JPH105668A - Rotary type substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rotary type substrate treatment apparatus having high washing capacity of a scattering preventing cup, dispensing with an exclusive space for the attaching and detaching operation or keeping of a cup washing jig and capable of suitably rotationally driving only a substrate holding means in low torque at a time of the usual rotary treatment of the substrate. SOLUTION: At a time of rotary treatment a cup washing member 13 is separated from the rotary shaft 6 of a spin chuck 1 and only the spin chuck 1 is rotationally driven. At a time of the washing of a cup, the spin chuck 1 and the scattering preventing cup 3 are relatively raised and lowered to move the cup washing member 13 to cup washing height and the cup washing member 13 is engaged with and connected to the rotary shaft 6 through a rotation transmission part 35. The cup washing member 13 is rotated in this state and a washing soln. is supplied to a washing soln. guide part 15 from the region above the cup washing member 13 through a washing soln. supply nozzle 12. The washing soln. supplied to the washing soln. guide part 15 is jetted by centrifugal force to wash the inner surface of the scattering preventing cup 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoresist liquid, a polyimide substrate, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a substrate for an optical disk, and the like. Resin, SOG
The present invention relates to a rotary type substrate processing apparatus that applies a coating liquid to a surface of a rotatable substrate by discharging a processing liquid such as a liquid (Spin On Glass, also referred to as a silica-based film forming material). The present invention relates to a technique for cleaning an inner surface of a scattering prevention cup disposed around the periphery.

[0002]

2. Description of the Related Art In a conventional rotary type substrate processing apparatus of this type, a scattering prevention cup is provided so as to surround a substrate holding means such as a spin chuck. The scattered processing liquid is received and collected by a scatter prevention cup. By the way, when the processing liquid scattered due to the spin coating process adheres to the inner surface of the scatter prevention cup and dries and solidifies, the internal shape of the scatter prevention cup substantially changes, and the coating performance is reduced. In some cases, the solidification of the processing liquid floats as fine powdery dust due to vibration during rotation or the like, and adheres to the surface of the substrate to be processed, thus contaminating the substrate. In order to prevent such inconvenience, it is preferable to appropriately wash the processing liquid attached to the inner surface of the scattering prevention cup. As means for performing such cleaning, the following has been proposed and implemented.

(1) In the apparatus disclosed in Japanese Utility Model Publication No. 5-1343, a liquid feed pipe for circulating a cleaning liquid is provided around a scattering prevention cup, and a plurality of conduits branched from the liquid feed pipe are scattered. The inner surface of the anti-scattering cup is cleaned by opening the inner surface of the anti-scattering cup and discharging the cleaning liquid from these openings to flow down the inner surface of the anti-scattering cup.

(2) In the apparatuses disclosed in JP-A-5-82435 and JP-A-7-66116, the cleaning jig removed during the ordinary spin coating process is used for cleaning the scattering prevention cup. It is mounted on a spin chuck for cleaning. Specifically, this cleaning jig having a substantially disc shape has an internal space or a lower space to which the cleaning liquid is supplied, and the internal space or the lower space is formed around the peripheral portion of the cleaning jig through a number of discharge ports. It is open to. A cleaning liquid is supplied to the internal space or the lower space through a nozzle while rotating the cleaning jig through a spin chuck, and the cleaning liquid is jetted by a centrifugal force from a discharge port formed in a peripheral portion of the cleaning jig. To clean the inside of the shatterproof cup.

(3) In the apparatus disclosed in JP-A-5-160017, the spin chuck itself is provided with a cleaning liquid guiding section, and the cleaning liquid supplied from the outside is centrifugally jetted to the surroundings via the cleaning liquid guiding section. The inside of the shatterproof cup is cleaned.

[0006]

However, the above prior arts have the following problems. That is, according to the conventional example (1), since the cleaning liquid discharged from the opening on the inner surface of the scattering prevention cup is washed by flowing down the inner surface of the cup, the cleaning liquid is jetted vigorously to wash the inner surface of the cup. Mechanical detergency cannot be demonstrated. Therefore, there is a problem that the cleaning ability is relatively low and a large amount of cleaning liquid is required to obtain a sufficient cleaning effect.

According to the conventional example (2), since the cleaning liquid is centrifugally sprayed toward the inner surface of the cup, mechanical cleaning power is added to the dissolving cleaning power of the cleaning liquid, so that the cleaning power is improved. Each time the cleaning process is performed, the cleaning jig must be held and mounted on the spin chuck, and after the cleaning process, the cleaning jig needs to be removed and stored. Therefore, there are disadvantages that it takes time to set up for the cleaning process and that a dedicated space for storing the cleaning jig is required.
Further, the surface of the spin chuck is easily stained by the attachment of the cleaning jig, and as a result, the rear surface of the substrate placed on the spin chuck may be contaminated.

According to the conventional example (3), since the spin chuck itself is provided with the cleaning liquid guiding section, there is no inconvenience seen in the above-mentioned conventional examples (1) and (2), and a high cleaning ability can be obtained. In addition, the diameter of the spin chuck itself needs to be large in order to bring the cleaning liquid guiding portion closer to the inner surface of the scattering prevention cup. As a result, the size of the spin chuck increases, and a correspondingly large driving torque is required. Therefore, there is another problem that the spin chuck driving mechanism must have a large output. In particular, the spin chuck is rotated at a high speed during a normal rotation process. Therefore, when the size of the spin chuck is increased, it becomes difficult to control the number of rotations.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has a high washing ability of a scattering prevention cup, and does not require a dedicated space for attaching and detaching a jig for washing a cup and storing the same. In addition, it is an object of the present invention to provide a rotary substrate processing apparatus capable of suitably rotating only a substrate holding unit with a low torque during normal substrate rotation processing.

[0010]

The present invention has the following configuration in order to achieve the above object. In other words, the rotary substrate processing apparatus according to claim 1 includes a substrate holding unit that holds a substrate, a rotation driving unit that drives the substrate holding unit to rotate around a vertical axis via a rotation shaft, A processing liquid supply means for supplying a processing liquid to the substrate, and a scattering prevention cup disposed so as to surround the periphery of the substrate holding means and preventing the processing liquid supplied to the substrate from scattering with the rotation of the substrate. A cleaning liquid supply means for supplying a cleaning liquid from above the scattering prevention cup, and a cleaning liquid supplied from the cleaning liquid supply means and inserted into a rotation shaft of the substrate holding means. A cup cleaning member formed with a cleaning liquid guide portion leading to
The substrate holding means and the cup cleaning member approach each other during the rotation processing of the substrate, and a scattering prevention cup surrounds the periphery of the substrate holding means, and the substrate holding means and the cup cleaning member are separated during cup cleaning, Lifting means for vertically moving the cup cleaning member and the scattering prevention cup relative to the substrate holding means so that the inner surface of the scattering prevention cup faces the outer peripheral portion of the cup cleaning member,
When the substrate holding unit and the cup cleaning member approach each other, the engagement between the cup cleaning member and the rotating shaft is released, and when the substrate holding unit and the cup cleaning member are separated from each other, the cup cleaning member and the rotating shaft rotate. And engagement means for engaging and connecting
It is characterized by having.

Further, the rotary substrate processing apparatus according to the second aspect is the rotary substrate processing apparatus according to the first aspect,
The upper surface of the cup cleaning member is formed substantially flat.

According to a third aspect of the present invention, in the rotary substrate processing apparatus according to the first or second aspect, the cleaning liquid guide of the cup cleaning member is provided.
It is characterized in that it has an annular groove in plan view for receiving the cleaning liquid supplied from the cleaning liquid supply means.

[0013]

The operation of the first aspect of the invention is as follows. During normal substrate rotation processing, the substrate holding means and the cup cleaning member are brought closer to each other by the lifting / lowering means, whereby the engagement between the cup cleaning member and the rotating shaft of the substrate holding means is released. Therefore, only the substrate holding means is rotationally driven by the rotation driving means, so that the processing liquid can be spin-coated on the substrate surface held by the substrate holding means. The processing liquid scattered around the substrate during the spin coating process is received and collected by the scatter prevention cup moved to a position surrounding the substrate holding means by the elevating means.

On the other hand, when cleaning the shatterproof cup,
When the substrate holding means and the cup cleaning member are separated from each other by the elevating means, the cup cleaning member and the rotating shaft of the substrate holding means are engaged and connected via the engaging means. Then, the outer peripheral portion of the cup cleaning member faces the inner surface of the scattering prevention cup. In this state, when the rotation driving means is rotationally driven, the rotational force is transmitted to the cup cleaning member via the rotation shaft, and the cup cleaning member can be rotationally driven.
Therefore, when the cleaning liquid is supplied from above the scattering prevention cup by the cleaning liquid supply means, the cleaning liquid is supplied to the upper surface of the cup cleaning member, and the centrifugal force of the cup cleaning member can be applied to the cleaning liquid. Since the cleaning liquid supply means supplies the cleaning liquid to the cup cleaning member from above the scattering prevention cup, loss during supply is reduced as compared with the case where the cleaning liquid is supplied from below the cup cleaning member. In addition to this, it is possible to easily confirm whether or not the supply position is appropriate, and to adjust the supply position if it is inappropriate. Since the cleaning liquid is guided by the cleaning liquid guide portion and is spouted out of the outer periphery of the cup cleaning member by centrifugal force, the inner surface of the scattering prevention cup can be effectively cleaned.

The operation of the invention described in claim 2 is as follows. The cup cleaning member receives the cleaning liquid supplied from above at its flat portion and jets it to the outer peripheral portion by centrifugal force. By forming the upper surface of the cup cleaning member to be flat, the thickness can be reduced, so that the inertia force at the time of rotational driving of the cup cleaning member can be reduced. Therefore, it is possible to employ a rotation driving means having a small driving torque. In addition, since the time from when the cup is stopped to when it reaches the predetermined rotation speed can be shortened during the cup washing, the processing time can be shortened.

According to the third aspect of the present invention, the cleaning liquid supplied from above is temporarily received by the annular groove in plan view of the cup cleaning member, and is guided to the outer peripheral portion thereof. As described above, the cleaning liquid is once received by the groove and then ejected to the outer peripheral portion, so that the cleaning liquid supplied to the portion directly below the cleaning liquid supply means spreads over the entire circumference by the groove, and substantially the entire circumference of the cup cleaning member. The cleaning solution can be spread almost uniformly over the entire area. Therefore,
The cleaning liquid can be spouted evenly from almost the entire circumference of the cup cleaning member. As a result, the inner surface of the scattering prevention cup can be uniformly washed over substantially the entire circumference.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 are longitudinal sectional views showing a schematic configuration of a rotary substrate processing apparatus according to an embodiment. In particular, FIG. 1 is a diagram illustrating a substrate rotation process, FIG. 2 is a diagram illustrating a substrate transport process, and FIG. 3 is a diagram illustrating a cup cleaning process. 4 is an enlarged view of a main part in the cup cleaning step, FIG. 5 is a partially cutaway perspective view showing the cup cleaning member, and FIG. 6 shows one portion of the outer peripheral surface of the cup cleaning member. It is a side view.

This rotary type substrate processing apparatus includes a spin chuck 1 which holds a lower surface of a substrate W by suction and horizontally rotates around a vertical axis. A processing liquid supply nozzle 2 for supplying the liquid to the vicinity of the rotation center of W is provided. Around the substrate W held by suction on the spin chuck 1, a substrate W
A scattering prevention cup 3 is provided so as to surround the photoresist solution supplied to the surroundings in order to prevent the photoresist solution from scattering around. The bottom of the scattering prevention cup 3 has a drain recovery drain 4a for collecting the surplus photoresist liquid which has scattered, and an air flow including mist and particles generated when the photoresist liquid is scattered. An exhaust port 4b is formed. A drain pipe and an exhaust duct which are generally connected to the drain recovery drain 4a and the exhaust port 4b are not shown. The above-mentioned spin chuck 1 corresponds to the substrate holding means of the present invention, and the processing liquid supply nozzle 2 corresponds to the processing liquid supply means of the present invention.

The spin chuck 1 is formed smaller than the diameter of the substrate W and has a substantially circular shape in plan view. The spin chuck 1 is fitted to the upper end of the rotating shaft 6 of the electric motor 5 at a portion protruding from the bottom. The electric motor 5 corresponds to a rotation drive unit in the present invention.

The anti-scattering cup 3 includes an outer cup 3a.
And the inner cup 3b, the base plate 7
Is locked to the outer edge portion of the cover. The base plate 7 is provided with a back rinse nozzle 8 for discharging a cleaning liquid toward the back surface of the substrate W in order to wash and remove the photoresist solution and mist adhering to the back surface of the substrate W during the rotation processing. Has been established. When the size of the substrate W is large, for example, when it is φ300 mm (12 inches), the area to be cleaned is large. Therefore, it is preferable to dispose the back rinse nozzles 8 at four positions which are almost orthogonal in plan view. . The base plate 7 is attached via a supporting member to an elevating plate 11 whose bottom is supported by a pair of upper and lower cylinders 9 and 10. The shatterproof cup 3 can be raised and lowered in three stages by the expansion and contraction of these cylinders 9 and 10. These cylinders 9 and 10 correspond to the lifting means in the present invention.

A cleaning liquid supply nozzle 12 for supplying a cleaning liquid from above to a cup cleaning member 13 to be described later is provided on the side of the scattering prevention cup 3. As shown in FIG. 3, the cleaning liquid supply nozzle 12 is configured to be movable by a moving mechanism (not shown). The state shown by the solid line in FIG. 1 is the standby position of the cleaning liquid supply nozzle 12, and the state shown by the solid line in FIG. 3 is the supply position of the cleaning liquid. As described above, the rotation position is at the standby position that is laterally displaced from the scattering prevention cup 3 during the rotation processing, and the apparatus is configured to move to the supply position above the scattering prevention cup 3 only during cup cleaning. In this case, it is possible to prevent the cleaning liquid from dropping on the surface of the substrate W (so-called dropping) and adversely affecting the rotation processing.

Please refer to FIG. 4 and FIG. The rotating shaft 6 operatively connected to the spin chuck 1 has a spin chuck 1
A cup cleaning member 13 having a diameter larger than that of the cup cleaning member 13 is loosely inserted. The cup cleaning member 13 has a substantially circular shape in plan view, and is preferably made of a synthetic resin such as PEEK (poly ether ether ketone), PP (polypropylene), PE (polyethylene), and PVDF (teflon difluoride). It is formed. The cup cleaning member 13 has a through hole 14 through which the base plate 7 of the scattering prevention cup 3 is inserted in order to avoid interference with the back rinse nozzle 8 when the base plate 7 of the anti-scattering cup 3 is at a relatively elevated position as described later. Is formed. The cleaning liquid supply nozzle 1 is provided on the outer peripheral side of the upper surface of the cup cleaning member 13.
A cleaning liquid guide section 15 is formed to receive the cleaning liquid supplied from 2 and guide the cleaning liquid to the outer peripheral portion.

The cleaning liquid guide portion 15 has a groove-like annular opening portion 16 which is formed in an annular shape in plan view and opens upward.
And a storage section 17 for storing the cleaning liquid is formed therein. The cleaning liquid stored in the storage section 17 is supplied to a large number of ejection ports 1 of an ejection section 18 formed on the outer peripheral surface.
From 9 a centrifugal force spouts out to the surroundings. In addition, as shown in FIG. 6, the innumerable ejection ports 19 are formed so as to be different in the vertical direction so that the cleaning liquid is ejected efficiently over a wide range such as a horizontal direction and a slightly upward direction. . Above the jetting portion 18, a flange portion 20 that protrudes toward the scattering prevention cup 3 is provided.
Are formed. Further, the flange portion 20 is formed so as to also serve as a part of the upper portion of the inner cup 3b during the rotation process shown in FIG. According to such a configuration, at the time of the rotation processing, since it is integrated with the inner cup 3b, the rectifying action of the airflow flowing into the scattering prevention cup 3 and flowing down the peripheral portion of the substrate W is not hindered, and the rotation processing of the substrate W It can be suitably performed.

Further, by providing such a flange portion 20, the distance between the scattering prevention cup 3 and the cup cleaning member 13 can be set to a very small distance L. FIG.
(A) As shown by the dotted arrow therein, it is possible to prevent leakage outside the scattering prevention cup 3 and scattering. If the cleaning liquid leaks out of the scattering prevention cup 3 as indicated by a dotted arrow, a problem arises that the spin chuck 1 located above the contamination is contaminated and the substrate W is contaminated.

As shown in FIGS. 1 and 2, when the base plate 7 of the scattering prevention cup 3 is at a relatively elevated position, the cup cleaning member 13 is supported by the base plate 7 so as to be supported. 3 is configured to move up and down integrally. Also, as shown in FIGS. 3 and 4, when the scattering prevention cup 3 is at the lower position, the small-diameter disc-shaped rotation transmitting portion 2 formed at the intermediate portion of the rotating shaft 6.
5 and the cup cleaning member 13
The pin 26 formed on the lower surface center side of the
The cup cleaning member 13 is engaged with the engagement hole 27 of the rotary shaft 6.
It is designed to rotate integrally with. The rotation transmitting section 25, the pin 26, and the engaging hole 27 correspond to the engaging means in the present invention.

The operation of the rotary substrate processing apparatus configured as described above will be described below. In a normal rotation processing step, as shown in FIG. 1, both the cylinders 9 and 10 are extended to raise the scattering prevention cup 3 to the height of the spin chuck 1. Then, a photoresist liquid is supplied from the processing liquid supply nozzle 2 to the surface of the substrate W, and the photoresist liquid is spin-coated by rotating the substrate W at a high speed. As described above, since the cup cleaning member 13 is integrated with the inner cup 3b, the rotation processing can be suitably performed without hindering the rectifying action. In this process, the scattered photoresist liquid is received by the scatter prevention cup 3 and collected. When the application of the photoresist liquid to the front surface of the substrate W is completed, a cleaning liquid is sprayed and supplied from the back rinse nozzle 8 toward the back surface of the substrate W in the rotating state, and the back rinse is performed. During this process, the cleaning liquid supply nozzle 12 is at the standby position shown in FIG.

In this rotation processing step, the cup cleaning member 1
3 is a scattering prevention cup 3 which is received and supported by the base plate 7.
And is located at a position close to the spin chuck 1. At this time, since the engagement between the cup cleaning member 13 and the rotation transmitting unit 25 is released, the spin chuck 1 is rotated.
Is rotated, the cup cleaning member 13 remains stopped. In the above-described back rinse, a part of the cleaning liquid drops on the cup cleaning member 13 and evaporates. However, since the cup cleaning member 13 is formed of a synthetic resin having a small heat conductivity and a large specific heat, Cleaning member 1
3 does not drop much in temperature. Therefore, the temperature of the substrate W adjacent to the cup cleaning member 13 can be prevented from lowering, so that a uniform photoresist coating can be applied to the substrate W.

Next, a transfer process for unloading a processed substrate W or loading an unprocessed substrate W will be described with reference to FIG. First, only the upper cylinder 9 of the pair of cylinders 9 and 10 is contracted so that
Lower only by steps. Then, with only the spin chuck 1 protruding above the scattering prevention cup 3, the substrate is transferred by a transfer robot (not shown) or the like. At this time, the cup cleaning member 13 is held by the base plate 7 and is lowered to the middle stage.

Next, the step of cleaning the scattering prevention cup 3 will be described with reference to FIGS. In this step, both the cylinders 9 and 10 are contracted to
Is greatly lowered. At this time, the cup cleaning member 13 lowered together with the scattering prevention cup 3 moves downward as shown in FIG.
As shown in FIG. 5, the rotation is stopped by the rotation transmitting portion 25 disposed on the rotating shaft 6, and thereafter, only the scattering prevention cup 3 is lowered. As a result, the cup cleaning member 1
The cleaning liquid guide 15 formed on the outer periphery of the third cup 3 is held at a height position in the scattering prevention cup 3 that faces between the outer cup 3a and the inner cup 3b. At this time, the pin 26 of the cup cleaning member 13 is engaged with the engagement hole 27 of the rotation transmitting portion 25, and the cup cleaning member 13 can rotate integrally with the rotating shaft 6. Further, the cleaning liquid supply nozzle 12 at a standby position indicated by a two-dot chain line in FIG. 3 is moved by a moving mechanism (not shown) to a supply position indicated by a solid line in FIG.

In this state, while rotating the cup cleaning member 13 together with the spin chuck 1 via the rotating shaft 6,
The cleaning liquid is supplied from the cleaning liquid supply nozzle 12. The supplied cleaning liquid is stored in the storage part 17 through the annular opening part 16, but is jetted outward from the jetting part 18 by centrifugal force to wash the inner surfaces of the outer cup 3a and the inner cup 3b. At this time, as shown in FIG.
, The entire inner surfaces of the outer cup 3a and the inner cup 3b of the scattering prevention cup 3 are evenly washed. In addition, by rotating the cup cleaning member 13 at a high speed, the cleaning effect of the outer cup 3a substantially opposed to the cleaning liquid guide portion 15 is further enhanced.
By reducing the rotation speed of the inner cup 3b, the cleaning effect of the inner cup 3b located below the cleaning liquid guide portion 15 may be further enhanced. Further, as described above, since the flange portion 20 is formed at the outermost peripheral portion of the cup cleaning member 13, it is possible to avoid the inconvenience caused by the cleaning liquid ejected upward leaking out of the outer cup 3a. it can.

In the above-described cleaning step, the cleaning liquid is supplied to the cleaning liquid supply nozzle 12 while rotating the cup cleaning member 13.
However, the supply of the cleaning liquid may be started with the cup cleaning member 13 stopped, and then the cup cleaning member 13 may be driven to rotate. In this way, the cleaning liquid can be evenly distributed over the entire circumference of the storage section 17, and the cleaning liquid can be uniformly jetted from the jetting section 18 when the cup cleaning member 13 is driven to rotate. Therefore, the entire inner surface of the outer cup 3a and the inner cup 3b can be almost uniformly washed.

In the above-described apparatus, since the cleaning liquid supply nozzle 12 is configured to supply the cleaning liquid to the cup cleaning member 13 from above, the supply position of the cleaning liquid can be easily confirmed visually. Therefore, when the supply position of the cleaning liquid to the cup cleaning member 13 is inappropriate and the amount of the cleaning liquid ejected from the cup cleaning member 13 is insufficient, the position is adjusted to avoid the problem. can do.

Further, in the above-described configuration, the description has been given of the configuration in which only one cleaning liquid supply nozzle 12 is provided. However, as shown by the dotted line in FIG. 3, the cleaning liquid supply nozzle 12 is also provided on the opposite side across the rotation center. The cleaning liquid may be supplied from two cleaning liquid supply nozzles 12 provided. According to such a configuration, the cleaning liquid can be supplied more evenly over the entire circumference of the storage unit 17, so that the entire circumference of the inner surfaces of the outer cup 3a and the inner cup 3b can be uniformly cleaned as in the above-described example. Note that the number of the cleaning liquid supply nozzles 12 may be appropriately set according to the volume of the storage portion 17 of the cup cleaning member 13 or the size of the substrate W related to the size of the cup cleaning member 13.

Further, as described above, as a result of performing the cleaning step by rotating the cup cleaning member 13 only in a certain direction,
In the case where unevenness in cleaning has occurred on the inner surface of the scattering prevention cup 3, a first cleaning step of performing cleaning by rotating the cup cleaning member 13 on one side and rotating the cup cleaning member 13 on the other side. A second cleaning step of performing cleaning may be performed. By rotating the cup cleaning member 13 in the forward and reverse directions as described above, the ejection portion 1 of the cup cleaning member 13 is rotated.
When the ejection trajectory of the washing liquid ejected from the nozzle 8 is viewed in a plan view, the bias due to the centrifugal force is canceled. As a result, uneven cleaning can be suppressed.

As shown in FIGS. 7 (a) and 7 (b), the large number of ejection ports 19 formed in the cleaning liquid guide portion 15 may be slit-shaped ejection ports 19 formed along the vertical direction. By employing such a spout 19, the cleaning liquid can be spouted over a wide range in the vertical direction.

Next, referring to FIG.
A modified example will be described. This cup cleaning member 30
Is largely different from the above-described cup cleaning member 13 in that the upper portion is formed substantially flat.

The cleaning liquid guide portion 31 is composed of an annular groove 32 which is an annular shallow groove in plan view, and a flat portion 33 formed flat from the annular groove 32 to the peripheral edge of the cup cleaning member 30. . In the cleaning process of the scattering prevention cup 3, the cleaning liquid is supplied from the cleaning liquid supply nozzle 12 toward the annular groove 32 while rotating the cup cleaning member 30. The supplied cleaning liquid fills the entire circumference of the annular groove 32, but the overflowing cleaning liquid is jetted from the flat portion 33 to the entire inner surfaces of the outer cup 3 a and the inner cup 3 b by centrifugal force.
Even when the cup cleaning member 30 is configured in this manner, the same effect as the above-described cup cleaning member 13 can be obtained.

In the cup cleaning member 13 described above, the thickness of the cup cleaning member 13 increases and the inertia force increases due to the formation of the storage portion 17 which is a deep recess.
Since only the shallow annular groove 32 is formed in the cup cleaning member 30, the thickness of the cup cleaning member 30 can be reduced. Therefore, the inertia force can be reduced, and the drive torque of the electric motor 5 can be adopted even if it is small. Further, in the cleaning process, the cleaning is performed in a state where the cup cleaning member 30 is rotationally driven at a predetermined rotational speed. However, since the inertial force is reduced, the rotation from the start of the rotational driving until the rotation reaches the predetermined rotational speed. Time can be reduced. Therefore, the time required for the cleaning step can be reduced, and the operation rate of the apparatus can be improved. Further, since the inertia force is small, it is suitable for the case where the number of rotations of the cup cleaning member is varied as described above, or the case where forward rotation and reverse rotation are performed.

As shown by a dotted line in FIG. 8, by forming an ejection groove 34 having the same depth as the annular groove 32 radially from the annular groove 32 toward the periphery of the cup cleaning member 30. Alternatively, the cleaning liquid may be given directionality.

Although the annular groove 32 is formed in the cup cleaning member 30 in the above modification, the cup cleaning member 30 having a completely flat upper surface may be used without forming such a groove. According to this configuration, the cup cleaning member 3 is further provided.
Since 0 can be formed even thinner, the inertial force can be further reduced.

As an engaging means for integrating the cup cleaning member 30 and the rotary shaft 6, for example, as shown in FIG.
5 may be configured to be engaged with a pin 37 penetrating through the rotating shaft 6.

Further, in the above-described embodiment, by lowering the cup cleaning member 13, the rotation shaft 6 of the spin chuck 1 and the cup cleaning member 13
However, when the rotating shaft 6 is raised, the rotating shaft 6 and the cup cleaning member 13 are engaged and connected via the rotation transmitting unit 25 to clean the scattering prevention cup 3. May be configured to be performed.

[0043]

As is clear from the above description, according to the first aspect of the present invention, the following effects can be obtained. (1) The cleaning liquid supplied to the cup cleaning member is sprayed around by the centrifugal force of the cup cleaning member to clean the inner surface of the anti-scattering cup. You can gain the ability.

(2) The cup cleaning member and the scattering prevention cup are moved up and down relative to the substrate holding means, so that the cup cleaning member is automatically engaged with the rotating shaft of the substrate holding means, or the engagement is established. Since the cup cleaning member is released, it is not necessary to attach and detach the cup cleaning member every time the cup cleaning process is performed, and the time required for the cup cleaning process can be reduced. Further, the labor and space for storing the cup cleaning member are not required, which is advantageous in terms of handleability and equipment management.

(3) During normal substrate rotation processing, the engagement between the cup cleaning member and the rotating shaft of the substrate holding means is released, so that only the substrate holding means can be driven with a low torque, and the rotational drive is performed. The load on the means can be reduced, and the control of the number of rotations can be facilitated.

(4) Since the cleaning liquid is supplied to the cup cleaning member from above the scattering prevention cup,
As compared with the configuration in which the cleaning liquid is supplied from below the cup cleaning member, the loss at the time of supplying the cleaning liquid can be reduced.

(5) The arrival position of the cleaning liquid supplied to the cup cleaning member can be easily confirmed from above. If the position is inappropriate, the position of the cleaning liquid supply means is adjusted. This makes it possible for the cleaning liquid to reach an appropriate position. Therefore, the cup cleaning process can always be appropriately performed.

According to the second aspect of the present invention, the inertia of the cup cleaning member can be reduced.
As the rotation driving means, a small driving torque can be adopted, and the number of rotations of the cup cleaning member can quickly reach the number of rotations at the time of processing, so that the time required for the cup cleaning processing can be reduced. it can.

Further, according to the third aspect of the present invention, the cleaning liquid can be uniformly distributed over substantially the entire circumference of the cup cleaning member by the annular groove in a plan view, and can be uniformly distributed from substantially the entire circumference of the cup cleaning member. The cleaning liquid can be jetted out. Therefore, the inner surface of the scattering prevention cup can be uniformly washed over substantially the entire circumference, and cup cleaning can be suitably performed.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a rotary substrate processing apparatus according to an embodiment, showing a rotary processing step.

FIG. 2 is a longitudinal sectional view showing a substrate transporting step of the apparatus.

FIG. 3 is a longitudinal sectional view showing a cup cleaning step of the apparatus.

FIG. 4 is an enlarged longitudinal sectional view of a main part in a cup cleaning step.

FIG. 5 is a partially cutaway perspective view showing a cup cleaning member of the apparatus of the embodiment.

FIG. 6 is an enlarged longitudinal sectional view of a main part of the cup cleaning member.

FIG. 7 is a side view showing a modified example of the cleaning liquid guide of the cup cleaning member.

FIG. 8 is a partially cutaway perspective view showing a modification of the cup cleaning member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Spin chuck (substrate holding | maintenance means) 2 ... Processing liquid supply nozzle (processing liquid supply means) 3 ... Scatter prevention cup 5 ... Electric motor (rotation drive means) 6 ... Rotating shaft 9, 10 ... Cylinder (elevation means) 12 ... Cleaning liquid supply nozzle (cleaning liquid supply means) 13, 30 ... cup cleaning member 15, 31 ... cleaning liquid guide part 25 ... rotation transmission part (engaging means) 26 ... pin (engaging means) 27 ... engaging hole (engaging means)

Claims (3)

[Claims] 1. A substrate holding means for holding a substrate, a rotation driving means for rotating the substrate holding means around a vertical axis via a rotation shaft, and a processing liquid supply means for supplying a processing liquid onto the substrate And a scatter prevention cup provided to surround the periphery of the substrate holding means and preventing a processing liquid supplied to the substrate from being scattered with the rotation of the substrate. A cleaning liquid supply means for supplying a cleaning liquid from above the scattering prevention cup; and a cup provided with a cleaning liquid guide inserted through a rotation shaft of the substrate holding means and configured to guide the cleaning liquid supplied from the cleaning liquid supply means to an outer peripheral portion. A cleaning member, the substrate holding means and the cup cleaning member approach each other during the rotation processing of the substrate, and a scattering prevention cup surrounds the periphery of the substrate holding means. The cup cleaning member and the scattering prevention cup are moved up and down relative to the substrate holding means so that the substrate holding means and the cup cleaning member are separated from each other, and the inner surface of the scattering prevention cup faces the outer peripheral portion of the cup cleaning member. Lifting and lowering means for disengaging the cup cleaning member and the rotating shaft when the substrate holding means and the cup cleaning member approach each other, and cup cleaning when the substrate holding means and the cup cleaning member are separated from each other; An engagement means for engaging and connecting a member and the rotary shaft. A rotary substrate processing apparatus, comprising: 2. The rotary substrate processing apparatus according to claim 1, wherein an upper surface of said cup cleaning member is formed substantially flat. 3. The rotary substrate processing apparatus according to claim 1, wherein the cleaning liquid guide of the cup cleaning member has a circular groove in plan view for receiving the cleaning liquid supplied from the cleaning liquid supply means. A rotary substrate processing apparatus, characterized in that: