WO2015029563A1

WO2015029563A1 - Cleaning jig, cleaning jig set, cleaning substrate, cleaning method, and substrate processing device

Info

Publication number: WO2015029563A1
Application number: PCT/JP2014/066641
Authority: WO
Inventors: 明日香吉住; 鮎美樋口; 本庄　一大; 高橋　光和; 達矢島野; 哲也二木
Original assignee: 大日本スクリーン製造株式会社
Priority date: 2013-08-28
Filing date: 2014-06-24
Publication date: 2015-03-05
Also published as: TWI600476B; TW201519967A

Abstract

This cleaning jig is fitted to a spin chuck in the place of a normal substrate. The cleaning jig is provided with: a flat base surface; and an inclined surface which is provided to the entire peripheral edge part of the base surface, and which inclines upwards from the centre of the base surface towards the outer periphery of the base surface. While the cleaning jig rotates, a cleaning solution is supplied from a discharge head to the vicinity of the centre of the base surface. The cleaning solution flows from the centre of the cleaning jig to the outer periphery thereof as a result of centrifugal force, and is scattered obliquely upwards from the inclined surface. The base surface and the inclined surface form a continuous surface along the entire peripheral edge part of the base surface, and thus the cleaning solution supplied to the base surface is smoothly guided to the inclined surface, and can be scattered obliquely upwards while inhibiting the unintended splashing of the cleaning solution.

Description

Cleaning jig, cleaning jig set, cleaning substrate, cleaning method, and substrate processing apparatus

The present invention relates to a cleaning technique for a substrate processing apparatus that performs liquid processing on a thin precision electronic substrate (hereinafter simply referred to as “substrate”) such as a semiconductor wafer or a glass substrate for a liquid crystal display device.

Conventionally, in a substrate manufacturing process, a substrate processing apparatus that performs a drying process after performing a surface treatment of the substrate such as a chemical solution treatment using a chemical solution and a rinse treatment using pure water has been used. As such a substrate processing apparatus, a single-wafer type apparatus that processes substrates one by one and a batch-type apparatus that collectively processes a plurality of substrates are used. A single-wafer type substrate processing apparatus usually performs a chemical treatment by supplying a chemical solution to the surface while rotating a substrate held by a spin chuck, a pure water rinsing process by supplying pure water, and then a substrate. Rotate at a high speed to dry off.

In such a single-wafer type substrate processing apparatus, a cup is disposed so as to surround the periphery of the rotating substrate, and the processing liquid scattered by the centrifugal force from the spin chuck and the substrate is received and collected. Since liquid drops containing chemicals and contaminants adhere to the cup, the contamination of the cup proceeds as the number of processed substrates increases. In addition, a part of the processing liquid scattered by the centrifugal force may become mist and scatter to the outer wall surface of the cup or the periphery of the cup. When the treatment liquid scattered outside the cup is also dried, it becomes a contamination source.

Also in a spin coating apparatus that forms a coating film by supplying a coating solution such as a resist to the surface of a rotating substrate, a cup for receiving the scattered coating solution is disposed around the substrate. In such a spin coater, when the scattered coating liquid adheres to the cup and dries, the resist deposition layer may adhere to the cup wall surface, which may become a significant contamination source.

For this reason, various cup cleaning techniques have been proposed. For example, Patent Document 1 discloses that a cup is cleaned by supplying a cleaning liquid to the rotating blocking plate while rotating the blocking plate provided above the spin chuck. Patent Document 2 discloses a technique for cleaning a cup by holding a dedicated cleaning jig on a spin chuck, supplying a cleaning liquid to the back surface of a rotating cleaning jig, and scattering the cleaning liquid from the outer peripheral edge. Has been. Further, in Patent Document 3, a cleaning jig having a hollow structure is attached to a spin chuck, and a cleaning liquid is supplied to a storage section inside a rotating cleaning jig, and the cleaning liquid is directed toward a cup from a discharge hole formed in the storage section. A technique for injecting water is disclosed.

Patent Document 4 discloses a technique for cleaning a cup by holding a cleaning substrate having a plurality of fins on a spin chuck, supplying a cleaning solution to the rotating cleaning substrate, and spraying the cleaning solution obliquely upward from the fins. It is disclosed. Patent Document 5 discloses a technique for rotating a spin base for holding a substrate, supplying a cleaning liquid to the upper surface of the spin base, and cleaning the cup with the cleaning liquid scattered from the rotating spin base. Yes. In the cleaning technique disclosed in Patent Document 5, the scattering distance of the cleaning liquid is adjusted by changing the rotation speed of the spin base, and not only the inner wall surface of the cup but also the outer wall surface of the cup and members outside the cup are cleaned. ing.

JP 2003-45838 A JP 2010-16315 A JP-A-5-82435 JP 2000-315671 A JP 2012-231049 A

The cup cleaning techniques disclosed in Patent Documents 1 to 4 all supply cleaning liquid to rotating members (blocking plates, cleaning jigs, etc.) and scatter the cleaning liquid toward the cup by centrifugal force. Is. In particular, in the techniques disclosed in Patent Document 2 to Patent Document 4 in which a dedicated cleaning jig (including a cleaning substrate) is provided, a contrivance is made so that the cleaning liquid is scattered at a predetermined angle from the horizontal direction. For example, in the technique disclosed in Patent Document 3, the discharge holes are formed in the cleaning jig obliquely upward and downward. In the technique disclosed in Patent Document 4, fins that rise at a predetermined angle from the horizontal direction are provided on the cleaning substrate so that the cleaning liquid is scattered obliquely upward. By doing in this way, the part of the cup which cannot be cleaned only by spraying the cleaning liquid in the horizontal direction can also be cleaned.

However, in the cleaning techniques disclosed in Patent Document 1 to Patent Document 4, since the direction in which the cleaning liquid is ejected is fixed, there is a problem in that the area to which the cleaning liquid is sprayed is limited and effective cleaning cannot be performed. It was. Insufficient cleaning of the contaminated cup causes deterioration in particle performance in the substrate processing apparatus.

Further, as disclosed in Patent Documents 4 and 5, when the cleaning liquid is supplied to the rotating plate-like member, the cleaning liquid flows toward the outer periphery of the rotating member by centrifugal force, and the friction of the rotating member due to friction with the rotating member. It also flows in the circumferential direction. Then, as in Patent Document 4, when a plurality of fins are provided at predetermined intervals along the circumferential direction of the cleaning substrate, the liquid splashes that are not controlled due to the collision of the cleaning liquid from the side surfaces of the fins. The cleaning liquid droplets land on an unintended part (for example, outside the cup) of the apparatus and become a new contamination source.

Also, as in Patent Document 5, when the cleaning liquid is supplied directly to the spin base, the cleaning liquid collides with the chuck pins provided so as to protrude from the upper surface of the spin base, and an unintended liquid splash occurs. Become. Even if such unintended random splashing occurs, the cleaning liquid droplets similarly land on unintended sites in the apparatus and become a new source of contamination.

Moreover, in the aspect of patent document 5, since the washing | cleaning liquid supplied on the spin base splashes to a measurement from the edge of a spin base with the centrifugal force of rotation, after washing | cleaning liquid is temporarily stored, it is scattered at a stretch, etc. It is difficult to control the scattering momentum.

This invention is made | formed in view of the said subject, and makes it the 1st objective to provide the washing processing technique which can suppress the liquid splash of the washing liquid which is not intended.

The second object of the present invention is to provide a cleaning technique that can effectively clean the cup over a wide range.

The third object of the present invention is to provide a cleaning processing technique capable of adjusting the scattering moment of the cleaning liquid.

Also, a fourth object of the present invention is to provide a substrate processing technique that can prevent liquid splashing by chuck pins during cleaning using a spin base.

In order to solve the above problems, a first aspect of the present invention is a substrate processing apparatus, wherein a substrate holding means for holding a substrate, a rotating means for rotating the substrate holding means, and a cup surrounding the periphery of the substrate holding means. And a cleaning jig attached to the substrate holding means, and a cleaning liquid supply means for supplying a cleaning liquid to the cleaning jig attached to the substrate holding means, the cleaning jig being flat A base surface, and an inclined surface that is provided over the entire circumference of the peripheral edge of the upper surface of the base surface and inclines upward from the center of the base surface toward the outer periphery.

Further, according to a second aspect, in the substrate processing apparatus according to the first aspect, the inclined surface is inclined upward from the same height position as the base surface along the circumferential direction of the base surface.

According to a third aspect, in the substrate processing apparatus according to the second aspect, the base surface is formed such that the inclined surface gradually increases in a direction opposite to a rotation direction of the substrate holding unit by the rotation unit. It is inclined along the circumferential direction of the surface.

According to a fourth aspect, in the substrate processing apparatus according to the second aspect, the inclined surface is divided into a plurality along the circumferential direction of the base surface, and each of the divided inclined surfaces is the base. Inclined upward from the same height as the surface.

Further, according to a fifth aspect, in the substrate processing apparatus according to the fourth aspect, each of the plurality of inclined surfaces gradually decreases in width from the lowest height position to the highest height position.

According to a sixth aspect, in the substrate processing apparatus according to the first aspect, the substrate holding means includes a plurality of chuck pins for holding an outer peripheral edge of the substrate, and the cleaning means mounted on the substrate holding means. The inclined surface of the jig covers the plurality of chuck pins.

Further, the seventh aspect is for cleaning the cup surrounding the substrate holding means by rotating in a predetermined rotation direction while being supplied with the cleaning liquid while being attached to the substrate holding means of the substrate processing apparatus. The cleaning jig includes a flat base surface and an inclined surface that is provided over the entire periphery of the upper surface periphery of the base surface and is inclined upward from the center of the base surface toward the outer periphery.

Further, according to an eighth aspect, in the cleaning jig according to the seventh aspect, the inclined surface is inclined upward from the same height position as the base surface along the circumferential direction of the base surface.

Further, according to a ninth aspect, in the cleaning jig according to the eighth aspect, the inclined surface is inclined so as to gradually increase in height from the base surface in a direction opposite to the rotation direction.

Further, a tenth aspect is the cleaning jig according to the eighth aspect, wherein the inclined surface is divided into a plurality along the circumferential direction of the base surface, and each of the divided inclined surfaces is the Inclined upward from the same height as the base surface.

Further, according to an eleventh aspect, in the cleaning jig according to the tenth aspect, each of the plurality of inclined surfaces gradually decreases in width from the lowest height position to the highest height position.

In a twelfth aspect, in the substrate processing apparatus, the substrate holding means for holding the substrate, the rotating means for rotating the substrate holding means, the cup surrounding the substrate holding means, and the substrate holding means are mounted. And a cleaning liquid supply means for supplying a cleaning liquid to the upper surface of the cleaning substrate mounted on the substrate holding means, and an outer periphery from the center of the cleaning substrate to the upper surface of the cleaning substrate. A guide piece having a portion inclined upward is provided, and at least a part from the base end to the tip of the guide piece has elasticity that changes an inclination angle with respect to the upper surface according to the number of rotations of the substrate holding means. .

Further, according to a thirteenth aspect, in the substrate processing apparatus according to the twelfth aspect, a plurality of the guide pieces are provided on the upper surface of the cleaning substrate.

Further, according to a fourteenth aspect, in the substrate processing apparatus according to the thirteenth aspect, the plurality of guide pieces are provided on the upper surface of the cleaning substrate at the same inclination angle.

Further, in the fifteenth aspect, in the substrate processing apparatus according to the thirteenth aspect, a part of the plurality of guide pieces is provided on the upper surface of the cleaning substrate at an inclination angle different from the rest.

According to a sixteenth aspect, in the substrate processing apparatus according to the thirteenth aspect, the substrate holding means includes a plurality of chuck pins for gripping an outer peripheral end of the substrate, and the cleaning substrate includes the plurality of guide pieces. Is attached to the holding means so as to face at least a part of the plurality of chuck pins.

According to a seventeenth aspect, in the substrate processing apparatus according to the twelfth aspect, the substrate processing apparatus further comprises a rinsing liquid supply means for supplying a rinsing liquid to the upper surface of the substrate and rinsing the substrate. When the substrate holding means is rotated at a smaller rotational speed than when the substrate is rinsed, the guide piece is used for the cleaning at an inclination angle at which the cleaning liquid scattered from the guide piece reaches the upper end of the cup. Attached to the substrate.

Further, according to an eighteenth aspect, in the substrate processing apparatus according to the twelfth aspect, the longitudinal direction of the guide piece is inclined with respect to the radial direction of the cleaning substrate.

According to a nineteenth aspect, in the substrate processing apparatus according to the twelfth aspect, the guide piece has a guide piece main body and an elastic member, and the guide piece main body is attached to the cleaning substrate via the elastic member. It is attached.

Further, a twentieth aspect is the substrate processing apparatus according to the nineteenth aspect, wherein the elastic member includes a spring.

According to a twenty-first aspect, in the substrate processing apparatus according to the twelfth aspect, the cleaning liquid flow path is formed on the upper surface of the guide piece by providing wall portions at both ends parallel to the longitudinal direction of the guide piece. .

In addition, according to a twenty-second aspect, in the substrate processing apparatus according to the twenty-first aspect, the flow path is narrower on the distal end side in the longitudinal direction than on the proximal end side in the longitudinal direction of the guide piece.

The twenty-third aspect is a cleaning substrate for cleaning a cup surrounding the substrate holding means by rotating while receiving supply of a cleaning liquid while being attached to the substrate holding means of the substrate processing apparatus. A guide piece inclined upward from the center of the cleaning substrate toward the outer periphery is provided on the upper surface, and at least a part of the guide piece from the proximal end to the distal end has a rotational speed of the substrate holding means. It has elasticity that the inclination angle with respect to the upper surface of the cleaning substrate can be changed by the change.

In the twenty-fourth aspect, a plurality of the guide pieces are provided in the cleaning substrate according to the twenty-third aspect.

In the twenty-fifth aspect, in the cleaning substrate according to the twenty-fourth aspect, the plurality of guide pieces are provided at the same inclination angle.

In the twenty-sixth aspect, in the cleaning substrate according to the twenty-fourth aspect, a part of the plurality of guide pieces is provided at an inclination angle different from the rest.

According to a twenty-seventh aspect, in the substrate processing apparatus, (a) a substrate holding unit that holds the substrate in a horizontal posture, a rotating unit that rotates the substrate holding unit, and a cleaning liquid is supplied from above the substrate holding unit. A processing unit having a cleaning liquid supply means and a cup surrounding the substrate holding means; and (b) has an outer size corresponding to the substrate in plan view and can be detachably held by the substrate holding means. A cleaning jig, provided along the outer peripheral side of the cleaning jig, a liquid receiving portion, a supply port that receives the cleaning liquid supplied from the cleaning liquid supply means and supplies the cleaning liquid to the liquid receiving portion. A cleaning jig having a plurality of discharge ports for discharging the cleaning liquid received by the liquid receiving portion, and each discharge shaft of the plurality of discharge ports has a centrifugal direction of rotation by the rotating means. From It is inclined and directed toward the front side of the rotational tangent of each discharge port.

According to a twenty-eighth aspect, in the substrate processing apparatus according to the twenty-seventh aspect, the cleaning jig has an inclined surface inclined upward from the center side toward the outer peripheral side at the bottom surface of the liquid receiving portion. .

According to a twenty-ninth aspect, in the substrate processing apparatus according to the twenty-seventh aspect, the substrate holding means includes a plurality of chuck members for holding an outer peripheral end of the substrate, and the outer peripheral end of the cleaning jig is the plurality of the outer peripheral ends. The plurality of discharge ports of the cleaning jig are arranged at different height positions from the plurality of chuck members.

According to a thirtieth aspect, in the cleaning jig for cleaning the inside of the processing unit by being supplied with the cleaning liquid while being detachably mounted on the substrate holding means of the processing unit and rotated, the cleaning liquid A supply port that receives the cleaning liquid supplied from the supply port, and is provided along an outer peripheral side of the cleaning jig, and discharges the cleaning liquid received by the liquid receiving unit. The discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of the rotation and are directed to the front side of the rotation tangent of the discharge ports.

The thirty-first aspect is the cleaning jig according to the thirtieth aspect, wherein the bottom surface of the liquid receiving part has an inclined surface that is inclined upward from the center side toward the outer peripheral side.

Further, in a thirty-second aspect, in the set of a plurality of cleaning jigs each corresponding to the cleaning jig according to the thirty-first aspect, an inclination angle of each inclined surface in the plurality of cleaning jigs is Different from each other.

A thirty-third aspect includes the processing unit according to the twenty-seventh aspect and the cleaning jig set according to the thirty-second aspect, wherein the cleaning liquid supply means is selected from the plurality of cleaning jigs and The cleaning liquid is supplied to one cleaning jig that is detachably held by the substrate holding means, and the cleaning liquid is discharged from the one cleaning jig by the rotation of the rotating means.

In a thirty-fourth aspect, there is a processing unit that performs predetermined processing on the substrate while rotating the substrate while holding the substrate in a horizontal posture by the predetermined substrate holding unit, and exists around the substrate holding unit in the processing unit. In the method for cleaning a predetermined portion, (A) a predetermined cleaning jig having a liquid receiving portion is attached to the substrate holding means instead of the substrate during a period when the predetermined processing is not performed. A mounting step of holding, (B) a supply step of supplying a cleaning liquid to the liquid receiving portion via a predetermined supply port of the cleaning jig, and (C) rotating the cleaning jig together with the substrate holding means. And (D) a decelerating step of decelerating the rotation, and the cleaning jig communicated with the liquid receiving portion and formed along the outer peripheral side of the cleaning jig Has multiple outlets Both the discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of rotation in the rotation step and are directed to the front side of the rotation tangent of the discharge ports, and the rotation of the cleaning liquid itself in the liquid receiving portion. Due to inertia, in the deceleration step, the cleaning liquid is ejected from the plurality of discharge ports toward the predetermined portion.

According to a thirty-fifth aspect of the substrate processing apparatus, in the substrate processing apparatus, a substrate holding unit having a flat base surface and holding the substrate at a predetermined interval above the base surface, and a rotation for rotating the substrate holding unit Means, a cup surrounding the periphery of the substrate holding means, a plurality of chuck pins arranged on the base surface and gripping the outer peripheral edge of the substrate, and a cleaning liquid supply means for supplying a cleaning liquid to the base surface of the substrate holding means And an inclined portion having an inclined surface that is provided on the base surface and inclines upward from the center of the base surface toward the outer periphery, wherein the inclined portion is located on the base surface more than the plurality of chuck pins. The cleaning liquid supply means supplies the cleaning liquid to the center side of the base surface from the inclined portion.

In a thirty-sixth aspect, in the substrate processing apparatus according to the thirty-fifth aspect, an inclination angle of the inclined surface with respect to the base surface is an angle at which the cleaning liquid scattered from the inclined portion does not interfere with the plurality of chuck pins. .

According to a thirty-seventh aspect, in the substrate processing apparatus according to the thirty-sixth aspect, an inclination angle of the inclined surface with respect to the base surface is an angle at which the cleaning liquid scattered from the inclined portion reaches the upper end portion of the cup. The

In a thirty-eighth aspect, in the substrate processing apparatus according to the thirty-fifth aspect, the inclined portion has a plurality of inclined pieces provided on a line connecting the plurality of chuck pins and the center of the base surface.

Also, in a thirty-ninth aspect, in the substrate processing apparatus according to the thirty-eighth aspect, the side surfaces along the circumferential direction of the base surface of the plurality of inclined pieces are curved surfaces that are continuous with the base surface.

According to a 40th aspect, in the substrate processing apparatus according to the 35th aspect, the inclined portion is formed in an annular shape along the circumferential direction of the base surface.

According to a forty-first aspect, in the substrate processing apparatus according to the forty-fourth aspect, an opening through which the cleaning liquid flows from the center of the base surface toward the outer periphery is formed in the inclined portion.

According to a forty-second aspect, in the substrate processing apparatus according to the thirty-fifth aspect, the inclined portion is provided such that the upper end of the inclined portion is below the lower surface of the substrate held by the plurality of chuck pins. .

According to the substrate processing apparatus according to the first to sixth aspects, since the inclined surface is provided over the entire circumference of the upper surface peripheral edge portion of the base surface, the supplied cleaning liquid is rotated in addition to the radial direction of the base surface rotating. Even if it flows in the direction, it is smoothly guided from the base surface to the inclined surface, and unintentional splashing of the cleaning liquid can be suppressed.

In particular, according to the substrate processing apparatus according to the sixth aspect, the inclined surface of the cleaning jig covers a plurality of chuck pins provided on the substrate holding means, so that the cleaning does not collide with the chuck pins, Unintentional splashing of the cleaning liquid by the chuck pins can also be suppressed.

According to the cleaning jigs according to the seventh to eleventh aspects, since the inclined surface is provided over the entire periphery of the upper surface peripheral portion of the base surface, in addition to the radial direction of the base surface on which the supplied cleaning liquid rotates. Even if it flows in the circumferential direction, it is smoothly guided from the base surface to the inclined surface, and unintentional splashing of the cleaning liquid can be suppressed.

According to the substrate processing apparatus according to the twelfth to twenty-second aspects, a guide piece having a portion inclined upward from the center of the cleaning substrate toward the outer periphery is provided on the upper surface of the cleaning substrate. Since at least a part from the base end to the tip end has elasticity that changes the inclination angle with respect to the upper surface according to the rotation speed of the substrate holding means, the inclination angle of the guide piece changes depending on the rotation speed of the substrate holding means. The cup can be effectively washed over a wide range by changing the flight angle.

In particular, according to the substrate processing apparatus of the fifteenth aspect, since a part of the plurality of guide pieces is provided on the upper surface of the cleaning substrate at an inclination angle different from the rest, the cleaning liquid can be scattered at a wide angle, The cup can be washed over a wider area.

In particular, according to the substrate processing apparatus of the sixteenth aspect, since the cleaning substrate is mounted on the holding means so that at least a part of the plurality of guide pieces faces the plurality of chuck pins, the substrate processing apparatus is directed to the chuck pins. The cleaning liquid is guided to the guide piece and scattered obliquely upward, and can be prevented from colliding with the chuck pin and being scattered.

In particular, according to the substrate processing apparatus of the seventeenth aspect, when the rotating means rotates the substrate holding means at a smaller number of rotations than when the substrate rinsing process is performed, the cleaning liquid splashed from the guide piece is cupped. Since the guide piece is attached to the cleaning substrate at an inclination angle that reaches the upper end of the cleaning liquid, the kinetic energy of the cleaning liquid sprayed on the upper end of the cup becomes small, and the splashing of the droplets can be suppressed.

In particular, according to the substrate processing apparatus of the eighteenth aspect, the longitudinal direction of the guide piece is inclined with respect to the radial direction of the cleaning substrate, so that the cleaning liquid guided by the guide piece flows down from the guide piece. Can be reduced.

Particularly, according to the substrate processing apparatus of the twenty-first aspect, since the wall portions are provided at both ends parallel to the longitudinal direction of the guide piece, it is possible to prevent the cleaning liquid guided by the guide piece from flowing down from the guide piece.

According to the cleaning substrate of the twenty-third to twenty-sixth aspects, the guide piece that is inclined upward from the center of the cleaning substrate toward the outer periphery is provided on the upper surface, and the guide piece is at least from the base end to the tip end. Since some of the elasticity has an inclination angle that is variable with respect to the upper surface of the cleaning substrate due to a change in the rotation speed of the substrate holding means, the inclination angle of the guide piece changes depending on the rotation speed of the cleaning substrate, and the flying angle of the cleaning liquid It is possible to effectively wash the cup over a wide range by changing.

In particular, according to the cleaning substrate of the twenty-sixth aspect, since a part of the plurality of guide pieces is provided at an inclination angle different from the rest, the cleaning liquid can be scattered at a wide angle, and the cup is wider. Can be cleaned over a range.

The substrate processing apparatus according to the twenty-seventh to twenty-ninth and thirty-third aspects supplies substrate cleaning means for holding the substrate in a horizontal posture, rotating means for rotating the substrate holding means, and supplying cleaning liquid from above the substrate holding means. And a cleaning unit having an outer size corresponding to the substrate in a plan view and detachably held by the substrate holding means. With.

The cleaning jig according to the twenty-seventh to thirty-fourth aspects is provided along a liquid receiving portion, a supply port that receives the cleaning liquid supplied from the cleaning liquid supply means and supplies the liquid to the liquid receiving portion, and an outer peripheral side of the cleaning jig. And a plurality of discharge ports for discharging the cleaning liquid received in the liquid receiving portion. The discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of rotation by the rotating means and are directed to the front side of the rotation tangent of the discharge ports.

When pure water is supplied to the supply port of the rotating cleaning jig, the pure water lands on the bottom surface of the cleaning jig and then flows from the center toward the outer periphery by centrifugal force. At this time, the pure water immediately after landing on the bottom surface of the cleaning jig does not have a speed component in the rotating direction. On the other hand, the pure water supplied near the center and flowing toward the outer periphery gradually has a speed component in the rotation direction of the cleaning jig due to friction with the bottom surface of the rotating cleaning jig. For this reason, the pure water that flows from the center of the cleaning jig toward the outer periphery does not normally flow linearly along the centrifugal direction of the cleaning jig, and from the centrifugal direction on the bottom surface of the cleaning jig. It flows while drawing a curved trajectory. In particular, when the rotational speed of the cleaning jig is reduced, the rotational speed caused by the rotational inertia of the pure water itself is larger than the rotational speed of the cleaning jig, and the pure water flowing inside the liquid receiving portion Is directed forward of the rotating tangent.

As described above, the directivity of the plurality of discharge ports of the cleaning jig corresponds to the directivity of pure water flowing inside the liquid receiving portion when the rotation of the cleaning jig is decelerated. For this reason, the pure water supplied to the liquid receiving part of the cleaning jig during a certain period from the start of rotation to the start of deceleration of the rotation is partially discharged from a plurality of discharge ports, but the rest is liquid reception. It is stored on the outer peripheral side of the part. On the other hand, in the period during which the rotational speed is reduced, the stored pure water is caused by the correspondence between the directivity of pure water in the liquid receiving portion and the directivity of the discharge port provided in the cleaning jig. Water spouts vigorously from multiple outlets. As a result, each part (around the cleaning jig) can be cleaned particularly strongly in the deceleration process.

In particular, in the thirty-second and thirty-third aspects, a cleaning jig set is constituted by a plurality of cleaning jigs having different inclination angles of the inclined surfaces. In the cleaning jig set according to the thirty-third aspect, the cleaning liquid supply means supplies the cleaning liquid to one cleaning jig selected from a plurality of cleaning jigs and detachably held by the substrate holding means. The cleaning liquid is discharged from the cleaning jig 1 by the rotation of the rotating means. For this reason, it becomes possible to discharge pure water at an inclination angle corresponding to the inclined surface (inclination from the horizontal plane) of the cleaning jig to be selected, and more accurate cleaning can be realized.

According to the substrate processing apparatus of the thirty-fifth to forty-second aspects, the inclined portion having the inclined surface that is inclined upward from the center of the base surface toward the outer periphery is provided closer to the center side of the base surface than the plurality of chuck pins. Since the cleaning liquid is supplied to the center side of the base surface from the inclined part, the cleaning liquid is scattered from the inclined part so as to jump over the chuck pin obliquely upward, and the splashing of the cleaning liquid by the chuck pin is prevented. be able to.

In particular, according to the substrate processing apparatus of the thirty-ninth aspect, the side surfaces along the circumferential direction of the base surfaces of the plurality of inclined pieces are curved surfaces that are continuous with the base surface. Can be prevented.

1 is a plan view of a substrate processing apparatus according to the present invention. It is a longitudinal cross-sectional view of the substrate processing apparatus of FIG. It is a top view which shows the jig | tool for washing | cleaning with which the spin chuck was mounted | worn. FIG. 4 is a sectional view taken along line AA in FIG. 3. It is a figure which shows the behavior of the washing | cleaning liquid supplied to the rotating jig | tool for rotation. It is a perspective view which shows the jig | tool for washing | cleaning of 2nd Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 3rd Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 4th Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 5th Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 6th Embodiment. It is an expanded sectional view of a chuck pin. It is sectional drawing which shows an example of the fixing method of the jig | tool for washing | cleaning. It is sectional drawing which shows an example of the fixing method of the jig | tool for washing | cleaning. It is a top view which shows the board | substrate for washing | cleaning of 7th Embodiment with which the spin chuck was mounted | worn. It is sectional drawing seen from the AA line of FIG. It is a figure which shows the behavior of the washing | cleaning liquid when the board | substrate for washing | cleaning is rotating at comparatively low speed. It is a figure which shows the behavior of the washing | cleaning liquid when the board | substrate for washing | cleaning is rotating at medium speed. It is a figure which shows the behavior of the washing | cleaning liquid when the board | substrate for washing | cleaning is rotating at comparatively high speed. It is a top view which shows the board | substrate for washing | cleaning of 8th Embodiment. FIG. 20 is a partial cross-sectional view of the cleaning substrate of FIG. 19 viewed from the line BB. FIG. 20 is a partial cross-sectional view of the cleaning substrate of FIG. 19 viewed from the line CC. It is a figure which shows an example which attached the guide piece to the board | substrate for washing | cleaning via the spring. It is a figure which shows the other example which attached the guide piece to the board | substrate for washing | cleaning via the spring. It is a figure which shows the structural example of the guide piece which provided the wall part. It is a figure which shows the structural example of the guide piece which provided the wall part. It is a figure which shows the structural example of the guide piece which provided the wall part. It is a figure which shows the structural example of the guide piece which provided the wall part. It is a top view which shows the board | substrate for washing | cleaning of 11th Embodiment. It is a perspective view which shows the board | substrate for washing | cleaning of 12th Embodiment. It is a partial longitudinal cross-sectional view of the washing | cleaning board | substrate of 12th Embodiment. It is a fragmentary sectional view which shows the modification of the board | substrate for washing | cleaning. It is a fragmentary sectional view which shows the modification of the board | substrate for washing | cleaning. It is a schematic diagram of the cleaning jig according to the thirteenth embodiment. It is sectional drawing of the washing | cleaning jig | tool of FIG. It is a flowchart which shows substrate processing mode. It is a figure which shows a mode that a chemical | medical solution is scattered toward a outer cup from a board | substrate in substrate processing mode. In a substrate processing mode, it is a figure which shows a mode that pure water splashes toward an inner cup from a board | substrate. In a substrate processing mode, it is a figure which shows a mode that pure water is scattered toward a middle cup from a board | substrate. It is a flowchart which shows washing | cleaning mode. It is a figure which shows a mode that pure water splashes toward a partition plate from a spin base in washing | cleaning mode. It is a figure which shows a mode that pure water is scattered toward a outer cup from a spin base in washing | cleaning mode. It is a figure which shows a mode that pure water splashes toward a middle cup from a spin base in washing | cleaning mode. It is a figure which shows a mode that pure water splashes toward a inner cup from a spin base in washing | cleaning mode. 40 is a time chart showing the operation of each part during the period from step ST12 to step ST16 in FIG. It is a top view which shows the relative locus | trajectory with respect to the cleaning jig | tool of the washing | cleaning liquid supplied to the cleaning jig | tool rotated. It is a figure which compares the discharge power of the cleaning liquid in the acceleration process and the constant speed process and the discharge power of the cleaning liquid in the deceleration process. 10 is a time chart showing another example of the operation of each part during the period from step ST12 to step ST16 in the cleaning mode. It is a top view of the substrate processing apparatus of 14th Embodiment. It is a longitudinal cross-sectional view of the substrate processing apparatus of FIG. It is a top view of the spin base of 14th Embodiment. FIG. 52 is a partial cross-sectional view of the spin base of FIG. 50 viewed from the line AA. It is a figure which shows the behavior of the washing | cleaning liquid supplied on the rotating spin base. It is a figure which shows the shape of the inclination piece of 15th Embodiment. It is a top view of the spin base of 16th Embodiment. FIG. 55 is a partial cross-sectional view of the spin base of FIG. 54 viewed from the line BB. FIG. 55 is a partial cross-sectional view of the spin base of FIG. 54 viewed from the CC line. It is a figure which shows the other example of the cross-sectional shape of an inclination part. It is a figure which shows the other example of the cross-sectional shape of an inclination part. It is a top view which shows the other example of the spin base which provided the some inclination piece. FIG. 60 is a partial cross-sectional view of the spin base of FIG. 59 viewed from the DD line. It is a top view which shows the other example of the spin base which provided the some inclination piece.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In FIG. 1 and the subsequent drawings, the size and number of each part are exaggerated or simplified as necessary for easy understanding.

<First Embodiment>
FIG. 1 is a plan view of a substrate processing apparatus 1 according to the present invention. FIG. 2 is a longitudinal sectional view of the substrate processing apparatus 1. The substrate processing apparatus 1 is a single wafer processing apparatus that processes substrates W for semiconductor use one by one, and a rinsing process using a chemical processing and a rinsing liquid such as pure water or alcohol on a circular silicon substrate W. After performing the drying process. More specifically, the substrate W is supplied with a chemical solution such as an SC1 solution, a DHF solution, or an SC2 solution to clean the substrate W (chemical solution treatment), and then rinsed with a rinse solution to perform the rinsing process. This is a single-wafer type substrate processing apparatus that removes a chemical solution from above and finally performs a drying process on the substrate W. FIG. 1 shows a state where the substrate W is not held on the spin chuck 20, and FIG. 2 shows a state where the substrate W is held on the spin chuck 20.

The substrate processing apparatus 1 includes a spin chuck 20 that holds a substrate W as a main element in a horizontal posture (a posture in which a normal line is along the vertical direction) in the chamber 10, and an upper surface of the substrate W held by the spin chuck 20. An upper surface processing liquid nozzle 30 for supplying a liquid and a processing cup 40 surrounding the periphery of the spin chuck 20 are provided. A partition plate 15 is provided around the processing cup 40 in the chamber 10 to partition the inner space of the chamber 10 up and down. In the present specification, the treatment liquid is a generic name including all of the chemical liquid, the rinse liquid, and the cleaning liquid.

The chamber 10 includes a side wall 11 along the vertical direction, a ceiling wall 12 that closes the upper side of the space surrounded by the side wall 11, and a floor wall 13 that closes the lower side. A space surrounded by the side wall 11, the ceiling wall 12, and the floor wall 13 is a processing space for the substrate W. Further, a part of the side wall 11 of the chamber 10 is provided with a carry-in / out opening for carrying the substrate W in / out of the chamber 10 and a shutter for opening / closing the carry-in / out opening (both not shown).

A fan filter unit (FFU) 14 for further purifying the air in the clean room in which the substrate processing apparatus 1 is installed and supplying it to the processing space in the chamber 10 is attached to the ceiling wall 12 of the chamber 10. . The fan filter unit 14 includes a fan and a filter (for example, a HEPA filter) for taking in air in the clean room and sending it out into the chamber 10, and forms a downflow of clean air in the processing space in the chamber 10. In order to disperse the clean air supplied from the fan filter unit 14 uniformly, a punching plate having a large number of blowing holes may be provided directly below the ceiling wall 12.

The spin chuck 20 includes a disc-shaped spin base 21 fixed in a horizontal posture at the upper end of a rotating shaft 24 extending in the vertical direction. A spin motor 22 that rotates the rotating shaft 24 is provided below the spin base 21. The spin motor 22 rotates the spin base 21 in the horizontal plane via the rotation shaft 24. Further, a cylindrical cover member 23 is provided so as to surround the periphery of the spin motor 22 and the rotating shaft 24.

The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. Therefore, the spin base 21 has a holding surface 21a that faces the entire lower surface of the substrate W to be held.

A plurality (four in this embodiment) of chuck pins 26 are provided upright on the peripheral edge of the holding surface 21a of the spin base 21. The plurality of chuck pins 26 are evenly spaced along the circumference corresponding to the outer circumference of the circular substrate W (if there are four chuck pins 26 as in this embodiment, the chuck pins 26 are spaced at 90 ° intervals. ) Is arranged. FIG. 11 is an enlarged cross-sectional view of the chuck pin 26. As shown in this figure, the chuck pin 26 has a base member 26a connected by a link mechanism (not shown) housed in the spin base 21 and a V-shaped member that is connected to the base member 26a and sandwiches the substrate W. The holding member 26c is formed with a groove 26b.

The plurality of chuck pins 26 are driven by a link mechanism. That is, the plurality of chuck pins 26 can be moved in conjunction with the radial direction of the substrate W around the rotation axis CX of the spin base 21 by a link mechanism. When the link mechanism moves each chuck pin 26 inward in the radial direction, each of the plurality of chuck pins 26 is brought into contact with the outer peripheral end of the substrate W to grip the substrate W, thereby holding the substrate W on the spin base 21. It can hold | maintain in the horizontal attitude | position close to the holding surface 21a above (refer FIG. 2). Further, when the link mechanism moves each chuck pin 26 radially outward, each of the plurality of chuck pins 26 can be separated from the outer peripheral end of the substrate W to release the grip.

The lower end of the cover member 23 covering the spin motor 22 is fixed to the floor wall 13 of the chamber 10 and the upper end reaches just below the spin base 21. At the upper end portion of the cover member 23, a hook-like member 25 is provided that protrudes almost horizontally outward from the cover member 23 and further bends and extends downward. The spin motor 22 rotates the rotary shaft 24 in a state where the spin chuck 20 holds the substrate W by gripping by the plurality of chuck pins 26, thereby rotating around the rotation axis CX along the vertical direction passing through the center of the substrate W. The substrate W can be rotated. The driving of the spin motor 22 is controlled by the control unit 9.

The top treatment liquid nozzle 30 is configured by attaching a discharge head 31 to the tip of a nozzle arm 32. The proximal end side of the nozzle arm 32 is fixedly connected to the nozzle base 33. The nozzle base 33 can be rotated around an axis along the vertical direction by a motor (not shown). As the nozzle base 33 rotates, the discharge head 31 of the upper processing liquid nozzle 30 has an arc shape along the horizontal direction between the processing position above the spin chuck 20 and the standby position outside the processing cup 40. Move to. The upper surface treatment liquid nozzle 30 is configured to be supplied with a plurality of kinds of treatment liquids (including at least pure water). The processing liquid discharged from the discharge head 31 of the upper surface processing liquid nozzle 30 at the processing position is deposited on the upper surface of the substrate W held by the spin chuck 20. Further, the upper surface treatment liquid nozzle 30 can be swung above the holding surface 21 a of the spin base 21 by the rotation of the nozzle base 33.

On the other hand, a lower surface treatment liquid nozzle 28 is provided along the vertical direction so as to pass through the inside of the rotating shaft 24. The upper end opening of the lower surface treatment liquid nozzle 28 is formed at a position facing the lower surface center of the substrate W held by the spin chuck 20. A plurality of types of processing liquids are also supplied to the lower surface processing liquid nozzle 28. The processing liquid discharged from the lower surface processing liquid nozzle 28 is deposited on the lower surface of the substrate W held by the spin chuck 20.

Further, the substrate processing apparatus 1 is provided with a two-fluid nozzle 60 in addition to the upper surface processing liquid nozzle 30. The two-fluid nozzle 60 is a nozzle that generates a droplet by mixing a treatment liquid such as pure water and a pressurized gas, and jets a mixed fluid (two-fluid) of the droplet and the gas onto the substrate W. . The two-fluid nozzle 60 is configured by attaching a liquid head (not shown) to the tip of a nozzle arm 62 and attaching a gas head 64 to a support member provided so as to branch from the nozzle arm 62. The base end side of the nozzle arm 62 is fixedly connected to the nozzle base 63. The nozzle base 63 can be rotated around an axis along the vertical direction by a motor (not shown). As the nozzle base 63 rotates, the two-fluid nozzle 60 moves in an arc along the horizontal direction between the processing position above the spin chuck 20 and the standby position outside the processing cup 40. A treatment liquid such as pure water is supplied to the liquid head, and a pressurized inert gas (nitrogen gas (N ₂ ) in this embodiment) is supplied to the gas head 64. The mixed fluid of the processing liquid ejected from the two-fluid nozzle 60 at the processing position is sprayed onto the upper surface of the substrate W held by the spin chuck 20.

The processing cup 40 surrounding the spin chuck 20 includes an inner cup 41, an intermediate cup 42, and an outer cup 43 that can be moved up and down independently of each other. The inner cup 41 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the rotation axis CX that passes through the center of the substrate W held by the spin chuck 20. The inner cup 41 includes an annular bottom 44 in plan view, a cylindrical inner wall 45 rising upward from the inner periphery of the bottom 44, a cylindrical outer wall 46 rising upward from the outer periphery of the bottom 44, and an inner wall The first guide portion 47 that rises from between the portion 45 and the outer wall portion 46 and extends obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W held by the spin chuck 20) while drawing a smooth arc at the upper end portion. And a cylindrical middle wall portion 48 that rises upward from between the first guide portion 47 and the outer wall portion 46.

The inner wall portion 45 is formed in such a length as to be accommodated with an appropriate gap between the cover member 23 and the bowl-like member 25 in a state where the inner cup 41 is raised most. The middle wall portion 48 is accommodated with a suitable gap between a second guide portion 52 (described later) of the middle cup 42 and the processing liquid separation wall 53 in a state where the inner cup 41 and the middle cup 42 are closest to each other. It is formed in such a length.

The first guide portion 47 has an upper end portion 47b that extends obliquely upward in the center (direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc. Further, a space between the inner wall portion 45 and the first guide portion 47 is a disposal groove 49 for collecting and discarding the used processing liquid. A space between the first guide portion 47 and the middle wall portion 48 is an annular inner collection groove 50 for collecting and collecting used processing liquid. Further, a space between the middle wall portion 48 and the outer wall portion 46 is an annular outer collection groove 51 for collecting and collecting different types of processing liquids from the inner collection groove 50.

The waste groove 49 is connected to an exhaust liquid mechanism (not shown) for discharging the processing liquid collected in the waste groove 49 and forcibly exhausting the waste groove 49. For example, four exhaust fluid mechanisms are provided at equal intervals along the circumferential direction of the discard groove 49. The inner recovery groove 50 and the outer recovery groove 51 have a recovery mechanism for recovering the processing liquid collected in the inner recovery groove 50 and the outer recovery groove 51, respectively, in a recovery tank provided outside the substrate processing apparatus 1. (Both not shown) are connected. The bottoms of the inner recovery groove 50 and the outer recovery groove 51 are inclined by a slight angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position. Thereby, the processing liquid that has flowed into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.

The middle cup 42 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the rotation axis CX that passes through the center of the substrate W held by the spin chuck 20. The inner cup 42 is integrally provided with a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.

The second guide portion 52 draws a smooth arc on the outside of the first guide portion 47 of the inner cup 41 from the lower end portion 52a that is coaxial with the lower end portion of the first guide portion 47 and the upper end of the lower end portion 52a. However, it has an upper end 52b that extends obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W) and a folded portion 52c that is formed by folding the tip of the upper end 52b downward. The lower end 52 a is accommodated in the inner collection groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48 in a state where the inner cup 41 and the middle cup 42 are closest to each other. The upper end portion 52b is provided so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and the first guide portion 47 is in a state where the inner cup 41 and the middle cup 42 are closest to each other. And close to the upper end portion 47b with a very small distance. Further, the folded portion 52c formed by folding the tip of the upper end portion 52b downward is in a state where the inner cup 41 and the middle cup 42 are closest to each other, and the folded portion 52c is the tip of the upper end portion 47b of the first guide portion 47. It is the length which overlaps with the horizontal direction.

Further, the upper end portion 52b of the second guide portion 52 is formed so as to increase in thickness toward the lower side, and the treatment liquid separation wall 53 is provided so as to extend downward from the lower peripheral edge of the upper end portion 52b. It has a cylindrical shape. The processing liquid separation wall 53 is accommodated in the outer collection groove 51 with an appropriate gap between the inner wall portion 48 and the outer cup 43 in a state where the inner cup 41 and the inner cup 42 are closest to each other.

The outer cup 43 surrounds the periphery of the spin chuck 20 outside the second guide portion 52 of the middle cup 42 and is substantially rotationally symmetric with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. It has a shape. The outer cup 43 has a function as a third guide part. The outer cup 43 has a lower end portion 43a that is coaxially cylindrical with the lower end portion 52a of the second guide portion 52, and a center side while drawing a smooth arc from the upper end of the lower end portion 43a (in the direction approaching the rotation axis CX of the substrate W). The upper end portion 43b extends obliquely upward, and the folded portion 43c is formed by folding the tip end portion of the upper end portion 43b downward.

The lower end portion 43a has an outer clearance groove with an appropriate gap between the processing liquid separation wall 53 of the inner cup 42 and the outer wall portion 46 of the inner cup 41 in a state where the inner cup 41 and the outer cup 43 are closest to each other. 51. The upper end portion 43b is provided so as to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and the upper end portion 52b of the second guide portion 52 is in a state where the middle cup 42 and the outer cup 43 are closest to each other. Close to each other with a very small distance. Further, the folded portion 43 c formed by folding the tip end portion of the upper end portion 43 b downward is in a state where the inner cup 42 and the outer cup 43 are closest to each other, and the folded portion 43 c is the same as the folded portion 52 c of the second guide portion 52. It is formed so as to overlap in the horizontal direction.

In addition, the inner cup 41, the middle cup 42, and the outer cup 43 can be moved up and down independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is provided with a lifting mechanism (not shown), and is lifted and lowered separately. As such an elevating mechanism, various known mechanisms such as a ball screw mechanism and an air cylinder can be employed.

The partition plate 15 is provided so as to partition the inner space of the chamber 10 up and down around the processing cup 40. The partition plate 15 may be a single plate-like member surrounding the processing cup 40, or may be a combination of a plurality of plate-like members. Further, the partition plate 15 may be formed with through holes or notches penetrating in the thickness direction. In this embodiment, the partition plate 15 supports the nozzle bases 33 and 63 of the upper treatment liquid nozzle 30 and the two-fluid nozzle 60. A through hole is formed through which a support shaft is inserted.

The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. Further, the edge portion surrounding the processing cup 40 of the partition plate 15 is formed to have a circular shape having a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not become an obstacle to the raising and lowering of the outer cup 43.

Further, an exhaust duct 18 is provided in a part of the side wall 11 of the chamber 10 and in the vicinity of the floor wall 13. The exhaust duct 18 is connected in communication with an exhaust mechanism (not shown). Of the clean air supplied from the fan filter unit 14 and flowing down in the chamber 10, the air that has passed between the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the apparatus.

The hardware configuration of the control unit 9 provided in the substrate processing apparatus 1 is the same as that of a general computer. That is, the control unit 9 stores a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It is configured with a magnetic disk to be placed. When the CPU of the control unit 9 executes a predetermined processing program, each operation mechanism of the substrate processing apparatus 1 is controlled by the control unit 9, and processing in the substrate processing apparatus 1 proceeds.

In the substrate processing apparatus 1 having the above-described configuration, the processing cup 40 can be cleaned by attaching the cleaning jig CT to the spin chuck 20 instead of the substrate W to be processed normally. FIG. 3 is a plan view showing the cleaning jig CT mounted on the spin chuck 20. 4 is a cross-sectional view taken along line AA in FIG.

The cleaning jig CT is a substantially disk-shaped member. The diameter of the cleaning jig CT is at least larger than the diameter of the substrate W to be processed. That is, the diameter of the cleaning jig CT is larger than the diameter of the circle on which the plurality of chuck pins 26 are arranged. The cleaning jig CT is provided with an internal space 73 whose lower end is opened. A base surface 71 and an inclined surface 72 are formed on the upper surface of the cleaning jig CT.

The cleaning jig CT can be detachably attached to the spin base 21 of the spin chuck 20. A method of mounting the cleaning jig CT on the spin base 21 can be set appropriately. For example, a gripping mechanism may be provided at the lower peripheral edge of the cleaning jig CT, and the outer peripheral end of the spin base 21 may be gripped by the gripping mechanism. Further, as shown in FIG. 12, a collar portion 74 having substantially the same thickness as that of a normal substrate W is provided along the entire outer surface of the bottom portion of the cleaning jig CT, and the collar portion 74 is gripped by a plurality of chuck pins 26. By doing so, the cleaning jig CT may be held on the spin chuck 20.

Alternatively, as shown in FIG. 13, a fitting portion 76 that can accommodate the chuck pin 26 and a projection 77 are provided on the bottom surface 75 of the cleaning jig CT. Further, on the upper surface of the holding surface 21 a of the spin base 21, a fitting portion 21 b having substantially the same size as the protruding portion 77 is formed at a position facing the protruding portion 77. Then, the cleaning jig CT may be mounted on the spin base 21 by fitting the protrusion 77 of the cleaning jig CT to the fitting portion 21 b of the spin base 21. Further, a recess 78 into which the arm of the transfer robot can enter is provided in the cleaning jig CT, and the cleaning jig CT is moved from the state in which the bottom surface 75 of the cleaning jig CT is in close contact with the holding surface 21a of the spin base 21. It is desirable to be able to remove from the holding surface 21a. Alternatively, the cleaning jig CT may simply be placed on the holding surface 21a of the spin base 21 by its own weight.

When the cleaning jig CT is mounted on the spin chuck 20, all of the plurality of chuck pins 26 are accommodated in the internal space 73, and the plurality of chuck pins 26 are moved by the inclined surfaces 72 as shown in FIGS. Covered. The internal space 73 may be any space that can accommodate at least a plurality of chuck pins 26, and may be a plurality of individual spaces provided so as to correspond to the plurality of chuck pins 26 on a one-to-one basis, for example.

The base surface 71 of the cleaning jig CT is a flat surface. When the cleaning jig CT is mounted on the spin chuck 20, the base surface 71 becomes a horizontal plane. The inclined surface 72 of the cleaning jig CT is formed over the entire periphery of the upper surface peripheral portion of the base surface 71. In the first embodiment, the inclined surface 72 has a substantially annular shape, and the height position of the inner peripheral end thereof is equal to the height position of the outer peripheral end of the base surface 71. That is, the base surface 71 and the inclined surface 72 form a continuous surface at the outer peripheral end of the base surface 71. However, the base surface 71 and the inclined surface 72 are not the same surface but form an obtuse angle of less than 180 °.

As shown in FIG. 4, the inclined surface 72 is inclined upward from the center of the base surface 71 toward the outer periphery. That is, the inclined surface 72 is provided so that the height gradually increases from the center of the base surface 71 toward the outer periphery. The inclination angle of the inclined surface 72 with respect to the base surface 71 can be set appropriately. In the first embodiment, the inclination angle and the height position of the inclined surface 72 are constant over the entire circumference of the base surface 71.

Next, the operation of the substrate processing apparatus 1 will be described. First, an outline of the processing procedure for the substrate W to be processed normally will be described. An outline of a general processing procedure of the substrate W in the substrate processing apparatus 1 is that a chemical solution is supplied to the surface of the substrate W to perform a predetermined chemical solution treatment, then pure water is supplied to perform a pure water rinse treatment, and then The substrate W is rotated at a high speed to perform a shake-off drying process. When processing the substrate W, the substrate W is held on the spin chuck 20 and the processing cup 40 moves up and down. When performing the chemical treatment, for example, only the outer cup 43 rises, and the substrate W held by the spin chuck 20 between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42 is used. An opening is formed to surround the periphery of the. In this state, the substrate W is rotated together with the spin chuck 20, and a chemical solution is supplied to the upper and lower surfaces of the substrate W from the upper surface processing liquid nozzle 30 and the lower surface processing liquid nozzle 28. The supplied chemical liquid flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered from the edge of the substrate W to the side. Thereby, the chemical treatment of the substrate W proceeds. The chemical solution splashed from the edge of the rotating substrate W is received by the upper end portion 43 b of the outer cup 43, flows down along the inner surface of the outer cup 43, and is collected in the outer collection groove 51.

When performing the pure water rinsing process, for example, all of the inner cup 41, the middle cup 42 and the outer cup 43 are raised, and the periphery of the substrate W held by the spin chuck 20 is the first guide portion 47 of the inner cup 41. Surrounded by. In this state, the substrate W is rotated together with the spin chuck 20, and pure water is supplied to the upper and lower surfaces of the substrate W from the upper surface processing liquid nozzle 30 and the lower surface processing liquid nozzle 28. The supplied pure water flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered from the edge of the substrate W to the side. Thereby, the pure water rinse process of the board | substrate W advances. The pure water splashed from the edge of the rotating substrate W flows down the inner wall of the first guide portion 47 and is discharged from the discard groove 49. In the case where pure water is collected by a path different from the chemical solution, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52b of the second guide portion 52 of the middle cup 42 and the first guide of the inner cup 41 are collected. An opening surrounding the periphery of the substrate W held by the spin chuck 20 may be formed between the upper end portion 47 b of the portion 47.

When performing the swing-off drying process, all of the inner cup 41, the middle cup 42 and the outer cup 43 are lowered, and the outer upper surface 43 d of the upper end portion 43 b of the outer cup 43 is below the substrate W held by the spin chuck 20. Located in. In this state, the substrate W is rotated at a high speed together with the spin chuck 20, and water droplets adhering to the substrate W are shaken off by a centrifugal force, and a drying process is performed.

As the processing of such a normal substrate W progresses, contaminants contained in the scattered processing liquid adhere and the contamination is gradually accumulated in the processing cup 40. In particular, the upper curved portions of the inner cup 41, the middle cup 42 and the outer cup 43, that is, the upper end portion 47b of the inner cup 41, the upper end portion 52b of the middle cup 42 and the inner side of the upper end portion 43b of the outer cup 43 are relatively contaminated. Easy to accumulate. If the contamination accumulated in the processing cup 40 is left as it is, it may reattach to the substrate W to be processed and cause processing defects.

Therefore, in the present embodiment, the processing cup 40 is cleaned using the cleaning jig CT. The cleaning of the processing cup 40 is preferably performed, for example, at a timing between processing lots when the processing of the substrate W to be processed is not performed.

When cleaning the processing cup 40, the cleaning jig CT is mounted on the spin base 21 of the spin chuck 20 using any of the plurality of mounting methods described above. Regardless of which of the plurality of mounting methods described above is used, by attaching the cleaning jig CT to the spin chuck 20, the plurality of chuck pins 26 erected on the holding surface 21 a of the spin base 21 are inclined surfaces. 72.

Subsequently, the processing cup 40 is moved up and down as appropriate. The processing cup 40 includes an inner cup 41, an intermediate cup 42, and an outer cup 43 that can be moved up and down independently of each other. Of these three cups, the cup to be cleaned is raised. For example, when cleaning the upper curved portion of the outer cup 43, only the outer cup 43 is raised, and an opening is formed between the upper end portion 43 b of the outer cup 43 and the upper end portion 52 b of the second guide portion 52 of the middle cup 42. Form. Further, when cleaning the upper curved portion of the middle cup 42, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52 b of the second guide portion 52 of the middle cup 42 and the first guide portion 47 of the inner cup 41. An opening is formed between the upper end portion 47b of the two. Further, when the upper curved portion of the inner cup 41 is washed, all of the inner cup 41, the middle cup 42 and the outer cup 43 are raised.

In this embodiment, only the outer cup 43 is raised to clean the outer cup 43. Although the height position of the outer cup 43 can be set appropriately, the outer cup 43 is raised so that the upper end portion 43b is at least higher than the upper end of the cleaning jig CT (the outer peripheral end of the inclined surface 72). Let In this state, the spin base 21 of the spin chuck 20 is rotated around the rotation axis CX by driving the spin motor 22. As the spin base 21 rotates, the cleaning jig CT mounted thereon also rotates. The rotation speed of the spin base 21 is not particularly limited and can be set to an appropriate value. The value is controlled by the control unit 9.

While rotating the spin base 21, the nozzle base 33 of the upper treatment liquid nozzle 30 rotates the nozzle arm 32 to move the ejection head 31 above the cleaning jig CT. Then, a cleaning liquid (pure water in this embodiment) is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 of the rotating cleaning jig CT. Further, the nozzle base 33 may swing the nozzle arm 32 under the control of the control unit 9, and the discharge head 31 for supplying the cleaning liquid may be reciprocated within the range of the base surface 71.

FIG. 5 is a diagram showing the behavior of the cleaning liquid supplied to the rotating cleaning jig CT. When the cleaning liquid is supplied to the vicinity of the center of the base surface 71 of the rotating cleaning jig CT, the cleaning liquid flows from the center of the base surface 71 toward the outer periphery by centrifugal force. Since the base surface 71 and the inclined surface 72 are continuous surfaces, the cleaning liquid that flows toward the outer periphery of the base surface 71 is smoothly guided along the inclined surface 72 from the base surface 71, and the cleaning jig CT. It is scattered toward the diagonally upward in the radial direction. The cleaning liquid splashed obliquely upward by the inclined surface 72 reaches the upper end portion 43b of the outer cup 43 as shown in FIG. As the cleaning liquid reaches, the contaminants attached to the upper end portion 43b, which is the curved portion of the outer cup 43, are washed away and cleaned. In other words, the inclination angle of the inclined surface 72 with respect to the base surface 71 depends on the positional relationship in the height direction between the cleaning jig CT and the outer cup 43, and the cleaning liquid scattered from the inclined surface 72 is at the upper end of the outer cup 43. Any angle that reaches 43b may be used.

By the way, as described above, when the cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the upper surface of the base surface 71 of the rotating cleaning jig CT, a centrifugal force acts on the cleaning liquid to move from the center of the base surface 71 to the outer periphery. The cleaning solution flows toward you. At this time, the cleaning liquid immediately after being supplied from the ejection head 31 onto the base surface 71 does not have a rotational speed component. On the other hand, the cleaning liquid that is supplied near the center of the base surface 71 and flows toward the outer periphery gradually has a velocity component in the rotational direction of the cleaning jig CT due to friction with the rotating base surface 71. . That is, the cleaning liquid flows toward the outer periphery of the cleaning jig CT due to centrifugal force, and also flows in the circumferential direction of the cleaning jig CT due to the inertia of the cleaning liquid itself. As a result, the cleaning liquid flowing from the center of the cleaning jig CT toward the outer periphery does not flow linearly along the radial direction of the disc-shaped cleaning jig CT, but is curved from the radial direction. It flows while drawing a trajectory.

In the first embodiment, since the base surface 71 and the inclined surface 72 are continuous over the entire periphery of the peripheral portion of the base surface 71, the supplied cleaning liquid is directed toward the outer periphery of the cleaning jig CT. Even if it flows in the circumferential direction, it is smoothly guided from the base surface 71 to the inclined surface 72. That is, the supplied cleaning liquid does not collide with any member of the cleaning jig CT, and the splashing of the unintended cleaning liquid due to such a collision can be suppressed. As a result, contamination in the substrate processing apparatus 1 due to splashing can be prevented.

Further, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surfaces 72 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

In this way, the upper end portion 43b, which is a curved portion of the outer cup 43 where contamination is particularly likely to accumulate inside the outer cup 43, has the cleaning liquid scattered obliquely upward from the inclined surface 72 of the cleaning jig CT. It will be effectively washed by reaching. In the cleaning process, the outer cup 43 may be reciprocated up and down together with the scattering of the cleaning liquid from the cleaning jig CT. Furthermore, the speed of the cleaning liquid sprayed on the outer cup 43 may be changed by adjusting the number of rotations of the cleaning jig CT. By doing in this way, while being able to reach a washing | cleaning liquid with appropriate intensity | strength over the wide range of the inner wall face of the outer cup 43, the said inner wall face can be wash | cleaned efficiently. In particular, it is preferable to adjust the height position of the outer cup 43 and the number of rotations of the cleaning jig CT so that the cleaning liquid is sprayed with a strong force on the upper end portion 43b of the outer cup 43 where contamination easily accumulates. The inner wall surface can also be efficiently cleaned by adjusting the height position of the outer cup 43 and the number of rotations of the cleaning jig CT according to the accumulation degree of contamination on the inner wall surface of the outer cup 43.

FIG. 5 illustrates the case where the outer cup 43 is washed, but even when the middle cup 42 and the inner cup 41 are washed, the washing can be performed in the same manner by raising the target cup. it can. In other words, by scattering the cleaning liquid from the cleaning jig CT, it is possible to clean the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

In the first embodiment, since the base surface 71 and the inclined surface 72 are continuous over the entire periphery of the base surface 71 of the cleaning jig CT, the cleaning liquid supplied to the base surface 71 is smooth. Therefore, the cleaning liquid can be scattered obliquely upward while suppressing unintentional splashing of the cleaning liquid. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 where contamination is particularly likely to accumulate. Further, since the chuck pin 26 is also covered with the cleaning jig CT, it is possible to prevent the cleaning liquid from splashing by the chuck pin 26.

Second Embodiment
Next, a second embodiment of the present invention will be described. In the first embodiment, the height position of the inclined surface 72 along the circumferential direction of the base surface 71 is constant, but in the second embodiment, an inclined surface that is also inclined along the circumferential direction of the base surface 71 is provided. ing.

FIG. 6 is a perspective view showing the cleaning jig CT of the second embodiment. As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space capable of accommodating a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown). When the cleaning jig CT is mounted on the spin chuck 20, the inclined surface 172 A plurality of chuck pins 26 are covered.

A base surface 71 and an inclined surface 172 are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. The inclined surface 172 of the cleaning jig CT is annularly formed over the entire periphery of the upper surface peripheral portion of the base surface 71.

In the second embodiment, the inclined surface 172 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Specifically, the height position of the base surface 71 is equal to the height position of the inner peripheral end of the inclined surface 172 at the flow guide port 173 among the outer peripheral ends of the base surface 71. In the example of FIG. 6, the inclined surface 172 is formed so that the height gradually increases in the clockwise direction from the vicinity of the flow inlet 173 along the circumferential direction of the base surface 71. Therefore, the lowest part of the inclined surface 172 in the vicinity of the flow inlet 173 and the highest part of the inclined surface 172 at a position slightly advanced counterclockwise from there form a step, and a wall surface 174 is formed between them. ing.

Further, at the outer peripheral end of the base surface 71 excluding the flow inlet 173, the height position of the inner peripheral end of the inclined surface 172 is higher than the height position of the base surface 71, and the wall surface 175 is between them. Is formed. That is, in the second embodiment, the base surface 71 and the inclined surface 172 form a continuous surface at the flow guide port 173 in the outer peripheral end of the base surface 71.

Also, as in the first embodiment, the inclined surface 172 is provided so as to be inclined upward (so that the height gradually increases) from the center of the base surface 71 toward the outer periphery. That is, in the second embodiment, the inclined surface 172 is provided so as to incline upward from the center of the base surface 71 toward the outer periphery and to incline upward even in the circumferential direction of the base surface 71. It is. The inclination angle of the inclined surface 172 with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the second embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

Even when the cleaning cup CT is cleaned using the cleaning jig CT of the second embodiment, the cleaning jig CT is mounted on the spin chuck 20 and is rotated counterclockwise in FIG. 6 (arrow AR16). The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). As described above, the cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT due to centrifugal force, and the cleaning liquid CT has an inertia of the cleaning liquid CT. It also flows in the circumferential direction (the direction opposite to the rotation direction of the spin chuck 20). As a result, the cleaning liquid flowing from the center to the outer periphery of the cleaning jig CT does not flow linearly along the radial direction of the cleaning jig CT, but draws a trajectory that curves from the radial direction. Flowing.

Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 173 is guided to the inclined surface 172 as indicated by an arrow AR6 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 175 between the base surface 71 and the inclined surface 172, but flows along the inner surface of the wall surface 175 and is repeatedly guided from the flow inlet 173 to the inclined surface 172. Since the inclined surface 172 is provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 172 faces outward in the radial direction of the cleaning jig CT and has a timepiece. It is scattered toward the obliquely upward direction (direction opposite to the rotation direction AR16 of the spin chuck 20). And since a washing | cleaning liquid can be scattered to the outer cup 43 from the continuous outer end part of the inclined surface 172, without changing the arrangement | positioning relationship of the height direction of cleaning jig CT and the outer cup 43, height The cleaning liquid can reach the outer cup 43 in a wide range in the direction. As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

In the second embodiment, the base surface 71 and the base surface 71 are arranged such that the inclined surface 172 gradually increases along the circumferential direction of the base surface 71 in the direction opposite to the rotation direction AR16 of the spin chuck 20 (clockwise). It is inclined upward from the same height position. For this reason, the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and, even if it flows in the circumferential direction, smoothly tilts from the base surface 71 via the flow inlet 173. It will be guided to the surface 172. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

In order to more effectively prevent such unintentional cleaning liquid splashing, the wall surface 175 between the base surface 71 and the inclined surface 172 may be a tapered surface having an inclination angle of less than 90 °. More preferably, the wall surface 175 is a curved surface. Further, the wall surface 174 which is the step portion of the inclined surface 172 may be a tapered surface having an inclination angle of less than 90 °. Thereby, the liquid splash of the unintended cleaning liquid can be further suppressed. It is more preferable that the wall surface 174 is a curved surface.

Also in the second embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surface 172 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

As described above, in the second embodiment, the inclined surface 172 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71 and is also upward from the center of the base surface 71 toward the outer periphery. Therefore, the cleaning liquid supplied to the base surface 71 is smoothly guided to the inclined surface 172 and is scattered obliquely upward from the inclined surface 172. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

<Third Embodiment>
Next, a third embodiment of the present invention will be described. In the second embodiment, the number of steps of the inclined surface 172 along the circumferential direction of the base surface 71 is one. However, in the third embodiment, the number of steps of the inclined surface is a plurality of steps.

FIG. 7 is a perspective view showing a cleaning jig CT of the third embodiment. The cleaning jig CT of the third embodiment is obtained by dividing the inclined surface 172 of the cleaning jig CT of the second embodiment into two along the circumferential direction of the base surface 71. As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space that can accommodate a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown), and when the cleaning jig CT is mounted on the spin chuck 20, the inclined surface 272 A plurality of chuck pins 26 are covered.

A base surface 71 and two inclined surfaces 122 are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two inclined surfaces 122 are formed continuously in an annular shape over the entire periphery of the upper surface periphery of the base surface 71.

In the third embodiment, each of the two inclined surfaces 122 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Specifically, the height position of the base surface 71 is equal to the height position of the inner peripheral end of each inclined surface 122 in the flow guide port 123 among the outer peripheral ends of the base surface 71. In the example of FIG. 7, the inclined surfaces 122 are formed so that the height gradually increases in the clockwise direction from the vicinity of the flow inlet 123 along the circumferential direction of the base surface 71. Therefore, the lowest portion of one inclined surface 122 in the vicinity of the flow introduction port 123 and the highest portion of the other inclined surface 122 form a step, and a wall surface 124 is formed between them.

In addition, at the outer peripheral end of the base surface 71 excluding the flow inlet 123, the height position of the inner peripheral end of the inclined surface 122 is higher than the height position of the base surface 71, and the wall surface 125 is between them. Is formed. That is, in the third embodiment, the base surface 71 and the inclined surface 122 form a continuous surface at the flow guide port 123 in the outer peripheral end of the base surface 71.

Similarly to the first embodiment, each inclined surface 122 is provided so as to be inclined upward (so that its height gradually increases) from the center of the base surface 71 toward the outer periphery. That is, in the third embodiment, as in the second embodiment, the inclined surface 122 is inclined upward from the center of the base surface 71 toward the outer periphery, and is also inclined upward along the circumferential direction of the base surface 71. It is provided as follows. The inclination angle of the inclined surface 122 with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the third embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

Even when the processing cup 40 is cleaned using the cleaning jig CT of the third embodiment, the cleaning jig CT is mounted on the spin chuck 20 and is rotated counterclockwise in FIG. 7 (arrow AR17). The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). It also flows in the opposite direction of the rotation direction.

Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 123 is guided to the inclined surface 122 as indicated by an arrow AR7 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 125 between the base surface 71 and the inclined surface 122, but flows along the inner surface of the wall surface 125, and the flow inlet 123 on the side opposite to the center of the base surface 71. To the inclined surface 122. Since the inclined surface 122 is provided so as to be inclined upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 122 faces outward in the radial direction of the cleaning jig CT. It is scattered toward the diagonally upward direction (direction opposite to the rotation direction AR17 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

Further, in the third embodiment, the base surface 71 and the base surface 71 are arranged such that the inclined surface 122 gradually increases along the circumferential direction of the base surface 71 in the direction opposite to the rotation direction AR17 of the spin chuck 20 (clockwise). It is inclined upward from the same height position. For this reason, the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71, and even if it flows in the circumferential direction, it is smoothly inclined from the base surface 71 via the flow inlet 123. It will be guided to the surface 122. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

In order to prevent such unintended cleaning liquid splashing more effectively, the wall surface 125 between the base surface 71 and the inclined surface 122 is tapered with an inclination angle of less than 90 °, as in the second embodiment. It is good as a surface. More preferably, the wall surface 125 is a curved surface. Further, the wall surface 124 which is a stepped portion of the two inclined surfaces 122 may be a tapered surface having an inclination angle of less than 90 °. Thereby, the liquid splash of the unintended cleaning liquid can be further suppressed. The wall surface 124 is more preferably a curved surface.

Also in the third embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surface 122 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

Thus, in the third embodiment, the inclined surface is divided into two along the circumferential direction of the base surface 71. Each of the two divided inclined surfaces 122 inclines upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and also upwards from the center of the base surface 71 toward the outer periphery. Inclined. For this reason, the cleaning liquid supplied to the base surface 71 is guided to the inclined surface 122 more smoothly than in the second embodiment, and is scattered obliquely upward from the inclined surface 122. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

In the third embodiment, the inclined surface is divided into two along the circumferential direction of the base surface 71, but it may be divided into three or more. Even in this case, each of the plurality of divided inclined surfaces 122 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71 and from the center of the base surface 71 to the outer periphery. By tilting upward, the same effect as described above can be obtained.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described. In the fourth embodiment, the liquid inlet of the inclined surface is wide.

FIG. 8 is a perspective view showing a cleaning jig CT of the fourth embodiment. In the cleaning jig CT according to the fourth embodiment, each inclined surface 122 of the cleaning jig CT according to the third embodiment is gradually narrowed from the lowest height position to the highest height position. Is. As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space capable of accommodating a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown), and when the cleaning jig CT is mounted on the spin chuck 20, the inclined surface 132 A plurality of chuck pins 26 are covered.

A base surface 71 and two inclined surfaces 132 are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two inclined surfaces 132 are formed continuously in an annular shape over the entire periphery of the upper surface peripheral portion of the base surface 71.

In the fourth embodiment, each of the two inclined surfaces 132 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Further, each of the two inclined surfaces 132 is formed so that the width gradually decreases from the lowest height position to the highest height position. Specifically, the base end side of each inclined surface 132 is a flow introduction port 133, and the height position thereof is equal to the height position of the base surface 71. In the example of FIG. 8, each inclined surface is gradually increased in the clockwise direction along the circumferential direction of the base surface 71 from the flow inlet 133 on the proximal end side of the inclined surface 132 toward the distal end side. 132 is formed. In addition, each inclined surface 132 is formed so that the width gradually decreases from the flow guide port 133 on the proximal end side which is the lowest height position of the inclined surface 132 toward the distal end side which is the highest height position. Yes. In other words, the width of the flow inlet 133 having the same height position with the base surface 71 of each inclined surface 132 is larger than the width of the other end side (tip side) different from the flow inlet 133 side of each inclined surface 132. It is getting wider. Thereby, in 4th Embodiment, the front end side of the inclined surface 132 is made sharp shape.

In addition, at the boundary between the base surface 71 and the inclined surface 132 excluding the flow inlet 133, the height position of the inner peripheral end of the inclined surface 132 is higher than the height position of the base surface 71, and between them, A wall surface 135 is formed. That is, in the fourth embodiment, the base surface 71 and the inclined surface 132 form a continuous surface at the flow guide port 133 on the proximal end side of the inclined surface 132.

Similarly to the first embodiment, each inclined surface 132 is provided to be inclined upward even from the center of the base surface 71 toward the outer periphery. That is, in the fourth embodiment, as in the second embodiment, the inclined surface 132 is inclined upward from the center of the base surface 71 toward the outer periphery, and is also inclined upward along the circumferential direction of the base surface 71. It is provided to do. The inclination angle of the inclined surface 132 with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the fourth embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

Even when the processing cup 40 is cleaned using the cleaning jig CT of the fourth embodiment, the cleaning jig CT is mounted on the spin chuck 20 and is rotated counterclockwise (arrow AR18) in FIG. The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). It also flows in the opposite direction of the rotation direction.

Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 133 is guided to the inclined surface 132 as indicated by an arrow AR8 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 135 between the base surface 71 and the inclined surface 132, but flows along the inner surface of the wall surface 135 and is guided from the flow inlet 133 to the inclined surface 132. Since the inclined surface 132 is provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 132 faces outward in the radial direction of the cleaning jig CT, and the timepiece It is scattered toward the diagonally upward direction (direction opposite to the rotation direction AR18 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

Further, in the fourth embodiment, the base surface 71 and the base surface 71 are arranged such that the inclined surface 132 gradually increases in the direction opposite to the rotation direction AR18 of the spin chuck 20 (clockwise) along the circumferential direction of the base surface 71. It is inclined upward from the same height position. For this reason, even if the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and also flows in the circumferential direction, it smoothly tilts from the base surface 71 via the flow inlet 133. It will be guided to the surface 132. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

In order to prevent such unintended cleaning liquid splashing more effectively, the wall surface 135 between the base surface 71 and the inclined surface 132 is tapered with an inclination angle of less than 90 °, as in the second embodiment. It is good as a surface. More preferably, the wall surface 135 is a curved surface.

Furthermore, in the fourth embodiment, since the inclined surface 132 is formed so that the width gradually becomes narrower from the lowest height position toward the highest height position, the inlet port that is the lowest height position is formed. The width of 133 is wide. For this reason, the cleaning liquid flowing on the base surface 71 can be efficiently guided to the inclined surface 132 and scattered.

Also in the fourth embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surfaces 132 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

Thus, in the fourth embodiment, the inclined surface is divided into two along the circumferential direction of the base surface 71. Each of the two divided inclined surfaces 132 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and also upward from the center of the base surface 71 toward the outer periphery. Inclined. Further, each of the two inclined surfaces 132 is formed so that the width gradually decreases from the lowest height position toward the highest height position. For this reason, the cleaning liquid supplied to the base surface 71 is smoothly and efficiently guided to the inclined surface 132 and scattered from the inclined surface 132 obliquely upward. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

In the fourth embodiment, the inclined surface is divided into two along the circumferential direction of the base surface 71, but it may be divided into three or more. Even in this case, each of the plurality of divided inclined surfaces 132 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71 and from the center of the base surface 71 to the outer periphery. By tilting upward and making the width gradually narrow from the lowest height position to the highest height position, the same effect as described above can be obtained.

<Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described. FIG. 9 is a perspective view showing a cleaning jig CT of the fifth embodiment. In the cleaning jig CT of the fifth embodiment, the tip side of each inclined surface 132 of the fourth embodiment is also wide.

A base surface 71 and two inclined surfaces 142 are formed on the upper surface of the cleaning jig CT of the fifth embodiment. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two inclined surfaces 142 are formed continuously in an annular shape over the entire periphery of the upper surface peripheral portion of the base surface 71. Each of the two inclined surfaces 142 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. The base end side of each inclined surface 142 is a wide inlet 143 similar to that of the fourth embodiment, and the height position thereof is equal to the height position of the base surface 71. And each inclined surface 142 is formed so that height may become high gradually along the circumferential direction of the base surface 71 toward the front end side from the flow inlet 143 of the base end side of the inclined surface 142. As shown in FIG. .

Also in the fifth embodiment, each of the two inclined surfaces 142 is formed such that the width gradually decreases from the lowest height position to the highest height position. That is, in the same manner as in the fourth embodiment, each width is gradually reduced from the base end side flow inlet 143 that is the lowest height position of the inclined surface 142 toward the distal end side that is the highest height position. An inclined surface 142 is formed. That is, the width of the flow inlet 143 having the same height position with the base surface 71 of each inclined surface 142 is wider than the width of the other end side (tip side) different from the flow inlet 143 side of each inclined surface 142. It has become. However, as shown in FIG. 9, in the fifth embodiment, the tip side of each inclined surface 142 also has a certain width, and the degree to which the width of the inclined surface 142 becomes narrower compared to the fourth embodiment. It is moderate.

In addition, at the boundary between the base surface 71 and the inclined surface 142 excluding the flow inlet 143, the height position of the inner peripheral end of the inclined surface 142 is higher than the height position of the base surface 71, and between them, A wall surface 145 is formed. That is, in the fifth embodiment, the base surface 71 and the inclined surface 142 form a continuous surface at the flow guide port 143 on the proximal end side of the inclined surface 142.

Further, similarly to the first embodiment, each inclined surface 142 is provided to be inclined upward even from the center of the base surface 71 toward the outer periphery. That is, in the fifth embodiment as well, as in the second embodiment, the inclined surface 142 is inclined upward from the center of the base surface 71 toward the outer periphery, and is also inclined upward along the circumferential direction of the base surface 71. It is provided to do. The inclination angle of the inclined surface 142 in the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the fifth embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

The cleaning process of the processing cup 40 using the cleaning jig CT of the fifth embodiment is almost the same as that of the fourth embodiment, and the same operational effects can be obtained. That is, the cleaning jig CT is mounted on the spin chuck 20 and the cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the counterclockwise direction (direction of arrow AR19) in FIG. To do. The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). It also flows in the opposite direction of the rotation direction.

Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 143 is guided to the inclined surface 142 as indicated by an arrow AR9 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 145 between the base surface 71 and the inclined surface 142, flows along the inside of the wall surface 145, and is guided from the flow inlet 143 to the inclined surface 142. Since the inclined surface 142 is provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 142 faces outward in the radial direction of the cleaning jig CT and is not It is scattered toward the obliquely upward direction (direction opposite to the rotation direction AR19 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

Further, the inclined surface 142 moves upward from the same height position as the base surface 71 so that the height gradually increases in the opposite direction (clockwise) to the rotation direction AR19 of the spin chuck 20 along the circumferential direction of the base surface 71. It is inclined to. For this reason, even if the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and also flows in the circumferential direction, it is smoothly inclined from the base surface 71 via the flow inlet 143. It will be guided to the surface 142. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

In order to prevent such unintentional cleaning liquid splashing more effectively, the wall surface 145 between the base surface 71 and the inclined surface 142 is tapered with an inclination angle of less than 90 °, as in the second embodiment. It is good as a surface. More preferably, the wall surface 145 is a curved surface.

In the fifth embodiment, since the inclined surface 142 is formed so that the width is gradually narrowed from the lowest height position toward the highest height position, the flow inlet that is the lowest height position is formed. The width of 143 is wide. For this reason, the cleaning liquid flowing on the base surface 71 can be efficiently guided to the inclined surface 142 and scattered.

Furthermore, in the fifth embodiment, the tip end side of the inclined surface 142 also has a certain width, and the degree to which the width of the inclined surface 142 becomes narrower than that of the fourth embodiment is moderate. For this reason, the amount of the cleaning liquid that is once guided to the inclined surface 142 and falls from the inclined surface 142 can be reduced, and the cleaning liquid can be efficiently scattered obliquely upward.

<Sixth Embodiment>
Next, a sixth embodiment of the present invention will be described. FIG. 10 is a perspective view showing a cleaning jig CT of the sixth embodiment. The cleaning jig CT of the sixth embodiment is different from the cleaning jig CT of the fourth embodiment in that the shapes of the two inclined surfaces are different.

As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member, and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space capable of accommodating a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown), and when the cleaning jig CT is attached to the spin chuck 20, the inclined surfaces 152a, The plurality of chuck pins 26 are covered by 152b.

A base surface 71 and two

inclined surfaces

152a and 152b are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two

inclined surfaces

152a and 152b are formed continuously in an annular shape over the entire periphery of the upper surface periphery of the base surface 71.

In the sixth embodiment, each of the two

inclined surfaces

152 a and 152 b is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Each of the two

inclined surfaces

152a and 152b is formed so that the width gradually decreases from the lowest height position to the highest height position. Specifically, the base end side of one inclined surface 152 a is a flow guide port 153 a, and the height position thereof is equal to the height position of the base surface 71. In addition, the base end side of the other inclined surface 152 b is a flow guide port 153 b, and the height position thereof is equal to the height position of the base surface 71. However, the width of the inlet 153a of the inclined surface 152a is wider than the width of the inlet 153b of the inclined surface 152b.

In the example of FIG. 10, the height is gradually increased in the clockwise direction along the circumferential direction of the base surface 71 from the

flow guide ports

153a and 153b on the base end side of the

inclined surfaces

152a and 152b toward the front end side. Two

inclined surfaces

152a and 152b are formed. In addition, the inclined surface 152a is formed so that the width gradually decreases from the proximal end side flow inlet 153a which is the lowest height position of the inclined surface 152a toward the distal end side which is the highest height position. . Similarly, the inclined surface 152b is formed so that the width is gradually narrowed from the proximal flow inlet 153b which is the lowest height position of the inclined surface 152b toward the distal end side which is the highest height position. . That is, the widths of the

flow inlets

153a, 153b having the same height position with the base surface 71 of the

inclined surfaces

152a, 152b are different from the other ends (front end side) of the

inclined surfaces

152a, 152b from the

flow inlets

153a, 153b side. ) Wider than Thereby, in 6th Embodiment, the front end side of

inclined surface

152a, 152b is made into the sharp shape. Since the width of the flow introduction port 153a is wider than the width of the flow introduction port 153b, the inclined surface 152b is gentler to the extent that the width of the surface gradually becomes narrower.

In addition, at the boundary between the base surface 71 and the inclined surface 152a excluding the flow introduction port 153a, the height position of the inner peripheral end of the inclined surface 152a is higher than the height position of the base surface 71, and between them, A wall surface 155a is formed. At the boundary between the base surface 71 and the inclined surface 152b excluding the flow inlet 153b, the height position of the inner peripheral end of the inclined surface 152b is higher than the height position of the base surface 71, and there is a wall surface between them. 155b is formed. That is, in the sixth embodiment, the base surface 71 and the

inclined surfaces

152a and 152b form a continuous surface at the

flow guide ports

153a and 153b on the base end side of the

inclined surfaces

152a and 152b.

Further, as in the first embodiment, the

inclined surfaces

152a and 152b are provided so as to be inclined upward even from the center of the base surface 71 toward the outer periphery. That is, in the sixth embodiment, as in the second embodiment, the two

inclined surfaces

152 a and 152 b are inclined upward from the center of the base surface 71 toward the outer periphery, and along the circumferential direction of the base surface 71. Is also provided so as to incline upward. The inclination angles of the

inclined surfaces

152a and 152b with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the sixth embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

Also when performing the cleaning process of the processing cup 40 using the cleaning jig CT of the sixth embodiment, the cleaning jig CT is mounted on the spin chuck 20 in the counterclockwise direction (arrow AR20 in FIG. 10). The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). It also flows in the opposite direction of the rotation direction.

Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the

flow inlets

153a and 153b is an inclined surface 152a as shown by an arrow AR10 in FIG. , 152b. The remaining cleaning liquid reaches the

wall surfaces

155a and 155b between the base surface 71 and the

inclined surfaces

152a and 152b, but flows along the inside of the

wall surfaces

155a and 155b and is inclined from the

flow inlets

153a and 153b. Guided to the

surfaces

152a, 152b. Since the

inclined surfaces

152a and 152b are provided so as to be inclined upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the

inclined surfaces

152a and 152b faces outward in the radial direction of the cleaning jig CT. In this case, it is scattered obliquely upward in the clockwise direction (the direction opposite to the rotation direction AR20 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

Further, in the sixth embodiment, the

inclined surfaces

152 a and 152 b are inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. For this reason, even if the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and also flows in the circumferential direction, the base surface 71 smoothly passes through the

flow inlets

153a and 153b. To the

inclined surfaces

152a and 152b. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

In order to prevent such unintentional cleaning liquid splashing more effectively, as in the second embodiment, the wall surface 155a between the base surface 71 and the inclined surface 152a and the wall surface 155b between the inclined surface 152b. May be a tapered surface having an inclination angle of less than 90 °. More preferably, the

wall surfaces

155a and 155b are curved surfaces.

Furthermore, in the sixth embodiment, since the

inclined surfaces

152a and 152b are formed so that the width gradually decreases from the lowest height position toward the highest height position, the guiding surface at the lowest height position is formed. The widths of the

flow ports

153a and 153b are wide. Therefore, the cleaning liquid flowing on the base surface 71 can be efficiently guided to the

inclined surfaces

152a and 152b and scattered.

Also in the sixth embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the

inclined surfaces

152a and 152b of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

As described above, in the sixth embodiment, the inclined surfaces having two different shapes are combined along the circumferential direction of the base surface 71. The base surface 71 and the

inclined surfaces

152a and 152b gradually increase in height in the opposite direction (clockwise) to the rotation direction AR20 of the spin chuck 20 along the circumferential direction of the base surface 71. Inclined upward from the same height position, and inclined upward from the center of the base surface 71 toward the outer periphery. Further, each of the two

inclined surfaces

152a and 152b is formed such that the width gradually decreases from the lowest height position to the highest height position. For this reason, the cleaning liquid supplied to the base surface 71 is smoothly and efficiently guided to the

inclined surfaces

152a and 152b, and is scattered obliquely upward from the

inclined surfaces

152a and 152b. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

In the sixth embodiment, two inclined surfaces having different shapes are combined along the circumferential direction of the base surface 71, but three or more different inclined surfaces may be combined. Even in this case, each of the plurality of inclined surfaces is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and also upward from the center of the base surface 71 toward the outer periphery. In addition, the same effect as described above can be obtained by making the width gradually narrower from the lowest height position toward the highest height position.

In each of the first to sixth embodiments, the inclined surface of the cleaning jig CT is a flat surface having a predetermined inclination angle, but the inclined surface may be curved. The curvature of the inclined surface may be warped so that the upper side is convex, or may be warped so that the lower side is convex. Further, the curved surface of the inclined surface may be formed in both the radial direction and the circumferential direction of the base surface 71.

In each of the first to sixth embodiments, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surface of the cleaning jig CT. Depending on the size, the base surface 71 may cover the plurality of chuck pins 26.

In the second to fifth embodiments, the inclined surface is formed so as to gradually increase in the clockwise direction along the circumferential direction of the base surface 71. However, the height gradually increases in the counterclockwise direction. The inclined surface may be formed so as to be higher, and the rotation direction of the cleaning jig CT may be appropriately set accordingly.

Further, in the second to sixth embodiments, the inclined surfaces 172 (second embodiment), 122 (third embodiment), 132 (fourth embodiment), 142 (fifth embodiment), 152a, 152b. (6th Embodiment) was provided so that it might incline upward toward the outer periphery from the center of the base surface 71. FIG. However, even if the

inclined surfaces

172, 122, 132, 142, 152a, and 152b are not inclined upward from the center of the base surface 71 toward the outer periphery (in other words, even if they are horizontal surfaces), they are inclined with the base surface 71. Wall surfaces 175 (second embodiment), 125 (third embodiment), 135 (fourth embodiment), 145 (fifth embodiment), 155a between the

surfaces

172, 122, 132, 142, 152a, 152b If 155b (sixth embodiment) is a tapered surface having an inclination angle of less than 90 °, the cleaning liquid supplied to the base surface 71 is scattered obliquely upward from the respective wall surfaces 175, 125, 135, 145, 155a, 155b. Can be made. Accordingly, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

Further, in the second to sixth embodiments, the inclined surfaces 172 (second embodiment), 122 (third embodiment), 132 (fourth embodiment), 142 (fifth embodiment), 152a, 152b. (Sixth embodiment) and wall surfaces 175 (second embodiment), 125 (third embodiment), 135 (fourth embodiment), 145 (fifth embodiment), 155a, 155b (sixth embodiment). A mode is also conceivable in which the cleaning liquid is scattered from the base surface 71 toward the inner surface of the processing cup 40 only by the circumferential inclination component of the base surface 71 without the radial inclination component of the base surface 71.

<Seventh embodiment>
Next, a seventh embodiment of the present invention will be described. The configuration of the substrate processing apparatus of the seventh embodiment is the same as that of the first embodiment. In the substrate processing apparatus 1 having such a configuration, the processing cup 40 can be cleaned by mounting the cleaning substrate CW on the spin chuck 20 instead of the substrate W to be processed normally. FIG. 14 is a plan view showing the cleaning substrate CW mounted on the spin chuck 20. FIG. 15 is a sectional view taken along line AA of FIG.

The cleaning substrate CW has a disc-shaped main body portion 271. The main body 271 has the same shape as the substrate W to be processed (for example, the diameter is 300 mm and the thickness is t = 0.775 mm). The material of the main body 271 is not particularly limited, and may be any material that does not become a contamination source of a semiconductor device. For example, the substrate W may be made of similar silicon. Accordingly, the cleaning substrate CW can be held on the spin chuck 20 by the plurality of chuck pins 26 gripping the outer peripheral end of the main body portion 271, similarly to the substrate W to be processed.

A plurality (four in the seventh embodiment) of guide pieces 272 are provided on the upper surface of the main body 271. Each guide piece 272 includes a guide piece main body 272a on the distal end side of the guide piece 272 and a connection portion 272b on the proximal end side, and the guide piece main body 272a is attached to the upper surface of the main body portion 271 via the connection portion 272b. . In the seventh embodiment, the plurality of guide pieces 272 provided on the cleaning substrate CW all have the same shape. Each guide piece main body 272a is a rectangular plate-shaped member, and is inclined upward from the center of the main body portion 271 toward the outer periphery. In the seventh embodiment, the material of the guide piece main body 272a is the same as that of the main body 271 (for example, silicon).

A base end portion of each rectangular guide piece main body 272a is attached to the upper surface of the main body portion 271 via the connection portion 272b. The connecting portion 272b is formed of an elastic member that does not become a contamination source of a semiconductor device. An example of such an elastic member is a silicone resin.

The four guide pieces 272 are provided at equal intervals (that is, 90 ° intervals) along the circumferential direction of the cleaning substrate CW. Each of the four guide pieces 272 is attached with the base end portion directed toward the center of the cleaning substrate CW so that the longitudinal direction of the rectangular shape coincides with the radial direction of the cleaning substrate CW. Each guide piece main body 272a is provided so as to incline upward from the center of the cleaning substrate CW toward the outer periphery in the radial direction (so that the height gradually increases).

The four guide piece main bodies 272a are attached to the main body section 271 via the connecting section 272b of an elastic member. As indicated by an arrow AR4 in FIG. 15, when the connecting portion 272b is elastically deformed according to a change in the rotation speed of the spin chuck 20, the inclination angle of each guide piece main body 272a with respect to the upper surface of the cleaning substrate CW changes. The inclination angle of each guide piece body 272a in the stationary cleaning substrate CW can be set appropriately. In the seventh embodiment, the inclination angles of the four guide piece main bodies 272a are the same. Hereinafter, when simply described as an inclination angle, the inclination angle of the guide piece main body 272a with respect to the upper surface of the cleaning substrate CW is indicated.

Further, each connecting portion 272b has the same elastic modulus. Therefore, when the spin chuck 20 rotates and a centrifugal force acts on each guide piece main body 272a, the inclination angle of each guide piece main body 272a changes at the same rate of change.

Next, the operation of the substrate processing apparatus 1 according to the seventh embodiment will be described. The processing procedure for the substrate W to be processed normally is the same as in the first embodiment. As the processing of the normal substrate W progresses, contaminants contained in the scattered processing liquid adhere and the contamination is gradually accumulated in the processing cup 40. In particular, the upper curved portions of the inner cup 41, the middle cup 42 and the outer cup 43, that is, the upper end portion 47b of the inner cup 41, the upper end portion 52b of the middle cup 42 and the inner side of the upper end portion 43b of the outer cup 43 are relatively contaminated. Easy to accumulate. If the contamination accumulated in the processing cup 40 is left as it is, it may adhere to the substrate W to be processed and cause processing defects.

For this reason, in the seventh embodiment, the processing cup 40 is cleaned using the cleaning substrate CW. The cleaning of the processing cup 40 is preferably performed, for example, at a timing between processing lots when the processing of the substrate W to be processed is not performed.

When cleaning the processing cup 40, the cleaning substrate CW is mounted on the spin chuck 20. Specifically, the cleaning substrate CW is carried into the chamber 10 from a loading / unloading port (not shown) formed on the side wall 11 of the chamber 10 by a robot (not shown), and is cleaned by the chuck pins 26 provided on the spin base 21. The outer peripheral end of the main body 271 of the substrate CW is gripped. At this time, as shown in FIG. 14, the cleaning substrate CW is placed on the spin chuck 20 so that the four guide pieces 272 of the cleaning substrate CW face the four chuck pins 26 on a one-to-one basis. Installing.

In this embodiment, only the outer cup 43 is raised to clean the outer cup 43. Although the height position of the outer cup 43 can be set appropriately, the outer cup 43 is raised so that the upper end portion 43b is at least above the holding surface 21a of the spin base 21. In this state, the spin base 21 of the spin chuck 20 is rotated around the rotation axis CX by driving the spin motor 22.

While rotating the spin base 21, the nozzle base 33 of the upper treatment liquid nozzle 30 rotates the nozzle arm 32 to move the ejection head 31 above the rotating cleaning substrate CW. Then, a cleaning liquid (pure water in this embodiment) is supplied from the ejection head 31 to the vicinity of the center of the upper surface of the rotating cleaning substrate CW. As the cleaning liquid, alcohol or functional water may be used in addition to pure water.

When the cleaning liquid is supplied to the vicinity of the center of the upper surface of the rotating cleaning substrate CW, the cleaning liquid flows from the center toward the outer periphery by centrifugal force. A part of the cleaning liquid that flows toward the outer periphery is guided along the plurality of guide pieces 272 and is scattered obliquely upward in the radial direction of the cleaning substrate CW. At this time, since the guide piece main body 272a is attached to the main body portion 271 via the connecting portion 272b of the elastic member, the inclination angle of the guide piece main body 272a changes according to the number of rotations of the cleaning substrate CW. Accordingly, the flying angle of the cleaning liquid scattered from the cleaning substrate CW also changes. In the seventh embodiment, the inclination angles of the four guide piece bodies 272a in the stationary cleaning substrate CW are the same, and the four connection portions 272b have the same elastic modulus. Therefore, the inclination angles of the four guide piece main bodies 272a when the cleaning substrate CW is rotating are the same, and the flying angles of the cleaning liquid splashed from the four guide pieces 272 are also equal.

16 to 18 are diagrams showing changes in the flying angle of the cleaning liquid scattered from the cleaning substrate CW. First, FIG. 16 is a diagram showing the behavior of the cleaning liquid when the cleaning substrate CW is rotating at a relatively low speed (less than 300 rpm). When the cleaning substrate CW rotates at a relatively low speed, the centrifugal force acting on the guide piece main body 272a is also relatively small, so that the inclination angle of the guide piece main body 272a with respect to the upper surface of the cleaning substrate CW becomes large. For this reason, the flying angle of the cleaning liquid guided along the guide piece 272 and scattered from the tip of the guide piece 272 with respect to the horizontal plane also increases. Accordingly, as shown in FIG. 16, the cleaning liquid is sprayed toward the vicinity of the uppermost portion of the upper end portion 43b of the outer cup 43 (in the vicinity of the folded portion 43c). By spraying the cleaning liquid, contaminants adhering to the vicinity of the uppermost portion of the upper end portion 43b of the outer cup 43 are washed away and cleaned.

Next, FIG. 17 is a diagram showing the behavior of the cleaning liquid when the cleaning substrate CW is rotating at a medium speed (300 rpm or more and less than 1000 rpm). When the cleaning substrate CW rotates at a medium speed, a larger centrifugal force acts on the guide piece body 272a than at the time of the low speed rotation described above, and the inclination angle of the guide piece body 272a with respect to the upper surface of the cleaning substrate CW is Smaller than during low-speed rotation. For this reason, the flight angle of the cleaning liquid guided along the guide piece 272 and scattered from the tip of the guide piece 272 with respect to the horizontal plane is also smaller than that during low-speed rotation. As a result, as shown in FIG. 17, the cleaning liquid is sprayed from the uppermost portion of the upper end portion 43b of the outer cup 43 toward the back side, and contaminants adhering to the vicinity of the region are washed away and cleaned. The

Next, FIG. 18 is a diagram showing the behavior of the cleaning liquid when the cleaning substrate CW is rotating at a relatively high speed (1000 rpm or more). When the cleaning substrate CW rotates at a high speed, a larger centrifugal force acts on the guide piece main body 272a than at the time of the medium speed rotation, so the inclination angle of the guide piece main body 272a with respect to the upper surface of the cleaning substrate CW is medium. Smaller than during fast rotation. For this reason, the flying angle of the cleaning liquid guided along the guide piece 272 and scattered from the tip of the guide piece 272 with respect to the horizontal plane is also smaller than that during the medium speed rotation. As a result, as shown in FIG. 18, the cleaning liquid is sprayed toward a relatively low region of the upper end portion 43b of the outer cup 43, and the contaminants adhering to the vicinity of the region are washed away and cleaned.

Thus, in the seventh embodiment, the inclination angle of the guide piece main body 272a changes depending on the number of rotations of the cleaning substrate CW, and the flying angle of the cleaning liquid scattered from the cleaning substrate CW also changes accordingly. As the number of rotations of the cleaning substrate CW increases, the inclination angle of the plurality of guide piece main bodies 272a decreases, and the flying angle of the cleaning liquid with respect to the horizontal plane also decreases. Therefore, the cleaning liquid can be sprayed over a wide range of the inner wall of the outer cup 43 by adjusting the number of rotations of the cleaning substrate CW by the spin motor 22. 16 to 18, the cleaning liquid is sprayed onto the outer cup 43. However, even when the inner cup 42 and the inner cup 41 are cleaned, the number of rotations of the cleaning substrate CW is similarly adjusted. By doing so, the cleaning liquid can be sprayed over a wide area. That is, in the seventh embodiment, the processing cup 40 can be effectively cleaned over a wide range by changing the flying angle of the cleaning liquid by adjusting the rotation speed of the cleaning substrate CW by the spin motor 22. is there.

An appropriate pattern can be adopted for controlling the number of rotations of the cleaning substrate CW. For example, the controller 9 may control the spin motor 22 so that the number of rotations of the cleaning substrate CW repeatedly increases and decreases at a constant period. By doing so, the flying direction of the cleaning liquid from the cleaning substrate CW oscillates with a constant period, and the cleaning liquid can be sprayed repeatedly over a wide range in the processing cup 40 with a constant period.

Alternatively, the cleaning substrate CW may be maintained at a high speed for a certain period of time and at a low speed. Alternatively, the rotational speed of the cleaning substrate CW may be changed stepwise.

Further, depending on the shape of the processing cup 40, there may be a portion where contaminants are particularly likely to adhere. In such a case, it is preferable that the control unit 9 controls the spin motor 22 to adjust the rotation speed of the cleaning substrate CW so that the cleaning liquid is sprayed intensively on the site where the contaminants are likely to adhere.

By the way, in this embodiment, when the cleaning substrate CW rotates at a relatively low speed, the cleaning liquid is ejected at a large flight angle and sprayed to the uppermost folded portion 43 c of the outer cup 43. In other words, when the spin motor 22 rotates the spin chuck 20 at a low speed, the plurality of guide piece main bodies have an inclination angle so that the cleaning liquid scattered from the plurality of guide pieces 272 reaches the folded portion 43c at the upper end of the cup. 272a is attached to the main body portion 271 of the cleaning substrate CW via the connection portion 272b.

Conventionally, for example, when a fixed angle fin is provided on the cleaning substrate as disclosed in Patent Document 4, the cleaning liquid is applied to the uppermost folded portion 43c of the cup at a high position unless the cleaning substrate is rotated at high speed. It couldn't be reached. When the cleaning substrate is rotated at a high speed, the cleaning liquid is also ejected at a high speed, and the splashing of the liquid droplets is strongly caused by spraying the cleaning liquid having a high kinetic energy on the top of the cup. If such a strong rebound occurs at the folded portion 43 close to the spin chuck 20, it may adhere to members in the apparatus such as the spin chuck 20 and cause new contamination.

In this embodiment, when the cleaning substrate CW is rotated at a relatively low speed, the cleaning liquid can be sprayed on the folded portion 43c at the top of the cup. At this time, the number of rotations of the cleaning substrate CW is smaller than that at the time of rinsing the normal substrate W. When the cleaning substrate CW rotates at a relatively low speed, the cleaning liquid is also ejected at a low speed, and the kinetic energy of the cleaning liquid sprayed on the uppermost part of the cup is also reduced, so that the droplets are less likely to rebound. As a result, new contamination due to the cleaning of the processing cup 40 can be suppressed.

In the seventh embodiment, the cleaning substrate CW is mounted on the spin chuck 20 so that the four guide pieces 272 of the cleaning substrate CW face the four chuck pins 26 on a one-to-one basis. The For this reason, when viewed from the vicinity of the center of the cleaning substrate CW, all the chuck pins 26 are covered with the guide pieces 272. As a result, the cleaning liquid supplied from the discharge head 31 toward the chuck pin 26 is guided to the guide piece main body 272a and scattered obliquely upward, and is prevented from colliding with the chuck pin 26 and being scattered. . As a result, contamination due to the cleaning liquid scattered by the chuck pins 26 adhering to members in the apparatus such as the processing cup 40 is prevented. In order to obtain such an effect, each guide piece main body 272a has a connecting portion 272b so that it can maintain an inclination angle that at least covers the chuck pin 26 even when the cleaning substrate CW is rotated at a high speed of 1000 rpm or more. It attaches to the main-body part 271 via. A part of the cleaning liquid supplied from the ejection head 31 to the cleaning substrate CW and not guided to the guide piece main body 272a is ejected from the outer peripheral end of the cleaning substrate CW in the horizontal direction, and the processing cup It will be sprayed to any part of 40.

As described above with reference to FIGS. 15 to 18, the inclination angle of the guide piece main body 272a changes according to the number of rotations of the cleaning substrate CW. For this reason, the length in the longitudinal direction (assumed to be length L) of each guide piece main body 272a in top view also changes according to the number of rotations of the cleaning substrate CW. The length L is preferably set so that the guide piece main body 272a and the chuck pin 26 do not overlap when the cleaning substrate CW is stationary. This is because there is a possibility that the operation of mounting the cleaning substrate CW on the spin base 21 may be hindered.

As apparent from FIGS. 16 to 18, the length L of the guide piece main body 272a increases as the rotational speed of the cleaning substrate CW increases. At any point, the guide piece main body 272a overlaps the chuck pin 26. It is desirable to do so. This is to reliably prevent collision / scattering between the cleaning liquid supplied from the discharge head 31 and guided to the guide piece main body 272a and scattered obliquely upward and the chuck pin 26.

<Eighth Embodiment>
Next, an eighth embodiment of the present invention will be described. In the seventh embodiment, the plurality of guide piece main bodies 272a have the same inclination angle, but in the eighth embodiment, the plurality of guide piece main bodies 272a are attached to the cleaning substrate CW so that the inclination angles are different. In the eighth embodiment, the same elements as those in the seventh embodiment are denoted by the same reference numerals.

FIG. 19 is a plan view showing a cleaning substrate CW of the eighth embodiment. 20 is a partial cross-sectional view of the cleaning substrate CW of FIG. 19 viewed from the line BB, and FIG. 21 is a partial cross-sectional view of the cleaning substrate CW of FIG. 19 viewed from the line CC. Similar to the seventh embodiment, the cleaning substrate CW includes a disk-shaped main body portion 271 having the same shape and material as the substrate W to be processed. A plurality of guide pieces 272a (eight in the eighth embodiment) guide pieces 272 are attached to the upper surface of the main body portion 271 via connecting portions 272b of elastic members. In the eighth embodiment, each of the plurality of guide piece main bodies 272a is a rectangular flat plate member formed of silicon, and the connection portion 272b is formed of PTFE (polytetrafluoroethylene).

In the eighth embodiment, half of the eight guide piece main bodies 272a are attached to the main body portion 271 of the cleaning substrate CW at a larger inclination angle than the remaining guide piece main bodies 272a. As shown in FIG. 20, four of the eight guide piece main bodies 272a are attached to the upper surface of the cleaning substrate CW so that the inclination angle in the stationary state is α. On the other hand, the remaining four of the eight guide piece main bodies 272a are attached to the upper surface of the cleaning substrate CW so that the inclination angle in the stationary state is β smaller than α. The four guide piece main bodies 272a attached so that the inclination angle is α and the four guide piece main bodies 272a attached so that the inclination angle is β are along the circumferential direction of the cleaning substrate CW. Alternately arranged. The eight guide pieces 272 are provided at equal intervals (that is, 45 ° intervals) along the circumferential direction of the cleaning substrate CW.

Each of the eight guide piece main bodies 272a is attached with the base end facing the center of the cleaning substrate CW so that the longitudinal direction of the rectangular shape coincides with the radial direction of the cleaning substrate CW. Each guide piece main body 272a is provided to be inclined upward from the center of the cleaning substrate CW toward the outer periphery in the radial direction. However, the height of the guide piece main body 272a attached at the inclination angle α is higher than that of the guide piece main body 272a attached at the inclination angle β.

Since the eight guide piece main bodies 272a are attached to the main body section 271 via the connecting portions 272b of elastic members, the inclination angle of each guide piece main body 272a with respect to the upper surface of the cleaning substrate CW is variable. However, since the inclination angle in the initial state (stationary state) is different, the guide piece body 272a attached at the inclination angle α in the stationary state is attached at the inclination angle β regardless of the number of rotations of the cleaning substrate CW. The inclination angle is larger than that of the guide piece main body 272a. The remaining points of the eighth embodiment excluding the inclination angle of the guide piece main body 272a are the same as those of the seventh embodiment.

Even when the cleaning process of the processing cup 40 is performed using the cleaning substrate CW of the eighth embodiment, the ejection head is located near the center of the upper surface while the cleaning substrate CW is mounted on the spin chuck 20 and rotated. A cleaning liquid is supplied from 31. Then, a part of the cleaning liquid that flows from the center toward the outer periphery by the centrifugal force is guided along the plurality of guide pieces 272 and scattered toward the upper side in the radial direction of the cleaning substrate CW.

In the eighth embodiment, the inclination angles of the eight guide piece main bodies 272a in a stationary state are different. Therefore, even when the cleaning substrate CW is rotating, the inclination angle is different between the guide piece main body 272a attached at an inclination angle α in a stationary state and the guide piece main body 272a attached at an inclination angle β. Specifically, the guide piece main body 72a attached at a tilt angle α in a stationary state has a larger tilt angle. Therefore, when the cleaning substrate CW is rotating, the cleaning liquid splashed from the guide piece main body 272a attached at an inclination angle α and the cleaning liquid scattered from the guide piece main body 272a attached at an inclination angle β when stationary. The flight angle with respect to the horizontal plane is also different. As a result, the cleaning liquid can be ejected at a wide angle even at the same rotation speed, and the processing cup 40 can be effectively cleaned over a wider range.

Similarly to the seventh embodiment, the inclination angle of each guide piece main body 272a changes depending on the rotation speed of the cleaning substrate CW, and the flying angle of the cleaning liquid scattered from the cleaning substrate CW also changes accordingly. . Therefore, by adjusting the rotation speed of the cleaning substrate CW by the spin motor 22, the processing cup 40 can be cleaned over a wide range by changing the flying angle of the cleaning liquid.

Further, four guide piece main bodies 272a (guide piece main bodies 272a having an inclination angle α in a stationary state) which are a part of the eight guide piece main bodies 272a are opposed to the four chuck pins 26 on a one-to-one basis. The cleaning substrate CW is mounted on the spin chuck 20 so as to be oriented. For this reason, as in the seventh embodiment, when viewed from the vicinity of the center of the cleaning substrate CW, all the chuck pins 26 are covered with the guide piece main body 272a. Accordingly, the cleaning liquid supplied from the ejection head 31 and directed to the chuck pin 26 is prevented from directly colliding with the chuck pin 26 and being scattered, and the scattered cleaning liquid is a member in the apparatus such as the processing cup 40. Contamination due to adhering to is prevented.

<Ninth Embodiment>
Next, a ninth embodiment of the present invention will be described. In the eighth embodiment, the guide piece 272 includes a guide piece main body 272a and a connection portion 272b that is an elastic member made of a resin material such as PTFE. On the other hand, the guide piece 272 of the ninth embodiment includes a guide piece main body 272a and an elastic spring made of a resin material, and the guide piece main body 272a is attached to the cleaning substrate CW using the spring. In the ninth embodiment, the same elements as those in the seventh embodiment are denoted by the same reference numerals.

FIG. 22 is a diagram showing an example in which the guide piece main body 272a is attached to the cleaning substrate CW via a spring. The main body 271 of the cleaning substrate CW is a disk-shaped member having the same shape and material as the substrate W to be processed, as in the seventh embodiment. In the ninth embodiment, the guide piece 272 includes a guide piece main body 272a, a leaf spring (leaf spring) 272c which is a kind of spring, and a hinge mechanism 272d, and a leaf spring (at the base end portion of the guide piece 272). A guide piece 272 is provided on the upper surface of the main body 271 by connecting the leaf spring 272c and the hinge mechanism 272d to the main body 271 of the cleaning substrate CW. More specifically, the guide piece main body 272a is attached to the upper surface of the main body 271 so as to be rotatable by a hinge mechanism 272d. Such a hinge mechanism 272d may be realized, for example, by forming a groove on the upper surface of the main body portion 271 and fitting a rotation shaft, and attaching the proximal end portion of the guide piece main body 272a to the rotation shaft. And as shown in FIG. 22, the leaf | plate spring 272c is provided between the lower surface of the guide piece main body 272a, and the upper surface of the main-body part 271. As shown in FIG.

The number of guide pieces 272 provided on the cleaning substrate CW can be set appropriately, and may be four as in the seventh embodiment, or may be eight as in the eighth embodiment. good. Each of the plurality of guide pieces 272 is attached with the base end portion directed toward the center of the cleaning substrate CW such that the longitudinal direction of the rectangular shape coincides with the radial direction of the cleaning substrate CW. Each guide piece main body 272a is attached so as to incline upward from the center of the cleaning substrate CW toward the outer periphery in the radial direction. The inclination angle of each guide piece main body 272a in the stationary cleaning substrate CW can be set to an appropriate value.

Even in the structure as shown in FIG. 22, each of the plurality of guide piece main bodies 272a is attached to the main body portion 271 of the cleaning substrate CW via an elastic leaf spring 272c. Therefore, as indicated by an arrow AR11 in FIG. 22, the inclination angle of each guide piece main body 272a with respect to the upper surface of the cleaning substrate CW is variable as in the seventh embodiment, and the rotation speed of the cleaning substrate CW increases. The inclination angle of the guide piece main body 272a becomes small.

FIG. 23 is a diagram showing another example in which the guide piece main body 272a is attached to the cleaning substrate CW via a spring. The main body 271 of the cleaning substrate CW is a disk-shaped member having the same shape and material as the substrate W to be processed, as in the seventh embodiment. As in FIG. 22, a guide piece main body 272a is attached to the upper surface of the main body 271 so as to be rotatable by a hinge mechanism 272d. Then, as shown in FIG. 23, a groove is formed on the upper surface of the main body 271 along the radial direction of the cleaning substrate CW, and a coil spring 272e which is a kind of spring is provided in the groove. One end of the coil spring 272e is fixed to the end of the groove, and the other end is connected to the guide piece main body 272a by a connecting member 272f. Both end connecting portions of the connecting member 272f (connecting portions with the guide piece main body 272a and the coil spring 272e) are rotatable by a hinge mechanism.

Also in the example of FIG. 23, the number of guide pieces 272 provided on the cleaning substrate CW can be set appropriately, and may be four as in the seventh embodiment, or as in the eighth embodiment. There may be eight. Each of the plurality of guide pieces 272 is attached with the base end portion directed toward the center of the cleaning substrate CW such that the longitudinal direction of the rectangular shape coincides with the radial direction of the cleaning substrate CW. Each guide piece main body 272a is attached so as to incline upward from the center of the cleaning substrate CW toward the outer periphery in the radial direction. The inclination angle of each guide piece main body 272a in the stationary cleaning substrate CW can be set to an appropriate value.

23, each of the plurality of guide piece main bodies 272a is attached to the main body 271 of the cleaning substrate CW via a coil spring 272e that is an elastic member. For this reason, as indicated by an arrow AR12 in FIG. 23, the inclination angle of each guide piece main body 272a with respect to the upper surface of the cleaning substrate CW is variable, and as the number of rotations of the cleaning substrate CW increases, the guide piece main body 272a increases. The inclination angle becomes smaller. That is, when the number of rotations of the cleaning substrate CW increases, the centrifugal force acting on the guide piece main body 272a increases, and the guide piece main body 272a falls to the outer peripheral side of the cleaning substrate CW, whereby tensile stress acts on the coil spring 272e. To do. Then, the guide piece body 272a falls down so that the tensile stress of the coil spring 272e and the centrifugal force acting on the guide piece body 272a are balanced.

Also in the examples shown in FIGS. 22 and 23, the inclination angle of the guide piece main body 272a changes depending on the number of rotations of the cleaning substrate CW, and the flying angle of the cleaning liquid scattered from the cleaning substrate CW also changes accordingly. . As the number of rotations of the cleaning substrate CW increases, the inclination angle of the plurality of guide piece main bodies 272a decreases, and the flying angle of the cleaning liquid with respect to the horizontal plane also decreases. Therefore, by adjusting the rotation speed of the cleaning substrate CW by the spin motor 22, the processing cup 40 can be effectively cleaned over a wide range by changing the flying angle of the cleaning liquid.

<Tenth Embodiment>
Next, a tenth embodiment of the present invention will be described. In the tenth embodiment, a wall portion is provided for preventing the cleaning liquid guided to the guide piece 272 from flowing down from the guide piece main body 272a. Also in the tenth embodiment, the same elements as those in the seventh embodiment are denoted by the same reference numerals.

FIGS. 24 to 27 are diagrams showing a configuration example of the guide piece main body 272a provided with a wall portion. In the example of FIG. 24, wall portions 281 are provided on both sides of the guide piece main body 272a along the longitudinal direction of the rectangular guide piece main body 272a. That is, a pair of wall portions 281 are provided at both ends parallel to the longitudinal direction of the guide piece main body 272a. By providing such a wall portion 281, a flow path is formed on the upper surface of the guide piece main body 272 a, and the cleaning liquid that has flowed into the flow path is prevented from flowing down from both ends parallel to the longitudinal direction (both ends in the short direction). can do. As a result, the cleaning liquid guided by the guide piece main body 272a can be scattered obliquely upward without waste.

In the example of FIG. 25, the inside of the guide piece main body 272a is hollow. Both ends in the longitudinal direction of the hollow portion are open ends. Thereby, the flow path 282 is formed in the inside of the guide piece main body 272a along the longitudinal direction. Even if such a flow path 282 is provided, a pair of wall portions are provided at both ends parallel to the longitudinal direction of the guide piece main body 272a.

When the guide piece main body 272a as shown in FIG. 25 is mounted on the cleaning substrate CW, a part of the cleaning liquid flowing from the center of the cleaning substrate CW toward the outer periphery flows into the flow path 282 of the guide piece main body 272a and is guided. Then, it is scattered toward the upper side of the cleaning substrate CW in the radial direction. At this time, since the wall portions exist at both ends parallel to the longitudinal direction of the guide piece main body 272a, it is possible to prevent the cleaning liquid flowing into the guide piece main body 272a from flowing down from both ends parallel to the longitudinal direction. As a result, the cleaning liquid guided by the guide piece main body 272a can be scattered obliquely upward without waste.

The example shown in FIG. 26 is such that the width of the guide piece body 272a of FIG. Similarly to the example of FIG. 24, wall portions 281 are provided at both ends of the guide piece main body 272a in the short direction. Even in this case, it is possible to prevent the cleaning liquid flowing into the guide piece main body 272a from flowing down from both ends in the lateral direction. In addition, as shown in FIG. 26, if the wall portion 281 is provided and the guide piece body 272a is formed so that the width gradually decreases from the proximal end side to the distal end side of the guide piece body 272a, the scattering region is limited. can do. The guide piece main body 272a as shown in FIG. 26 is suitable for enhancing the cleaning effect by increasing the momentum of the cleaning liquid sprayed on the processing cup 40.

In the example shown in FIG. 27, an additional guide 292 is further provided on the upper surface of the guide piece main body 272a shown in FIG. The guide piece main body 272a of FIG. 27 is provided with a pair of wall portions 281 at both ends parallel to the longitudinal direction, as in FIG. An additional guide portion 292 is provided on the upper surface of the guide piece main body 272a. The additional guide part 292 is obtained by reducing the size of the guide piece main body 272a. The additional guide portion 292 is also provided with a pair of wall portions 291 at both ends parallel to the longitudinal direction. The additional guide part 292 is provided so as to further form a predetermined inclination angle with respect to the upper surface of the guide piece main body 272a.

When the guide piece main body 272a as shown in FIG. 27 is mounted on the cleaning substrate CW, a part of the cleaning liquid flowing from the center of the cleaning substrate CW toward the outer periphery flows into the guide piece main body 272a. A part of the cleaning liquid guided by the guide piece main body 272a further flows into the additional guide portion 292. Therefore, the cleaning liquid is scattered from each of the guide piece main body 272a and the additional guide portion 292 toward the diagonally upward in the radial direction of the cleaning substrate CW. The guide piece main body 272a and the additional guide portion 292 have different inclination angles with respect to the upper surface of the cleaning substrate CW. Therefore, the flying angle with respect to the horizontal plane is different between the cleaning liquid splashed from the guide piece main body 272a and the cleaning liquid splashed from the additional guide portion 292. As a result, as in the eighth embodiment, the cleaning liquid can be ejected at a wide angle even at the same rotational speed, and the processing cup 40 can be effectively cleaned over a wider range.

Also, in the example of FIG. 27, wall portions 281 are provided at both ends parallel to the longitudinal direction of the guide piece main body 272a, and wall portions 291 are provided at both ends parallel to the longitudinal direction of the additional guide portion 292. It is possible to prevent the cleaning liquid from flowing down from both ends parallel to the longitudinal direction of the guide piece main body 272a and the additional guide portion 292. As a result, the cleaning liquid guided by the guide piece main body 272a and the additional guide portion 292 can be scattered obliquely upward without waste.

<Eleventh embodiment>
Next, an eleventh embodiment of the present invention will be described. In the seventh embodiment, each of the plurality of guide pieces 272 is provided such that the longitudinal direction of the rectangular shape coincides with the radial direction of the cleaning substrate CW. However, in the eleventh embodiment, the longitudinal direction is the diameter of the cleaning substrate CW. A plurality of guide pieces 272 are provided so as to be inclined with respect to the direction. In the eleventh embodiment, the same elements as those in the seventh embodiment are denoted by the same reference numerals.

FIG. 28 is a plan view showing the cleaning substrate CW of the eleventh embodiment. As shown in the figure, in the eleventh embodiment, each guide piece 272 is attached to the main body 271 so that the longitudinal direction of the rectangular guide piece 272 is inclined with respect to the radial direction of the cleaning substrate CW indicated by the dotted line. Is provided.

As described above, when the cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the upper surface of the rotating cleaning substrate CW, the cleaning liquid flows from the center toward the outer periphery on the upper surface of the cleaning substrate CW by centrifugal force. At this time, the cleaning liquid immediately after being supplied from the ejection head 31 does not have a speed component in the rotating direction. On the other hand, the cleaning liquid that is supplied near the center and flows toward the outer periphery gradually has a velocity component in the rotation direction of the cleaning substrate CW due to friction with the upper surface of the rotating cleaning substrate CW. As a result, the cleaning liquid flowing from the center to the outer periphery of the cleaning substrate CW does not flow linearly along the radial direction of the cleaning substrate CW, and as shown by an arrow AR28 in FIG. 28, the cleaning substrate CW It flows while drawing a trajectory that curves from the radial direction on the top surface. The trajectory of the cleaning liquid as indicated by an arrow AR28 is a trajectory of the relative movement of the cleaning liquid with respect to the upper surface of the cleaning substrate CW, which is generated as a result of the centrifugal force and the frictional force accompanying the rotation of the cleaning substrate CW acting on the cleaning liquid.

Thus, if the locus of the cleaning liquid flowing on the upper surface of the cleaning substrate CW is curved from the radial direction, the cleaning liquid that has flowed into the guide piece 272 may flow down from the short-side end of the guide piece 272. In the eleventh embodiment, each of the plurality of guide piece main bodies 272a is attached to the main body portion 271 so that the longitudinal direction of the rectangular guide piece 272 is inclined with respect to the radial direction of the cleaning substrate CW. Further, it is possible to reduce the cleaning liquid that has flowed into the guide piece 272 from the end of the guide piece 272 in the short direction. As a result, the cleaning liquid guided by the guide piece 272 can be scattered obliquely upward without waste.

<Twelfth embodiment>
Next, a twelfth embodiment will be described. FIG. 29 is a perspective view showing the cleaning substrate CW of the twelfth embodiment, and FIG. 30 is a longitudinal section of the cleaning substrate CW as seen by cutting it at the center in the short direction of the guide piece 272 provided on the upper surface. FIG. The guide piece 272 of the twelfth embodiment includes a guide piece main body 272a and a connecting portion 272b. The guide piece main body 272a and the connection portion 272b are both plate-like members, and the guide piece 272 is configured as a whole by connecting the distal end of the connection portion 272b and the base end of the guide piece main body 272a.

As in the seventh embodiment, the material of the guide piece main body 272a is the same as that of the main body 271 (for example, silicon). The rectangular connection portion 272b is formed of an elastic member. Examples of the elastic member include a silicone resin.

A recess 271a having a width substantially the same as the width of the connecting portion 272b in the short direction is formed on the upper surface of the main body portion 271. By fixing the base end portion of the connecting portion 272b in the concave portion 271a in a curved state, the entire guide piece 272 is attached to the upper surface of the main body portion 271 while being inclined upward.

When the cleaning substrate CW is rotated, the bending state of the connection portion 272b is changed by the centrifugal force acting on the guide piece 272, and the inclination angle of the guide piece 272 with respect to the upper surface of the main body portion 271 is changed as indicated by an arrow AR13 in FIG. Change.

In each of the seventh to twelfth embodiments, the silicon guide piece main body 272a is attached to the cleaning substrate CW via an elastic member such as a resin material or a spring, but the entire guide piece 272 is made of the resin material. The elastic member may be bonded to the upper surface of the main body 271 of the cleaning substrate CW with the base end of the guide piece 272 of the elastic member curved (see FIG. 31). When the cleaning substrate CW rotates, the curved state of the base end changes due to the centrifugal force acting on the guide piece 272, and as shown by the arrow AR14 in FIG. The tilt angle changes. Even in this case, since the end portion of the guide piece 272 bonded to the upper surface of the cleaning substrate CW is an elastic member, the guide piece 272 is attached to the upper surface of the cleaning substrate CW in a broad sense through the elastic member. Will be.

Alternatively, as shown in FIG. 32, the cleaning substrate CW may be formed of an elastic member. A part of the upper surface of the main body 271 of the cleaning substrate CW is scraped off in a tongue shape. Then, the guide piece 272 is formed by keeping the base end portion 272h of the scraped tongue piece member 272g connected to the cleaning substrate CW. In particular, as shown in FIG. 32, if the base end portion 272h of the guide piece 272 is formed to be thinner than the other portions, the base end portion 272h of the guide piece 272 is more easily bent than the other portions. The degree of change in the inclination angle of the guide piece 272 according to the number of rotations of the substrate CW can be increased.

Even if the guide piece 272 itself is formed of an elastic member in this way, the inclination angle of each guide piece 272 changes depending on the number of rotations of the cleaning substrate CW, and the cleaning liquid splashed from the cleaning substrate CW accordingly. The flight angle with respect to the horizontal plane also changes. Therefore, by adjusting the rotation speed of the cleaning substrate CW by the spin motor 22, the processing cup 40 can be cleaned over a wide range by changing the flying angle of the cleaning liquid.

In each of the seventh to twelfth embodiments, the guide piece 272 is a rectangular flat plate member. However, the present invention is not limited to this, and the guide piece 272 is a curved plate member. May be. The curve of the guide piece 272 may be warped so that the upper side is convex, or may be warped so that the lower side is convex.

In the seventh embodiment, four guide pieces 272 are provided on the cleaning substrate CW, and in the eighth embodiment, eight guide pieces 272 are provided. However, the guide pieces 272 provided on one cleaning substrate CW are provided. The number of can be set appropriately. For example, in the seventh embodiment, eight guide pieces 272 may be attached to the cleaning substrate CW at the same inclination angle. However, from the viewpoint of covering all the chuck pins 26 of the spin chuck 20 with the guide pieces 72, it is preferable that at least the guide pieces 272 equal to or more in number than the chuck pins 26 are provided in a positional relationship corresponding to the chuck pins 26. In this way, the cleaning substrate CW can be mounted on the spin chuck 20 so that at least a part of the plurality of guide pieces 272 faces the plurality of chuck pins 26, and the cleaning liquid collides with the chuck pins 26. It can be prevented from being scattered. The number of chuck pins 26 provided on the spin chuck 20 is typically four or six.

In the eighth embodiment, the plurality of guide pieces 272 are attached to the upper surface of the cleaning substrate CW at two types of inclination angles. However, these may be attached at three or more types of inclination angles. .

In the eighth embodiment, the plurality of guide pieces 272 are attached to the cleaning substrate CW so that the inclination angles are different. However, the plurality of guide pieces 272 having different lengths may be attached to the cleaning substrate CW. good. In this case, the inclination angles for attaching the plurality of guide pieces 272 may be the same or different. Even if a plurality of guide pieces 272 having different lengths are attached to the cleaning substrate CW, the cleaning liquid can be sprayed over a wide range of the processing cup 40.

In the seventh embodiment, the elastic member of the connection portion 272b is made of silicone resin. However, the present invention is not limited to this, and the connection portion 272b is formed using another resin material, for example, fluorine resin. May be.

In each of the seventh to twelfth embodiments, the inclination angle of the plurality of guide pieces 272 is changed according to the number of rotations of the cleaning substrate CW, and accordingly the cleaning liquid scattered from the cleaning substrate CW with respect to the horizontal plane. Although the flight angle is changed, the processing cup 40 may be moved up and down to change the position where the cleaning liquid is sprayed. If it does in this way, processing cup 40 can be washed effectively over a wider range, and the variation of cup washing can be made abundant.

In each of the seventh to twelfth embodiments, the base end portion of the guide piece 272 is mainly elastic. However, at least a part from the base end to the tip end of the guide piece 272 is elastic. What is necessary is just to have. For example, it is possible to change the direction of the cleaning liquid scattered from the guide piece 272 even if the distal end portion of the guide piece 272 is elastic instead of the base end portion.

<13th Embodiment>
Next, a thirteenth embodiment of the present invention is described. The configuration of the substrate processing apparatus of the thirteenth embodiment is substantially the same as that of the first embodiment. The substrate processing apparatus of the thirteenth embodiment includes the cleaning jig 80 used in the cleaning mode MD2 (FIG. 39) described later, with the substrate processing apparatus 1 of the first embodiment as a processing unit. FIG. 33 is a schematic view of the cleaning jig 80, FIG. 34 (a) is a longitudinal sectional view of the cleaning jig 80, and FIG. 34 (b) is a transverse sectional view of the cleaning jig 80.

The cleaning jig 80 is a jig that is transferred to the substrate processing apparatus 1 by a transfer robot (not shown), and is used outside the chamber 10 (for example, used for substrate processing) in a substrate processing mode MD1 (FIG. 35) described later. In an unoccupied chamber, a shelf for placing the cleaning jig 80, etc.) and is held by the spin chuck 20 in the chamber 10 for executing the processing in the later-described cleaning mode MD2 (FIG. 39). It is rotated (FIGS. 40 to 43). In the present embodiment, first, the substrate processing apparatus 1 including one cleaning jig 80 will be described, and the substrate processing apparatus including a cleaning jig set including a plurality of cleaning jigs will be described later.

The cleaning jig 80 has a dome shape so as to cover a bottom plate 84 having an external size corresponding to the substrate W in a plan view (in this embodiment, substantially the same circle as the substrate W in a top view), and the top surface of the bottom plate 84. A jig that can be detachably held by the spin chuck 20. A hollow portion surrounded by the upper surface of the bottom plate 84 and the inner wall of the cover portion 85 functions as the liquid receiving portion 81. A supply port 82 communicating with the liquid receiving portion 81 is formed at the top of the cover portion 85, and the cleaning liquid supplied from the upper surface treatment liquid nozzle 30 to the supply port 82 is received by the liquid receiving portion 81. A plurality of discharge ports 83 for discharging the cleaning liquid received by the liquid receiving portion 81 to the outside are provided on the outer peripheral side of the cleaning jig 80 (side surface of the cover portion 85).

The outer peripheral end of the disc-shaped bottom plate 84 constitutes a flange portion 84a. The flange portion 84 a is an outer peripheral portion of the bottom plate 84 that is not covered by the cover portion 85, and has substantially the same thickness as the processing target substrate W of the substrate processing apparatus 1. Therefore, similarly to the substrate W, each of the plurality of chuck pins 26 can be brought into contact with the flange portion 84a of the cleaning jig 80 to grip the cleaning jig 80. Further, the gripping can be released by separating each of the plurality of chuck pins 26 from the flange portion 84a of the cleaning jig 80.

The method for holding the cleaning jig 80 by the chuck pins 26 is not limited to the above. Even if the cleaning jig 80 does not include the flange portion 84a, there are various methods such as a method of holding the cleaning jig 80 by bringing each of the plurality of chuck pins 26 into contact with the side surface of the cleaning jig 80. Can be adopted.

In a cleaning mode MD2, which will be described later, the cleaning liquid is supplied from a supply port 82 that is an upper opening of the cleaning jig 80 while the cleaning jig 80 is held in a horizontal posture by the spin chuck 20 and rotated around the rotation axis CX. Thus, the cleaning liquid can be discharged from a plurality of discharge ports 83 provided along the outer peripheral side of the cleaning jig 80 and communicating with the liquid receiving portion 81 (FIG. 46). As a result, predetermined portions (for example, the side wall 11, the partition plate 15, and the processing cup 40) existing around the spin chuck 20 are cleaned with the cleaning liquid scattered from the cleaning jig 80.

The cleaning jig 80 has an inclined surface 81 a that is inclined upward from the center side toward the outer peripheral side on the bottom surface of the liquid receiving portion 81. For this reason, the cleaning liquid supplied to the rotating cleaning jig 80 flows from the inner side to the outer side (flows along the inclined surface 81a) by the centrifugal force of rotation, and is discharged obliquely upward from the discharge port 83. . Thereby, the inner wall surface of the processing cup 40 can be effectively cleaned.

The plurality of discharge ports 83 of the cleaning jig 80 are arranged at positions higher than the plurality of chuck pins 26 in a state where the jig is held by the spin chuck 20 (FIGS. 40 to 43). As described above, since the plurality of discharge ports 83 are arranged at different height positions from the chuck pins 26, pure water supplied to the cleaning jig 80 and discharged from the plurality of discharge ports 83 collides with the chuck pins 26. Without being scattered around. Therefore, pure water can be scattered with high precision at the location to be cleaned.

Each discharge shaft 83a of the plurality of discharge ports 83 (the central axis of the discharge port 83 having a substantially cylindrical shape) is inclined forward from the centrifugal direction of rotation by the spin motor 22 and is directed to the front side of the rotation tangent of each discharge port. (FIG. 34 (b)). The reason for this configuration will be described later. Note that in FIG. 34B, the discharge shaft 83a is expressed only for one discharge port 83 for the purpose of preventing the figure from becoming complicated.

In addition, a plurality of substrate processing modes in the substrate processing apparatus 1 are set in advance in the storage unit (magnetic disk or the like) of the control unit 9, and the CPU of the control unit 9 executes the predetermined processing program to execute the above-described plurality of processing modes. Each operation mechanism of the substrate processing apparatus 1 is controlled by selecting and executing one of the modes.

Next, each operation mode (each mode) of the substrate processing apparatus 1 will be described. The substrate processing apparatus 1 of the thirteenth embodiment is selected exceptionally or temporarily when the substrate processing mode MD1 (FIG. 35) set as a default mode among a plurality of modes and a predetermined condition are satisfied. And a cleaning mode MD2 (FIG. 39). A mode different from the above two modes may be additionally set in the control unit 9 of the substrate processing apparatus 1 and the additional mode may be selectable. In the present embodiment, the above two modes are particularly preferable. A case where only the mode is set will be described.

FIG. 35 is a flowchart showing the procedure of the substrate processing mode MD1 in the substrate processing apparatus 1. Hereinafter, the substrate processing mode MD1 will be described with reference to FIG.

First, the substrate W to be processed is loaded into the chamber 10 by a transfer robot (not shown) (step ST1). The four chuck pins 26 are driven, and the substrate W is gripped by the spin chuck 20 (step ST2). When the spin motor 22 rotates the rotation shaft 24, the substrate W is rotated around the rotation axis CX along the vertical direction through the center of the substrate W (step ST3).

Next, the nozzle arm 32 of the upper surface treatment liquid nozzle 30 is rotated to move the ejection head 31 above the spin base 21 (for example, above the rotation axis CX), and the substrate W rotated by the spin chuck 20 is moved. Supply chemicals to the top surface. The chemical solution supplied to the upper surface of the substrate W spreads over the entire upper surface of the rotating substrate W by centrifugal force. Thereby, the chemical | medical solution process of the board | substrate W advances (step ST4). Then, the chemical liquid scatters around from the end of the rotating substrate W.

For the purpose of collecting the scattered chemicals, in step ST4, for example, only the outer cup 43 rises, and a spin is formed between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42. An opening OPa surrounding the periphery of the substrate W held by the chuck 20 is formed (FIG. 36). As a result, the chemical solution (shown by a dotted arrow in FIG. 36) splashed from the edge portion of the rotating substrate W is received by the upper end portion 43b of the outer cup 43, flows down along the inner surface of the outer cup 43, and the outer recovery groove. 51 is collected. After a predetermined time has elapsed (or after a predetermined amount of chemical solution has been supplied), the supply of the chemical solution is stopped.

Next, pure water (rinse liquid) is supplied from the upper surface treatment liquid nozzle 30 to the upper surface of the substrate W rotated by the spin chuck 20. The pure water supplied to the upper surface of the substrate W spreads over the entire upper surface of the rotating substrate W by centrifugal force. Thereby, the rinsing process in which the chemical solution remaining on the upper surface of the substrate W is flowed proceeds (step ST5). Then, the pure water and the chemical solution that is poured into the pure water are scattered from the end of the rotating substrate W to the surroundings.

In step ST <b> 5, for example, all of the inner cup 41, the middle cup 42, and the outer cup 43 are raised, and the opening surrounded by the first guide portion 47 of the inner cup 41 around the substrate W held by the spin chuck 20. OPc is formed (FIG. 37). As a result, pure water and chemical liquid (shown by dotted arrows in FIG. 37) splashed from the edge of the rotating substrate W are received by the inner cup 41 and flow down along the inner wall of the first guide portion 47, and are discarded. 49 is discharged. In the case where pure water is collected by a path different from the chemical solution, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52b of the second guide portion 52 of the middle cup 42 and the first guide of the inner cup 41 are collected. An opening OPb surrounding the periphery of the substrate W held by the spin chuck 20 may be formed between the upper end portion 47b of the portion 47 (FIG. 38). After a predetermined time has elapsed (or after a predetermined amount of pure water has been supplied), the supply of pure water is stopped.

Then, step ST4 and step ST5 are alternately repeated until all the chemical processing defined in the substrate processing recipe is executed (step ST6). For example, when three types of chemical processing are set in the recipe, chemical processing (step ST4) and rinsing processing (step ST5) are executed for each chemical.

When the chemical treatment and the rinse treatment are completed, the substrate W is dried (step ST7). When performing the drying process, all of the inner cup 41, the inner cup 42 and the outer cup 43 are lowered, and the upper end portion 47 b of the first guide portion 47 of the inner cup 41 and the upper end portion 52 b of the second guide portion 52 of the inner cup 42. Both the upper end 43b of the outer cup 43 and the substrate W held by the spin chuck 20 are positioned below. In this state, the substrate W is rotated at a high speed together with the spin chuck 20, and droplets (chemical solution droplets or water droplets) adhering to the substrate W are shaken off by a centrifugal force, and a drying process is performed.

Thereafter, the rotation of the substrate W is stopped (step ST8), the four chuck pins 26 are driven, the substrate W is released from the spin chuck 20 (step ST9), and the substrate W is moved out of the chamber 10 by a transfer robot (not shown). It is carried out (step ST10).

As described above, in the substrate processing mode MD1, the surface treatment is performed by supplying a chemical solution and pure water (rinse solution) to the substrate W. Although most of the chemical liquid and pure water splashed from the rotating substrate W are collected and drained by the processing cup 40, the processing liquid splashes outside the cup or the processing liquid splashed to the processing cup 40 is drained. May remain attached.

As described above, the processing liquid adhering to the inside and outside of the processing cup 40 may generate particles and the like to become a contamination source for the processing target substrate W when dried. For this reason, in the substrate processing apparatus 1 of this embodiment, the cleaning mode MD2 (FIG. 39) described later is executed to clean the inside and outside of the processing cup 40.

The cleaning mode MD2 is different from the above-described substrate processing mode MD1 executed at the timing when the substrate W exists in the chamber 10, and the timing at which the substrate processing is not performed because the substrate W does not exist in the chamber 10 (for example, This mode is executed at the interval of lot processing). The cleaning mode MD2 is
(1) When a predetermined number of substrates are processed in the “number standard”, that is, the substrate processing mode MD1,
(2) “Time reference”, that is, when the substrate processing apparatus 1 is operated for a predetermined time in the substrate processing mode MD1,
(3) “Failure cause occurrence criteria”, for example, when a deposit (detected) is detected inside or outside the processing cup 40 by a sensor (not shown), there is an obstacle to sustaining high-precision substrate processing. If we detect that
The mode is selected exceptionally or temporarily when a predetermined condition is satisfied, and the condition is set in the control unit 9 in advance.

In the “number basis”, the cleaning mode MD2 is periodically executed on the basis of the number of processed substrates, and in the “time basis”, the cleaning mode MD2 is periodically executed on the basis of time. When viewed in terms of (number of sheets and time), the cleaning mode MD2 is periodically executed. On the other hand, in the “disturbance cause occurrence criteria”, such trouble causes do not always occur periodically, and thus the cleaning mode MD2 is often executed aperiodically.

FIG. 39 is a flowchart showing the procedure of the cleaning mode MD2 in the substrate processing apparatus 1. Hereinafter, the cleaning mode MD2 will be described with reference to FIG.

First, the cleaning jig 80 is carried into the chamber 10 by a transfer robot (not shown), and the cleaning jig 80 is mounted on the spin chuck 20 (step ST11: mounting process).

Then, the partition plate 15 and the side wall 11 are cleaned (steps ST12 to ST13).

The cleaning jig 80 is rotated around the rotation axis CX by the spin motor 22 while being held by the spin chuck 20 (step ST12: rotation process). At this time, all of the inner cup 41, the middle cup 42, and the outer cup 43 positioned around the spin chuck 20 are lowered to the lowermost position, and the upper ends of the processing cup 40 (upper end portion 47b, upper end portion 52b, and upper end portion 43b). Is lower than the plurality of discharge ports 83 of the cleaning jig 80.

In a state where the cleaning jig 80 is rotated, pure water is supplied from the discharge head 31 to the liquid receiving portion 81 through the supply port 82 of the cleaning jig 80 (step ST13: supply process).

When pure water is supplied to the supply port 82 of the rotating cleaning jig 80, the pure water is deposited on the liquid receiving portion 81, which is the internal space of the cleaning jig 80, and the liquid receiving portion 81 is rotated by the centrifugal force of rotation. It flows from the inside toward the outside. As described above, the bottom surface of the liquid receiving portion 81 is provided with the inclined surface 81a that is inclined upward from the center side toward the outer peripheral side. For this reason, in step ST13, pure water flows along the inclined surface 81a and is scattered obliquely upward from the plurality of discharge ports 83. Since the upper end of the processing cup 40 is lower than the discharge port 83 of the cleaning jig 80, the pure water scattered from the rotating cleaning jig 80 is removed from the upper surface of the partition plate 15, as shown in FIG. And it will pour onto the side wall 11 of the chamber 10. When pure water scattered from the cleaning jig 80 pours down, the upper surface of the partition plate 15 and the side wall 11 of the chamber 10 are cleaned.

Next, the processing cup 40 is cleaned (step ST14 to step ST16).

The processing cup 40 includes an inner cup 41, a middle cup 42, and an outer cup 43 that can be moved up and down independently of each other, and the inner side surfaces of the inner cup 41, the middle cup 42, and the outer cup 43 function as a guide portion. That is, the processing cup 40 is provided with a plurality of guide portions along the height direction. When cleaning the inside of the cup, the outer cup 43, the middle cup 42, and the inner cup 41 are sequentially raised around the cleaning jig 80 held by the spin chuck 20.

When cleaning the inside of the outer cup 43, as shown in FIG. 41, only the outer cup 43 rises (step ST14). As a result, the upper end portion 43b of the outer cup 43 becomes higher than the plurality of discharge ports 83 of the cleaning jig 80, and the cleaning jig is interposed between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the middle cup 42. An opening OPa surrounding the periphery of the plurality of discharge ports 83 of the tool 80 is formed.

Since the discharge head 31 continues to supply pure water to the rotating cleaning jig 80 from step ST13, the supplied pure water is supplied to the plurality of discharge ports 83 by the centrifugal force accompanying the rotation of the cleaning jig. To the inside of the outer cup 43. As a result, the pure water splashed from the plurality of discharge ports 83 of the cleaning jig 80 pours onto the upper surface of the middle cup 42 at the same time as the inner surface of the outer cup 43, and the inner surface of the outer cup 43 and the upper surface of the middle cup 42. Will be washed.

Further, when cleaning the inside of the middle cup 42, as shown in FIG. 42, the outer cup 43 and the middle cup 42 are raised, and only the inner cup 41 is lowered (step ST15). As a result, the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the middle cup 42 become higher than the plurality of discharge ports 83 of the cleaning jig 80, and the upper end portion 52b of the middle cup 42 and the upper end portion 47b of the inner cup 41 are obtained. The opening OPb surrounding the periphery of the plurality of discharge ports 83 of the cleaning jig 80 is formed.

Since the discharge head 31 continues to supply pure water to the rotating cleaning jig 80 from step ST13, the supplied pure water is supplied to the plurality of discharge ports 83 by the centrifugal force accompanying the rotation of the cleaning jig. From the inside toward the inside of the middle cup 42. As a result, the pure water splashed from the plurality of discharge ports 83 of the cleaning jig 80 pours onto the upper surface of the inner cup 41 at the same time as the inner surface of the middle cup 42, and the inner surface of the middle cup 42 and the upper surface of the inner cup 41. Will be washed.

Further, when the inside of the inner cup 41 is washed, as shown in FIG. 43, all of the outer cup 43, the middle cup 42 and the inner cup 41 are raised (step ST16). As a result, the upper end portion 43b of the outer cup 43, the upper end portion 52b of the middle cup 42, and the upper end portion 47b of the inner cup 41 are all higher than the plurality of discharge ports 83 of the cleaning jig 80. An opening OPc is formed in which the one guide portion 47 surrounds the periphery thereof at the same height as the plurality of discharge ports 83 of the cleaning jig 80.

Since the discharge head 31 continues to supply pure water to the rotating cleaning jig 80 from step ST13, the supplied pure water is supplied to the plurality of discharge ports 83 by the centrifugal force accompanying the rotation of the cleaning jig. From the inside toward the inside of the inner cup 41. As a result, the pure water splashed from the plurality of discharge ports 83 of the cleaning jig 80 pours onto the inner side surface (first guide portion) of the inner cup 41 and the inner side surface of the inner cup 41 is cleaned.

As described above, in steps ST14 to ST16, the inner cup 41, the inner cup 42, and the outer cup 43 are moved up and down, so that each of the three guide portions formed by the inner side surface of each cup becomes the cleaning jig 80. Each guide part is washed so as to be positioned around the plurality of discharge ports 83.

After the cleaning process inside the processing cup 40 is completed as described above, a drying process is performed (step ST17 to step ST22).

When performing the drying process, first, the supply of pure water from the upper surface treatment liquid nozzle 30 is stopped, and the rotation of the cleaning jig 80 by the spin motor 22 is stopped (step ST17).

All of the inner cup 41, the inner cup 42 and the outer cup 43 are lowered to the lowest position, and the upper end (upper end portion 47b, upper end portion 52b and upper end portion 43b) of the processing cup 40 is lower than the holding surface 21a of the spin base 21. (Step ST18).

In this state, the cleaning jig 80 is rotated at high speed around the rotation axis CX by driving the spin motor 22 (step ST19). As the cleaning jig 80 is rotated at a high speed, a spiral airflow is formed in the chamber 10. By blowing the airflow generated along with the rotation of the cleaning jig 80, the cleaning jig 80, the upper surface of the processing cup 40, the upper surface of the partition plate 15, and the side wall 11 of the chamber 10 are dried.

Also, in conjunction with the rotation of the cleaning jig 80, an inert gas (nitrogen in this embodiment) is sprayed from the two-fluid nozzle 60 onto the upper surface of the processing cup 40 (step ST20). In addition to the airflow generated by the rotation of the cleaning jig 80, an inert gas is blown from the two-fluid nozzle 60, whereby the cleaning jig 80, the upper surface of the processing cup 40, the upper surface of the partition plate 15, and the chamber 10 The drying efficiency of the side wall 11 can be increased.

When the blowing of nitrogen from the two-fluid nozzle 60 is stopped and the drying process is completed, the rotation of the spin base 21 is also stopped (step ST21).

Then, the cleaning jig 80 is released from the spin chuck 20 and is carried out of the chamber 10 by a transfer robot (not shown) (step ST22).

The overall flow of the cleaning mode MD2 has been described above. In the following, the operation of each part in the cleaning mode MD2, particularly in steps ST12 to ST16 will be described in more detail. FIG. 44 is a time chart showing the operation of each part in steps ST12 to ST16. Time t0 to time t12 are indices indicating the passage of time.

Time t0 to time t3 is a period in which the cleaning liquid is scattered from the cleaning jig 80 in a state where each cup is lowered, and the cleaning process of the partition plate 15 and the side wall 11 is executed (step ST12 to step ST13 in FIG. 39). , FIG. 40).

From time t3 to time t6, the cleaning liquid is scattered from the cleaning jig 80 in a state where the outer cup 43 is raised and the middle cup 42 and the inner cup 41 are lowered, and the cleaning process inside the outer cup 43 is executed. (Step ST14 in FIG. 39, FIG. 41).

From time t6 to time t9 is a period in which the cleaning liquid is scattered from the cleaning jig 80 in a state where the outer cup 43 and the middle cup 42 are raised and the inner cup 41 is lowered, and the cleaning process inside the middle cup 42 is executed. (Step ST15 in FIG. 39, FIG. 42).

From time t9 to time t12 is a period in which the cleaning liquid is scattered from the cleaning jig 80 in a state where each cup is raised, and the cleaning process inside the inner cup 41 is executed (step ST16 in FIG. 39, FIG. 43).

In the cleaning mode MD2 of this embodiment, as a rotation process of the cleaning jig 80, an acceleration process (time t0 to time t1, time t3 to time) for accelerating the rotation of the cleaning jig 80 in the early stage of cleaning of each part. t4, time t6 to time t7, time t9 to time t10), and a constant speed process (time t1 to time t2, time t4 to time t5, time to rotate the cleaning jig 80 at a predetermined speed in the middle plate of each part. t7 to time t8, time t10 to time t11), and deceleration steps (time t2 to time t3, time t5 to time t6, time t8 to time t9) for decelerating the rotation of the cleaning jig 80 at the final stage of cleaning of each part, Time t11 to time t12).

As described above, when pure water is supplied from the discharge head 31 to the supply port 82 of the rotating cleaning jig 80, the pure water lands on the bottom surface of the cleaning jig 80 and then the outer periphery from the center by centrifugal force. It flows toward. At this time, the pure water supplied from the discharge head 31 and having landed on the bottom surface of the cleaning jig 80 does not have a speed component in the rotating direction. On the other hand, the pure water supplied near the center and flowing toward the outer periphery gradually has a speed component in the rotation direction of the cleaning jig 80 due to friction with the bottom surface of the rotating cleaning jig 80. Become. As a result, the pure water that flows from the center of the cleaning jig 80 toward the outer periphery does not normally flow linearly along the centrifugal direction of the cleaning jig 80, but at the bottom surface of the cleaning jig 80. It flows while drawing a trajectory that curves from the centrifugal direction.

45. The locus of pure water indicated by an arrow AR45 in FIG. 45 is a locus of relative movement of pure water with respect to the bottom surface of the cleaning jig 80 in the acceleration process.

Further, the path of pure water indicated by an arrow AR46 in FIG. 45 is a path of relative movement of pure water with respect to the bottom surface of the cleaning jig 80 in the deceleration process. Unlike the arrow AR45, the arrow AR46 is directed in the forward direction of the rotation tangent (counterclockwise direction shown in FIG. 45) because the rotational speed generated by the rotational inertia of the pure water itself is reduced by the cleaning jig 80. This is because it is larger than the rotation speed.

As described above, the discharge shafts 83a (the central axes of the substantially cylindrical discharge ports 83) of the plurality of discharge ports 83 of the cleaning jig 80 are inclined with respect to the centrifugal direction of rotation by the spin motor 22, and the respective discharge ports. It points to the front side of the rotation tangent. This directivity corresponds to the arrow AR46.

For this reason, in the acceleration process and the constant speed process, while a part of the pure water WT supplied to the liquid receiving part 81 of the cleaning jig 80 is discharged from the plurality of discharge ports 83, the remaining pure water WT is liquid. It is stored on the outer peripheral side inside the receiving portion 81 (FIG. 46A). On the other hand, in the deceleration process, the directivity of the pure water WT in the liquid receiving portion 81 and the directivity of the discharge port 83 provided in the cleaning jig 80 correspond to each other. The pure water WT is ejected vigorously from the plurality of discharge ports 83 (FIG. 46B). As a result, in the deceleration process (time t2 to time t3, time t5 to time t6, time t8 to time t9, time t11 to time t12), each part (around the cleaning jig 80) can be particularly strongly cleaned. it can. As described above, since the pure water flows in the direction of the arrow AR46 in the deceleration process is due to the rotational inertia of the pure water itself, if the deceleration of the rotational speed in the deceleration process is a rapid deceleration (for example, a sudden stop). The rotational inertia can be sufficiently exerted, and pure water can be ejected more vigorously.

As shown in FIG. 44, in the cleaning mode MD2 of the present embodiment, the partition plate 15 and the side wall 11 are cleaned (time t0 to time t3), and the inner cup is cleaned (time t3 to time t6). A deceleration process is included in any of the cleaning process period (time t6 to time t9) inside the inner cup 42 and the cleaning process period (time t9 to time t12) inside the inner cup 41. For this reason, it is possible to perform effective cleaning by executing strong injection (strong cleaning) of pure water by the above-described cleaning jig 80 in all of the cleaning target portions.

In addition, each element in the chamber 10 such as the spin chuck 20 and the upper surface treatment liquid nozzle 30 is originally used for performing a surface treatment on the substrate W, and the components other than the substrate W are cleaned. It is not provided for the purpose. In this embodiment, a cleaning jig 80 is provided, and the cleaning mode MD2 is executed by using the cleaning jig 80 and each element (such as the spin chuck 20) in the chamber 10. Thus, since each part originally used for substrate processing is also used for execution of the cleaning mode MD2, it is not necessary to newly provide a large member such as a cleaning nozzle for the purpose of using the chamber 10 for cleaning. An increase in the size of the unit UT can be suppressed.

In the thirteenth embodiment, the cleaning liquid used in the substrate processing mode MD1 and the cleaning mode MD2 is pure water. However, the present invention is not limited to this, and a liquid obtained by diluting a chemical liquid with pure water is used as the cleaning liquid. Also good. In the thirteenth embodiment, the gas used in the cleaning mode MD2 is nitrogen. However, the present invention is not limited to this, and various gases can be used. From the viewpoint of substrate processing, this gas is preferably an inert gas.

The two modes described above are merely examples of processing modes, and other modes such as a mode in which processing liquid is supplied to the lower surface of the substrate W from the lower processing liquid nozzle 28 may be adopted.

Also, the number of each part (upper surface processing liquid nozzle 30, chuck pin 26, etc.) and the arrangement of each part in the substrate processing apparatus 1 can be freely changed in design.

Further, in the cleaning mode MD2 of the thirteenth embodiment, after starting the rotation process of rotating the cleaning jig 80, the supply process of supplying pure water to the cleaning jig 80 is started (FIG. 39). However, the present invention is not limited to this. The rotation process and the supply process may be started at the same time, or the rotation process may be started after the supply process is started. If the rotational speed of the cleaning jig 80 is reduced in a state where pure water is supplied to the cleaning jig 80 that is mounted and rotated on the spin chuck 20, regardless of whether the start time of these processes starts or after, The powerful cleaning can be realized by utilizing the directivity of the plurality of discharge ports 83 of the cleaning jig 80.

In the thirteenth embodiment, the cleaning process period of the partition plate 15 and the side wall 11 (time t0 to time t3), the cleaning process period inside the outer cup 43 (time t3 to time 6), and the cleaning of the inner side of the middle cup 42 are performed. Although the mode (FIG. 44) having the deceleration process has been described in the cleaning period in any part of the processing period (time t6 to time t9) and the cleaning process period (time t9 to time t12) inside the inner cup 41. However, it is not limited to this. In the case where a portion where strong cleaning is performed is a part (for example, when strong cleaning is performed only for cleaning of the partition plate 15 and the side wall 11), there is a deceleration step only in the portion, and other portions (each cup ) May not have a deceleration step (FIG. 47). In this way, by controlling at which timing the deceleration process is performed by the control unit 9 according to the processing recipe, it is possible to adjust the splashing power of pure water from the cleaning jig 80 over time. .

In the thirteenth embodiment, the aspect in which the substrate processing apparatus 1 includes one cleaning jig 80 has been described. However, the substrate processing apparatus 1 includes a set of a plurality of cleaning jigs 80 (hereinafter referred to as “cleaning jigs”). It may be an aspect provided with a “set”). In particular, it has a cleaning jig set composed of a plurality of cleaning jigs 80 having different inclination angles of the inclined surfaces 81a, and the one cleaning jig 80 is selected and mounted on the spin chuck 20. In the substrate processing apparatus that executes the cleaning mode MD2, it becomes possible to discharge pure water at an inclination angle corresponding to the inclined surface 81a (inclination from the horizontal plane) of the cleaning jig 80 to be selected. Cleaning can be realized.

In the thirteenth embodiment, the aspect in which the supply amount per unit time of pure water supplied from the upper surface treatment liquid nozzle 30 during the cleaning mode MD2 is not variable has been described. However, the supply amount is variably adjusted. You may be the aspect to do.

<Fourteenth embodiment>
FIG. 48 is a plan view of the substrate processing apparatus 1 according to the fourteenth embodiment. FIG. 49 is a longitudinal sectional view of the substrate processing apparatus 1. The substrate processing apparatus 1 is a single wafer processing apparatus that processes substrates W for semiconductor use one by one. A circular silicon substrate W is subjected to a chemical treatment and a rinse treatment using a rinse solution such as pure water. Then dry it. The configuration of the substrate processing apparatus 1 of the fourteenth embodiment is different from that of the first embodiment in the spin base 21. In FIG. 48 and subsequent figures, the same elements as those in the first embodiment are denoted by the same reference numerals.

FIG. 50 is a plan view of the spin base 21 of the fourteenth embodiment. FIG. 51 is a partial cross-sectional view of the spin base 21 of FIG. 50 viewed from the line AA. The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. Therefore, the spin base 21 has a flat circular base surface 21a facing the entire lower surface of the substrate W to be held.

A plurality (four in this embodiment) of chuck pins 26 are provided upright at the peripheral edge of the base surface 21a of the spin base 21. The plurality of chuck pins 26 are evenly spaced along the circumference corresponding to the outer circumference of the circular substrate W (if there are four chuck pins 26 as in this embodiment, the chuck pins 26 are spaced at 90 ° intervals. ) Is arranged. The plurality of chuck pins 26 are driven in conjunction with a link mechanism (not shown) housed in the spin base 21. The spin chuck 20 holds the substrate W by bringing each of the plurality of chuck pins 26 into contact with the outer peripheral end of the substrate W, thereby separating the substrate W from the base surface 21 a above the spin base 21. In addition, the gripping can be released by separating each of the plurality of chuck pins 26 from the outer peripheral end of the substrate W (see FIG. 49).

In addition, an inclined portion 370 including a plurality of inclined pieces 371 is provided on the base surface 21 a of the spin base 21. In the fourteenth embodiment, four inclined pieces 371 having the same number as the chuck pins 26 are provided as the inclined portions 370. The four chuck pins 26 and the four inclined pieces 371 are arranged concentrically with different diameters. Specifically, the diameter of the circle on which the four inclined pieces 371 are arranged is smaller than the diameter of the circle on which the four chuck pins 26 are arranged (substantially the same as the outer diameter of the substrate W). The centers of both the circles coincide with the center CS of the base surface 21a of the spin base 21. That is, the inclined portion 370 of the first embodiment is provided closer to the center CS side of the base surface 21 a of the spin base 21 than the plurality of chuck pins 26.

The four inclined pieces 371 are provided at equal intervals (that is, 90 ° intervals) along the circumferential direction of the spin base 21. The four inclined pieces 371 are provided at the inner positions corresponding to the four chuck pins 26 on a one-to-one basis. More precisely, each of the four inclined pieces 371 is on a line connecting the four chuck pins 26 and the center CS of the base surface 21a (that is, on the diameter of the base surface 21a inside the chuck pins 26). Is provided.

The plurality of inclined pieces 371 provided on the spin base 21 have the same size and shape as each other, and the material thereof is the same as that of the spin base 21. Each inclined piece 371 has a triangular prism shape. The cross section of each inclined piece 371 cut along the radial direction of the spin base 21 is a right triangle. Therefore, the inclined piece 371 provided on the flat base surface 21a has the inclined surface 371a (FIG. 51). Each of the four inclined pieces 371 is provided so that the inclined surface 371a is inclined upward from the center CS of the base surface 21a toward the outer periphery in the radial direction (so that the height gradually increases). The inclination angle γ of the inclined surface 371a with respect to the base surface 21a of the spin base 21 will be described later. In addition, as shown in FIG. 51, the inclined portion 370 is provided so that the uppermost ends of the four inclined pieces 371 are located below the lower surface of the substrate W held by the plurality of chuck pins 26. The remaining configuration of the fourteenth embodiment excluding the plurality of inclined pieces 371 provided on the spin base 21 is the same as that of the first embodiment.

Next, the operation of the substrate processing apparatus 1 according to the fourteenth embodiment will be described. First, an outline of the processing procedure for the substrate W to be processed normally will be described. An outline of a general processing procedure of the substrate W in the substrate processing apparatus 1 is that a chemical solution is supplied to the surface of the substrate W to perform a predetermined chemical solution treatment, then pure water is supplied to perform a pure water rinse treatment, and then The substrate W is rotated at a high speed to perform a shake-off drying process. When processing the substrate W, the substrate W is held on the spin chuck 20 and the processing cup 40 moves up and down. When the spin chuck 20 holds the substrate W, the inclined portion 370 is provided so that the uppermost end of the inclined piece 371 is below the lower surface of the substrate W held by the plurality of chuck pins 26. 370 does not hinder the holding of the substrate W. When the substrate W is transferred to the spin chuck 20 (immediately before being gripped by the plurality of chuck pins 26), a part of the lower surface of the substrate W may be supported by the inclined portion 370.

When performing the chemical treatment on the substrate W, for example, only the outer cup 43 rises and is held by the spin chuck 20 between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42. An opening surrounding the periphery of the substrate W is formed. In this state, the substrate W is rotated together with the spin chuck 20, and a chemical solution is supplied to the upper and lower surfaces of the substrate W from the upper surface processing liquid nozzle 30 and the lower surface processing liquid nozzle 28. The supplied chemical liquid flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered from the edge of the substrate W to the side. Thereby, the chemical treatment of the substrate W proceeds. The chemical solution splashed from the edge of the rotating substrate W is received by the upper end portion 43 b of the outer cup 43, flows down along the inner surface of the outer cup 43, and is collected in the outer collection groove 51.

As the processing of such a normal substrate W progresses, contaminants contained in the scattered processing liquid adhere and the contamination is gradually accumulated in the processing cup 40. In particular, the upper curved portions of the inner cup 41, the middle cup 42 and the outer cup 43, that is, the upper end portion 47b of the inner cup 41, the upper end portion 52b of the middle cup 42 and the inner side of the upper end portion 43b of the outer cup 43 are relatively contaminated. Easy to accumulate. If the contamination accumulated in the processing cup 40 is left as it is, it may adhere to the substrate W to be processed and cause processing defects.

In addition, a part of the processing liquid scattered from the rotating substrate W during processing may become mist and diffuse to the outside of the processing cup 40. Such processing liquid reaches and adheres to the outer upper surface of the processing cup 40 and the partition plate 15. Here, the outer upper surface of the processing cup 40 is the outer upper surface 43d of the upper end portion 43b of the outer cup 43 located on the outermost side. If the processing liquid adhering to the outer upper surface 43d of the processing cup 40 or the upper surface of the partition plate 15 is dried, it may become a contamination source that generates particles.

For this reason, in the fourteenth embodiment, the inside and outside of the processing cup 40 is cleaned using the spin base 21 provided with the inclined portion 370. The inside / outside cleaning of the processing cup 40 is preferably performed, for example, at the timing between processing lots when the processing of the substrate W to be processed is not performed.

First, the processing cup 40 is moved up and down appropriately according to the part to be cleaned. The processing cup 40 includes an inner cup 41, an intermediate cup 42, and an outer cup 43 that can be moved up and down independently of each other. When cleaning the outer upper surface 43 d of the processing cup 40 and the partition plate 15, all of the inner cup 41, the middle cup 42 and the outer cup 43 are lowered below the base surface 21 a of the spin base 21. On the other hand, when the inside of the processing cup 40 is cleaned, the cup to be cleaned is raised among the three cups. For example, when cleaning the upper curved portion of the outer cup 43, only the outer cup 43 is raised, and an opening is formed between the upper end portion 43 b of the outer cup 43 and the upper end portion 52 b of the second guide portion 52 of the middle cup 42. Form. Further, when cleaning the upper curved portion of the middle cup 42, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52 b of the second guide portion 52 of the middle cup 42 and the first guide portion 47 of the inner cup 41. An opening is formed between the upper end portion 47b of the two. Further, when the upper curved portion of the inner cup 41 is washed, all of the inner cup 41, the middle cup 42 and the outer cup 43 are raised.

In the fourteenth embodiment, only the outer cup 43 is raised to clean the inside of the outer cup 43, particularly the upper end portion 43b, which is a curved portion where contamination is likely to accumulate. The height position of the outer cup 43 can be set appropriately, but the outer cup 43 is raised so that the upper end portion 43b is at least above the base surface 21a of the spin base 21. In this state, the spin base 21 of the spin chuck 20 is rotated around the rotation axis CX by driving the spin motor 22. The number of rotations of the spin base 21 is not particularly limited and can be an appropriate value, and the value is controlled by the control unit 9.

While rotating the spin base 21, the nozzle base 33 of the upper treatment liquid nozzle 30 rotates the nozzle arm 32 to move the ejection head 31 above the rotating spin base 21. Then, a cleaning liquid (pure water in this embodiment) is supplied from the ejection head 31 onto the base surface 21 a of the rotating spin base 21. At this time, the ejection head 31 of the upper processing liquid nozzle 30 supplies the cleaning liquid to the center side of the base surface 21a from the inclined portion 70, for example, near the center CS of the base surface 21a. Further, the nozzle base 33 may swing the nozzle arm 32 under the control of the control unit 9, and the discharge head 31 for supplying the cleaning liquid may be reciprocated within a range inside the inclined portion 70.

FIG. 52 is a diagram showing the behavior of the cleaning liquid supplied onto the rotating spin base 21. FIG. When the cleaning liquid is supplied onto the base surface 21a of the rotating spin base 21, the cleaning liquid flows from the center side of the base surface 21a toward the outer periphery by centrifugal force. A part of the cleaning liquid flowing toward the outer periphery is guided by the plurality of inclined pieces 371 and scattered toward the upper side in the radial direction of the spin base 21. The cleaning liquid splashed obliquely upward by the inclined piece 371 is sprayed onto the upper end portion 43b of the outer cup 43 as shown in FIG. By spraying the cleaning liquid, contaminants adhering to the upper end portion 43b which is a curved portion of the outer cup 43 are washed away and cleaned.

Further, the four inclined pieces 371 constituting the inclined portion 370 are provided at the inner positions corresponding to the four chuck pins 26 on a one-to-one basis. Therefore, the cleaning liquid splashed obliquely upward by the inclined piece 371 jumps over the upper portion of the chuck pin 26 toward the upper end portion 43b of the outer cup 43 as shown in FIG. Therefore, it is possible to prevent the supplied cleaning liquid from colliding with the plurality of chuck pins 26 and causing random liquid splashing. As a result, contamination in the substrate processing apparatus 1 due to splashing can be prevented.

In other words, the inclination angle γ (FIG. 51) of the inclined surface 371a of the inclined piece 371 with respect to the base surface 21a of the spin base 21 is an angle at which the cleaning liquid scattered from the inclined piece 371 does not interfere with the chuck pin 26. In addition, the inclination angle γ is an angle at which the cleaning liquid scattered from the inclined piece 371 reaches the upper end portion 43 b of the outer cup 43.

On the other hand, a part of the cleaning liquid that flows from the center side of the base surface 21a toward the outer periphery (the remaining portion that has not been scattered obliquely upward by the inclined piece 371) is directed substantially horizontally from the outer peripheral end of the base surface 21a. It is scattered and sprayed to the inner wall surface of the outer cup 43. In this way, the cleaning liquid is sprayed over a wide range inside the outer cup 43 to perform the cleaning process. In particular, the upper end portion 43b, which is a curved portion of the outer cup 43 where contamination easily accumulates, is effectively cleaned by spraying the cleaning liquid scattered obliquely upward from the inclined portion 370.

Further, the outer cup 43 may be reciprocated up and down in conjunction with the splashing of the cleaning liquid from the spin base 21. Furthermore, the speed of the cleaning liquid sprayed on the outer cup 43 may be changed by adjusting the rotation speed of the spin base 21. By doing in this way, the wide range of the inner wall surface of the outer cup 43 can be cleaned efficiently. In particular, it is preferable to adjust the height position of the outer cup 43 and the rotation speed of the spin base 21 so that the cleaning liquid is sprayed with a strong force on the upper end portion 43b of the outer cup 43 where contamination is likely to accumulate.

FIG. 52 illustrates the case of cleaning the outer cup 43, but even when the inner cup 42 and the inner cup 41 are cleaned, the target cup can be cleaned in the same manner. it can. Further, when cleaning the outer upper surface 43d of the processing cup 40 and the partition plate 15, all of the inner cup 41, the middle cup 42 and the outer cup 43 are lowered below the base surface 21a of the spin base 21. Cleaning can be performed by setting the rotational speed of the spin base 21 to a higher speed than that described above. That is, by setting the rotation speed of the spin base 21 to a higher value, the cleaning liquid can reach the outer upper surface 43d of the processing cup 40 and the partition plate 15 for cleaning.

As described above, in the fourteenth embodiment, the inclined portion 370 including the plurality of inclined pieces 371 is provided on the base surface 21a of the spin base 21, and the spin base 21 is rotated more than the inclined portion 370 on the base surface 21a. By supplying a cleaning liquid to the center side, the inside and outside of the processing cup 40 can be cleaned. Since each of the plurality of inclined pieces 371 is provided such that the inclined surface 371a is inclined upward from the center CS of the base surface 21a toward the outer periphery in the radial direction, the inclined pieces 371 scatter the cleaning liquid obliquely upward. The cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 to effectively clean it.

In addition, since each of the four inclined pieces 371 is provided on a line connecting the four chuck pins 26 and the center CS of the base surface 21a, the cleaning liquid scattered obliquely upward by the inclined piece 371 is Then, it jumps over the upper side of the chuck pin 26 without interfering with the chuck pin 26. For this reason, the liquid splash by the chuck pin 26 can be prevented, and a new contamination source can be prevented from being generated.

In addition, since the inclined portion 370 is provided on the base surface 21a of the spin base 21 and the inside and outside of the processing cup 40 can be cleaned by supplying the cleaning liquid directly to the spin base 21, a dedicated substrate for cleaning, There is no need to provide a jig. This eliminates the need for a space for storing a dedicated substrate or jig.

<Fifteenth embodiment>
Next, a fifteenth embodiment of the present invention is described. The overall configuration and processing operation of the substrate processing apparatus of the fifteenth embodiment are substantially the same as those of the fourteenth embodiment. The fifteenth embodiment is different from the fourteenth embodiment in the shape of a plurality of inclined pieces constituting the inclined portion 370.

FIG. 53 is a diagram showing the shape of the inclined piece 471 of the fifteenth embodiment. FIG. 53 is a view of the inclined piece 471 viewed from the outer peripheral side of the spin base 21. In the figure, the dotted line indicates the shape of the inclined piece 371 of the fourteenth embodiment and is shown for reference. 53, the side view of the chuck pin 26 is omitted.

As in the fourteenth embodiment, an inclined portion 370 including a plurality of inclined pieces 471 is provided on the base surface 21a of the spin base 21. The arrangement configuration of the plurality of inclined pieces 471 is the same as that in the fourteenth embodiment. That is, the plurality of inclined pieces 471 are provided concentrically with the plurality of chuck pins 26, and each inclined piece 471 is provided on a line connecting the chuck pins 26 and the center CS of the base surface 21a.

In the fourteenth embodiment, since the inclined piece 371 has a triangular prism shape, when viewed from the outer peripheral side of the spin base 21, the inclined piece 371 has a quadrangular shape as shown by a dotted line in FIG. In the fifteenth embodiment, as indicated by a solid line in FIG. 53, the side surfaces of the inclined pieces 471 along the circumferential direction of the base surface 21a of the spin base 21 are curved surfaces that are continuous with the base surface 21a.

As described above, when the cleaning liquid is supplied from the ejection head 31 onto the base surface 21a of the rotating spin base 21, the cleaning liquid flows on the base surface 21a from the center toward the outer periphery by centrifugal force. At this time, the cleaning liquid immediately after being supplied from the ejection head 31 does not have a speed component in the rotating direction. On the other hand, the cleaning liquid flowing from the center of the base surface 21a toward the outer periphery gradually has a velocity component in the rotation direction of the spin base 21 due to friction with the base surface 21a of the rotating spin base 21. As a result, the cleaning liquid that flows from the center of the spin base 21 toward the outer periphery does not flow linearly along the radial direction of the base surface 21a, but flows while drawing a trajectory that curves from the radial direction of the base surface 21a. .

Thus, when the locus of the cleaning liquid flowing on the base surface 21a of the spin base 21 is curved from the radial direction, a part of the cleaning liquid hits the side surface of the inclined piece 471 along the circumferential direction of the base surface 21a. In the fifteenth embodiment, since the side surfaces of the inclined pieces 471 along the circumferential direction of the base surface 21a of the spin base 21 are curved surfaces that are continuous with the base surface 21a, the cleaning liquid that hits from such side surfaces can be smoothly inclined pieces. Therefore, the cleaning liquid splashes by the inclined pieces 471 can be prevented.

The remaining points of the fifteenth embodiment except for the shape of each inclined piece 471 are the same as those of the fourteenth embodiment. As in the fourteenth embodiment, the cleaning liquid is sprayed onto the upper curved portion of the processing cup 40 for effective cleaning. In addition, it is possible to prevent liquid splashing by the chuck pin 26.

<Sixteenth Embodiment>
Next, a sixteenth embodiment of the present invention will be described. In the fourteenth and fifteenth embodiments, the inclined portion 370 is composed of a plurality of inclined pieces 371 (or 471), but in the sixteenth embodiment, the inclined portion 570 is formed in an annular shape. In the sixteenth embodiment, the same elements as those in the fourteenth embodiment are denoted by the same reference numerals.

FIG. 54 is a plan view of the spin base 21 of the sixteenth embodiment. FIG. 55 is a partial cross-sectional view of the spin base 21 of FIG. 54 viewed from the line BB. FIG. 56 is a partial cross-sectional view of the spin base 21 of FIG. 54 viewed from the CC line. The outer diameter of the disk-shaped spin base 21 is larger than the diameter of the substrate W, and the upper surface of the spin base 21 is a flat base surface 21a. Similar to the fourteenth embodiment, four chuck pins 26 are erected on the peripheral edge of the base surface 21a.

In the sixteenth embodiment, an annular inclined portion 570 is provided on the base surface 21 a of the spin base 21. The center of the annular inclined portion 570 coincides with the center CS of the base surface 21 a of the spin base 21. That is, the inclined portion 570 is formed in an annular shape along the circumferential direction of the base surface 21a.

Further, the annular inclined portion 570 is provided so as to be concentric with the circle on which the four chuck pins 26 are arranged. The diameter of the circle on which the four chuck pins 26 are arranged is larger than the outer diameter of the inclined portion 570. Therefore, the inclined portion 570 of the sixteenth embodiment is provided closer to the center CS side of the base surface 21a of the spin base 21 than the plurality of chuck pins 26.

As shown in FIG. 55, the cross section of the inclined portion 570 cut along the radial direction of the spin base 21 is a right triangle like the cross section of the inclined piece 371 of the fourteenth embodiment. Therefore, the inclined portion 570 provided on the flat base surface 21a has the inclined surface 571a. The inclined surface 571a of the inclined portion 570 is formed so as to be inclined upward (to gradually increase in height) from the center CS of the base surface 21a toward the outer periphery in the radial direction. The inclination angle of the inclined surface 571a with respect to the base surface 21a of the spin base 21 is the same as that in the fourteenth embodiment. Further, the inclined portion 570 is provided so that the uppermost end thereof is below the lower surface of the substrate W held by the plurality of chuck pins 26.

Furthermore, the inclined portion 570 of the sixteenth embodiment is provided with openings 572 at four locations. The four openings 572 are provided at equal intervals (90 ° intervals) along the circumferential direction of the annular inclined portion 570. As shown in FIG. 56, each opening 572 is a flow path provided at the bottom of the inclined portion 570 so as to penetrate from the center CS side of the base surface 21a of the spin base 21 to the outer peripheral side. The four openings 572 are provided at positions that do not face the four chuck pins 26. More precisely, the four openings 572 are provided at positions off the line connecting the four chuck pins 26 and the center CS of the base surface 21a.

The remaining configuration of the apparatus of the sixteenth embodiment excluding the inclined portion 570 is the same as that of the fourteenth embodiment. The processing operation in the sixteenth embodiment is also substantially the same as in the first embodiment. Also in the sixteenth embodiment, the cleaning liquid is supplied from the ejection head 31 onto the base surface 21 a of the rotating spin base 21. At this time, the discharge head 31 supplies the cleaning liquid to the center side of the base surface 21a rather than the annular inclined portion 570. When the cleaning liquid is supplied onto the base surface 21a of the rotating spin base 21, the cleaning liquid flows from the center side of the base surface 21a toward the outer periphery by centrifugal force.

Part of the cleaning liquid that flows toward the outer periphery of the base surface 21 a is guided along the inclined surface 571 a of the inclined portion 570 and scattered toward the upper side in the radial direction of the spin base 21. Since the inclination angle of the inclined surface 571a with respect to the base surface 21a is the same as that in the fourteenth embodiment, the cleaning liquid splashed from the inclined portion 570 jumps over the chuck pin 26 without interfering with the chuck pin 26 and curves upward on the processing cup 40. Reach the part. As a result, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 for effective cleaning.

On the other hand, a part of the cleaning liquid flowing toward the outer periphery of the base surface 21 a passes through the opening 572 and is scattered from the outer peripheral end of the base surface 21 a toward the substantially horizontal direction and sprayed on the inner wall surface of the processing cup 40. . Thereby, the cleaning liquid is sprayed over a wide range of the processing cup 40 to perform the cleaning process. Further, since the opening 572 is provided at a position that does not face the chuck pin 26, the treatment liquid that has passed through the opening 572 is prevented from colliding with the chuck pin 26. For this reason, the liquid splash by the chuck pin 26 can be prevented, and a new contamination source can be prevented from being generated.

As described above, in the sixteenth embodiment in which the annular-shaped inclined portion 570 is provided, the cleaning liquid can be sprayed on the upper curved portion of the processing cup 40 and the cleaning can be effectively performed, as in the fourteenth embodiment. Further, splashing of the liquid by the chuck pin 26 can be prevented.

In the fourteenth to sixteenth embodiments, the cross-sectional shape of the inclined portion is a right triangle. However, the shape is not limited to this, and may be a shape as shown in FIG. 57 or FIG. An inclined portion 670 having a cross-sectional shape shown in FIG. 57 is formed by rounding the corners of the right triangle according to the fourteenth to sixteenth embodiments to make the outer periphery a smooth curved surface. An inclined portion 770 having a cross-sectional shape shown in FIG. 58 has a curved surface as the inclined surface in the fourteenth to sixteenth embodiments. In any of the examples, the inclined surfaces of the

inclined portions

670 and 770 are formed so as to be inclined upward from the center CS of the base surface 21a toward the outer periphery in the radial direction (so that the height gradually increases). That is, the inclined portion only needs to have an inclined surface that is inclined upward from the center CS of the base surface 21a of the spin base 21 toward the outer periphery in the radial direction.

In the fourteenth embodiment, the four inclined pieces 371 are provided on the base surface 21a of the spin base 21, but the number of the inclined pieces 371 is not limited to four, and may be an appropriate number. be able to. For example, six inclined pieces 371 may be provided on the base surface 21a at intervals of 60 °, or eight inclined pieces 371 may be provided at intervals of 45 °. However, from the viewpoint of preventing liquid splashing by the chuck pins 26, the number of the inclined pieces 371 is set to be equal to or greater than the number of the chuck pins 26, and at least inclined on a line connecting the plurality of chuck pins 26 and the center CS of the base surface 21a. A piece 371 is preferably provided. In this way, since at least some of the plurality of inclined pieces 371 are provided so as to face the plurality of chuck pins 26, it is possible to prevent the cleaning liquid from colliding with the chuck pins 26 and causing splashing. it can. The number of chuck pins 26 provided on the spin chuck 20 is typically four or six.

Note that the inclination angles γ of the plurality of inclined pieces 371 may be set to different angles. When the inclined pieces 371 having various inclination angles are arranged on the base surface 21a, the cleaning liquid flies obliquely upward from the inclined pieces 371 at different angles, so that the cleaning range of the inner surface of the processing cup 40 can be expanded vertically. .

As shown in FIG. 61, one or a plurality of chuck pins 26 are located closer to the center side of the base surface 21a than the plurality of chuck pins 26 and are out of the line connecting the chuck pins 26 and the center CS of the base surface 21a. An inclined piece 710 may be added.

Since the inclined piece 710 is not opposed to the chuck pin 26 and there is no need to consider the interference between the liquid flying from the inclined piece 710 and the chuck pin 26, the inclination angle is smaller than the inclination angle of the other inclined pieces 371. Can be set to angle. When such an inclined piece 710 is arranged on the base surface 21a, the flying direction of the cleaning liquid can be further expanded vertically.

In the sixteenth embodiment, the four openings 572 of the inclined portion 570 are provided, but the number of openings 572 is not limited to four, and can be an appropriate number. However, from the viewpoint of preventing liquid splashing by the chuck pin 26, the opening 572 needs to be provided at a position off the line connecting the chuck pin 26 and the center CS of the base surface 21a. Preferably, as shown in FIG. 54, an opening 572 is provided on a line connecting an intermediate position between adjacent chuck pins 26 along the circumferential direction of the base surface 21a of the spin base 21 and the center CS of the base surface 21a. Is good.

In the sixteenth embodiment, the opening 572 is not necessarily formed. When the opening 572 is not formed in the inclined portion 570, all of the cleaning liquid supplied to the base surface 21a of the spin base 21 can be scattered obliquely upward from the inclined portion 570. Accordingly, all the cleaning liquid jumps over the chuck pin 26 without interfering with the chuck pin 26 and reaches the upper curved portion of the processing cup 40. Even if it does in this way, while being able to wash | clean effectively by spraying a washing | cleaning liquid on the upper side curved part of the process cup 40, the liquid splash by the chuck pin 26 can be prevented. However, when the opening 572 is not formed in the inclined portion 570, a cleaning liquid pool may be formed inside the annular inclined portion 570 after the processing. If it is inconvenient if such a liquid pool is formed, it is desirable to provide an opening 572 in the inclined portion 570 to ensure a liquid flow path as in the sixteenth embodiment.

In the fourteenth embodiment, the longitudinal direction of the plurality of inclined pieces 371 is provided so as to coincide with the radial direction of the base surface 21a. However, the longitudinal direction of the inclined piece 371 is inclined with respect to the radial direction of the base surface 21a. You may do it. As described in the fifteenth embodiment, the cleaning liquid supplied from the ejection head 31 and flowing from the center to the outer periphery of the spin base 21 does not flow linearly along the radial direction of the base surface 21a. It flows while drawing a trajectory that curves from the radial direction of 21a. If the longitudinal direction of the inclined piece 371 is inclined with respect to the radial direction of the base surface 21a, it is possible to reduce the cleaning liquid guided by the inclined surface 371a of the inclined piece 371 from flowing down from the inclined surface 371a. As a result, the cleaning liquid can be efficiently scattered obliquely upward by the plurality of inclined pieces 371.

Further, the inclined portion in each of the fourteenth to sixteenth embodiments may be detachably attached to the spin base 21 or may be fixedly installed.

In each of the fourteenth to sixteenth embodiments, the inclined portion is provided inside the plurality of chuck pins 26. However, the inclined portion may be provided outside the plurality of chuck pins 26. FIG. 59 is a plan view showing another example of the spin base 21 provided with a plurality of inclined pieces 371. FIG. 60 is a partial cross-sectional view of the spin base 21 of FIG. 59 as seen from the DD line. The outer diameter of the disk-shaped spin base 21 is larger than the diameter of the substrate W, and the upper surface of the spin base 21 is a flat base surface 21a. Similar to the fourteenth embodiment, four chuck pins 26 are erected on the peripheral edge of the base surface 21a. An inclined portion 370 including four inclined pieces 371 is provided on the base surface 21 a of the spin base 21. In the example of FIG. 59, the diameter of the circle on which the four inclined pieces 371 are arranged is larger than the diameter of the circle on which the four chuck pins 26 are arranged. That is, the inclined portion 370 including four inclined pieces 371 is provided on the outer peripheral end side of the base surface 21 a of the spin base 21 with respect to the plurality of chuck pins 26. The shape of the inclined piece 371 is the same as that in the fourteenth embodiment.

Even in this case, a part of the cleaning liquid that flows from the center side of the base surface 21 a toward the outer periphery is guided along the inclined surface 371 a of the inclined piece 371 and scattered toward the diagonally upper side of the spin base 21 in the radial direction. Is done. As a result, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 for effective cleaning. However, from the viewpoint of preventing liquid splashing by the chuck pins 26, as in the above-described fourteenth to sixteenth embodiments, the center surface side of the base surface 21a of the spin base 21 is closer to the center CS side than the plurality of chuck pins 26. It is preferable to provide an inclined portion. In addition, an inclined portion may be provided in an annular shape outside the plurality of chuck pins 26.

Further, in each of the above embodiments, the processing cup 40 is provided with the inner cup 41, the middle cup 42 and the outer cup 43 that can be moved up and down independently of each other, but the three cups are integrally configured to move up and down. There may be. When the three cups are integrally stacked in multiple stages along the height direction, the cups may be moved up and down sequentially so as to surround the holding surface 21a of the spin base 21. Further, the processing cup 40 may include only a one-stage cup surrounding the spin base 21.

Further, the substrate to be processed by the substrate cleaning apparatus 1 is not limited to a substrate for semiconductor use, and may be a glass substrate used for a flat panel display such as a substrate for a solar cell or a liquid crystal display device.

Further, the substrate processing apparatus 1 may be any apparatus that supplies the processing liquid to the surface of the substrate held by the spin chuck and receives the processing liquid scattered from the substrate by the cup. In addition to the apparatus and the etching processing apparatus, for example, a spin coating apparatus (spin coater) or a rotary developing apparatus (spin developer) for applying a resist or the like may be used. The cup cleaning technique according to the present invention can be suitably applied to an apparatus that easily adheres to the cup and becomes a contamination source, such as a spin coating apparatus. Alternatively, the substrate processing apparatus 1 may be a spin scrubber that performs a scrub cleaning process by supplying a cleaning liquid to the surface of a rotating substrate and bringing a brush into contact with or close to the surface.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 9 Control part 10 Chamber 20 Spin chuck 21 Spin base 21a Holding surface 22 Spin motor 26 Chuck pin 28 Lower surface processing liquid nozzle 30 Upper surface processing liquid nozzle 31 Discharge head 40 Processing cup 41 Inner cup 42 Medium cup 43 Outer cup 43b Upper end portion 43c Folding portion 71

Base surface

72, 122, 132, 142, 152a, 152b, 172 Inclined surface 80 Cleaning jig 81 Liquid receiving portion 81a Inclined surface 82 Supply port 83 Discharge port

83a Discharge shaft

123, 133, 143 153a, 153b, 173 Flow inlet 271 Main body portion 272 Guide piece 272a Guide piece main body

272b Connection portion

272c Leaf spring

272d Hinge mechanism

272e Coil spring 272f Connection member 272g Tongue piece member 272h Base end portion 281 Wall portion 28 Passage 370,570,670,770 inclined portions 371,471 inclined piece 371a, jig CW cleaning substrate 571a inclined surface 572 opening CT washed MD1 substrate processing mode MD2 cleaning mode W substrate

Claims

Substrate holding means for holding the substrate;
Rotating means for rotating the substrate holding means;
A cup surrounding the periphery of the substrate holding means;
A cleaning jig mounted on the substrate holding means;
Cleaning liquid supply means for supplying a cleaning liquid to the cleaning jig mounted on the substrate holding means;
With
The cleaning jig is
A flat base surface;
An inclined surface that is provided over the entire periphery of the upper surface peripheral portion of the base surface and is inclined upward from the center of the base surface toward the outer periphery;
A substrate processing apparatus.
The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the inclined surface is inclined upward from the same height position as the base surface along a circumferential direction of the base surface.
The substrate processing apparatus according to claim 2,
The substrate processing apparatus, wherein the inclined surface is inclined along the circumferential direction of the base surface so that the height gradually increases in a direction opposite to the rotation direction of the substrate holding means by the rotating means.
The substrate processing apparatus according to claim 2,
The inclined surface is divided into a plurality along the circumferential direction of the base surface,
A substrate processing apparatus in which each of a plurality of divided inclined surfaces is inclined upward from the same height position as the base surface.
The substrate processing apparatus according to claim 4, wherein
Each of the plurality of inclined surfaces is a substrate processing apparatus in which the width gradually decreases from the lowest height position toward the highest height position.
The substrate processing apparatus according to claim 1,
The substrate holding means includes a plurality of chuck pins for gripping the outer peripheral edge of the substrate,
The substrate processing apparatus, wherein the inclined surface of the cleaning jig mounted on the substrate holding means covers the plurality of chuck pins.
A cleaning jig for cleaning a cup surrounding the periphery of the substrate holding means by rotating in a predetermined rotation direction while being supplied with a cleaning liquid while being attached to the substrate holding means of the substrate processing apparatus. ,
A flat base surface;
An inclined surface that is provided over the entire periphery of the upper surface peripheral portion of the base surface and is inclined upward from the center of the base surface toward the outer periphery;
A cleaning jig comprising:
The cleaning jig according to claim 7, wherein
The inclined surface is a cleaning jig that inclines upward from the same height position as the base surface along the circumferential direction of the base surface.
The cleaning jig according to claim 8, wherein
The cleaning jig in which the inclined surface is inclined so as to gradually increase in height from the base surface in a direction opposite to the rotation direction.
The cleaning jig according to claim 8, wherein
The inclined surface is divided into a plurality along the circumferential direction of the base surface,
A cleaning jig in which each of a plurality of divided inclined surfaces is inclined upward from the same height position as the base surface.
The cleaning jig according to claim 10, wherein
Each of the plurality of inclined surfaces is a cleaning jig whose width gradually decreases from the lowest height position to the highest height position.
Substrate holding means for holding the substrate;
Rotating means for rotating the substrate holding means;
A cup surrounding the periphery of the substrate holding means;
A cleaning substrate mounted on the substrate holding means;
Cleaning liquid supply means for supplying a cleaning liquid to the upper surface of the cleaning substrate mounted on the substrate holding means,
A guide piece having a portion inclined upward from the center of the cleaning substrate toward the outer periphery is provided on the upper surface of the cleaning substrate,
The guide piece is a substrate processing apparatus in which at least a part from a base end to a tip end thereof has elasticity in which an inclination angle with respect to the upper surface changes according to the number of rotations of the substrate holding means.
The substrate processing apparatus according to claim 12, wherein
A substrate processing apparatus, wherein a plurality of the guide pieces are provided on an upper surface of the cleaning substrate.
The substrate processing apparatus according to claim 13, wherein
The substrate processing apparatus, wherein the plurality of guide pieces are provided on the upper surface of the cleaning substrate at the same inclination angle.
The substrate processing apparatus according to claim 13, wherein
A substrate processing apparatus, wherein a part of the plurality of guide pieces is provided on the upper surface of the cleaning substrate at an inclination angle different from the rest.
The substrate processing apparatus according to claim 13, wherein
The substrate holding means includes a plurality of chuck pins for gripping the outer peripheral edge of the substrate,
The cleaning substrate is a substrate processing apparatus that is mounted on the holding means such that at least a part of the plurality of guide pieces faces the plurality of chuck pins.
The substrate processing apparatus according to claim 12, wherein
Rinsing liquid supply means for supplying a rinsing liquid to the upper surface of the substrate and rinsing the substrate;
When the rotating means rotates the substrate holding means at a smaller rotational speed than when the substrate rinsing process is performed, the guide is inclined at an inclination angle at which the cleaning liquid scattered from the guide piece reaches the upper end of the cup. A substrate processing apparatus in which a piece is attached to the cleaning substrate.
The substrate processing apparatus according to claim 12, wherein
The substrate processing apparatus, wherein a longitudinal direction of the guide piece is inclined with respect to a radial direction of the cleaning substrate.
The substrate processing apparatus according to claim 12, wherein
The guide piece includes a guide piece main body and an elastic member, and the guide piece main body is attached to the cleaning substrate via the elastic member.
The substrate processing apparatus according to claim 19, wherein
The substrate processing apparatus, wherein the elastic member includes a spring.
The substrate processing apparatus according to claim 12, wherein
The substrate processing apparatus which formed the flow path of the said washing | cleaning liquid in the upper surface of the said guide piece by providing a wall part in the both ends parallel to the longitudinal direction of the said guide piece.
The substrate processing apparatus according to claim 21, wherein
The substrate processing apparatus, wherein the flow path is narrower on the distal end side in the longitudinal direction than the proximal end side in the longitudinal direction of the guide piece.
A cleaning substrate for cleaning a cup surrounding the periphery of the substrate holding means by rotating while receiving supply of a cleaning liquid in a state of being mounted on the substrate holding means of the substrate processing apparatus,
A guide piece inclined upward from the center of the cleaning substrate toward the outer periphery is provided on the upper surface,
The guide piece is a cleaning substrate having elasticity in which at least a part from the base end to the tip end thereof has an inclination angle that is variable with respect to the upper surface of the cleaning substrate according to a change in a rotation speed of the substrate holding means.
The cleaning substrate according to claim 23,
A cleaning substrate provided with a plurality of the guide pieces.
The cleaning substrate according to claim 24,
A cleaning substrate in which the plurality of guide pieces are provided at the same inclination angle.
The cleaning substrate according to claim 24,
A cleaning substrate in which a part of the plurality of guide pieces is provided at an inclination angle different from the rest.
(a) substrate holding means for holding the substrate in a horizontal position;
Rotating means for rotating the substrate holding means;
Cleaning liquid supply means for supplying a cleaning liquid from above the substrate holding means;
A cup surrounding the periphery of the substrate holding means;
A processing unit having
(b) a cleaning jig having an outer size corresponding to the substrate in a plan view and removably held by the substrate holding means;
A liquid receiver,
A supply port for receiving the cleaning liquid supplied from the cleaning liquid supply means and supplying the cleaning liquid to the liquid receiving portion;
A plurality of discharge ports provided along the outer peripheral side of the cleaning jig, for discharging the cleaning liquid received by the liquid receiving portion;
A cleaning jig having
With
The substrate processing apparatus, wherein the discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of rotation by the rotating means and are directed to the front side of the rotation tangent of the discharge ports.
The substrate processing apparatus according to claim 27, wherein
The substrate processing apparatus, wherein the cleaning jig has an inclined surface inclined upward from the center side toward the outer peripheral side at the bottom surface of the liquid receiving portion.
The substrate processing apparatus according to claim 27, wherein
The substrate holding means includes a plurality of chuck members for gripping the outer peripheral edge of the substrate,
The substrate processing in which the plurality of discharge ports of the cleaning jig are arranged at different height positions from the plurality of chuck members when the outer peripheral end of the cleaning jig is gripped by the plurality of chuck members. apparatus.
A cleaning jig for cleaning the inside of the processing unit by being supplied with a cleaning liquid while being detachably mounted on the substrate holding means of the processing unit and rotated.
A supply port to which the cleaning liquid is supplied;
A liquid receiver that receives the cleaning liquid supplied from the supply port;
A plurality of discharge ports provided along the outer peripheral side of the cleaning jig, for discharging the cleaning liquid received by the liquid receiving portion;
Have
A cleaning jig in which the discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of rotation and are directed to the front side of the rotation tangent of the discharge ports.
The cleaning jig according to claim 30, wherein
A cleaning jig having an inclined surface inclined upward from the center side toward the outer peripheral side at the bottom surface of the liquid receiving portion.
A set of a plurality of cleaning jigs each corresponding to the cleaning jig according to claim 31,
A cleaning jig set in which the inclined angles of the inclined surfaces of the plurality of cleaning jigs are different from each other.
A processing unit according to claim 27;
A cleaning jig set according to claim 32;
With
The cleaning liquid supply means supplies the cleaning liquid to one cleaning jig selected from the plurality of cleaning jigs and detachably held by the substrate holding means,
A substrate processing apparatus in which the cleaning liquid is discharged from the first cleaning jig by rotation by the rotating means.
For a processing unit that performs a predetermined process on the substrate while rotating the substrate while holding the substrate in a horizontal posture by a predetermined substrate holding unit, a method of cleaning a predetermined part existing around the substrate holding unit in the processing unit There,
(A) a mounting step of mounting and holding a predetermined cleaning jig having a liquid receiving portion on the substrate holding means instead of the substrate during a period when the predetermined processing is not performed;
(B) a supply step of supplying a cleaning liquid to the liquid receiving portion via a predetermined supply port of the cleaning jig;
(C) a rotating step of rotating the cleaning jig together with the substrate holding means;
(D) a deceleration step of decelerating the rotation;
With
The cleaning jig communicates with the liquid receiving portion and has a plurality of discharge ports formed along the outer peripheral side of the cleaning jig,
Each discharge axis of the plurality of discharge ports is inclined from the centrifugal direction of rotation in the rotation step and is directed to the front side of the rotation tangent of each discharge port,
A cleaning method in which, in the deceleration step, the cleaning liquid is ejected from the plurality of discharge ports toward the predetermined portion side by the rotational inertia of the cleaning liquid itself in the liquid receiving portion.
A substrate holding means having a flat base surface and holding the substrate at a predetermined interval above the base surface;
Rotating means for rotating the substrate holding means;
A cup surrounding the periphery of the substrate holding means;
A plurality of chuck pins disposed on the base surface and gripping the outer peripheral edge of the substrate;
Cleaning liquid supply means for supplying a cleaning liquid to the base surface of the substrate holding means;
An inclined portion provided on the base surface and having an inclined surface inclined upward from the center of the base surface toward the outer circumference;
With
The inclined portion is provided closer to the center side of the base surface than the plurality of chuck pins,
The substrate processing apparatus, wherein the cleaning liquid supply means supplies the cleaning liquid to a center side of the base surface with respect to the inclined portion.
36. The substrate processing apparatus according to claim 35, wherein
The substrate processing apparatus, wherein an inclination angle of the inclined surface with respect to the base surface is an angle at which the cleaning liquid scattered from the inclined portion does not interfere with the plurality of chuck pins.
The substrate processing apparatus according to claim 36, wherein
The substrate processing apparatus, wherein an inclination angle of the inclined surface with respect to the base surface is an angle at which a cleaning liquid scattered from the inclined portion reaches an upper end portion of the cup.
36. The substrate processing apparatus according to claim 35, wherein
The inclined section includes a plurality of inclined pieces provided on a line connecting the plurality of chuck pins and the center of the base surface.
The substrate processing apparatus according to claim 38, wherein
A substrate processing apparatus, wherein side surfaces of the plurality of inclined pieces along the circumferential direction of the base surface are curved surfaces that are continuous with the base surface.
36. The substrate processing apparatus according to claim 35, wherein
The inclined portion is a substrate processing apparatus formed in an annular shape along a circumferential direction of the base surface.
The substrate processing apparatus according to claim 40, wherein
The substrate processing apparatus, wherein the inclined portion is formed with an opening through which a cleaning liquid flows from the center of the base surface toward the outer periphery.
36. The substrate processing apparatus according to claim 35, wherein
The substrate processing apparatus, wherein the inclined portion is provided such that an upper end of the inclined portion is below a lower surface of the substrate held by the plurality of chuck pins.