JP2015046457A - Substrate processing apparatus and cleaning tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning process technology capable of suppressing unintended liquid splashing of a cleaning liquid.SOLUTION: A cleaning tool CT instead of a normal substrate is attached on a spin chuck 20. The cleaning tool CT comprises a flat base surface 71 and an inclined surface 72 which is disposed throughout the whole periphery of the peripheral edge of the base surface 71, inclining upward toward the outer periphery from the center of the base surface 71. A cleaning liquid is supplied in the vicinity of the center of the base surface 71 from a discharge head 31 while rotating the cleaning tool CT. The cleaning liquid flows toward the outer periphery from the center of the cleaning tool CT by centrifugal force and is splashed obliquely upward from the inclined surface 72. As the base surface 71 and the inclined surface 72 make a continuous surface over the whole periphery of the peripheral edge of the base surface 71, the cleaning liquid supplied to the base surface 71 is smoothly guided to the inclined surface 72; therefore, the cleaning liquid can be splashed obliquely upward while suppressing unintended liquid splashes.

Description

  The present invention relates to a cleaning technique for a substrate processing apparatus that performs liquid processing on a thin precision electronic substrate (hereinafter simply referred to as “substrate”) such as a semiconductor wafer or a glass substrate for a liquid crystal display device.

  2. Description of the Related Art Conventionally, in a substrate manufacturing process, a substrate processing apparatus that performs a drying process after performing a surface treatment of a substrate such as a chemical treatment using a chemical solution and a rinsing treatment using pure water has been used. As such a substrate processing apparatus, a single-wafer type apparatus that processes substrates one by one and a batch-type apparatus that collectively processes a plurality of substrates are used. A single-wafer type substrate processing apparatus usually performs a chemical treatment by supplying a chemical solution to the surface while rotating a substrate held by a spin chuck, a pure water rinsing process by supplying pure water, and then a substrate. Rotate at a high speed to dry off.

  In such a single-wafer type substrate processing apparatus, a cup is arranged so as to surround the periphery of the rotating substrate, and the processing liquid scattered from the spin chuck and the substrate by centrifugal force is received and collected. Since liquid drops containing chemicals and contaminants adhere to the cup, the contamination of the cup proceeds as the number of processed substrates increases.

  Also in a spin coating apparatus that forms a coating film by supplying a coating solution such as a resist to the surface of a rotating substrate, a cup for receiving the scattered coating solution is disposed around the substrate. In such a spin coater, when the scattered coating liquid adheres to the cup and dries, the resist deposition layer may adhere to the cup wall surface, which may become a significant contamination source.

  For this reason, Patent Document 1 discloses a technique for cleaning a cup by holding a cleaning substrate having a plurality of fins on a spin chuck, supplying a cleaning solution to the rotating cleaning substrate, and spraying the cleaning solution obliquely upward from the fins. Is disclosed. Patent Document 2 discloses a technique of rotating a spin base for holding a substrate, supplying a cleaning liquid to the upper surface of the spin base, and cleaning the cup with the cleaning liquid scattered from the rotating spin base. Yes.

JP 2000-315671 A JP 2012-231049 A

  However, as disclosed in Patent Literatures 1 and 2, when the cleaning liquid is supplied to the rotating plate-shaped member, the cleaning liquid flows toward the outer periphery of the rotating member by centrifugal force, and the friction of the rotating member causes the rotation of the rotating member. It also flows in the circumferential direction. Then, as in Patent Document 1, when a plurality of fins are provided at predetermined intervals along the circumferential direction of the cleaning substrate, the liquid splashes that are not controlled due to the collision of the cleaning liquid from the side surfaces of the fins. The cleaning liquid droplets land on an unintended part (for example, outside the cup) of the apparatus and become a new contamination source.

  Further, as in Patent Document 2, when the cleaning liquid is supplied directly to the spin base, the cleaning liquid collides with the chuck pins provided so as to protrude from the upper surface of the spin base, and an unintended liquid splash occurs. Become. Even if such unintended random splashing occurs, the cleaning liquid droplets similarly land on unintended sites in the apparatus and become a new source of contamination.

  This invention is made | formed in view of the said subject, and it aims at providing the washing processing technique which can suppress the liquid splash of the washing liquid which is not intended.

  In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus, wherein a substrate holding means for holding a substrate, a rotating means for rotating the substrate holding means, a cup surrounding the periphery of the substrate holding means, A cleaning jig mounted on the substrate holding means, and a cleaning liquid supply means for supplying a cleaning liquid to the cleaning jig mounted on the substrate holding means, the cleaning jig having a flat base And an inclined surface that is provided over the entire periphery of the upper surface peripheral portion of the base surface and is inclined upward from the center of the base surface toward the outer periphery.

  According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the invention, the inclined surface is inclined upward from the same height position as the base surface along the circumferential direction of the base surface. It is characterized by.

  The invention according to claim 3 is the substrate processing apparatus according to claim 2, wherein the inclined surface gradually increases in height in a direction opposite to the rotation direction of the substrate holding means by the rotating means. It is inclined along the circumferential direction of the base surface.

  According to a fourth aspect of the present invention, in the substrate processing apparatus according to the second or third aspect of the present invention, the inclined surface is divided into a plurality along the circumferential direction of the base surface, and the plurality of divided inclinations are provided. Each of the surfaces is inclined upward from the same height position as the base surface.

  According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect of the present invention, the width of each of the plurality of inclined surfaces gradually decreases from the lowest height position to the highest height position. It is characterized by.

  According to a sixth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fifth aspects of the present invention, the substrate holding means includes a plurality of chuck pins for gripping an outer peripheral end of the substrate, The inclined surface of the cleaning jig mounted on a holding unit covers the plurality of chuck pins.

  According to a seventh aspect of the present invention, the cup surrounding the substrate holding means is cleaned by rotating in a predetermined rotation direction while being supplied with the cleaning liquid while being attached to the substrate holding means of the substrate processing apparatus. And a flat base surface, and an inclined surface that is provided over the entire periphery of the upper surface peripheral edge of the base surface and is inclined upward from the center of the base surface toward the outer periphery. It is characterized by that.

  The invention according to claim 8 is the cleaning jig according to claim 7, wherein the inclined surface is inclined upward from the same height position as the base surface along the circumferential direction of the base surface. It is characterized by that.

  The invention of claim 9 is the cleaning jig according to the invention of claim 8, wherein the inclined surface is inclined so as to gradually increase in height from the base surface in a direction opposite to the rotational direction. It is characterized by that.

  The invention of claim 10 is the cleaning jig according to claim 8 or claim 9, wherein the inclined surface is divided into a plurality along the circumferential direction of the base surface. Each of the inclined surfaces is inclined upward from the same height position as the base surface.

  The invention of claim 11 is the cleaning jig according to the invention of claim 10, wherein each of the plurality of inclined surfaces gradually narrows from the lowest height position to the highest height position. It is characterized by that.

  According to the first to sixth aspects of the present invention, since the inclined surface is provided over the entire circumference of the upper surface peripheral portion of the base surface, the supplied cleaning liquid flows in the circumferential direction in addition to the radial direction of the rotating base surface. Even in such a case, the liquid is smoothly guided from the base surface to the inclined surface, and unintentional splashing of the cleaning liquid can be suppressed.

  In particular, according to the invention of claim 6, since the inclined surface of the cleaning jig covers the plurality of chuck pins provided on the substrate holding means, the cleaning does not collide with the chuck pins, and the intention by the chuck pins It is also possible to suppress splashing of the cleaning liquid that is not performed.

  According to the seventh to eleventh aspects of the invention, since the inclined surface is provided over the entire periphery of the upper surface peripheral portion of the base surface, the supplied cleaning liquid flows in the circumferential direction in addition to the radial direction of the rotating base surface. Even in such a case, the liquid is smoothly guided from the base surface to the inclined surface, and unintentional splashing of the cleaning liquid can be suppressed.

1 is a plan view of a substrate processing apparatus according to the present invention. It is a longitudinal cross-sectional view of the substrate processing apparatus of FIG. It is a top view which shows the jig | tool for washing | cleaning with which the spin chuck was mounted | worn. It is sectional drawing seen from the AA line of FIG. It is a figure which shows the behavior of the washing | cleaning liquid supplied to the rotating jig | tool for rotation. It is a perspective view which shows the jig | tool for washing | cleaning of 2nd Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 3rd Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 4th Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 5th Embodiment. It is a perspective view which shows the jig | tool for washing | cleaning of 6th Embodiment. It is an expanded sectional view of a chuck pin. It is sectional drawing which shows an example of the fixing method of the jig | tool for washing | cleaning. It is sectional drawing which shows an example of the fixing method of the jig | tool for washing | cleaning.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In FIG. 1 and the subsequent drawings, the size and number of each part are exaggerated or simplified as necessary for easy understanding.

<First Embodiment>
FIG. 1 is a plan view of a substrate processing apparatus 1 according to the present invention. FIG. 2 is a longitudinal sectional view of the substrate processing apparatus 1. The substrate processing apparatus 1 is a single wafer processing apparatus that processes substrates W for semiconductor use one by one, and a rinsing process using a chemical processing and a rinsing liquid such as pure water or alcohol on a circular silicon substrate W. After performing the drying process. More specifically, the substrate W is supplied with a chemical solution such as an SC1 solution, a DHF solution, or an SC2 solution to clean the substrate W (chemical solution treatment), and then rinsed with a rinse solution to perform the rinsing process. This is a single-wafer type substrate processing apparatus that removes a chemical solution from above and finally performs a drying process on the substrate W. FIG. 1 shows a state where the substrate W is not held on the spin chuck 20, and FIG. 2 shows a state where the substrate W is held on the spin chuck 20.

  The substrate processing apparatus 1 includes a spin chuck 20 that holds the substrate W as a main element in a horizontal posture (a posture in which the normal line is along the vertical direction) in the chamber 10, and an upper surface of the substrate W held by the spin chuck 20. An upper surface processing liquid nozzle 30 for supplying a liquid and a processing cup 40 surrounding the periphery of the spin chuck 20 are provided. A partition plate 15 is provided around the processing cup 40 in the chamber 10 to partition the inner space of the chamber 10 up and down. In the present specification, the treatment liquid is a generic name including all of the chemical liquid, the rinse liquid, and the cleaning liquid.

  The chamber 10 includes a side wall 11 along the vertical direction, a ceiling wall 12 that closes an upper side of a space surrounded by the side wall 11, and a floor wall 13 that closes a lower side. A space surrounded by the side wall 11, the ceiling wall 12, and the floor wall 13 is a processing space for the substrate W. Further, a part of the side wall 11 of the chamber 10 is provided with a carry-in / out opening for carrying the substrate W in / out of the chamber 10 and a shutter for opening / closing the carry-in / out opening (both not shown).

  A fan filter unit (FFU) 14 for further purifying the air in the clean room in which the substrate processing apparatus 1 is installed and supplying it to the processing space in the chamber 10 is attached to the ceiling wall 12 of the chamber 10. . The fan filter unit 14 includes a fan and a filter (for example, a HEPA filter) for taking in air in the clean room and sending it out into the chamber 10, and forms a downflow of clean air in the processing space in the chamber 10. In order to disperse the clean air supplied from the fan filter unit 14 uniformly, a punching plate having a large number of blowing holes may be provided directly below the ceiling wall 12.

  The spin chuck 20 includes a disk-shaped spin base 21 fixed in a horizontal posture at the upper end of a rotating shaft 24 extending along the vertical direction. A spin motor 22 that rotates the rotating shaft 24 is provided below the spin base 21. The spin motor 22 rotates the spin base 21 in the horizontal plane via the rotation shaft 24. Further, a cylindrical cover member 23 is provided so as to surround the periphery of the spin motor 22 and the rotating shaft 24.

  The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. Therefore, the spin base 21 has a holding surface 21a that faces the entire lower surface of the substrate W to be held.

  A plurality (four in this embodiment) of chuck pins 26 are erected on the peripheral edge of the holding surface 21 a of the spin base 21. The plurality of chuck pins 26 are evenly spaced along the circumference corresponding to the outer circumference of the circular substrate W (if there are four chuck pins 26 as in this embodiment, the chuck pins 26 are spaced at 90 ° intervals. ) Is arranged. FIG. 11 is an enlarged cross-sectional view of the chuck pin 26. As shown in this figure, the chuck pin 26 has a base member 26a connected by a link mechanism (not shown) housed in the spin base 21 and a V-shaped member that is connected to the base member 26a and sandwiches the substrate W. The holding member 26c is formed with a groove 26b.

  The plurality of chuck pins 26 are driven in conjunction with each other by a link mechanism. That is, the plurality of chuck pins 26 can be moved in conjunction with the radial direction of the substrate W around the rotation axis CX of the spin base 21 by a link mechanism. When the link mechanism moves each chuck pin 26 inward in the radial direction, each of the plurality of chuck pins 26 is brought into contact with the outer peripheral end of the substrate W to grip the substrate W, thereby holding the substrate W on the spin base 21. It can hold | maintain in the horizontal attitude | position close to the holding surface 21a above (refer FIG. 2). Further, when the link mechanism moves each chuck pin 26 radially outward, each of the plurality of chuck pins 26 can be separated from the outer peripheral end of the substrate W to release the grip.

  The cover member 23 covering the spin motor 22 has a lower end fixed to the floor wall 13 of the chamber 10 and an upper end reaching just below the spin base 21. At the upper end portion of the cover member 23, a hook-like member 25 is provided that protrudes almost horizontally outward from the cover member 23 and further bends and extends downward. The spin motor 22 rotates the rotary shaft 24 in a state where the spin chuck 20 holds the substrate W by gripping by the plurality of chuck pins 26, thereby rotating around the rotation axis CX along the vertical direction passing through the center of the substrate W. The substrate W can be rotated. The driving of the spin motor 22 is controlled by the control unit 9.

  The upper surface treatment liquid nozzle 30 is configured by attaching a discharge head 31 to the tip of a nozzle arm 32. The proximal end side of the nozzle arm 32 is fixedly connected to the nozzle base 33. The nozzle base 33 can be rotated around an axis along the vertical direction by a motor (not shown). As the nozzle base 33 rotates, the discharge head 31 of the upper processing liquid nozzle 30 has an arc shape along the horizontal direction between the processing position above the spin chuck 20 and the standby position outside the processing cup 40. Move to. The upper surface treatment liquid nozzle 30 is configured to be supplied with a plurality of kinds of treatment liquids (including at least pure water). The processing liquid discharged from the discharge head 31 of the upper surface processing liquid nozzle 30 at the processing position is deposited on the upper surface of the substrate W held by the spin chuck 20. Further, the upper surface treatment liquid nozzle 30 can be swung above the holding surface 21 a of the spin base 21 by the rotation of the nozzle base 33.

  On the other hand, a lower surface treatment liquid nozzle 28 is provided along the vertical direction so as to pass through the inside of the rotation shaft 24. The upper end opening of the lower surface treatment liquid nozzle 28 is formed at a position facing the lower surface center of the substrate W held by the spin chuck 20. A plurality of types of processing liquids are also supplied to the lower surface processing liquid nozzle 28. The processing liquid discharged from the lower surface processing liquid nozzle 28 is deposited on the lower surface of the substrate W held by the spin chuck 20.

Further, the substrate processing apparatus 1 is provided with a two-fluid nozzle 60 in addition to the upper surface processing liquid nozzle 30. The two-fluid nozzle 60 is a nozzle that generates a droplet by mixing a treatment liquid such as pure water and a pressurized gas, and jets a mixed fluid (two-fluid) of the droplet and the gas onto the substrate W. . The two-fluid nozzle 60 is configured by attaching a liquid head (not shown) to the tip of a nozzle arm 62 and attaching a gas head 64 to a support member provided so as to branch from the nozzle arm 62. The base end side of the nozzle arm 62 is fixedly connected to the nozzle base 63. The nozzle base 63 can be rotated around an axis along the vertical direction by a motor (not shown). As the nozzle base 63 rotates, the two-fluid nozzle 60 moves in an arc along the horizontal direction between the processing position above the spin chuck 20 and the standby position outside the processing cup 40. A treatment liquid such as pure water is supplied to the liquid head, and a pressurized inert gas (nitrogen gas (N ₂ ) in this embodiment) is supplied to the gas head 64. The mixed fluid of the processing liquid ejected from the two-fluid nozzle 60 at the processing position is sprayed onto the upper surface of the substrate W held by the spin chuck 20.

  The processing cup 40 surrounding the spin chuck 20 includes an inner cup 41, an intermediate cup 42, and an outer cup 43 that can be moved up and down independently of each other. The inner cup 41 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the rotation axis CX that passes through the center of the substrate W held by the spin chuck 20. The inner cup 41 includes an annular bottom 44 in plan view, a cylindrical inner wall 45 rising upward from the inner periphery of the bottom 44, a cylindrical outer wall 46 rising upward from the outer periphery of the bottom 44, and an inner wall The first guide portion 47 that rises from between the portion 45 and the outer wall portion 46 and extends obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W held by the spin chuck 20) while drawing a smooth arc at the upper end portion. And a cylindrical middle wall portion 48 that rises upward from between the first guide portion 47 and the outer wall portion 46.

  The inner wall portion 45 is formed in such a length as to be accommodated with an appropriate gap between the cover member 23 and the bowl-shaped member 25 in a state where the inner cup 41 is raised most. The middle wall portion 48 is accommodated with a suitable gap between a second guide portion 52 (described later) of the middle cup 42 and the processing liquid separation wall 53 in a state where the inner cup 41 and the middle cup 42 are closest to each other. It is formed in such a length.

  The first guide portion 47 has an upper end portion 47b extending obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W) while drawing a smooth arc. Further, a space between the inner wall portion 45 and the first guide portion 47 is a disposal groove 49 for collecting and discarding the used processing liquid. A space between the first guide portion 47 and the middle wall portion 48 is an annular inner collection groove 50 for collecting and collecting used processing liquid. Further, a space between the middle wall portion 48 and the outer wall portion 46 is an annular outer collection groove 51 for collecting and collecting different types of processing liquids from the inner collection groove 50.

  The waste groove 49 is connected to an exhaust liquid mechanism (not shown) for discharging the processing liquid collected in the waste groove 49 and forcibly exhausting the inside of the waste groove 49. For example, four exhaust fluid mechanisms are provided at equal intervals along the circumferential direction of the discard groove 49. The inner recovery groove 50 and the outer recovery groove 51 have a recovery mechanism for recovering the processing liquid collected in the inner recovery groove 50 and the outer recovery groove 51, respectively, in a recovery tank provided outside the substrate processing apparatus 1. (Both not shown) are connected. The bottoms of the inner recovery groove 50 and the outer recovery groove 51 are inclined by a slight angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position. Thereby, the processing liquid that has flowed into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.

  The middle cup 42 surrounds the periphery of the spin chuck 20 and has a shape that is substantially rotationally symmetric with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The inner cup 42 is integrally provided with a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52.

  The second guide portion 52 draws a smooth arc on the outside of the first guide portion 47 of the inner cup 41 from the lower end portion 52a that is coaxial with the lower end portion of the first guide portion 47 and the upper end of the lower end portion 52a. However, it has an upper end 52b that extends obliquely upward in the center side (in the direction approaching the rotation axis CX of the substrate W) and a folded portion 52c that is formed by folding the tip of the upper end 52b downward. The lower end 52 a is accommodated in the inner collection groove 50 with an appropriate gap between the first guide portion 47 and the middle wall portion 48 in a state where the inner cup 41 and the middle cup 42 are closest to each other. The upper end portion 52b is provided so as to overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41 in the vertical direction, and the first guide portion 47 is in a state where the inner cup 41 and the middle cup 42 are closest to each other. And close to the upper end portion 47b with a very small distance. Further, the folded portion 52c formed by folding the tip of the upper end portion 52b downward is in a state where the inner cup 41 and the middle cup 42 are closest to each other, and the folded portion 52c is the tip of the upper end portion 47b of the first guide portion 47. It is the length which overlaps with the horizontal direction.

  Further, the upper end portion 52b of the second guide portion 52 is formed so as to increase in thickness toward the lower side, and the treatment liquid separation wall 53 is provided so as to extend downward from the lower peripheral edge of the upper end portion 52b. It has a cylindrical shape. The processing liquid separation wall 53 is accommodated in the outer collection groove 51 with an appropriate gap between the inner wall portion 48 and the outer cup 43 in a state where the inner cup 41 and the inner cup 42 are closest to each other.

  The outer cup 43 surrounds the periphery of the spin chuck 20 outside the second guide portion 52 of the middle cup 42 and is substantially rotationally symmetric with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. It has a shape. The outer cup 43 has a function as a third guide part. The outer cup 43 has a lower end portion 43a that is coaxially cylindrical with the lower end portion 52a of the second guide portion 52, and a center side while drawing a smooth arc from the upper end of the lower end portion 43a (in the direction approaching the rotation axis CX of the substrate W). The upper end portion 43b extends obliquely upward, and the folded portion 43c is formed by folding the tip end portion of the upper end portion 43b downward.

  The lower end portion 43a has an outer clearance groove with an appropriate gap between the processing liquid separation wall 53 of the inner cup 42 and the outer wall portion 46 of the inner cup 41 in a state where the inner cup 41 and the outer cup 43 are closest to each other. 51. The upper end portion 43b is provided so as to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and the upper end portion 52b of the second guide portion 52 is in a state where the middle cup 42 and the outer cup 43 are closest to each other. Close to each other with a very small distance. Further, the folded portion 43 c formed by folding the tip end portion of the upper end portion 43 b downward is in a state where the inner cup 42 and the outer cup 43 are closest to each other, and the folded portion 43 c is the same as the folded portion 52 c of the second guide portion 52. It is formed so as to overlap in the horizontal direction.

  Further, the inner cup 41, the middle cup 42, and the outer cup 43 can be moved up and down independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is provided with a lifting mechanism (not shown), and is lifted and lowered separately. As such an elevating mechanism, various known mechanisms such as a ball screw mechanism and an air cylinder can be employed.

  The partition plate 15 is provided so as to partition the inner space of the chamber 10 up and down around the processing cup 40. The partition plate 15 may be a single plate-like member surrounding the processing cup 40, or may be a combination of a plurality of plate-like members. Further, the partition plate 15 may be formed with through holes or notches penetrating in the thickness direction. In this embodiment, the partition plate 15 supports the nozzle bases 33 and 63 of the upper treatment liquid nozzle 30 and the two-fluid nozzle 60. A through hole is formed through which a support shaft is inserted.

  The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. Further, the edge portion surrounding the processing cup 40 of the partition plate 15 is formed to have a circular shape having a diameter larger than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not become an obstacle to the raising and lowering of the outer cup 43.

  An exhaust duct 18 is provided in a part of the side wall 11 of the chamber 10 and in the vicinity of the floor wall 13. The exhaust duct 18 is connected in communication with an exhaust mechanism (not shown). Of the clean air supplied from the fan filter unit 14 and flowing down in the chamber 10, the air that has passed between the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the apparatus.

  The hardware configuration of the control unit 9 provided in the substrate processing apparatus 1 is the same as that of a general computer. That is, the control unit 9 stores a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It is configured with a magnetic disk to be placed. When the CPU of the control unit 9 executes a predetermined processing program, each operation mechanism of the substrate processing apparatus 1 is controlled by the control unit 9, and processing in the substrate processing apparatus 1 proceeds.

  In the substrate processing apparatus 1 having the above-described configuration, the processing cup 40 can be cleaned by mounting the cleaning jig CT on the spin chuck 20 instead of the substrate W to be processed normally. FIG. 3 is a plan view showing the cleaning jig CT mounted on the spin chuck 20. 4 is a cross-sectional view taken along line AA of FIG.

  The cleaning jig CT is a substantially disk-shaped member. The diameter of the cleaning jig CT is at least larger than the diameter of the substrate W to be processed. That is, the diameter of the cleaning jig CT is larger than the diameter of the circle on which the plurality of chuck pins 26 are arranged. The cleaning jig CT is provided with an internal space 73 whose lower end is opened. A base surface 71 and an inclined surface 72 are formed on the upper surface of the cleaning jig CT.

  The cleaning jig CT can be detachably attached to the spin base 21 of the spin chuck 20. A method of mounting the cleaning jig CT on the spin base 21 can be set appropriately. For example, a gripping mechanism may be provided at the lower peripheral edge of the cleaning jig CT, and the outer peripheral end of the spin base 21 may be gripped by the gripping mechanism. Further, as shown in FIG. 12, a collar portion 74 having substantially the same thickness as that of a normal substrate W is provided along the entire outer surface of the bottom portion of the cleaning jig CT, and the collar portion 74 is gripped by a plurality of chuck pins 26. By doing so, the cleaning jig CT may be held on the spin chuck 20.

  Alternatively, as shown in FIG. 13, a fitting portion 76 that can accommodate the chuck pin 26 and a protruding portion 77 are provided on the bottom surface 75 of the cleaning jig CT. Further, on the upper surface of the holding surface 21 a of the spin base 21, a fitting portion 21 b having substantially the same size as the protruding portion 77 is formed at a position facing the protruding portion 77. Then, the cleaning jig CT may be mounted on the spin base 21 by fitting the protrusion 77 of the cleaning jig CT to the fitting portion 21 b of the spin base 21. Further, a recess 78 into which the arm of the transfer robot can enter is provided in the cleaning jig CT, and the cleaning jig CT is moved from the state in which the bottom surface 75 of the cleaning jig CT is in close contact with the holding surface 21a of the spin base 21. It is desirable to be able to remove from the holding surface 21a. Alternatively, the cleaning jig CT may simply be placed on the holding surface 21a of the spin base 21 by its own weight.

  When the cleaning jig CT is mounted on the spin chuck 20, all of the plurality of chuck pins 26 are accommodated in the internal space 73, and the plurality of chuck pins 26 are moved by the inclined surfaces 72 as shown in FIGS. Covered. The internal space 73 may be any space that can accommodate at least a plurality of chuck pins 26, and may be a plurality of individual spaces provided so as to correspond to the plurality of chuck pins 26 on a one-to-one basis, for example.

  The base surface 71 of the cleaning jig CT is a flat surface. When the cleaning jig CT is mounted on the spin chuck 20, the base surface 71 becomes a horizontal plane. The inclined surface 72 of the cleaning jig CT is formed over the entire periphery of the upper surface peripheral portion of the base surface 71. In the first embodiment, the inclined surface 72 has a substantially annular shape, and the height position of the inner peripheral end thereof is equal to the height position of the outer peripheral end of the base surface 71. That is, the base surface 71 and the inclined surface 72 form a continuous surface at the outer peripheral end of the base surface 71. However, the base surface 71 and the inclined surface 72 are not the same surface but form an obtuse angle of less than 180 °.

  As shown in FIG. 4, the inclined surface 72 is inclined upward from the center of the base surface 71 toward the outer periphery. That is, the inclined surface 72 is provided so that the height gradually increases from the center of the base surface 71 toward the outer periphery. The inclination angle of the inclined surface 72 with respect to the base surface 71 can be set appropriately. In the first embodiment, the inclination angle and the height position of the inclined surface 72 are constant over the entire circumference of the base surface 71.

  Next, the operation in the substrate processing apparatus 1 will be described. First, an outline of the processing procedure for the substrate W to be processed normally will be described. An outline of a general processing procedure of the substrate W in the substrate processing apparatus 1 is that a chemical solution is supplied to the surface of the substrate W to perform a predetermined chemical solution treatment, then pure water is supplied to perform a pure water rinse treatment, and then The substrate W is rotated at a high speed to perform a shake-off drying process. When processing the substrate W, the substrate W is held on the spin chuck 20 and the processing cup 40 moves up and down. When performing the chemical treatment, for example, only the outer cup 43 rises, and the substrate W held by the spin chuck 20 between the upper end portion 43b of the outer cup 43 and the upper end portion 52b of the second guide portion 52 of the middle cup 42 is used. An opening is formed to surround the periphery of the. In this state, the substrate W is rotated together with the spin chuck 20, and a chemical solution is supplied to the upper and lower surfaces of the substrate W from the upper surface processing liquid nozzle 30 and the lower surface processing liquid nozzle 28. The supplied chemical liquid flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered from the edge of the substrate W to the side. Thereby, the chemical treatment of the substrate W proceeds. The chemical solution splashed from the edge of the rotating substrate W is received by the upper end portion 43 b of the outer cup 43, flows down along the inner surface of the outer cup 43, and is collected in the outer collection groove 51.

  When performing the pure water rinsing process, for example, all of the inner cup 41, the middle cup 42 and the outer cup 43 are raised, and the periphery of the substrate W held by the spin chuck 20 is the first guide portion 47 of the inner cup 41. Surrounded by. In this state, the substrate W is rotated together with the spin chuck 20, and pure water is supplied to the upper and lower surfaces of the substrate W from the upper surface processing liquid nozzle 30 and the lower surface processing liquid nozzle 28. The supplied pure water flows along the upper and lower surfaces of the substrate W due to the centrifugal force generated by the rotation of the substrate W, and is eventually scattered from the edge of the substrate W to the side. Thereby, the pure water rinse process of the board | substrate W advances. The pure water splashed from the edge of the rotating substrate W flows down the inner wall of the first guide portion 47 and is discharged from the discard groove 49. In the case where pure water is collected by a path different from the chemical solution, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52b of the second guide portion 52 of the middle cup 42 and the first guide of the inner cup 41 are collected. An opening surrounding the periphery of the substrate W held by the spin chuck 20 may be formed between the upper end portion 47 b of the portion 47.

  When performing the swing-off drying process, all of the inner cup 41, the middle cup 42 and the outer cup 43 are lowered, and the outer upper surface 43 d of the upper end portion 43 b of the outer cup 43 is below the substrate W held by the spin chuck 20. Located in. In this state, the substrate W is rotated at a high speed together with the spin chuck 20, and water droplets adhering to the substrate W are shaken off by a centrifugal force, and a drying process is performed.

  As the processing of such a normal substrate W progresses, contaminants contained in the scattered processing liquid adhere and the contamination is gradually accumulated in the processing cup 40. In particular, the upper curved portions of the inner cup 41, the middle cup 42 and the outer cup 43, that is, the upper end portion 47b of the inner cup 41, the upper end portion 52b of the middle cup 42 and the inner side of the upper end portion 43b of the outer cup 43 are relatively contaminated. Easy to accumulate. If the contamination accumulated in the processing cup 40 is left as it is, it may reattach to the substrate W to be processed and cause processing defects.

  For this reason, in this embodiment, the processing cup 40 is cleaned using the cleaning jig CT. The cleaning of the processing cup 40 is preferably performed, for example, at a timing between processing lots when the processing of the substrate W to be processed is not performed.

  When cleaning the processing cup 40, the cleaning jig CT is mounted on the spin base 21 of the spin chuck 20 using any of the plurality of mounting methods described above. Regardless of which of the plurality of mounting methods described above is used, by attaching the cleaning jig CT to the spin chuck 20, the plurality of chuck pins 26 erected on the holding surface 21 a of the spin base 21 are inclined surfaces. 72.

  Subsequently, the processing cup 40 is moved up and down as appropriate. The processing cup 40 includes an inner cup 41, an intermediate cup 42, and an outer cup 43 that can be moved up and down independently of each other. Of these three cups, the cup to be cleaned is raised. For example, when cleaning the upper curved portion of the outer cup 43, only the outer cup 43 is raised, and an opening is formed between the upper end portion 43 b of the outer cup 43 and the upper end portion 52 b of the second guide portion 52 of the middle cup 42. Form. Further, when cleaning the upper curved portion of the middle cup 42, the middle cup 42 and the outer cup 43 are raised, and the upper end portion 52 b of the second guide portion 52 of the middle cup 42 and the first guide portion 47 of the inner cup 41. An opening is formed between the upper end portion 47b of the two. Further, when the upper curved portion of the inner cup 41 is washed, all of the inner cup 41, the middle cup 42 and the outer cup 43 are raised.

  In the present embodiment, only the outer cup 43 is raised to clean the outer cup 43. Although the height position of the outer cup 43 can be set appropriately, the outer cup 43 is raised so that the upper end portion 43b is at least higher than the upper end of the cleaning jig CT (the outer peripheral end of the inclined surface 72). Let In this state, the spin base 21 of the spin chuck 20 is rotated around the rotation axis CX by driving the spin motor 22. As the spin base 21 rotates, the cleaning jig CT mounted thereon also rotates. The rotation speed of the spin base 21 is not particularly limited and can be set to an appropriate value. The value is controlled by the control unit 9.

  While rotating the spin base 21, the nozzle base 33 of the upper treatment liquid nozzle 30 rotates the nozzle arm 32 to move the ejection head 31 above the cleaning jig CT that rotates. Then, a cleaning liquid (pure water in this embodiment) is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 of the rotating cleaning jig CT. Further, the nozzle base 33 may swing the nozzle arm 32 under the control of the control unit 9, and the discharge head 31 for supplying the cleaning liquid may be reciprocated within the range of the base surface 71.

  FIG. 5 is a diagram illustrating the behavior of the cleaning liquid supplied to the rotating cleaning jig CT. When the cleaning liquid is supplied to the vicinity of the center of the base surface 71 of the rotating cleaning jig CT, the cleaning liquid flows from the center of the base surface 71 toward the outer periphery by centrifugal force. Since the base surface 71 and the inclined surface 72 are continuous surfaces, the cleaning liquid that flows toward the outer periphery of the base surface 71 is smoothly guided along the inclined surface 72 from the base surface 71, and the cleaning jig CT. It is scattered toward the diagonally upward in the radial direction. The cleaning liquid splashed obliquely upward by the inclined surface 72 reaches the upper end portion 43b of the outer cup 43 as shown in FIG. As the cleaning liquid reaches, the contaminants attached to the upper end portion 43b, which is the curved portion of the outer cup 43, are washed away and cleaned. In other words, the inclination angle of the inclined surface 72 with respect to the base surface 71 depends on the positional relationship in the height direction between the cleaning jig CT and the outer cup 43, and the cleaning liquid scattered from the inclined surface 72 is at the upper end of the outer cup 43. Any angle that reaches 43b may be used.

  By the way, as described above, when the cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the upper surface of the base surface 71 of the rotating cleaning jig CT, a centrifugal force acts on the cleaning liquid to move from the center of the base surface 71 to the outer periphery. The cleaning solution flows toward you. At this time, the cleaning liquid immediately after being supplied from the ejection head 31 onto the base surface 71 does not have a rotational speed component. On the other hand, the cleaning liquid that is supplied near the center of the base surface 71 and flows toward the outer periphery gradually has a velocity component in the rotational direction of the cleaning jig CT due to friction with the rotating base surface 71. . That is, the cleaning liquid flows toward the outer periphery of the cleaning jig CT due to centrifugal force, and also flows in the circumferential direction of the cleaning jig CT due to the inertia of the cleaning liquid itself. As a result, the cleaning liquid flowing from the center of the cleaning jig CT toward the outer periphery does not flow linearly along the radial direction of the disc-shaped cleaning jig CT, but is curved from the radial direction. It flows while drawing a trajectory.

  In the first embodiment, since the base surface 71 and the inclined surface 72 are continuous over the entire periphery of the peripheral portion of the base surface 71, the supplied cleaning liquid is directed toward the outer periphery of the cleaning jig CT. Even if it flows in the circumferential direction, it is smoothly guided from the base surface 71 to the inclined surface 72. That is, the supplied cleaning liquid does not collide with any member of the cleaning jig CT, and the splashing of the unintended cleaning liquid due to such a collision can be suppressed. As a result, contamination in the substrate processing apparatus 1 due to splashing can be prevented.

  Further, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surfaces 72 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

  In this way, the upper end portion 43b, which is a curved portion of the outer cup 43 where contamination is particularly likely to accumulate inside the outer cup 43, has the cleaning liquid scattered obliquely upward from the inclined surface 72 of the cleaning jig CT. It will be effectively washed by reaching. In the cleaning process, the outer cup 43 may be reciprocated up and down together with the scattering of the cleaning liquid from the cleaning jig CT. Furthermore, the speed of the cleaning liquid sprayed on the outer cup 43 may be changed by adjusting the number of rotations of the cleaning jig CT. By doing in this way, while being able to reach a washing | cleaning liquid with appropriate intensity | strength over the wide range of the inner wall face of the outer cup 43, the said inner wall face can be wash | cleaned efficiently. In particular, it is preferable to adjust the height position of the outer cup 43 and the number of rotations of the cleaning jig CT so that the cleaning liquid is sprayed with a strong force on the upper end portion 43b of the outer cup 43 where contamination easily accumulates. The inner wall surface can also be efficiently cleaned by adjusting the height position of the outer cup 43 and the number of rotations of the cleaning jig CT according to the accumulation degree of contamination on the inner wall surface of the outer cup 43.

  FIG. 5 illustrates the case where the outer cup 43 is washed, but even when the middle cup 42 and the inner cup 41 are washed, the washing can be performed in the same manner by raising the target cup. it can. In other words, by scattering the cleaning liquid from the cleaning jig CT, it is possible to clean the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

  In the first embodiment, since the base surface 71 and the inclined surface 72 are continuous over the entire periphery of the base surface 71 of the cleaning jig CT, the cleaning liquid supplied to the base surface 71 is smooth. Therefore, the cleaning liquid can be scattered obliquely upward while suppressing unintentional splashing of the cleaning liquid. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 where contamination is particularly likely to accumulate. Further, since the chuck pin 26 is also covered with the cleaning jig CT, it is possible to prevent the cleaning liquid from splashing by the chuck pin 26.

Second Embodiment
Next, a second embodiment of the present invention will be described. In the first embodiment, the height position of the inclined surface 72 along the circumferential direction of the base surface 71 is constant, but in the second embodiment, an inclined surface that is also inclined along the circumferential direction of the base surface 71 is provided. ing.

  FIG. 6 is a perspective view showing a cleaning jig CT of the second embodiment. As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space capable of accommodating a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown). When the cleaning jig CT is mounted on the spin chuck 20, the inclined surface 172 A plurality of chuck pins 26 are covered.

  A base surface 71 and an inclined surface 172 are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. The inclined surface 172 of the cleaning jig CT is annularly formed over the entire periphery of the upper surface peripheral portion of the base surface 71.

  In the second embodiment, the inclined surface 172 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Specifically, the height position of the base surface 71 is equal to the height position of the inner peripheral end of the inclined surface 172 at the flow guide port 173 among the outer peripheral ends of the base surface 71. In the example of FIG. 6, the inclined surface 172 is formed so that the height gradually increases in the clockwise direction from the vicinity of the flow inlet 173 along the circumferential direction of the base surface 71. Therefore, the lowest part of the inclined surface 172 in the vicinity of the flow inlet 173 and the highest part of the inclined surface 172 at a position slightly advanced counterclockwise from there form a step, and a wall surface 174 is formed between them. ing.

  Further, at the outer peripheral end of the base surface 71 excluding the flow inlet 173, the height position of the inner peripheral end of the inclined surface 172 is higher than the height position of the base surface 71, and the wall surface 175 is between them. Is formed. That is, in the second embodiment, the base surface 71 and the inclined surface 172 form a continuous surface at the flow guide port 173 in the outer peripheral end of the base surface 71.

  Similarly to the first embodiment, the inclined surface 172 is provided so as to be inclined upward (so that the height gradually increases) from the center of the base surface 71 toward the outer periphery. That is, in the second embodiment, the inclined surface 172 is provided so as to incline upward from the center of the base surface 71 toward the outer periphery and to incline upward even in the circumferential direction of the base surface 71. It is. The inclination angle of the inclined surface 172 with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the second embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

  Even when the cleaning cup CT is cleaned using the cleaning jig CT of the second embodiment, the cleaning jig CT is mounted on the spin chuck 20 and is rotated counterclockwise in FIG. 6 (arrow AR16). The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). As described above, the cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT due to centrifugal force, and the cleaning liquid CT has an inertia of the cleaning liquid CT. It also flows in the circumferential direction (the direction opposite to the rotation direction of the spin chuck 20). As a result, the cleaning liquid flowing from the center to the outer periphery of the cleaning jig CT does not flow linearly along the radial direction of the cleaning jig CT, but draws a trajectory that curves from the radial direction. Flowing.

  Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 173 is guided to the inclined surface 172 as indicated by an arrow AR6 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 175 between the base surface 71 and the inclined surface 172, but flows along the inner surface of the wall surface 175 and is repeatedly guided from the flow inlet 173 to the inclined surface 172. Since the inclined surface 172 is provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 172 faces outward in the radial direction of the cleaning jig CT and has a timepiece. It is scattered toward the obliquely upward direction (direction opposite to the rotation direction AR16 of the spin chuck 20). And since a washing | cleaning liquid can be scattered to the outer cup 43 from the continuous outer end part of the inclined surface 172, without changing the arrangement | positioning relationship of the height direction of cleaning jig CT and the outer cup 43, height The cleaning liquid can reach the outer cup 43 in a wide range in the direction. As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

  In the second embodiment, the base surface 71 and the base surface 71 are arranged such that the inclined surface 172 gradually increases along the circumferential direction of the base surface 71 in the direction opposite to the rotation direction AR16 of the spin chuck 20 (clockwise). It is inclined upward from the same height position. For this reason, the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and, even if it flows in the circumferential direction, smoothly tilts from the base surface 71 via the flow inlet 173. It will be guided to the surface 172. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

  In order to prevent such unintended cleaning liquid splashing more effectively, the wall surface 175 between the base surface 71 and the inclined surface 172 may be a tapered surface having an inclination angle of less than 90 °. More preferably, the wall surface 175 is a curved surface. Further, the wall surface 174 which is the step portion of the inclined surface 172 may be a tapered surface having an inclination angle of less than 90 °. Thereby, the liquid splash of the unintended cleaning liquid can be further suppressed. It is more preferable that the wall surface 174 is a curved surface.

  Also in the second embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surface 172 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

  As described above, in the second embodiment, the inclined surface 172 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71 and is also upward from the center of the base surface 71 toward the outer periphery. Therefore, the cleaning liquid supplied to the base surface 71 is smoothly guided to the inclined surface 172 and is scattered obliquely upward from the inclined surface 172. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

<Third Embodiment>
Next, a third embodiment of the present invention will be described. In the second embodiment, the number of steps of the inclined surface 172 along the circumferential direction of the base surface 71 is one. However, in the third embodiment, the number of steps of the inclined surface is a plurality of steps.

  FIG. 7 is a perspective view showing a cleaning jig CT of the third embodiment. The cleaning jig CT of the third embodiment is obtained by dividing the inclined surface 172 of the cleaning jig CT of the second embodiment into two along the circumferential direction of the base surface 71. As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space that can accommodate a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown), and when the cleaning jig CT is mounted on the spin chuck 20, the inclined surface 272 A plurality of chuck pins 26 are covered.

  A base surface 71 and two inclined surfaces 272 are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two inclined surfaces 272 are formed continuously in an annular shape over the entire periphery of the upper surface peripheral portion of the base surface 71.

  In the third embodiment, each of the two inclined surfaces 272 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Specifically, the height position of the base surface 71 is equal to the height position of the inner peripheral end of each inclined surface 272 at the flow guide port 273 among the outer peripheral ends of the base surface 71. In the example of FIG. 7, the inclined surfaces 272 are formed so that the height gradually increases in the clockwise direction from the vicinity of the flow inlet 273 along the circumferential direction of the base surface 71. Therefore, the lowest part of one inclined surface 272 near the flow inlet 273 and the highest part of the other inclined surface 272 form a step, and a wall surface 274 is formed between them.

  In addition, at the outer peripheral end of the base surface 71 excluding the flow inlet 273, the height position of the inner peripheral end of the inclined surface 272 is higher than the height position of the base surface 71, and the wall surface 275 is between them. Is formed. That is, in the third embodiment, the base surface 71 and the inclined surface 272 form a continuous surface at the flow guide port 273 among the outer peripheral ends of the base surface 71.

  Similarly to the first embodiment, each inclined surface 272 is provided so as to be inclined upward (so that its height gradually increases) from the center of the base surface 71 toward the outer periphery. That is, in the third embodiment, similarly to the second embodiment, the inclined surface 272 is inclined upward from the center of the base surface 71 toward the outer periphery, and is also inclined upward along the circumferential direction of the base surface 71. It is provided to do. The inclination angle of the inclined surface 272 with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the third embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

  Even when the processing cup 40 is cleaned using the cleaning jig CT of the third embodiment, the cleaning jig CT is mounted on the spin chuck 20 and is rotated counterclockwise in FIG. 7 (arrow AR17). The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). Also flows in the opposite direction of

  Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 273 is guided to the inclined surface 272 as indicated by an arrow AR7 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 275 between the base surface 71 and the inclined surface 272, but flows along the inner surface of the wall surface 275 and flows in the opposite direction to the center of the base surface 71. To the inclined surface 272. Since the inclined surface 272 is provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 272 faces outward in the radial direction of the cleaning jig CT and is not It is scattered toward the diagonally upward direction (direction opposite to the rotation direction AR17 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

  Further, in the third embodiment, the base surface 71 and the base surface 71 are arranged such that the inclined surface 272 gradually increases along the circumferential direction of the base surface 71 in the direction opposite to the rotation direction AR17 of the spin chuck 20 (clockwise). It is inclined upward from the same height position. For this reason, the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and, even if it flows in the circumferential direction, smoothly tilts from the base surface 71 via the flow inlet 273. It will be guided to the surface 272. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

  In order to prevent such unintended cleaning liquid splashing more effectively, the wall surface 275 between the base surface 71 and the inclined surface 272 is tapered with an inclination angle of less than 90 °, as in the second embodiment. It is good as a surface. More preferably, the wall surface 275 is a curved surface. Further, the wall surface 274 that is a stepped portion of the two inclined surfaces 272 may be a tapered surface having an inclination angle of less than 90 °. Thereby, the liquid splash of the unintended cleaning liquid can be further suppressed. It is more preferable that the wall surface 274 is a curved surface.

  Also in the third embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surfaces 272 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

  As described above, in the third embodiment, the inclined surface is divided into two along the circumferential direction of the base surface 71. Each of the two divided inclined surfaces 272 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and also upward from the center of the base surface 71 toward the outer periphery. It is inclined. For this reason, the cleaning liquid supplied to the base surface 71 is guided more smoothly to the inclined surface 272 than in the second embodiment, and is scattered obliquely upward from the inclined surface 272. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

  In 3rd Embodiment, although the inclined surface was divided | segmented into 2 along the circumferential direction of the base surface 71, you may divide this into 3 or more. Even in this case, each of the divided inclined surfaces 272 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and from the center of the base surface 71 to the outer periphery. By tilting upward, the same effect as described above can be obtained.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described. In the fourth embodiment, the liquid inlet of the inclined surface is wide.

  FIG. 8 is a perspective view showing a cleaning jig CT of the fourth embodiment. In the cleaning jig CT of the fourth embodiment, the width of each inclined surface 272 of the cleaning jig CT of the third embodiment is gradually reduced from the lowest height position to the highest height position. Is. As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space capable of accommodating a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown). When the cleaning jig CT is mounted on the spin chuck 20, the inclined surface 372 A plurality of chuck pins 26 are covered.

  A base surface 71 and two inclined surfaces 372 are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two inclined surfaces 372 are formed continuously in an annular shape over the entire circumference of the peripheral edge of the upper surface of the base surface 71.

  In the fourth embodiment, each of the two inclined surfaces 372 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Each of the two inclined surfaces 372 is formed so that the width gradually decreases from the lowest height position to the highest height position. Specifically, the base end side of each inclined surface 372 is a flow guide port 373, and the height position thereof is equal to the height position of the base surface 71. In the example of FIG. 8, each inclined surface is gradually increased in the clockwise direction along the circumferential direction of the base surface 71 from the flow guide port 373 on the proximal end side of the inclined surface 372 toward the distal end side. 372 is formed. In addition, each inclined surface 372 is formed so that the width gradually decreases from the flow guide port 373 on the base end side which is the lowest height position of the inclined surface 372 toward the distal end side which is the highest height position. Yes. In other words, the width of the flow introduction port 373 having the same height position with the base surface 71 of each inclined surface 372 is larger than the width of the other end side (tip side) different from the flow introduction port 373 side of each inclined surface 372. It is getting wider. Thereby, in 4th Embodiment, the front end side of the inclined surface 372 is made into the sharp shape.

  In addition, at the boundary between the base surface 71 and the inclined surface 372 excluding the flow inlet 373, the height position of the inner peripheral end of the inclined surface 372 is higher than the height position of the base surface 71, and between them, A wall surface 375 is formed. That is, in the fourth embodiment, the base surface 71 and the inclined surface 372 form a continuous surface at the flow introduction port 373 on the proximal end side of the inclined surface 372.

  Similarly to the first embodiment, each inclined surface 372 is provided to be inclined upward even from the center of the base surface 71 toward the outer periphery. That is, in the fourth embodiment, as in the second embodiment, the inclined surface 372 is inclined upward from the center of the base surface 71 toward the outer periphery, and is also inclined upward along the circumferential direction of the base surface 71. It is provided to do. The inclination angle of the inclined surface 372 with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the fourth embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

  Even when the processing cup 40 is cleaned using the cleaning jig CT of the fourth embodiment, the cleaning jig CT is mounted on the spin chuck 20 and is rotated counterclockwise (arrow AR18) in FIG. The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). It also flows in the opposite direction of the rotation direction.

  Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 373 is guided to the inclined surface 372 as indicated by an arrow AR8 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 375 between the base surface 71 and the inclined surface 372, flows along the inside of the wall surface 375, and is guided from the flow inlet 373 to the inclined surface 372. Since the inclined surface 372 is provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 372 faces outward in the radial direction of the cleaning jig CT, and the timepiece It is scattered toward the diagonally upward direction (direction opposite to the rotation direction AR18 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

  In the fourth embodiment, the base surface 71 and the base surface 71 are arranged such that the inclined surface 372 gradually increases in the opposite direction (clockwise) to the rotation direction AR18 of the spin chuck 20 along the circumferential direction of the base surface 71. It is inclined upward from the same height position. For this reason, even if the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and also flows in the circumferential direction, it is smoothly inclined from the base surface 71 via the flow introduction port 373. It will be guided to the surface 372. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

  In order to prevent such unintended cleaning liquid splashing more effectively, the wall surface 375 between the base surface 71 and the inclined surface 372 is tapered with an inclination angle of less than 90 °, as in the second embodiment. It is good as a surface. More preferably, the wall surface 375 is a curved surface.

  Furthermore, in the fourth embodiment, since the inclined surface 372 is formed so that the width gradually becomes narrower from the lowest height position toward the highest height position, the flow inlet that is the lowest height position is formed. The width of 373 is wide. For this reason, the cleaning liquid flowing on the base surface 71 can be efficiently guided to the inclined surface 372 and scattered.

  Also in the fourth embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surface 372 of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

  As described above, in the fourth embodiment, the inclined surface is divided into two along the circumferential direction of the base surface 71. Each of the divided two inclined surfaces 372 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and also upward from the center of the base surface 71 toward the outer periphery. It is inclined. Further, each of the two inclined surfaces 372 is formed so that the width gradually decreases from the lowest height position to the highest height position. For this reason, the cleaning liquid supplied to the base surface 71 is smoothly and efficiently guided to the inclined surface 372 and is scattered obliquely upward from the inclined surface 372. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

  In 4th Embodiment, although the inclined surface was divided | segmented into 2 along the circumferential direction of the base surface 71, you may divide this into 3 or more. Even in this case, each of the plurality of divided inclined surfaces 372 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and from the center of the base surface 71 to the outer periphery. By tilting upward and making the width gradually narrow from the lowest height position to the highest height position, the same effect as described above can be obtained.

<Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described. FIG. 9 is a perspective view showing a cleaning jig CT of the fifth embodiment. In the cleaning jig CT of the fifth embodiment, the front end side of each inclined surface 372 of the fourth embodiment is also wide.

  A base surface 71 and two inclined surfaces 472 are formed on the upper surface of the cleaning jig CT of the fifth embodiment. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two inclined surfaces 472 are formed continuously in an annular shape over the entire periphery of the upper surface peripheral portion of the base surface 71. Each of the two inclined surfaces 472 is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. The base end side of each inclined surface 472 is a wide inlet 473 similar to that of the fourth embodiment, and the height position thereof is equal to the height position of the base surface 71. Each inclined surface 472 is formed so that the height gradually increases in the clockwise direction along the circumferential direction of the base surface 71 from the flow inlet 473 on the proximal end side of the inclined surface 472 toward the distal end side. .

  Also in the fifth embodiment, each of the two inclined surfaces 472 is formed so that the width gradually decreases from the lowest height position to the highest height position. That is, in the same manner as in the fourth embodiment, each width is gradually reduced from the proximal flow inlet 473, which is the lowest height position of the inclined surface 472, toward the distal end, which is the highest height position. An inclined surface 472 is formed. That is, the width of the flow inlet 473 having the same height position with the base surface 71 of each inclined surface 472 is wider than the width of the other end side (tip side) different from the flow inlet 473 side of each inclined surface 472. It has become. However, as shown in FIG. 9, in the fifth embodiment, the tip side of each inclined surface 472 also has a certain width, and the degree to which the width of the inclined surface 472 becomes narrower compared to the fourth embodiment. It is moderate.

  In addition, at the boundary between the base surface 71 and the inclined surface 472 excluding the flow inlet 473, the height position of the inner peripheral end of the inclined surface 472 is higher than the height position of the base surface 71, and between them, A wall surface 475 is formed. That is, in the fifth embodiment, the base surface 71 and the inclined surface 472 form a continuous surface in the flow guide port 473 on the proximal end side of the inclined surface 472.

  Similarly to the first embodiment, each inclined surface 472 is provided to be inclined upward even from the center of the base surface 71 toward the outer periphery. That is, in the fifth embodiment, as in the second embodiment, the inclined surface 472 is inclined upward from the center of the base surface 71 toward the outer periphery, and is also inclined upward along the circumferential direction of the base surface 71. It is provided to do. The inclination angle of the inclined surface 472 with respect to the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the fifth embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

  The cleaning process of the processing cup 40 using the cleaning jig CT of the fifth embodiment is substantially the same as that of the fourth embodiment, and the same operational effects can be obtained. That is, the cleaning jig CT is mounted on the spin chuck 20 and the cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the counterclockwise direction (direction of arrow AR19) in FIG. To do. The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). Also flows in the opposite direction of

  Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlet 473 is guided to the inclined surface 472 as indicated by an arrow AR9 in FIG. It is burned. The remaining cleaning liquid reaches the wall surface 475 between the base surface 71 and the inclined surface 472, flows along the inner surface of the wall surface 475, and is guided from the flow inlet 473 to the inclined surface 472. Since the inclined surface 472 is provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surface 472 faces outward in the radial direction of the cleaning jig CT and is not It is scattered toward the obliquely upward direction (direction opposite to the rotation direction AR19 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

  Further, the inclined surface 472 moves upward from the same height position as the base surface 71 so that the height gradually increases in the opposite direction (clockwise) to the rotation direction AR19 of the spin chuck 20 along the circumferential direction of the base surface 71. It is inclined to. For this reason, even if the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and also flows in the circumferential direction, it is smoothly inclined from the base surface 71 via the flow inlet 473. It will be guided to the surface 472. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

  In order to prevent such unintended cleaning liquid splashing more effectively, the wall surface 475 between the base surface 71 and the inclined surface 472 is tapered with an inclination angle of less than 90 °, as in the second embodiment. It is good as a surface. More preferably, the wall surface 475 is a curved surface.

  In the fifth embodiment, since the inclined surface 472 is formed so that the width is gradually narrowed from the lowest height position toward the highest height position, the flow inlet that is the lowest height position is formed. The width of 473 is wide. For this reason, the cleaning liquid flowing on the base surface 71 can be efficiently guided to the inclined surface 472 and scattered.

  Furthermore, in the fifth embodiment, the tip side of the inclined surface 472 also has a certain width, and the degree to which the width of the inclined surface 472 becomes narrower than that in the fourth embodiment. For this reason, the amount of the cleaning liquid that is once guided to the inclined surface 472 and falls from the inclined surface 472 can be reduced, and the cleaning liquid can be efficiently scattered obliquely upward.

<Sixth Embodiment>
Next, a sixth embodiment of the present invention will be described. FIG. 10 is a perspective view showing a cleaning jig CT of the sixth embodiment. The cleaning jig CT of the sixth embodiment is different from the cleaning jig CT of the fourth embodiment in that the shapes of the two inclined surfaces are different.

  As in the first embodiment, the cleaning jig CT is a substantially disk-shaped member and can be detachably attached to the spin base 21 of the spin chuck 20. Further, an inner space capable of accommodating a plurality of chuck pins 26 is formed on the lower surface of the cleaning jig CT (not shown), and when the cleaning jig CT is mounted on the spin chuck 20, inclined surfaces 572a, The plurality of chuck pins 26 are covered by 572b.

  A base surface 71 and two inclined surfaces 572a and 572b are formed on the upper surface of the cleaning jig CT. The base surface 71 is a flat surface, and when the cleaning jig CT is attached to the spin chuck 20, the base surface 71 becomes a horizontal surface. Two inclined surfaces 572a and 572b are formed continuously in an annular shape over the entire periphery of the upper surface peripheral portion of the base surface 71.

  In the sixth embodiment, each of the two inclined surfaces 572 a and 572 b is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. Further, each of the two inclined surfaces 572a and 572b is formed such that the width gradually decreases from the lowest height position to the highest height position. Specifically, the base end side of one inclined surface 572a is a flow introduction port 573a, and the height position thereof is equal to the height position of the base surface 71. Further, the base end side of the other inclined surface 572 b is a flow guide port 573 b, and the height position thereof is equal to the height position of the base surface 71. However, the width of the inlet 573a of the inclined surface 572a is wider than the width of the inlet 573b of the inclined surface 572b.

  In the example of FIG. 10, the height is gradually increased in the clockwise direction along the circumferential direction of the base surface 71 from the flow guide ports 573 a and 573 b on the base end side of the inclined surfaces 572 a and 572 b toward the front end side. Two inclined surfaces 572a and 572b are formed. In addition, the inclined surface 572a is formed so that the width gradually decreases from the proximal flow inlet 573a which is the lowest height position of the inclined surface 572a toward the distal end side which is the highest height position. . Similarly, the inclined surface 572b is formed so that the width is gradually narrowed from the proximal flow inlet 573b which is the lowest height position of the inclined surface 572b toward the distal end side which is the highest height position. . In other words, the width of the flow guide ports 573a and 573b having the same height position with the base surface 71 of the inclined surfaces 572a and 572b is the other end side (the tip side) different from the flow guide ports 573a and 573b side of the inclined surfaces 572a and 572b. ) Wider than Thereby, in 6th Embodiment, the front end side of inclined surface 572a, 572b is made into the sharp shape. Since the width of the flow inlet 573a is wider than the width of the flow inlet 573b, the inclined surface 572b is gentler to the extent that the width of the surface gradually decreases.

  Further, at the boundary between the base surface 71 and the inclined surface 572a excluding the flow inlet 573a, the height position of the inner peripheral end of the inclined surface 572a is higher than the height position of the base surface 71, A wall surface 575a is formed. At the boundary between the base surface 71 and the inclined surface 572b excluding the flow introduction port 573b, the height position of the inner peripheral end of the inclined surface 572b is higher than the height position of the base surface 71, and there is a wall surface between them. 575b is formed. That is, in the sixth embodiment, the base surface 71 and the inclined surfaces 572a and 572b form a continuous surface at the flow guide ports 573a and 573b on the base end side of the inclined surfaces 572a and 572b.

  Similarly to the first embodiment, the inclined surfaces 572a and 572b are provided so as to be inclined upward even from the center of the base surface 71 toward the outer periphery. That is, in the sixth embodiment, as in the second embodiment, the two inclined surfaces 572a and 572b are inclined upward from the center of the base surface 71 toward the outer periphery, and along the circumferential direction of the base surface 71. Is also provided so as to incline upward. The inclination angles of the inclined surfaces 572a and 572b in the radial direction and the circumferential direction of the base surface 71 can be set appropriately. The remaining configuration of the sixth embodiment excluding the shape of the cleaning jig CT is the same as that of the first embodiment.

  Also when performing the cleaning process of the processing cup 40 using the cleaning jig CT of the sixth embodiment, the cleaning jig CT is mounted on the spin chuck 20 in the counterclockwise direction (arrow AR20 in FIG. 10). The cleaning liquid is supplied from the ejection head 31 to the vicinity of the center of the base surface 71 while rotating the spin chuck 20 in the direction of (1). The cleaning liquid supplied in the vicinity of the center of the rotating cleaning jig CT flows toward the outer periphery of the cleaning jig CT by centrifugal force, and the circumferential direction of the cleaning jig CT (spin chuck 20 due to the inertia of the cleaning liquid itself). Also flows in the opposite direction of

  Of the cleaning liquid that flows toward the outer periphery of the base surface 71 of the cleaning jig CT and also flows in the circumferential direction, the cleaning liquid that has reached the flow inlets 573a and 573b is an inclined surface 572a as shown by an arrow AR10 in FIG. , 572b. The remaining cleaning liquid reaches the wall surfaces 575a and 575b between the base surface 71 and the inclined surfaces 572a and 572b. Guided to surfaces 572a and 572b. Since the inclined surfaces 572a and 572b are provided so as to incline upward even from the center of the base surface 71 toward the outer periphery, the cleaning liquid that has flowed into the inclined surfaces 572a and 572b faces outward in the radial direction of the cleaning jig CT. In this case, it is scattered obliquely upward in the clockwise direction (the direction opposite to the rotation direction AR20 of the spin chuck 20). As a result, as in the first embodiment, the cleaning liquid can be sprayed onto the upper curved portion of the processing cup 40 where contamination is likely to accumulate, so that effective cleaning can be performed.

  In the sixth embodiment, the inclined surfaces 572 a and 572 b are inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71. For this reason, even if the cleaning liquid supplied to the cleaning jig CT flows toward the outer periphery of the base surface 71 and also flows in the circumferential direction, the base surface 71 smoothly passes through the flow inlets 573a and 573b. To the inclined surfaces 572a and 572b. Accordingly, unintentional splashing of the cleaning liquid due to the cleaning liquid colliding with some member of the cleaning jig CT can be suppressed.

  In order to prevent such unintended cleaning liquid splashing more effectively, as in the second embodiment, the wall surface 575a between the base surface 71 and the inclined surface 572a and the wall surface 575b between the inclined surface 572b. May be a tapered surface having an inclination angle of less than 90 °. More preferably, the wall surfaces 575a and 575b are curved surfaces.

  Furthermore, in the sixth embodiment, since the inclined surfaces 572a and 572b are formed so that the width gradually decreases from the lowest height position toward the highest height position, the guide at the lowest height position is formed. The widths of the flow ports 573a and 573b are wide. For this reason, the cleaning liquid flowing on the base surface 71 can be efficiently guided to the inclined surfaces 572a and 572b and scattered.

  Also in the sixth embodiment, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surfaces 572a and 572b of the cleaning jig CT. Therefore, the cleaning liquid supplied onto the base surface 71 of the cleaning jig CT does not collide with the chuck pin 26, and unintentional liquid splashing by the chuck pin 26 can be prevented.

  Thus, in the sixth embodiment, two inclined surfaces having different shapes are provided along the circumferential direction of the base surface 71. The two inclined surfaces 572a and 572b are formed so as to gradually increase in height in the opposite direction (clockwise) to the rotation direction AR20 of the spin chuck 20 along the circumferential direction of the base surface 71. Inclined upward from the same height position, and inclined upward from the center of the base surface 71 toward the outer periphery. Further, each of the two inclined surfaces 572a and 572b is formed such that the width gradually decreases from the lowest height position to the highest height position. For this reason, the cleaning liquid supplied to the base surface 71 is smoothly and efficiently guided to the inclined surfaces 572a and 572b, and is scattered obliquely upward from the inclined surfaces 572a and 572b. Thereby, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

  In the sixth embodiment, two different shapes of inclined surfaces are combined along the circumferential direction of the base surface 71, but three or more different shapes of inclined surfaces may be combined. Even in this case, each of the plurality of inclined surfaces is inclined upward from the same height position as the base surface 71 along the circumferential direction of the base surface 71, and also upward from the center of the base surface 71 toward the outer periphery. In addition, the same effect as described above can be obtained by making the width gradually narrower from the lowest height position toward the highest height position.

<Modification>
While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention. For example, in each of the above embodiments, the inclined surface of the cleaning jig CT is a flat surface having a predetermined inclination angle, but the inclined surface may be curved. The curvature of the inclined surface may be warped so that the upper side is convex, or may be warped so that the lower side is convex. Further, the curved surface of the inclined surface may be formed in both the radial direction and the circumferential direction of the base surface 71.

  In each of the above embodiments, the plurality of chuck pins 26 on the spin base 21 are covered with the inclined surface of the cleaning jig CT. However, depending on the shape and size of the cleaning jig CT, the base surface A plurality of chuck pins 26 may be covered with 71.

  In the second to fifth embodiments, the inclined surface is formed so as to gradually increase in the clockwise direction along the circumferential direction of the base surface 71. However, the height gradually increases in the counterclockwise direction. The inclined surface may be formed so as to be higher, and the rotation direction of the cleaning jig CT may be appropriately set accordingly.

  In the second to sixth embodiments, the inclined surface 172 (second embodiment), 272 (third embodiment), 372 (fourth embodiment), 472 (fifth embodiment), 572a, 572b. (6th Embodiment) was provided so that it might incline upward toward the outer periphery from the center of the base surface 71. FIG. However, even if the inclined surfaces 172, 272, 372, 472, 572a, and 572b are not inclined upward from the center of the base surface 71 toward the outer periphery (in other words, even if they are horizontal surfaces), they are inclined with the base surface 71. Wall surfaces 175 (second embodiment), 275 (third embodiment), 375 (fourth embodiment), 475 (fifth embodiment), 575a between the surfaces 172, 272, 372, 472, 572a, 572b If 575b (sixth embodiment) is a tapered surface having an inclination angle of less than 90 °, the cleaning liquid supplied to the base surface 71 is scattered obliquely upward from the respective wall surfaces 175, 275, 375, 475, 575a, 575b. Can be made. Accordingly, it is possible to perform effective cleaning by spraying the cleaning liquid onto the upper curved portion of the processing cup 40 while suppressing unintentional splashing of the cleaning liquid.

  Furthermore, in the second to sixth embodiments, the inclined surface 172 (second embodiment), 272 (third embodiment), 372 (fourth embodiment), 472 (fifth embodiment), 572a, 572b. (Sixth embodiment) and wall surface 175 (second embodiment), 275 (third embodiment), 375 (fourth embodiment), 475 (fifth embodiment), 575a, 575b (sixth embodiment). A mode is also conceivable in which the cleaning liquid is scattered from the base surface 71 toward the inner surface of the processing cup 40 only by the circumferential inclination component of the base surface 71 without the radial inclination component of the base surface 71.

  Further, in each of the above embodiments, the processing cup 40 is provided with the inner cup 41, the middle cup 42 and the outer cup 43 that can be moved up and down independently of each other. There may be. Further, the processing cup 40 may include only a one-stage cup surrounding the spin base 21.

  The substrate to be processed by the substrate cleaning apparatus 1 is not limited to a substrate for semiconductor use, and may be a glass substrate used for a flat panel display such as a substrate for a solar cell or a liquid crystal display device.

  Further, the substrate processing apparatus 1 may be any apparatus that supplies the processing liquid to the surface of the substrate held by the spin chuck and receives the processing liquid scattered from the substrate by the cup. In addition to the apparatus and the etching processing apparatus, for example, a spin coating apparatus (spin coater) or a rotary developing apparatus (spin developer) for applying a resist or the like may be used. The cup cleaning technique according to the present invention can be suitably applied to an apparatus that easily adheres to the cup and becomes a contamination source, such as a spin coating apparatus. Alternatively, the substrate processing apparatus 1 may be a spin scrubber that performs a scrub cleaning process by supplying a cleaning liquid to the surface of a rotating substrate and bringing a brush into contact with or close to the surface.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 9 Control part 10 Chamber 20 Spin chuck 21 Spin base 21a Holding surface 22 Spin motor 26 Chuck pin 28 Lower surface processing liquid nozzle 30 Upper surface processing liquid nozzle 31 Discharge head 40 Processing cup 41 Inner cup 42 Medium cup 43 Outer cup 43b Upper end portion 71 Base surface 72, 172, 272, 372, 472, 572a, 572b Inclined surface 173, 273, 373, 473, 573a, 573b Inlet port CT Cleaning jig W substrate

Claims (11)

Substrate holding means for holding the substrate;
Rotating means for rotating the substrate holding means;
A cup surrounding the periphery of the substrate holding means;
A cleaning jig mounted on the substrate holding means;
Cleaning liquid supply means for supplying a cleaning liquid to the cleaning jig mounted on the substrate holding means;
With
The cleaning jig is
A flat base surface;
An inclined surface that is provided over the entire periphery of the upper surface peripheral portion of the base surface and is inclined upward from the center of the base surface toward the outer periphery;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the inclined surface is inclined upward from the same height position as the base surface along a circumferential direction of the base surface. The substrate processing apparatus according to claim 2,
The substrate processing apparatus, wherein the inclined surface is inclined along the circumferential direction of the base surface so that the height gradually increases in a direction opposite to the rotation direction of the substrate holding means by the rotating means. . In the substrate processing apparatus of Claim 2 or Claim 3,
The inclined surface is divided into a plurality along the circumferential direction of the base surface,
Each of the plurality of divided inclined surfaces is inclined upward from the same height position as the base surface. The substrate processing apparatus according to claim 4, wherein
Each of the plurality of inclined surfaces has a width that gradually decreases from a lowest height position to a highest height position. In the substrate processing apparatus in any one of Claims 1-5,
The substrate holding means includes a plurality of chuck pins for gripping the outer peripheral edge of the substrate,
The substrate processing apparatus, wherein the inclined surface of the cleaning jig mounted on the substrate holding means covers the plurality of chuck pins. A cleaning jig for cleaning a cup surrounding the periphery of the substrate holding means by rotating in a predetermined rotation direction while being supplied with a cleaning liquid while being attached to the substrate holding means of the substrate processing apparatus. ,
A flat base surface;
An inclined surface that is provided over the entire periphery of the upper surface peripheral portion of the base surface and is inclined upward from the center of the base surface toward the outer periphery;
A cleaning jig, comprising: The cleaning jig according to claim 7, wherein
The cleaning jig according to claim 1, wherein the inclined surface is inclined upward from the same height position as the base surface along a circumferential direction of the base surface. The cleaning jig according to claim 8, wherein
The cleaning jig, wherein the inclined surface is inclined so as to gradually increase in height from the base surface in a direction opposite to the rotation direction. In the cleaning jig according to claim 8 or 9,
The inclined surface is divided into a plurality along the circumferential direction of the base surface,
Each of the plurality of divided inclined surfaces is inclined upward from the same height position as the base surface. The cleaning jig according to claim 10, wherein
Each of the plurality of inclined surfaces has a width that gradually decreases from the lowest height position to the highest height position.

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