JP2015046461A - Substrate processing device, cleaning jig, cleaning jig set, and cleaning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device, a cleaning jig, a cleaning jig set, and a cleaning method, capable of adjusting dispersion strength of cleaning liquid.SOLUTION: Respective discharge shafts 83a (center shafts of substantially-columnar discharge ports 83) of the plurality of discharge ports 83 of a cleaning jig 80, are tilted from a centrifugal direction of rotation by a spin motor 22 and oriented to a front side of a rotation tangent line of the respective discharge ports. In addition, this directivity corresponds to a track (an allow AR2) of relative motion of pure water to a bottom face of the cleaning jig 80 at a deceleration step of decelerating a rotation speed in a state that cleaning liquid is supplied to the rotating cleaning jig 80. Therefore, at an acceleration step and a constant speed step, while a part of the pure water supplied to a liquid receiver 81 of the cleaning jig 80 is discharged from the plurality of discharge ports 83, the remaining pure water is reserved at an outer peripheral side of the liquid receiving 81. At the deceleration step, the reserved pure water is blowed out with great force from the plurality of discharge ports 83.

Description

  The present invention relates to a substrate processing apparatus, a cleaning jig, a cleaning jig set, and a cleaning method.

  2. Description of the Related Art Conventionally, in a substrate manufacturing process, a substrate processing apparatus that performs a drying process after performing a surface treatment of a substrate such as a chemical treatment using a chemical solution and a rinsing treatment using pure water has been used. As such a substrate processing apparatus, a single-wafer type apparatus that processes substrates one by one and a batch-type apparatus that collectively processes a plurality of substrates are used.

  A single-wafer type substrate processing apparatus normally performs chemical processing by supplying a chemical solution to the surface of a rotating substrate and rinsing processing by supplying pure water, and then swings and dries by rotating the substrate at a high speed. . At this time, most of the scattered processing liquid lands on the inner wall of the cup surrounding the spin chuck and flows down to be drained, but a part of the processing liquid scatters and adheres to the outside of the cup, or on the inner wall of the cup. There is a case where the scattered material does not flow down and adheres as it is.

  The treatment liquid adhering to the inside and outside of the cup becomes particles when dried, causing contamination of the substrate. For this reason, a cleaning process for cleaning the inside and outside of the cup is usually performed every time a predetermined number (typically, a predetermined lot) of substrates is processed. Such a single-wafer type substrate processing apparatus is disclosed in Patent Document 1, for example.

  A substrate processing apparatus disclosed in Patent Document 1 includes a spin chuck that rotates while holding a substrate in a substantially horizontal posture, a nozzle that supplies a processing liquid to the upper surface of the substrate held by the spin chuck, and a periphery of the spin chuck. A cup that surrounds and receives the processing liquid scattered from the substrate.

JP 2012-231049 A

  In the substrate processing apparatus disclosed in Patent Document 1, a cleaning liquid is supplied to a spin base portion (circular plate-like portion) of a spin chuck that rotates without holding a substrate, and the spin base is rotated by a centrifugal force of rotation. The cleaning liquid splashes from. The cleaning liquid scatters around the cup and its surroundings, and the scattered parts are cleaned.

  However, in the aspect of Patent Document 1, since the cleaning liquid supplied onto the spin base is scattered in a direction from the edge of the spin base due to the centrifugal force of rotation, the cleaning liquid can be scattered at once after temporarily storing the cleaning liquid. It is difficult to control the scattering momentum.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate processing apparatus, a cleaning jig, a cleaning jig set, and a cleaning method capable of adjusting the scattering force of the cleaning liquid. .

  In order to solve the above-mentioned problem, the invention described in claim 1 includes: (a) a substrate holding means for holding the substrate in a horizontal position; a rotating means for rotating the substrate holding means; and a cleaning liquid from above the substrate holding means. (B) a processing unit having a cup surrounding the periphery of the substrate holding means, and (b) an external size corresponding to the substrate in plan view, and is detachable by the substrate holding means. A cleaning jig that can be held, a liquid receiving part, a supply port that receives the cleaning liquid supplied from the cleaning liquid supply means and supplies the cleaning liquid to the liquid receiving part, and an outer peripheral side of the cleaning jig A cleaning jig having a plurality of discharge ports for discharging the cleaning liquid received by the liquid receiving portion, and each discharge shaft of the plurality of discharge ports is rotated by the rotating means. Tilted from the centrifugal direction The substrate processing apparatus is directed to the front side of the rotational tangent of each discharge port.

  Invention of Claim 2 is the substrate processing apparatus of Claim 1, Comprising: The said jig | tool for washing | cleaning inclines incline upwards toward the outer peripheral side from the center side in the bottom face of the said liquid receiving part. It has a surface.

  A third aspect of the present invention is the substrate processing apparatus according to the first or second aspect, wherein the substrate holding means includes a plurality of chuck members for gripping an outer peripheral edge of the substrate, and the cleaning jig. When the outer peripheral end of the tool is gripped by the plurality of chuck members, the plurality of discharge ports of the cleaning jig are arranged at different height positions from the plurality of chuck members.

  The invention according to claim 4 is a cleaning jig for cleaning the inside of the processing unit by being supplied with a cleaning liquid while being detachably mounted on the substrate holding means of the processing unit and rotated. The cleaning liquid is provided along the outer peripheral side of the cleaning jig and received by the liquid receiving part, the supply port for supplying the cleaning liquid, the liquid receiving part for receiving the cleaning liquid supplied from the supply port, A plurality of discharge ports, each discharge shaft of each of the plurality of discharge ports being inclined from the centrifugal direction of rotation and directed to the front side of the rotation tangent of each discharge port. And

  The invention according to claim 5 is the cleaning jig according to claim 4, wherein the bottom surface of the liquid receiving portion has an inclined surface inclined upward from the center side toward the outer peripheral side. And

  The invention according to claim 6 is a set of a plurality of cleaning jigs each corresponding to the cleaning jig according to claim 5, wherein each of the inclined surfaces of the plurality of cleaning jigs The tilt angles are different from each other.

  The invention according to claim 7 comprises the processing unit according to claim 1 and the cleaning jig set according to claim 6, wherein the cleaning liquid supply means is selected from the plurality of cleaning jigs The cleaning liquid is supplied to one cleaning jig that is detachably held by the substrate holding means, and the cleaning liquid is discharged from the one cleaning jig by the rotation of the rotating means. .

  According to an eighth aspect of the present invention, there is provided a processing unit for performing predetermined processing on the substrate while rotating the substrate while holding the substrate in a horizontal posture by the predetermined substrate holding unit, and around the substrate holding unit in the processing unit. A method for cleaning an existing predetermined portion, wherein (A) a predetermined cleaning jig having a liquid receiving portion is used as the substrate holding means in place of the substrate during a period when the predetermined processing is not performed. A mounting step of mounting and holding; (B) a supply step of supplying a cleaning liquid to the liquid receiving portion via a predetermined supply port of the cleaning jig; and (C) the cleaning treatment together with the substrate holding means. A rotating step for rotating the tool, and (D) a decelerating step for decelerating the rotation, wherein the cleaning jig communicates with the liquid receiving portion along the outer peripheral side of the cleaning jig. While having a plurality of discharge ports formed The discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of rotation in the rotation step and are directed to the front side of the rotation tangent of the discharge ports, and are caused by the rotational inertia of the cleaning liquid itself in the liquid receiving portion. In the decelerating step, the cleaning liquid is ejected from the plurality of discharge ports toward the predetermined portion.

  The substrate processing apparatus according to any one of claims 1 to 3 and claim 7 includes a substrate holding unit that holds the substrate in a horizontal posture, a rotating unit that rotates the substrate holding unit, and a cleaning liquid from above the substrate holding unit. And a processing unit having a cup surrounding the periphery of the substrate holding means, and a cleaning unit having an external size corresponding to the substrate in plan view and detachably held by the substrate holding means A jig.

  The cleaning jig according to any one of claims 1 to 8 includes a liquid receiving portion, a supply port that receives the cleaning liquid supplied from the cleaning liquid supply means and supplies the cleaning liquid to the liquid receiving portion, and an outer peripheral side of the cleaning jig. And a plurality of discharge ports for discharging the cleaning liquid received in the liquid receiving portion. The discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of rotation by the rotating means and are directed to the front side of the rotation tangent of the discharge ports.

  When pure water is supplied to the supply port of the rotating cleaning jig, the pure water lands on the bottom surface of the cleaning jig and then flows from the center toward the outer periphery by centrifugal force. At this time, the pure water immediately after landing on the bottom surface of the cleaning jig does not have a speed component in the rotating direction. On the other hand, the pure water supplied near the center and flowing toward the outer periphery gradually has a speed component in the rotation direction of the cleaning jig due to friction with the bottom surface of the rotating cleaning jig. For this reason, the pure water that flows from the center of the cleaning jig toward the outer periphery does not normally flow linearly along the centrifugal direction of the cleaning jig, and from the centrifugal direction on the bottom surface of the cleaning jig. It flows while drawing a curved trajectory. In particular, when the rotational speed of the cleaning jig is reduced, the rotational speed caused by the rotational inertia of the pure water itself is larger than the rotational speed of the cleaning jig, and the pure water flowing inside the liquid receiving portion Is directed forward of the rotating tangent.

  In this way, the directivity of the plurality of discharge ports of the cleaning jig corresponds to the directivity of pure water flowing inside the liquid receiving portion when the rotation of the cleaning jig is decelerated. For this reason, the pure water supplied to the liquid receiving part of the cleaning jig during a certain period from the start of rotation to the start of deceleration of the rotation is partially discharged from a plurality of discharge ports, but the rest is liquid reception. Stored on the outer peripheral side of the part. On the other hand, in the period during which the rotational speed is reduced, the stored pure water is caused by the correspondence between the directivity of pure water in the liquid receiving portion and the directivity of the discharge port provided in the cleaning jig. Water spouts vigorously from multiple outlets. As a result, each part (around the cleaning jig) can be cleaned particularly strongly in the deceleration process.

  Particularly, in the inventions according to claims 6 and 7, the cleaning jig set is constituted by a plurality of cleaning jigs having different inclination angles of the inclined surfaces. According to a seventh aspect of the present invention, the cleaning liquid supply means supplies the cleaning liquid to one cleaning jig selected from a plurality of cleaning jigs and detachably held on the substrate holding means, and the above-mentioned 1 is obtained by rotation by the rotating means. The cleaning liquid is discharged from the cleaning jig. For this reason, it becomes possible to discharge pure water at an inclination angle corresponding to the inclined surface (inclination from the horizontal plane) of the cleaning jig to be selected, and more accurate cleaning can be realized.

It is a top view of processing unit UT concerning an embodiment. It is a longitudinal section of processing unit UT concerning an embodiment. It is a schematic diagram of the cleaning jig 80 according to the embodiment. It is sectional drawing of the jig | tool 80 for washing | cleaning which concerns on embodiment. It is a flowchart which shows substrate processing mode MD1 which concerns on embodiment. In substrate processing mode MD1 which concerns on embodiment, it is a longitudinal cross-sectional view of the processing unit UT which shows a mode that a chemical | medical solution splashes toward the outer cup 43 from the board | substrate W. FIG. In substrate processing mode MD1 which concerns on embodiment, it is a longitudinal cross-sectional view of the processing unit UT which shows a mode that a pure water splashes toward the inner cup 41 from the board | substrate W. FIG. In substrate processing mode MD1 which concerns on embodiment, it is a longitudinal cross-sectional view of the processing unit UT which shows a mode that a pure water splashes toward the inside cup 42 from the board | substrate W. FIG. It is a flowchart which shows washing | cleaning mode MD2 which concerns on embodiment. In cleaning mode MD2 which concerns on embodiment, it is a longitudinal cross-sectional view of the processing unit UT which shows a mode that a pure water is scattered toward the partition plate 15 from the spin base 21. FIG. In cleaning mode MD2 which concerns on embodiment, it is a longitudinal cross-sectional view of the processing unit UT which shows a mode that pure water is scattered toward the outer cup 43 from the spin base 21. FIG. In cleaning mode MD2 which concerns on embodiment, it is a longitudinal cross-sectional view of the process unit UT which shows a mode that pure water is scattered toward the inside cup 42 from the spin base 21. FIG. In cleaning mode MD2 which concerns on embodiment, it is a longitudinal cross-sectional view of the process unit UT which shows a mode that pure water splashes toward the inner cup 41 from the spin base 21. FIG. In the embodiment, it is a time chart showing the operation of each part during the period from step ST12 to step ST16 of the cleaning mode MD2. In the embodiment, it is a top view showing a relative trajectory of the cleaning liquid supplied to the rotating cleaning jig 80 relative to the cleaning jig 80. FIG. In cleaning jig 80 of an embodiment, it is a side view comparing the discharge power of the cleaning liquid in the acceleration process and the constant speed process with the discharge power of the cleaning liquid in the deceleration process. In the modification, it is the time chart which showed the operation | movement of each part in the period of step ST12-step ST16 of cleaning mode MD2.

  Hereinafter, each embodiment will be described in detail.

<1 embodiment>
<1.1 Configuration of Substrate Processing Apparatus 1>
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a top view of a single wafer processing unit UT capable of sequentially processing substrates. FIG. 2 is a longitudinal sectional view of the processing unit UT. This processing unit UT is a single-wafer processing unit that processes semiconductor substrates W one by one, and after performing a chemical treatment and a rinsing process using pure water on a circular silicon substrate W, a drying process is performed. Do. More specifically, after the chemical treatment for supplying the chemical liquid such as SC1 liquid, DHF liquid, and SC2 liquid to the substrate W to clean the surface of the substrate W, the rinse water such as pure water WT and alcohol is applied to the substrate W. A rinsing process is performed to remove the chemical solution remaining on the surface of the substrate W and finally dry the substrate W. FIG. 1 shows a state where the substrate W is not held on the spin chuck 20, and FIG. 2 shows a state where the substrate W is held on the spin chuck 20.

  The substrate processing apparatus 1 is an apparatus having at least one processing unit and a transport robot (not shown), and transports an unprocessed substrate W to the processing unit by the transport robot and performs substrate processing in the processing unit. After that, the processed substrate W is transferred to the processing unit for the next processing. Although the substrate processing apparatus 1 may have any number of processing units, the processing unit UT of the one will be described in detail below.

  The processing unit UT includes, in the chamber 10, a spin chuck 20 that holds the substrate W as a main element in a horizontal posture (a posture in which the normal line is along the vertical direction), and a processing liquid on the upper surface of the substrate W held by the spin chuck 20. The upper surface processing liquid nozzle 30 and the processing cup 40 surrounding the periphery of the spin chuck 20 are provided. A partition plate 15 is provided around the processing cup 40 in the chamber 10 to partition the inner space of the chamber 10 up and down. In the present specification, the processing liquid is a generic name including a chemical liquid, a rinsing liquid, and a cleaning liquid (a liquid used in a cleaning mode MD2 described later).

  The chamber 10 includes a side wall 11 along the vertical direction, a ceiling wall 12 that closes an upper side of a space surrounded by the side wall 11, and a floor wall 13 that closes a lower side. A space surrounded by the side wall 11, the ceiling wall 12, and the floor wall 13 is a processing space for the substrate W. Further, a part of the side wall 11 of the chamber 10 is provided with a carry-in / out opening for carrying the substrate W in / out of the chamber 10 and a shutter for opening / closing the carry-in / out opening (both not shown).

  A fan filter unit (FFU) 14 for further purifying the air in the clean room in which the processing unit UT is installed and supplying it to the processing space in the chamber 10 is attached to the ceiling wall 12 of the chamber 10. The fan filter unit 14 includes a fan and a filter (for example, a HEPA filter) for taking in air in the clean room and sending it out into the chamber 10, and forms a downflow of clean air in the processing space in the chamber 10. In order to disperse the clean air supplied from the fan filter unit 14 uniformly, a punching plate having a large number of blowing holes may be provided directly below the ceiling wall 12.

  The spin chuck 20 (substrate holding means) includes a disc-shaped spin base 21 fixed in a horizontal posture at the upper end of a rotating shaft 24 extending in the vertical direction, and the rotating shaft 24 disposed below the spin base 21. A spin motor 22 that rotates, and a cylindrical cover member 23 that surrounds the periphery of the spin motor 22 are provided. The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. Therefore, the spin base 21 has a holding surface 21a that faces the entire lower surface of the substrate W to be held.

  A plurality (four in this embodiment) of chuck members 26 are erected on the peripheral edge of the holding surface 21 a of the spin base 21. The plurality of chuck members 26 are equally spaced along the circumference corresponding to the outer circumference of the circular substrate W (if there are four chuck members 26 as in the present embodiment, the chuck members 26 are spaced at 90 ° intervals. ) Is arranged. The plurality of chuck members 26 can move in the radial direction of the substrate W around the axis CX of the spin base 21 by a link mechanism (not shown) housed in the spin base 21. When the link mechanism moves each chuck member 26 in a direction approaching the axis CX, each of the plurality of chuck members 26 is brought into contact with the edge of the substrate W to grip the substrate W, thereby spinning the substrate W. While being close to the holding surface 21a above the base 21, it can be held in a horizontal posture with a predetermined space from the holding surface 21a (see FIG. 2). Further, when the link mechanism moves each chuck member 26 away from the axis CX, the gripping can be released by separating each of the plurality of chuck members 26 from the edge of the substrate W.

  The cover member 23 covering the spin motor 22 has a lower end fixed to the floor wall 13 of the chamber 10 and an upper end reaching just below the spin base 21. At the upper end portion of the cover member 23, a hook-like member 25 is provided that protrudes almost horizontally outward from the cover member 23 and further bends and extends downward. In a state where the spin chuck 20 holds the substrate W by gripping by the plurality of chuck members 26, the spin motor 22 (rotating means) rotates the rotation shaft 24, whereby an axis along the vertical direction passing through the center of the substrate W. The substrate W can be rotated around the center CX. The driving of the spin motor 22 is controlled by the control unit 9.

  The upper surface treatment liquid nozzle 30 is configured by attaching a discharge head 31 to the tip of a nozzle arm 32. The proximal end side of the nozzle arm 32 is fixedly connected to the nozzle base 33. The nozzle base 33 can be rotated around an axis along the vertical direction by a motor (not shown). As the nozzle base 33 rotates, the discharge head 31 of the upper processing liquid nozzle 30 has an arc-shaped locus in the horizontal plane between the processing position above the spin chuck 20 and the standby position outside the processing cup 40. Move along. The upper surface treatment liquid nozzle 30 is configured to be supplied with a plurality of kinds of treatment liquids (including at least pure water). The processing liquid discharged from the discharge head 31 of the upper surface processing liquid nozzle 30 at the processing position is deposited on the upper surface of the substrate W held by the spin chuck 20. Further, the upper surface treatment liquid nozzle 30 can be swung above the holding surface 21 a of the spin base 21 by the rotation of the nozzle base 33. The upper surface treatment liquid nozzle 30 also functions as a cleaning liquid supply unit that supplies a cleaning liquid in a cleaning mode MD2 described later.

  On the other hand, a lower surface treatment liquid nozzle 28 is provided along the vertical direction so as to pass through the inside of the rotation shaft 24. The upper end opening of the lower surface treatment liquid nozzle 28 is formed at a position facing the lower surface center of the substrate W held by the spin chuck 20. A plurality of types of processing liquids are also supplied to the lower surface processing liquid nozzle 28. The processing liquid discharged from the lower surface processing liquid nozzle 28 is deposited on the lower surface of the substrate W held by the spin chuck 20.

  The chamber 10 is provided with a two-fluid nozzle 60 in addition to the upper surface treatment liquid nozzle 30. The two-fluid nozzle 60 is a processing nozzle that mixes a processing liquid such as pure water with a pressurized gas to generate droplets and injects a mixed fluid of the droplets and gas onto the substrate W. The two-fluid nozzle 60 is configured by attaching a liquid head (not shown) to the tip of a nozzle arm 62 and attaching a gas head 64 to a support member provided so as to branch from the nozzle arm 62. The base end side of the nozzle arm 62 is fixedly connected to the nozzle base 63. The nozzle base 63 can be rotated around an axis along the vertical direction by a motor (not shown). As the nozzle base 63 rotates, the two-fluid nozzle 60 moves in an arc along the horizontal direction between the processing position above the spin chuck 20 and the standby position outside the processing cup 40. A treatment liquid such as pure water is supplied to the liquid head, and a pressurized inert gas (nitrogen gas (N2) in this embodiment) is supplied to the gas head 64. The mixed fluid of the processing liquid ejected from the two-fluid nozzle 60 at the processing position is sprayed onto the upper surface of the substrate W held by the spin chuck 20.

  The processing cup 40 surrounding the spin chuck 20 includes a plurality of cups that can be moved up and down independently of each other, that is, an inner cup 41, an intermediate cup 42, and an outer cup 43. The inner cup 41 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the axis CX passing through the center of the substrate W held by the spin chuck 20. The inner cup 41 includes an annular bottom 44 in plan view, a cylindrical inner wall 45 rising upward from the inner periphery of the bottom 44, a cylindrical outer wall 46 rising upward from the outer periphery of the bottom 44, and an inner wall The first guide portion 47 that rises from between the portion 45 and the outer wall portion 46 and extends obliquely upward (in the direction approaching the axis CX of the substrate W held by the spin chuck 20) while drawing a smooth arc at the upper end portion. And a cylindrical middle wall portion 48 that rises upward from between the first guide portion 47 and the outer wall portion 46.

  The inner wall portion 45 is formed in such a length as to be accommodated with an appropriate gap between the cover member 23 and the bowl-shaped member 25 in a state where the inner cup 41 is raised most (FIG. 8). . The middle wall portion 48 is accommodated with a suitable gap between a second guide portion 52 (described later) of the middle cup 42 and the processing liquid separation wall 53 in a state where the inner cup 41 and the middle cup 42 are closest to each other. It is formed in such a length.

  The first guide portion 47 has an upper end portion 47b extending obliquely upward in the center side (in the direction approaching the axis CX of the substrate W) while drawing a smooth arc. Further, a space between the inner wall portion 45 and the first guide portion 47 is a disposal groove 49 for collecting and discarding the used processing liquid. A space between the first guide portion 47 and the middle wall portion 48 is an annular inner collection groove 50 for collecting and collecting used processing liquid. Further, a space between the middle wall portion 48 and the outer wall portion 46 is an annular outer collection groove 51 for collecting and collecting different types of processing liquids from the inner collection groove 50.

  The waste groove 49 is connected to an exhaust liquid mechanism (not shown) for discharging the processing liquid collected in the waste groove 49 and forcibly exhausting the inside of the waste groove 49. For example, four exhaust fluid mechanisms are provided at equal intervals along the circumferential direction of the discard groove 49. Further, the inner collection groove 50 and the outer collection groove 51 are provided with a collection mechanism (for collecting the processing liquid collected in the inner collection groove 50 and the outer collection groove 51 in a collection tank provided outside the processing unit UT). Both are not shown). The bottoms of the inner recovery groove 50 and the outer recovery groove 51 are inclined by a slight angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position. Thereby, the processing liquid that has flowed into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.

  The middle cup 42 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the axis CX that passes through the center of the substrate W held by the spin chuck 20. The inner cup 42 is integrally provided with a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.

  The second guide portion 52 draws a smooth arc on the outside of the first guide portion 47 of the inner cup 41 from the lower end portion 52a that is coaxial with the lower end portion of the first guide portion 47 and the upper end of the lower end portion 52a. However, it has an upper end 52b that extends obliquely upward in the center side (in the direction approaching the axis CX of the substrate W) and a folded portion 52c that is formed by folding the tip of the upper end 52b downward. The lower end 52 a is accommodated in the inner collection groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48 in a state where the inner cup 41 and the middle cup 42 are closest to each other. The upper end portion 52b is provided so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and the first guide portion 47 is in a state where the inner cup 41 and the middle cup 42 are closest to each other. And close to the upper end portion 47b with a very small distance. Further, the folded portion 52c formed by folding the tip of the upper end portion 52b downward is in a state where the inner cup 41 and the middle cup 42 are closest to each other, and the folded portion 52c is the tip of the upper end portion 47b of the first guide portion 47. It is the length which overlaps with the horizontal direction.

  Further, the upper end portion 52b of the second guide portion 52 is formed so as to increase in thickness toward the lower side, and the treatment liquid separation wall 53 is provided so as to extend downward from the lower peripheral edge of the upper end portion 52b. It has a cylindrical shape. The processing liquid separation wall 53 is accommodated in the outer collection groove 51 with an appropriate gap between the inner wall portion 48 and the outer cup 43 in a state where the inner cup 41 and the inner cup 42 are closest to each other.

  The outer cup 43 surrounds the periphery of the spin chuck 20 outside the second guide portion 52 of the middle cup 42 and is substantially rotationally symmetric with respect to the axis CX passing through the center of the substrate W held by the spin chuck 20. It has a shape. The outer cup 43 has a function as a third guide part. The outer cup 43 has a lower end part 43a that is coaxially cylindrical with the lower end part 52a of the second guide part 52, and a center side (in a direction approaching the axis CX of the substrate W) while drawing a smooth arc from the upper end of the lower end part 43a. The upper end portion 43b extends obliquely upward, and the folded portion 43c is formed by folding the tip end portion of the upper end portion 43b downward.

  The lower end portion 43a has an outer clearance groove with an appropriate gap between the processing liquid separation wall 53 of the inner cup 42 and the outer wall portion 46 of the inner cup 41 in a state where the inner cup 41 and the outer cup 43 are closest to each other. 51. The upper end portion 43b is provided so as to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and the upper end portion 52b of the second guide portion 52 is in a state where the middle cup 42 and the outer cup 43 are closest to each other. Close to each other with a very small distance. Further, the folded portion 43 c formed by folding the tip end portion of the upper end portion 43 b downward is in a state where the inner cup 42 and the outer cup 43 are closest to each other, and the folded portion 43 c is the same as the folded portion 52 c of the second guide portion 52. It is formed so as to overlap in the horizontal direction.

  Further, the inner cup 41, the middle cup 42, and the outer cup 43 can be moved up and down independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is provided with a lifting mechanism (not shown), and is lifted and lowered separately. As such an elevating mechanism, for example, various mechanisms such as a ball screw mechanism and an air cylinder can be employed.

  The partition plate 15 is provided so as to partition the inner space of the chamber 10 up and down around the processing cup 40. The partition plate 15 may be a single plate-like member surrounding the processing cup 40, or may be a combination of a plurality of plate-like members. Further, the partition plate 15 may be formed with through holes or notches penetrating in the thickness direction. In this embodiment, the partition plate 15 supports the nozzle bases 33 and 63 of the upper treatment liquid nozzle 30 and the two-fluid nozzle 60. A through hole is formed through which a support shaft is inserted.

  The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. Further, the edge portion surrounding the processing cup 40 of the partition plate 15 is formed to have a circular shape having a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not become an obstacle to the raising and lowering of the outer cup 43.

  An exhaust duct 18 is provided in a part of the side wall 11 of the chamber 10 and in the vicinity of the floor wall 13. The exhaust duct 18 is connected in communication with an exhaust mechanism (not shown). Of the clean air supplied from the fan filter unit 14 and flowing down in the chamber 10, the air that has passed between the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the apparatus.

  Further, the substrate processing apparatus 1 includes a cleaning jig 80 used in a cleaning mode MD2 (FIG. 9) described later. 3 is a schematic view of the cleaning jig 80, FIG. 4A is a longitudinal sectional view of the cleaning jig 80, and FIG. 4B is a transverse sectional view of the cleaning jig 80. FIG.

  The cleaning jig 80 is a jig that is transferred by a transfer robot (not shown) in the substrate processing apparatus 1, and in a substrate processing mode MD <b> 1 (FIG. 5) described later, the chamber 10 that executes processing in the substrate processing apparatus 1. (For example, an empty chamber 10 that is not used for substrate processing among the plurality of chambers 10 included in the substrate processing apparatus 1 or a shelf for arranging the cleaning jig 80). In a later-described cleaning mode MD2 (FIG. 9), it is held and rotated by the spin chuck 20 in the chamber 10 that executes the process (FIGS. 10 to 13). Further, in the present embodiment, the substrate processing apparatus 1 including one cleaning jig 80 will be described, and the substrate processing apparatus including a cleaning jig set including a plurality of cleaning jigs will be described later. <2 Modification> Will be described in detail.

  The cleaning jig 80 has a dome shape so as to cover a bottom plate 84 having an external size corresponding to the substrate W in a plan view (in this embodiment, substantially the same circle as the substrate W in a top view), and the top surface of the bottom plate 84. A jig that can be detachably held by the spin chuck 20. A hollow portion surrounded by the upper surface of the bottom plate 84 and the inner wall of the cover portion 85 functions as the liquid receiving portion 81. A supply port 82 communicating with the liquid receiving portion 81 is formed at the top of the cover portion 85, and the cleaning liquid supplied from the upper surface treatment liquid nozzle 30 to the supply port 82 is received by the liquid receiving portion 81. A plurality of discharge ports 83 for discharging the cleaning liquid received by the liquid receiving portion 81 to the outside are provided on the outer peripheral side of the cleaning jig 80 (side surface of the cover portion 85).

  The outer peripheral end of the disc-shaped bottom plate 84 constitutes a flange portion 84a. The flange portion 84 a is an outer peripheral portion of the bottom plate 84 that is not covered by the cover portion 85, and has substantially the same thickness as the processing target substrate W of the substrate processing apparatus 1. Therefore, similarly to the substrate W, each of the plurality of chuck members 26 can be brought into contact with the flange portion 84a of the cleaning jig 80 to hold the cleaning jig 80. The gripping can also be released by separating each of the plurality of chuck members 26 from the collar portion 84a of the cleaning jig 80.

  The method for holding the cleaning jig 80 by the chuck member 26 is not limited to the above. Even if the cleaning jig 80 does not include the flange portion 84a, there are various methods such as a method of holding the cleaning jig 80 by bringing each of the plurality of chuck members 26 into contact with the side surface of the cleaning jig 80. Can be adopted.

  In a cleaning mode MD2, which will be described later, the cleaning liquid is supplied from a supply port 82 that is an upper opening of the cleaning jig 80 in a state where the cleaning jig 80 is held in a horizontal posture by the spin chuck 20 and rotated around the axis CX. Thus, the cleaning liquid can be discharged from a plurality of discharge ports 83 provided along the outer peripheral side of the cleaning jig 80 and communicating with the liquid receiving portion 81 (FIG. 16). As a result, predetermined portions (for example, the side wall 11, the partition plate 15, and the processing cup 40) existing around the spin chuck 20 are cleaned with the cleaning liquid scattered from the cleaning jig 80.

  The cleaning jig 80 has an inclined surface 81 a that is inclined upward from the center side toward the outer peripheral side on the bottom surface of the liquid receiving portion 81. For this reason, the cleaning liquid supplied to the rotating cleaning jig 80 flows from the inner side to the outer side (flows along the inclined surface 81a) by the centrifugal force of rotation, and is discharged obliquely upward from the discharge port 83. . Thereby, the inner wall surface of the processing cup 40 can be effectively cleaned.

  The plurality of discharge ports 83 of the cleaning jig 80 are arranged at positions higher than the plurality of chuck members 26 in a state where the jig is held by the spin chuck 20 (FIGS. 10 to 13). Since the plurality of discharge ports 83 are thus arranged at different height positions from the chuck member 26, pure water supplied to the cleaning jig 80 and discharged from the plurality of discharge ports 83 collides with the chuck member 26. Without being scattered around. Therefore, pure water can be scattered with high precision at the location to be cleaned.

  Each discharge shaft 83a of the plurality of discharge ports 83 (the central axis of the discharge port 83 having a substantially cylindrical shape) is inclined forward from the centrifugal direction of rotation by the spin motor 22 and is directed to the front side of the rotation tangent of each discharge port. (FIG. 4B). The reason for this configuration will be described later. In FIG. 4B, the discharge shaft 83a is expressed only for one discharge port 83 for the purpose of preventing the drawing from becoming complicated.

  In addition, the substrate processing apparatus 1 includes a processing unit UT configured by the above-described components and a control unit 9 that controls the transfer robot. The configuration of the control unit 9 as hardware is the same as that of a general computer. That is, the control unit 9 stores a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It is configured with a magnetic disk to be placed.

  A plurality of substrate processing modes in the processing unit UT are set in advance in the storage unit (magnetic disk or the like) of the control unit 9, and the CPU of the control unit 9 executes a predetermined processing program to execute the above-described plurality of modes. Each operation mechanism of the substrate processing apparatus 1 is controlled by selecting and executing one of them.

<1.2 Operation of Substrate Processing Apparatus 1>
Next, each operation mode (each mode) of the processing unit UT will be described.

  The substrate processing apparatus 1 according to the present embodiment is exceptional when the processing unit UT satisfies a predetermined condition and a substrate processing mode MD1 (FIG. 5) set as a default mode among a plurality of modes. Or a temporary cleaning mode MD2 (FIG. 9). A mode different from the above two modes may be additionally set in the control unit 9 of the substrate processing apparatus 1 and the additional mode may be selectable. In the present embodiment, the above two modes are particularly preferable. A case where only the mode is set will be described.

<1.2.1 Substrate Processing Mode MD1>
FIG. 5 is a flowchart showing the procedure of the substrate processing mode MD1 in the processing unit UT. Hereinafter, the substrate processing mode MD1 will be described with reference to FIG.

  First, the substrate W to be processed is loaded into the chamber 10 by a transfer robot (not shown) (step ST1). The four chuck members 26 are driven, and the substrate W is gripped by the spin chuck 20 (step ST2). When the spin motor 22 rotates the rotating shaft 24, the substrate W is rotated around the axis CX passing through the center of the substrate W along the vertical direction (step ST3).

  Next, the nozzle arm 32 of the upper surface treatment liquid nozzle 30 is rotated to move the ejection head 31 above the spin base 21 (for example, above the axis CX), and the substrate W rotated by the spin chuck 20 is moved. Supply chemicals to the top surface. The chemical solution supplied to the upper surface of the substrate W spreads over the entire upper surface of the rotating substrate W by centrifugal force. Thereby, the chemical | medical solution process of the board | substrate W advances (step ST4). Then, the chemical liquid scatters around from the end of the rotating substrate W.

  For the purpose of collecting the scattered chemicals, in step ST4, for example, only the outer cup 43 rises, and a spin is formed between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42. An opening OPa surrounding the periphery of the substrate W held by the chuck 20 is formed (FIG. 6). As a result, the chemical solution (shown by a dotted arrow in FIG. 6) splashed from the edge of the rotating substrate W is received by the upper end 43b of the outer cup 43, flows down along the inner surface of the outer cup 43, and the outer recovery groove. 51 is collected. After a predetermined time has elapsed (or after a predetermined amount of chemical solution has been supplied), the supply of the chemical solution is stopped.

  Next, pure water (rinse liquid) is supplied from the upper surface treatment liquid nozzle 30 to the upper surface of the substrate W rotated by the spin chuck 20. The pure water supplied to the upper surface of the substrate W spreads over the entire upper surface of the rotating substrate W by centrifugal force. Thereby, the rinsing process in which the chemical solution remaining on the upper surface of the substrate W is flowed proceeds (step ST5). Then, the pure water and the chemical solution that is poured into the pure water are scattered from the end of the rotating substrate W to the surroundings.

  In step ST <b> 5, for example, all of the inner cup 41, the middle cup 42, and the outer cup 43 are raised, and the opening surrounded by the first guide portion 47 of the inner cup 41 around the substrate W held by the spin chuck 20. OPc is formed (FIG. 7). As a result, the pure water and the chemical liquid (shown by dotted arrows in FIG. 7) splashed from the edge of the rotating substrate W are received by the inner cup 41 and flow down along the inner wall of the first guide portion 47, and the waste groove 49 is discharged. In the case where pure water is collected by a path different from the chemical solution, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52b of the second guide portion 52 of the middle cup 42 and the first guide of the inner cup 41 are collected. An opening OPb surrounding the periphery of the substrate W held by the spin chuck 20 may be formed between the upper end portion 47b of the portion 47 (FIG. 8). After a predetermined time has elapsed (or after a predetermined amount of pure water has been supplied), the supply of pure water is stopped.

  And step ST4 and step ST5 are alternately repeated until all the chemical | medical solution processes defined by a board | substrate process recipe are performed (step ST6). For example, when three types of chemical processing are set in the recipe, chemical processing (step ST4) and rinsing processing (step ST5) are executed for each chemical.

  When the chemical solution process and the rinse process are completed, the substrate W is dried (step ST7). When performing the drying process, all of the inner cup 41, the inner cup 42 and the outer cup 43 are lowered, and the upper end portion 47 b of the first guide portion 47 of the inner cup 41 and the upper end portion 52 b of the second guide portion 52 of the inner cup 42. Both the upper end 43b of the outer cup 43 and the substrate W held by the spin chuck 20 are positioned below. In this state, the substrate W is rotated at a high speed together with the spin chuck 20, and droplets (chemical solution droplets or water droplets) adhering to the substrate W are shaken off by centrifugal force, and a drying process is performed.

  Thereafter, the rotation of the substrate W is stopped (step ST8), the four chuck members 26 are driven, the substrate W is released from the spin chuck 20 (step ST9), and the substrate W is moved out of the chamber 10 by a transfer robot (not shown). It is carried out (step ST10).

  As described above, in the substrate processing mode MD1, the surface treatment is performed by supplying the chemical liquid and the pure water (rinsing liquid) to the substrate W. Although most of the chemical liquid and pure water splashed from the rotating substrate W are collected and drained by the processing cup 40, the processing liquid splashes outside the cup or the processing liquid splashed to the processing cup 40 is drained. May remain attached.

  In this way, the processing liquid adhering to the inside and outside of the processing cup 40 generates particles and the like when dried, and may become a contamination source for the processing target substrate W. For this reason, in the substrate processing apparatus 1 of the present embodiment, a cleaning mode MD2 (FIG. 9) described later is executed to clean the inside and outside of the processing cup 40.

<1.2.2 Cleaning mode MD2>
The cleaning mode MD2 is different from the above-described substrate processing mode MD1 executed at the timing when the substrate W exists in the chamber 10, and the timing at which the substrate processing is not performed because the substrate W does not exist in the chamber 10 (for example, This mode is executed at the interval of lot processing). The cleaning mode MD2 is
(1) When a predetermined number of substrates are processed in the “number standard”, that is, the substrate processing mode MD1,
(2) “Time reference”, that is, when the substrate processing apparatus 1 is operated for a predetermined time in the substrate processing mode MD1,
(3) “Failure cause occurrence criteria”, for example, when a deposit (detected) is detected inside or outside the processing cup 40 by a sensor (not shown), there is an obstacle to sustaining high-precision substrate processing. If we detect that
The mode is selected exceptionally or temporarily when a predetermined condition is satisfied, and the condition is set in the control unit 9 in advance.

  In the “number basis”, the cleaning mode MD2 is periodically executed on the basis of the number of processed substrates, and in the “time basis”, the cleaning mode MD2 is periodically executed on the basis of time. When viewed in terms of (number of sheets and time), the cleaning mode MD2 is periodically executed. On the other hand, in the “disturbance cause occurrence criteria”, such trouble causes do not always occur periodically, and thus the cleaning mode MD2 is often executed aperiodically.

  FIG. 9 is a flowchart showing the procedure of the cleaning mode MD2 in the substrate processing apparatus 1 of the present embodiment. Hereinafter, the cleaning mode MD2 will be described with reference to FIG.

  First, the cleaning jig 80 is carried into the chamber 10 by a transfer robot (not shown), and the cleaning jig 80 is mounted on the spin chuck 20 (step ST11: mounting process).

  Then, the partition plate 15 and the side wall 11 are cleaned (steps ST12 to ST13).

  The cleaning jig 80 is rotated around the axis CX by the spin motor 22 while being held by the spin chuck 20 (step ST12: rotation process). At this time, all of the inner cup 41, the middle cup 42, and the outer cup 43 positioned around the spin chuck 20 are lowered to the lowermost position, and the upper ends of the processing cup 40 (upper end portion 47b, upper end portion 52b, and upper end portion 43b). Is lower than the plurality of discharge ports 83 of the cleaning jig 80.

  In a state where the cleaning jig 80 is rotated, pure water is supplied from the ejection head 31 to the liquid receiving portion 81 via the supply port 82 of the cleaning jig 80 (step ST13: supply process).

  When pure water is supplied to the supply port 82 of the rotating cleaning jig 80, the pure water is deposited on the liquid receiving portion 81, which is the internal space of the cleaning jig 80, and the liquid receiving portion 81 is rotated by the centrifugal force of rotation. It flows from the inside toward the outside. As described above, the bottom surface of the liquid receiving portion 81 is provided with the inclined surface 81a that is inclined upward from the center side toward the outer peripheral side. For this reason, in step ST13, pure water flows along the inclined surface 81a and is scattered obliquely upward from the plurality of discharge ports 83. Since the upper end of the processing cup 40 is lower than the discharge port 83 of the cleaning jig 80, the pure water scattered from the rotating cleaning jig 80 is removed from the upper surface of the partition plate 15 as shown in FIG. And it will pour onto the side wall 11 of the chamber 10. When pure water scattered from the cleaning jig 80 pours down, the upper surface of the partition plate 15 and the side wall 11 of the chamber 10 are cleaned.

  Next, the cleaning process of the processing cup 40 is performed (step ST14 to step ST16).

  The processing cup 40 includes an inner cup 41, a middle cup 42, and an outer cup 43 that can be moved up and down independently of each other, and the inner side surfaces of the inner cup 41, the middle cup 42, and the outer cup 43 function as a guide portion. That is, the processing cup 40 is provided with a plurality of guide portions along the height direction. When cleaning the inside of the cup, the outer cup 43, the middle cup 42, and the inner cup 41 are sequentially raised around the cleaning jig 80 held by the spin chuck 20.

  When cleaning the inside of the outer cup 43, as shown in FIG. 11, only the outer cup 43 rises (step ST14). As a result, the upper end portion 43b of the outer cup 43 becomes higher than the plurality of discharge ports 83 of the cleaning jig 80, and the cleaning jig is interposed between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the middle cup 42. An opening OPa surrounding the periphery of the plurality of discharge ports 83 of the tool 80 is formed.

  Since the discharge head 31 continues to supply pure water to the rotating cleaning jig 80 from step ST13, the supplied pure water is supplied to the plurality of discharge ports 83 by the centrifugal force accompanying the rotation of the cleaning jig. To the inside of the outer cup 43. As a result, the pure water splashed from the plurality of discharge ports 83 of the cleaning jig 80 pours onto the upper surface of the middle cup 42 at the same time as the inner surface of the outer cup 43, and the inner surface of the outer cup 43 and the upper surface of the middle cup 42. Will be washed.

  When the inside of the middle cup 42 is washed, as shown in FIG. 12, the outer cup 43 and the middle cup 42 are raised, and only the inner cup 41 is lowered (step ST15). As a result, the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the middle cup 42 become higher than the plurality of discharge ports 83 of the cleaning jig 80, and the upper end portion 52b of the middle cup 42 and the upper end portion 47b of the inner cup 41 are obtained. The opening OPb surrounding the periphery of the plurality of discharge ports 83 of the cleaning jig 80 is formed.

  Since the discharge head 31 continues to supply pure water to the rotating cleaning jig 80 from step ST13, the supplied pure water is supplied to the plurality of discharge ports 83 by the centrifugal force accompanying the rotation of the cleaning jig. From the inside toward the inside of the middle cup 42. As a result, the pure water splashed from the plurality of discharge ports 83 of the cleaning jig 80 pours onto the upper surface of the inner cup 41 at the same time as the inner surface of the middle cup 42, and the inner surface of the middle cup 42 and the upper surface of the inner cup 41. Will be washed.

  Further, when cleaning the inside of the inner cup 41, as shown in FIG. 13, all of the outer cup 43, the middle cup 42 and the inner cup 41 are raised (step ST16). As a result, the upper end portion 43b of the outer cup 43, the upper end portion 52b of the middle cup 42, and the upper end portion 47b of the inner cup 41 are all higher than the plurality of discharge ports 83 of the cleaning jig 80. An opening OPc is formed in which the one guide portion 47 surrounds the periphery thereof at the same height as the plurality of discharge ports 83 of the cleaning jig 80.

  Since the discharge head 31 continues to supply pure water to the rotating cleaning jig 80 from step ST13, the supplied pure water is supplied to the plurality of discharge ports 83 by the centrifugal force accompanying the rotation of the cleaning jig. From the inside toward the inside of the inner cup 41. As a result, the pure water splashed from the plurality of discharge ports 83 of the cleaning jig 80 pours onto the inner side surface (first guide portion) of the inner cup 41 and the inner side surface of the inner cup 41 is cleaned.

  As described above, in steps ST14 to ST16, the inner cup 41, the inner cup 42, and the outer cup 43 are moved up and down, so that each of the three guide portions formed by the inner side surface of each cup becomes the cleaning jig 80. Each guide part is washed so as to be positioned around the plurality of discharge ports 83.

  After the cleaning process inside the processing cup 40 is completed as described above, a drying process is performed (steps ST17 to ST22).

  When performing the drying process, first, the supply of pure water from the upper surface treatment liquid nozzle 30 is stopped, and the rotation of the cleaning jig 80 by the spin motor 22 is stopped (step ST17).

  All of the inner cup 41, the inner cup 42 and the outer cup 43 are lowered to the lowest position, and the upper end (upper end portion 47b, upper end portion 52b and upper end portion 43b) of the processing cup 40 is lower than the holding surface 21a of the spin base 21. (Step ST18).

  In this state, the cleaning jig 80 is rotated at high speed around the axis CX by driving the spin motor 22 (step ST19). As the cleaning jig 80 is rotated at a high speed, a spiral airflow is formed in the chamber 10. By blowing the airflow generated along with the rotation of the cleaning jig 80, the cleaning jig 80, the upper surface of the processing cup 40, the upper surface of the partition plate 15, and the side wall 11 of the chamber 10 are dried.

  Further, together with the rotation of the cleaning jig 80, an inert gas (nitrogen in this embodiment) is sprayed from the two-fluid nozzle 60 onto the upper surface of the processing cup 40 (step ST20). In addition to the airflow generated by the rotation of the cleaning jig 80, an inert gas is blown from the two-fluid nozzle 60, whereby the cleaning jig 80, the upper surface of the processing cup 40, the upper surface of the partition plate 15, and the chamber 10 The drying efficiency of the side wall 11 can be increased.

  When the blowing of nitrogen from the two-fluid nozzle 60 is stopped and the drying process is completed, the rotation of the spin base 21 is also stopped (step ST21).

  Then, the cleaning jig 80 is released from the spin chuck 20 and carried out of the chamber 10 by a transfer robot (not shown) (step ST22).

  The overall flow of the cleaning mode MD2 has been described above. Hereinafter, the operation of each unit in the cleaning mode MD2 in particular in steps ST12 to ST16 will be described in more detail. FIG. 14 is a time chart showing the operation of each part in step ST12 to step ST16. Time t0 to time t12 is an index indicating the passage of time.

  Time t0 to time t3 is a period in which the cleaning liquid is scattered from the cleaning jig 80 in a state where each cup is lowered, and the partition plate 15 and the side wall 11 are cleaned (step ST12 to step ST13 in FIG. 9). , FIG. 10).

  From time t3 to time t6, the cleaning liquid is scattered from the cleaning jig 80 in a state where the outer cup 43 is raised and the middle cup 42 and the inner cup 41 are lowered, and the cleaning process inside the outer cup 43 is executed. (Step ST14 in FIG. 9, FIG. 11).

  From time t6 to time t9 is a period in which the cleaning liquid is scattered from the cleaning jig 80 in a state where the outer cup 43 and the middle cup 42 are raised and the inner cup 41 is lowered, and the inner cup 42 is cleaned. (Step ST15 in FIG. 9, FIG. 12).

  Time t9 to time t12 is a period in which the cleaning liquid is scattered from the cleaning jig 80 in a state where each cup is raised, and the cleaning process inside the inner cup 41 is executed (step ST16 in FIG. 9, FIG. 13).

  In the cleaning mode MD2 of the present embodiment, as a rotation process of the cleaning jig 80, an acceleration process (time t0 to time t1, time t3 to time) for accelerating the rotation of the cleaning jig 80 in the early stage of cleaning of each part. t4, time t6 to time t7, time t9 to time t10), and a constant speed process (time t1 to time t2, time t4 to time t5, time to rotate the cleaning jig 80 at a predetermined speed in the middle of the cleaning of each part. t7 to time t8, time t10 to time t11), and a decelerating step (time t2 to time t3, time t5 to time t6, time t8 to time t9) for decelerating the rotation of the cleaning jig 80 at the end of the cleaning of each part. Time t11 to time t12).

  As described above, when pure water is supplied from the discharge head 31 to the supply port 82 of the rotating cleaning jig 80, the pure water lands on the bottom surface of the cleaning jig 80 and then the outer periphery from the center by centrifugal force. It flows toward. At this time, the pure water supplied from the discharge head 31 and having landed on the bottom surface of the cleaning jig 80 does not have a speed component in the rotating direction. On the other hand, the pure water supplied near the center and flowing toward the outer periphery gradually has a speed component in the rotation direction of the cleaning jig 80 due to friction with the bottom surface of the rotating cleaning jig 80. Become. As a result, the pure water that flows from the center of the cleaning jig 80 toward the outer periphery does not normally flow linearly along the centrifugal direction of the cleaning jig 80, but at the bottom surface of the cleaning jig 80. It flows while drawing a trajectory that curves from the centrifugal direction.

  The locus of pure water indicated by the arrow AR1 in FIG. 15 is a locus of relative movement of pure water with respect to the bottom surface of the cleaning jig 80 in the acceleration process.

  Further, the locus of pure water indicated by an arrow AR2 in FIG. 15 is a locus of relative movement of pure water with respect to the bottom surface of the cleaning jig 80 in the deceleration process. Unlike the arrow AR1, the arrow AR2 is directed in the forward direction of the rotation tangent (counterclockwise direction shown in FIG. 15) because the rotational speed generated by the rotational inertia of the pure water itself is reduced by the cleaning jig 80. This is because it is larger than the rotation speed.

  As described above, the discharge shafts 83a (the central axes of the substantially cylindrical discharge ports 83) of the plurality of discharge ports 83 of the cleaning jig 80 are inclined with respect to the centrifugal direction of rotation by the spin motor 22, and the respective discharge ports. It points to the front side of the rotation tangent. This directivity corresponds to the arrow AR2.

  For this reason, in the acceleration process and the constant speed process, while a part of the pure water WT supplied to the liquid receiving part 81 of the cleaning jig 80 is discharged from the plurality of discharge ports 83, the remaining pure water WT is liquid. It is stored on the outer peripheral side inside the receiving portion 81 (FIG. 16A). On the other hand, in the deceleration process, the directivity of the pure water WT in the liquid receiving portion 81 and the directivity of the discharge port 83 provided in the cleaning jig 80 correspond to each other. Pure water WT ejects vigorously from the plurality of discharge ports 83 (FIG. 16B). As a result, in the deceleration process (time t2 to time t3, time t5 to time t6, time t8 to time t9, time t11 to time t12), each part (around the cleaning jig 80) can be particularly strongly cleaned. it can. As described above, since the pure water flows in the direction of the arrow AR2 in the deceleration process is due to the rotational inertia of the pure water itself, if the deceleration of the rotational speed in the deceleration process is a rapid deceleration (for example, a sudden stop). The rotational inertia can be sufficiently exerted, and pure water can be ejected more vigorously.

  As shown in FIG. 14, the cleaning mode MD2 of the present embodiment has a cleaning processing period (time t0 to time t3) for the partition plate 15 and the side wall 11, and a cleaning processing period (time t3 to time t6) inside the outer cup 43. A deceleration process is included in any of the cleaning process period (time t6 to time t9) inside the inner cup 42 and the cleaning process period (time t9 to time t12) inside the inner cup 41. For this reason, it is possible to perform effective cleaning by executing strong injection (strong cleaning) of pure water by the above-described cleaning jig 80 in all of the cleaning target portions.

  In addition, each element in the chamber 10 such as the spin chuck 20 and the upper surface treatment liquid nozzle 30 is originally used for performing a surface treatment on the substrate W, and the components other than the substrate W are cleaned. It is not provided for the purpose. In this embodiment, a cleaning jig 80 is provided, and the cleaning mode MD2 is executed by using the cleaning jig 80 and each element (such as the spin chuck 20) in the chamber 10. Thus, since each part originally used for substrate processing is also used for execution of the cleaning mode MD2, it is not necessary to newly provide a large member such as a cleaning nozzle for the purpose of using the chamber 10 for cleaning. An increase in the size of the unit UT can be suppressed.

<2 Modification>
While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention. For example, in the above-described embodiment, the cleaning liquid used in the substrate processing mode MD1 and the cleaning mode MD2 is pure water. However, the present invention is not limited to this. May be. Moreover, in the said embodiment, although the gas used by washing | cleaning mode MD2 was made into nitrogen, it is not limited to this, Various gas can be utilized. From the viewpoint of substrate processing, this gas is preferably an inert gas.

  The two modes described above are merely examples of the processing mode, and other modes such as a mode in which the processing liquid is supplied to the lower surface of the substrate W from the lower surface processing liquid nozzle 28 may be adopted.

  The number of each part (upper surface treatment liquid nozzle 30, chuck member 26, etc.) in the substrate processing apparatus 1 and the arrangement of each part are matters that can be freely changed in design.

  Further, in the cleaning mode MD2 of the above embodiment, after starting the rotation process of rotating the cleaning jig 80, the aspect of starting the supply process of supplying pure water to the cleaning jig 80 (FIG. 9) Although explained, it is not limited to this. The rotation process and the supply process may be started at the same time, or the rotation process may be started after the supply process is started. If the rotational speed of the cleaning jig 80 is reduced in a state where pure water is supplied to the cleaning jig 80 that is mounted and rotated on the spin chuck 20, regardless of whether the start time of these processes starts or after, The powerful cleaning can be realized by utilizing the directivity of the plurality of discharge ports 83 of the cleaning jig 80.

  Moreover, in the said embodiment, the cleaning process period (time t0 to time t3) of the partition plate 15 and the side wall 11, the cleaning process period inside the outer cup 43 (time t3 to time 6), and the cleaning process inside the middle cup 42 Although the aspect (FIG. 14) which has a deceleration process in the cleaning period of any part of the period (time t6 to time t9) and the cleaning process period (time t9 to time t12) inside the inner cup 41 has been described, It is not limited to this. In the case where a portion where strong cleaning is performed is a part (for example, when strong cleaning is performed only for cleaning of the partition plate 15 and the side wall 11), there is a deceleration step only in the portion, and other portions (each cup ) May have an aspect without a deceleration step (FIG. 17). In this way, by controlling at which timing the deceleration process is performed by the control unit 9 according to the processing recipe, it is possible to adjust the splashing power of pure water from the cleaning jig 80 over time. .

  In the above embodiment, the substrate processing apparatus 1 includes one cleaning jig 80. However, the substrate processing apparatus 1 includes a plurality of cleaning jigs 80 (hereinafter referred to as “cleaning jig set”). It may be an aspect provided with a In particular, it has a cleaning jig set composed of a plurality of cleaning jigs 80 having different inclination angles of the inclined surfaces 81a, and the one cleaning jig 80 is selected and mounted on the spin chuck 20. In the substrate processing apparatus that executes the cleaning mode MD2, it becomes possible to discharge pure water at an inclination angle corresponding to the inclined surface 81a (inclination from the horizontal plane) of the cleaning jig 80 to be selected. Cleaning can be realized.

  In each of the above embodiments, the processing cup 40 includes the inner cup 41, the middle cup 42, and the outer cup 43 that can be moved up and down independently of each other. However, the three cups are integrally configured to move up and down. May be. When the three cups are integrally stacked in multiple stages along the height direction, the cups may be moved up and down sequentially so as to surround the holding surface 21a of the spin base 21. Further, the processing cup 40 may include only a one-stage cup surrounding the spin base 21.

  The substrate to be processed by the substrate processing apparatus 1 is not limited to a semiconductor substrate, and may be various substrates such as a glass substrate used for a flat panel display such as a liquid crystal display device.

  Further, in each of the above-described embodiments, the aspect in which the supply amount per unit time of pure water supplied from the upper surface treatment liquid nozzle 30 during the cleaning mode MD2 is not variable has been described, but the supply amount is variably adjusted. It may be an aspect to do.

  Although the substrate processing apparatus according to the embodiment and its modification has been described above, these are examples of the preferred embodiment of the present invention, and do not limit the scope of implementation of the present invention. Within the scope of the invention, the present invention can be freely combined with each embodiment, modified with any component in each embodiment, or omitted with any component in each embodiment.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 9 Control part 10 Chamber 20 Spin chuck 21 Spin base 22 Spin motor 26 Chuck member 30 Upper surface process liquid nozzle 31 Discharge head 32 Nozzle arm 33 Nozzle base 40 Process cup 41 Inner cup 42 Medium cup 43 Outer cup 80 Cleaning Jig 81 Liquid receiving portion 81a Inclined surface 82 Supply port 83 Discharge port 83a Discharge shaft CX Axis MD1 Substrate processing mode MD2 Cleaning mode OPa, OPb, OPc Opening UT processing unit

Claims (8)

(a) substrate holding means for holding the substrate in a horizontal position;
Rotating means for rotating the substrate holding means;
Cleaning liquid supply means for supplying a cleaning liquid from above the substrate holding means;
A cup surrounding the periphery of the substrate holding means;
A processing unit having
(b) a cleaning jig having an outer size corresponding to the substrate in a plan view and removably held by the substrate holding means;
A liquid receiver,
A supply port for receiving the cleaning liquid supplied from the cleaning liquid supply means and supplying the cleaning liquid to the liquid receiving portion;
A plurality of discharge ports provided along the outer peripheral side of the cleaning jig, for discharging the cleaning liquid received by the liquid receiving portion;
A cleaning jig having
With
The substrate processing apparatus according to claim 1, wherein the discharge shafts of the plurality of discharge ports are inclined from the centrifugal direction of rotation by the rotating means and are directed to the front side of the rotation tangent of the discharge ports. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the cleaning jig has an inclined surface inclined upward from a center side toward an outer peripheral side at a bottom surface of the liquid receiving portion. The substrate processing apparatus according to claim 1 or 2, wherein
The substrate holding means includes a plurality of chuck members for gripping the outer peripheral edge of the substrate,
When the outer peripheral end of the cleaning jig is gripped by the plurality of chuck members, the plurality of discharge ports of the cleaning jig are arranged at different height positions from the plurality of chuck members. A substrate processing apparatus. A cleaning jig for cleaning the inside of the processing unit by being supplied with a cleaning liquid while being detachably mounted on the substrate holding means of the processing unit and rotated.
A supply port to which the cleaning liquid is supplied;
A liquid receiver that receives the cleaning liquid supplied from the supply port;
A plurality of discharge ports provided along the outer peripheral side of the cleaning jig, for discharging the cleaning liquid received by the liquid receiving portion;
Have
Each of the discharge ports of the plurality of discharge ports is inclined from the centrifugal direction of rotation and is directed to the front side of the rotation tangent of each discharge port. The cleaning jig according to claim 4,
A cleaning jig, wherein the bottom surface of the liquid receiving portion has an inclined surface inclined upward from the center side toward the outer peripheral side. A set of a plurality of cleaning jigs each corresponding to the cleaning jig according to claim 5,
The cleaning jig set, wherein the inclined angles of the inclined surfaces of the plurality of cleaning jigs are different from each other. A processing unit according to claim 1;
A cleaning jig set according to claim 6;
With
The cleaning liquid supply means supplies the cleaning liquid to one cleaning jig selected from the plurality of cleaning jigs and detachably held by the substrate holding means,
The substrate processing apparatus, wherein the cleaning liquid is discharged from the one cleaning jig by the rotation of the rotating means. For a processing unit that performs a predetermined process on the substrate while rotating the substrate while holding the substrate in a horizontal posture by a predetermined substrate holding unit, a method of cleaning a predetermined part existing around the substrate holding unit in the processing unit There,
(A) a mounting step of mounting and holding a predetermined cleaning jig having a liquid receiving portion on the substrate holding means instead of the substrate during a period when the predetermined processing is not performed;
(B) a supply step of supplying a cleaning liquid to the liquid receiving portion via a predetermined supply port of the cleaning jig;
(C) a rotating step of rotating the cleaning jig together with the substrate holding means;
(D) a deceleration step of decelerating the rotation;
With
The cleaning jig communicates with the liquid receiving portion and has a plurality of discharge ports formed along the outer peripheral side of the cleaning jig,
Each discharge axis of the plurality of discharge ports is inclined from the centrifugal direction of rotation in the rotation step and is directed to the front side of the rotation tangent of each discharge port,
The cleaning method according to claim 1, wherein the cleaning liquid is ejected from the plurality of discharge ports toward the predetermined portion in the deceleration step due to the rotational inertia of the cleaning liquid itself in the liquid receiver.

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