, one side of the casing 10 is provided with a cleaning jig 20 or a carrying in / out port 11 of a wafer as an object to be processed, and an opening / closing shutter 12 is provided at the carrying in / out port.

Inside the casing 10, as shown in FIG. 1, the spin chuck 21 as a rotation holding member which adsorbs-holds the cleaning jig 20 or a wafer is provided in the upper surface. The spin chuck 21 has a horizontal upper surface, and a suction jig (not shown) for sucking the wafer 20 or the wafer is provided on the upper surface, for example. By the suction from the suction port, the cleaning jig 20 or the wafer can be adsorbed and held on the spin chuck 21.

The spin chuck 21 has, for example, a drive mechanism 22 provided with a motor or the like, and can rotate at a predetermined speed by the drive mechanism 22. The drive mechanism 22 is provided with a lift drive source such as a cylinder, and the spin chuck 21 can move up and down.

On the lower side of the spin chuck 21, a guide ring 23 having a cross-sectional shape is provided, and the outer circumference of the guide ring 23 is bent downward to extend. A container 24 is provided to surround the spin chuck 21, the wafer or cleaning jig 20 held on the spin chuck 21, and the guide ring 23.

The container 24 has an opening larger than the cleaning jig 20 or the wafer so as to elevate the spin chuck 21 on the upper surface thereof, and is discharged between the circumferential surface and the outer circumference of the guide ring 23. The gap 25 which forms a furnace is formed. The lower side of the vessel 24 forms a bent path together with the outer circumferential portion of the guide ring 23 to form a gas-liquid separator. An inner region exhaust port 26 in the bottom portion of the container 24 is formed, and an exhaust pipe 26a is connected to the exhaust port 26. In addition, a drain port 27 is formed in the outer region of the bottom of the container 24, and a drain tube 27a is connected to the drain port 27.

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Moreover, the resist liquid supply nozzle 30 for supplying a resist liquid to the center part of the wafer surface is arrange | positioned above the spin chuck 21. The resist liquid supply nozzle 30 is connected to the resist liquid supply source 32 via the piping 31.

The resist liquid supply nozzle 30 is connected to the movement mechanism 34 via the arm 33 as shown in FIG. The arm 33 is a standby area provided outside the one end side (right side in FIG. 2) of the container 24 along the longitudinal direction (Y direction) guide rail 35 of the casing 10 by the moving mechanism 34 ( From 36), it can move toward one end side and at the same time move up and down.

The cleaning liquid supply nozzles 40 and 40 which are below the spin chuck 21 and spray the cleaning liquid toward the back surface of the cleaning jig 20 or the wafer are shown on the guide ring 22, for example. Is being installed on. The cleaning liquid supply nozzle 40 is connected to the cleaning liquid supply source 42 via a pipe 41. As the cleaning liquid, for example, a solvent such as thinner is used.

Next, the cleaning jig 20 described above will be described. The cleaning jig 20 has a disk-shaped main body 50 having a flat surface as shown in FIGS. 3 and 4. Protruding portions 51 protruding outward from the main body portion 50 are formed on the outer circumference of the main body portion 50, and the protruding portions 51 are integrally formed on these main body portions 50. As shown in FIG. 5, the protrusion part 51 curves outward so that it may continue from the front surface 50a and the back surface 50b of the main-body part 50. As shown in FIG. And the position of the vertex part T of the protrusion part 51 changes continuously in the thickness direction of the cleaning jig 20 along the outer periphery of the cleaning jig 20, as shown to FIG. 3 and FIG. 5 (a) shows the side seen from the A-A line of the cleaning jig 20 shown in FIG. 4, and FIG. 5 (b) shows the side seen from the B-B line of the cleaning jig 20 shown in FIG.

The resist coating apparatus 1 which concerns on this embodiment is comprised as mentioned above, Next, the coating process of the wafer and the cleaning process of the container 24 using the resist coating apparatus 1 are demonstrated. 6 is an explanatory diagram showing a coating process and a washing process involved.

First, the wafer W is loaded into the casing 10 from the carry-in / out port 11, and is sucked and held by the spin chuck 21. As shown in FIG. Next, the wafer W is rotated at a predetermined rotational speed by the spin chuck 21, and the resist liquid R is supplied from the resist liquid supply nozzle 30 to the center portion of the wafer W. The resist liquid R is spread on the entire surface of the wafer W by centrifugal force, and the resist liquid R is applied to the surface of the wafer W. As shown in FIG. At this time, the excess resist liquid R is scattered from the outer edge portion of the wafer W and taken into the container 24 (Fig. 6 (a)). And the wafer W to which the resist liquid R was apply | coated is carried out from the loading / exit opening 11.

After the predetermined number of times the coating treatment of the resist liquid R to the wafer W is carried out, a washing process for washing the resist liquid R adhered to the inner surface of the container 24 is performed.

About the cleaning process of the container 24, the cleaning jig 20 is first carried in from the carrying in / out port 11 into the casing 10, and it is adsorbed-held by the spin chuck 21 (FIG. 6 (b)). Thereafter, the cleaning jig 20 is rotated at a predetermined rotational speed, and the cleaning liquid L is injected from the cleaning liquid supply nozzle 10 to the rear surface of the cleaning jig 10. The washing liquid L diffuses the rear surface of the cleaning jig 20 radially outward by the centrifugal force and scatters from the protrusions 51 toward the inner surface of the container 24 (Fig. 6 (c)). At this time, the washing | cleaning liquid L flows along the curved part of the protrusion part 51, and scatters from the vertex part T of the protrusion part 51, as shown in FIG. Then, since the position of the vertex part T continuously changes in the thickness direction of the cleaning jig 20 along the outer periphery of the cleaning jig 20, the cleaning liquid L scattered from the vertex part T is As shown in FIG. 8, it sprays continuously in the vertical direction (Z direction in the figure) with respect to the inner surface of the container 24. As shown in FIG. And the inner surface of the container 24 is wash | cleaned with the washing | cleaning liquid L injected directly. Moreover, the area | region D in which the washing | cleaning liquid L is injected directly covers the part which the resist liquid R adheres to the inner surface of the container 24. As shown in FIG.

According to the above embodiment, the cleaning jig 20 is held by the spin chuck 21, and protruding portions 51 protruding outwardly and curved in the thickness direction of the cleaning jig 20 are formed on the outer circumference of the cleaning jig 20. Therefore, the cleaning liquid L injected from the cleaning liquid supply nozzle 40 to the rear surface of the cleaning jig 20 diffuses outward in the radial direction by the centrifugal force caused by the rotation of the cleaning jig 20 and the curved portion of the protrusion 51. It flows and scatters from the vertex part T of the protrusion part 51. FIG. And since the position of the vertex part T of the protrusion part 51 changes continuously in the thickness direction of the washing jig 20 along the outer periphery of the cleaning jig 20, the vertex part T of the protrusion part 51 The cleaning liquid L scattered from the surface may be continuously sprayed in a direction perpendicular to the inner surface of the container 24. Thus, since the cleaning liquid L can be directly sprayed on the inner surface of the container 24 to which the resist liquid R is attached, without spotting and uniformly, the cleaning effect is higher than before, and the container 24 is cleaned. Can be performed in a short time. Moreover, the quantity of the washing | cleaning liquid L consumed at the time of washing | cleaning can also be reduced compared with the past, and the container 24 can be cleaned efficiently.

Even if the cleaning liquid supply nozzle 60 for supplying a cleaning liquid to the center of the cleaning jig 20 is provided above the spin chuck 21 in the resist coating apparatus 1 of the above embodiment, as shown in FIG. Okay. The other cleaning liquid supply nozzle 60 is connected to the cleaning liquid supply source 62 via a pipe 61. The other cleaning liquid supply nozzle 60 is connected to the moving mechanism 64 via the arm 63 as shown in FIG. The arm 63 can move toward the other end from the standby region 65 provided outside the other end side (left side in FIG. 2) of the container 24 along the guide rail 35 by the moving mechanism 64. At the same time, it is configured to move in the vertical direction.

In order to clean the container 24, first, as shown in FIG. 9, the resist liquid supply nozzle 30 is moved to the atmospheric region 36, and the other cleaning liquid supply nozzle 60 is moved above the central part of the cleaning jig 20. As shown in FIG. Move on. Next, the cleaning liquid L1 is injected from the cleaning liquid supply nozzle 30 to the rear surface of the cleaning jig 20, and the cleaning liquid L2 is provided from the other cleaning liquid supply nozzle 60 to the center of the upper surface of the cleaning jig 20. To supply. At the same time as the cleaning liquids L1 and L2 are supplied, the cleaning jig 20 is rotated by the spin chuck 21. As a result, as shown in FIG. 10, the cleaning liquids L1 and L2 diffuse outward in the radial direction of the cleaning jig 20 by centrifugal force, and scatter from the protrusions 51 toward the inner side surface of the container 24. At this time, as shown in FIG. 11, the cleaning liquid L1 flowing through the top surface of the cleaning jig 20 and the cleaning liquid L2 flowing through the back surface join at the apex portion T of the protrusion 51 and are scattered from the apex portion T. do.

In this case, since the cleaning liquids L1 and L2 can be supplied to both surfaces of the cleaning jig 20, the amount of the cleaning liquid sprayed on the inner surface of the container 24 can be increased to perform the cleaning process in a shorter time. Can be.

In addition, for the cleaning jig 20 of the above embodiment, as shown in FIG. 12, you may use the cleaning jig 70 which has the storage part 71 which stores cleaning liquid inside. In the central portion of the surface of the cleaning jig 70, an opening 72 for introducing the cleaning liquid L into the storage portion 71 of the cleaning jig 70 from another cleaning liquid supply nozzle 60 is formed. In the side surface of the cleaning jig 70, a plurality of discharge holes 73 passing through the storage portion 71 are formed. As shown in FIG. 13, the discharge hole 73 is provided with the cleaning jig 70 in accordance with the outer periphery of the cleaning jig 70, and the position of the some discharge hole 73 has the outer periphery of the cleaning jig 70. The thickness is continuously changing in the thickness direction. FIG. 13A is a side view of the cleaning jig 70 shown in FIG. 12 as seen from the positive direction of FIG. 12B, and FIG. 13B is a side view of the cleaning jig 70 shown in FIG. 12 as seen from the negative direction of X. FIG.

When the container 24 is cleaned, the cleaning jig 70 is supplied from the other cleaning solution supply nozzle 60 to the storage 71 of the cleaning jig 20 as shown in FIG. 12. It rotates by the spin chuck 21. At this time, the washing | cleaning liquid L in the storage part 71 is discharged toward the inner surface of the container 24 from the discharge hole 73 by centrifugal force. Then, since the position of the discharge hole 73 is continuously changed in the thickness direction of the cleaning jig 70 along the outer circumferential surface of the cleaning jig 20, the cleaning liquid L discharged from the discharge hole 73 The silver is continuously injected in a direction perpendicular to the inner surface of the container 24. Therefore, even when the related cleaning jig 70 is used, the inner surface of the container 24 can be cleaned efficiently.

As mentioned above, although the preferred embodiment of this invention was described referring an accompanying drawing, this invention is not limited to the example which concerns. Those skilled in the art are within the scope of the spirit described in the claims, and it is obvious that various modifications or modifications can be made, and it can be understood that they belong naturally to the technical scope of the present invention. The present invention is not limited to this example and can take various forms. For example, although the above-mentioned embodiment demonstrated the application process of the resist liquid as an example, the present invention is another processing liquid other than a resist liquid, for example, an anti-reflective film, a SOG (Spin ON Glass) film, and a SOD (Spin ON) Dielectric) can also be applied to a treatment solution for forming a film or the like, or a coating treatment of a developer. Moreover, in the above embodiment, although the application | coating process was performed to the wafer W, in this invention, the board | substrate of another board | substrate, such as a mask reticle for FPD (flat panel display) other than a wafer, and photomask, is used. It can also be applied to a coating treatment.

The present invention is useful for a coating processing apparatus that supplies a processing liquid to a substrate while rotating a substrate, such as a semiconductor wafer, for example, to perform a predetermined treatment, and in particular, to clean a container with a processing liquid scattered by rotation. It is useful for the coating processing apparatus which can be used.

1 is a longitudinal sectional view showing an outline of a configuration of a resist coating apparatus according to the present embodiment.

2 is a cross sectional view showing an outline of a configuration of a resist coating apparatus according to the present embodiment.

3 is a perspective view of the cleaning jig.

4 is a plan view of the cleaning jig.

Fig. 5 shows a side view of the cleaning jig, (a) shows a side view seen from the A-A line of the cleaning jig shown in Fig. 4, and (b) is a side view seen from the B-B line of the cleaning jig shown in Fig. 4.

6 is an explanatory view showing a state of a wafer coating process and a container cleaning process, (a) shows a state of wafer coating process, (b) shows a state that the cleaning jig is adsorbed and held by the spin chuck, (c) has shown the washing | cleaning state of a container.

It is explanatory drawing which showed the flow of the cleaning liquid in the protrusion part of a cleaning jig | tool.

It is explanatory drawing which shows the part in which the washing | cleaning liquid is sprayed in the inner surface of a container.

9 is a longitudinal cross-sectional view illustrating an outline of a configuration of a resist coating apparatus according to another embodiment.

10 is a cross sectional view showing an outline of a configuration of a resist coating apparatus according to another embodiment.

It is explanatory drawing which showed the flow of the cleaning liquid in the protrusion part of a cleaning jig | tool.

It is a longitudinal cross-sectional view which shows the outline of the structure of the resist coating apparatus which concerns on another form.

FIG. 13 is a side view of the cleaning jig, (a) is a side view seen from the positive direction of the cleaning jig shown in FIG. 12, and (b) is a side view seen from the X direction part direction of the cleaning jig shown in FIG.

It is explanatory drawing which showed the state which wash | cleans a container using the conventional cleaning jig | tool.

15 is a plan view of a conventional cleaning jig.

It is explanatory drawing which shows the part which the washing | cleaning liquid in the case of using the conventional washing | cleaning jig is sprayed on the inner surface of a container.

** Description of reference numerals indicating main parts **

1 resist coating device

20 cleaning jig

21 pin spin chuck

24 container

30 resist liquid supply nozzle

40 cleaning liquid supply nozzle

50 body

51 protrusions

60 Other Cleaning Liquid Supply Nozzle

70 cleaning jig

71 Storage

73 discharge hole

L washing liquid

R resist liquid

T Government

W wafer

Claims (3)

It is a substrate processing apparatus which has the rotation holding member which hold | maintains a board | substrate and rotates, and the container which covers the periphery of the board | substrate hold | maintained by the said rotation holding member, and prevents the scattering of the processing liquid supplied on the board | substrate to the outside, A cleaning jig held by the rotation holding member for cleaning the inner surface of the container; A cleaning liquid supply nozzle for supplying a cleaning liquid to at least a surface or a rear surface of the cleaning jig held in the rotation holding member; It is provided on the side of the said cleaning jig, and has a scattering guide part for flying the cleaning liquid supplied to the said cleaning jig to the inner surface of the said container by rotation of the said cleaning jig, The surface and the back surface of the cleaning jig is flat, The scattering guide portion is formed around the entire side surface of the cleaning jig and is a vertex portion of the protruding portion that protrudes outward, The apex part of the said projection part is formed by bending outward so that it may continue in thickness direction between the surface side of the side surface of the said cleaning jig, and the back surface side, The scattering guide portion scatters the cleaning liquid supplied to any one of the front surface or the rear surface of the cleaning jig from the apex, or joins and scatters the cleaning liquid supplied to the front surface and the rear surface of the cleaning jig at the apex. A substrate processing apparatus. The method according to claim 1, It has a cleaning liquid supply nozzle which supplies a cleaning liquid to at least the surface or back surface of the said cleaning jig | tool hold | maintained by the said rotation holding member, The outer periphery of the cleaning jig is formed with a protrusion protruding outward from the front and back surfaces of the cleaning jig, And the scattering guide portion is a vertex portion of the protrusion. It is a substrate processing apparatus which has the rotation holding member which hold | maintains a board | substrate and rotates, and the container which covers the periphery of the board | substrate hold | maintained by the said rotation holding member, and prevents the scattering of the processing liquid supplied on the board | substrate to the outside, A cleaning jig held by the rotation holding member for cleaning the inner surface of the container; A cleaning liquid supply nozzle for supplying a cleaning liquid to at least a surface or a rear surface of the cleaning jig held in the rotation holding member; It is provided on the side of the said cleaning jig, and has a scattering guide part for flying the cleaning liquid supplied to the said cleaning jig to the inner surface of the said container by rotation of the said cleaning jig, The surface and the back surface of the cleaning jig is flat, It has a cleaning liquid supply nozzle which supplies a cleaning liquid to the storage part in the said cleaning jig | tool hold | maintained by the said rotation holding member, On the outer periphery of the cleaning jig, a plurality of discharge holes through the storage portion are formed, And the scattering guide portion is the discharge hole.

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