IL171557A

IL171557A - Spinner washing apparatus and dicing apparatus

Info

Publication number: IL171557A
Application number: IL17155705A
Authority: IL
Original assignee: Disco Corp
Priority date: 2004-10-28
Filing date: 2005-10-26
Publication date: 2011-02-28
Also published as: JP4502260B2; CN1765528A; CN1765528B; JP2006128359A

Description

171557 i?'Ti I 453478 ΤΑΊΚ SPINNER WASHING APPARATUS AND DICING APPARATUS n m -pr n ipnm ηηια na ju m ipnri BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spinner washing apparatus adapted to wash a wafer by supplying washing water thereto while rotating the wafer, and a dicing apparatus mounted with the spinning washing apparatus. 2. Related Art A wafer a surface of which is partitioned by streets to form a plurality of devices is separated at the streets by a dicing apparatus into individual devices. A general dicing apparatus has a wafer-holding chuck table, a cutting means provided with a blade for cutting the streets of the wafer held on the chuck table, and a spinner washing apparatus adapted to wash the wafer, which has been diced with the cutting means, while rotating the wafer, wherein the wafer to be diced is held on the chuck table with the wafer made integral with a dicing frame via a dicing tape. The streets of the wafer receive the actions of the cutting means and are cut longitudinally and laterally as the chuck table is moved, the wafer being thereby divided into individual devices. The diced devices are affixed on the dicing tape, and the resultant product as a whole is transferred to the washing apparatus with the outer shape of the wafer maintained, the chips and the like occurred during the wafer cutting operation is then removed with washing water (refer to, for example, JP-A-2003-86543).

In the washing apparatus mounted on the dicing apparatus generally uses an apparatus called a spinner washing apparatus adapted to rotate a rotary table on which the wafer is held, and blow out washing water onto the rotating wafer. As the rotary table on which the wafer is held in this spinner washing apparatus, it is known such a structure that is provided at a circumferential portion thereof with holding pendulums formed by rotatable weight portions and a holding portions in one body and supported on a pivot, the frame made integral with the wafer being thereby held between the holding portions and rotary table by utilizing the rotation of the weight portion in the circumferential direction due to the centrifugal force occurring during the rotation of the rotary table (refer to, for example, JP-U 1-61 -86931 ).

When the frame is held on the rotary table (spinner table) disclosed in JP-U1-61-86931 , however, the holding of the same is done by the holding portions of the holding pendulums provided on an outer circumference of the same table. Therefore, the outer diameter of the frame capable of being held is determined in advance, so that the rotary table cannot be applied to a plurality of kinds of frames of different outer diameters.

On the chuck table to hold the wafer when the wafer is cut, the fixing can be done by sucking the wafer holding table on a base of the table. Therefore, when only the sucking of the wafer holding table is stopped, it is comparatively easy to exchange the table in accordance with the outer diameter of the frame. However, it is necessary for the spinner table to rotate at a high speed of around 100 rpm to 3000 rpm during the washing of the wafer, different from the chuck table. Therefore, the table cannot be held by a sucking operation, so that the table has to be fixed firmly to the base of the table by bolts and the like. In consequence, when a plurality of spinner tables in conformity with the outer diameter of the frame are prepared in advance and the wafer combined in one body with the frames of different outer diameters is washed with a spinner table exchanging each time for one in conformity with the outer diameter, the exchange operation takes a considerably long time, and this causes the productivity to lower greatly.

SUMMARY OF THE INVENTION An object of the invention is to provide a spinner washing apparatus in which a troublesome spinner table exchange operation is made unnecessary concerning the holding of a plurality of kinds of frames of different outer diameters.

The invention' relates to a spinner washing apparatus provided with at least a rotatable spinner table adapted to hold a wafer made integral with a frame via a tape, and a nozzle for supplying washing water to the wafer held on the spinner table, wherein the spinner table is provided with a frame support portion to support the frame, and a wafer region support portion, and a holding means having holding pendulums adapted to hold the frame between the pendulums and frame support portion by a centrifugal force occurring due to rotation of the spinner table is provided at an outer circumference of the frame support portion, and the holding means is provided with at least a first holding means having first holding pendulums to hold a large-diameter frame, and a second holding means having second holding pendulums to hold a small-diameter frame. The "large and small" mentioned above concerning the diameter of the frame mean the relative relation between the outer diameters of frames in a case where there are two kinds of frames of different outer diameters. The "wafer region" means the portion of the tape on which the wafer is affixed.

It is desirable that the first holding means be provided on four portions of an outer circumference of the frame support portion at equal intervals, and the second holding means be provided at equal intervals in positions in which the second holding pendulums do not contact the first holding pendulums. As an example of this arrangement, there is a structure having at the outer circumference of the frame support portion recesses extending toward the inner circumference thereof with second holding means provided in the recesses. It is desirable that the second holding means be provided with stoppers to restrict swinging of the second holding pendulums.

The invention also provides a dicing apparatus provided with at least a chuck table adapted to hold a wafer made integral with a frame via a tape, a means for cutting the wafer held on the chuck table, a spinner washing apparatus as described above, and a means for transferring the wafer finished being cut from the cutting means to a spinner washing apparatus.

The spinner washing apparatus according to the invention is provided with a first holding means having first holding pendulums for holding a large-diameter frame, and a second holding means having second holding pendulums for holding a small-diameter frame. Accordingly, the first holding means can hold a large-diameter frame, and the second holding means can hold a small-diameter frame. Therefore, the wafer can be washed with two kinds of frames of different diameters held on one spinner table. This makes an operation for exchanging the spinner table in accordance with the outer diameter of the frame unnecessary, and enables to increase the productivity.

When the first holding means is provided at equal intervals at four portions of the outer circumference of the frame supporting portion while the second holding pendulums arranged at equal intervals so that the second holding pendulums do not contact the first holding pendulums, it enables to hold a large-diameter frame and a small-diameter frame stably.

When stoppers to restrict swinging of the second holding pendulums are provided on the second holding means, it enables to prevent the second holding pendulums from contacting a large-diameter frame when the large-diameter frame is supported.

In the dicing apparatus provided with the spinner washing apparatus according to the invention, the cut wafer can be washed. Therefore, the diced wafer integral with one of not smaller than two kinds of frames can be washed by one dicing apparatus, so that the invention is efficiently used.

The above and other objects as well as advantageous features of the invention will become apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWING Fig. 1 is a perspective view showing an embodiment of a dicing apparatus according to the invention; Fig. 2 is a perspective view showing an embodiment of a spinner washing apparatus according to the invention; Fig. 3 is a sectional view showing a condition of a first holding means of the spinner washing apparatus not holding a larger-diameter frame; Fig. 4 is a sectional view showing a condition of the first holding means holding the larger-diameter frame; Fig. 5 is a sectional view showing a fixed condition of a second holding pendulum of the spinner washing apparatus; and Fig. 6 is a sectional view showing a condition of a small-diameter frame held by the second holding means of the spinner washing apparatus.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENT A dicing apparatus 1 shown in Fig. 1 is an apparatus for dicing a wafer so as to divide the same into individual devices and then washing the devices, and the apparatus is mounted with a spinner washing apparatus 2. The objects to be diced are at least two kinds of wafers W1 , W2 of different outer diameters. The wafers are affixed on adhesive surfaces of tapes T1 , T2 closing openings of the frames F1 , F2. The wafers in an integral condition with respect to the frames F1 , F2 via the tapes T1 , T2 are stored in a cassette 3.

The frame F1 (F2) of the wafer W1 (W2) stored in the cassette 3 is held by a carrying-out and -in means 4. The carrying-out and -in means 4 is moved in the -Y direction, and the wafer W1 (W2) is thereby placed on a tentative storage region 5. The wafer W1 (W2) is then absorbed to a first transfer means 6 and transferred to a chuck table 7 owing to a swing motion of the means 6, and suction-held on the chuck table 7.

The chuck table 7 is made movable in an X-axis direction, and an alignment means 8 for detecting streets to be cut and a cutting means 9 having a blade 9a are provided above a path of movement of the chuck table 7. The chuck table 7 holding the wafer W1 (W2) is moved in +X direction, and the wafer W1 (W2) is placed just under the alignment means 8. A street to be cut i detected by an imaging means 8a constituting the alignment means 8, and the positioning of the street and the cutting blade 9a in the Y-axis direction are done. The chuck table 7 is then moved in +X direction with the cutting means 9 moved down as the blade 9a is rotated at a high speed. The blade 9a rotating at a high speed thereby cuts into the street detected, and the street is thereby cut off.

The wafer W1 (W2) held on the chuck table 7 is moved reciprocatingly in X-axis direction, and the streets are cut one by one as the cutting means 9 is index-fed in the Y-axis direction by a distance corresponding to one street length, all the streets in the same direction being thereby cut. The chuck table 7 is further turned at 90 degrees to turn the wafer W1 (W2) at 90 degrees. When the same cutting operation as is described above is then carried out, all the streets are cut longitudinally and laterally, so that the wafer is diced and divided into individual devices. Since the individual device is left affixed on the tape T1 (T2) during this time, the outer shape of the wafer W1 (W2) as a whole is maintained.

The diced device maintained the outer shape of the wafer W1 (W2) as a whole is transferred to the spinner washing apparatus 2 by a second transfer means 10 in an integral state with the frame F1 (F2) via the tape T1 (T2).

As shown in Fig. 2, the spinner washing apparatus 2 is provided with a spinner table 20 adapted to hold the wafer W1 (W2) made integral with the frame F1 (F2) via the tape T1 (T2), a nozzle 21 for supplying washing water to the wafer W1 (W2) held on the spinner table 20, and an air nozzle 22 for blowing out the air for removing the washing water.

The spinner table 20 is connected to a motor 24 via a shaft 23, and driven by the motor 24 and rendered rotatable. The motor 24 is upwardly movable by air pistons 25, and, in accordance with the upward and downward movements of the motor 24, the spinner table 20 is also moved up and down.

The objects capable of being held on the spinner table 20 are at least the wafer W1 made integral with the frame F1 via the tape T1 , and the wafer W2 made integral with the frame F2 via the tape T2, as shown in Fig. 2. The wafer W1 is formed larger in the outer diameter than that of the wafer W2, and the frame F1 is also formed larger in the outer diameter than that of the frame F2 correspondingly.

The spinner table 20 includes a frame support portion 26 adapted to support the frame F1 and frame F2 among the wafer W1 integral with the frame F1 via the tape T1 and the wafer W2 made integral with the frame F2 via the tape T2, a wafer region support portion 27, i.e. the portion among the tape T1 on which the wafer W1 is affixed and the portion among the tape T2 on which the wafer W2 is affixed, and holding means 28 provided on an outer circumference of the frame support portion 26, while the holding means 28 includes a first holding means 280 and a second holding means 285. Around the shaft 23, a washing water cover 29a is provided, and, under the cover 29a, a washing water receiving portion 29b and a discharge portion 29c for discharging the used washing water staying in the washing water receiving portion 29b are provided.

The wafer region support portion 27 is formed out of a porous material, communicates with a suction material source (not shown), and can suction-hold the wafer region. In the frame support portion 26, recesses 26a are formed by cutting parts of an outer circumference of a ring-shaped plate member toward the side of an inner circumference thereof. At a circumferential end portion of the plate member, first holding means 280 are provided, and, in the recesses 26a, second holding means 285 are provided. The first holding means 280 and second holding means 285 are provided in plural respectively. In the illustrated example, four first holding means 280 and four second holding means 285 are provided at equal intervals (equal angles) and alternately. This enables the large-diameter frame F1 and small-diameter frame F2 to be held stably.

The first holding means 280 correspond to the (large-diameter) frame F1 of a large outer diameter, 0nd the second holding means 285 the (small-diameter) frame F2 of a small outer diameter. The spinner table 20 can hold two kinds of frames of different outer diameters. The first holding means 280 are provided with first holding pendulums 281 , and the second holding means 285 are provided with second holding pendulums 286 respectively in the positions in which the second holding pendulums do not contact the first holding pendulums 281.

The first holding means 280 is formed with the first holding pendulum 281 supported on pivotal support portion 282 as shown in Fig. 3. The first holding pendulum 281 include holding portion 281a adapted to hold the frame F1 between the same holding portions 281a and frame support portion 26, and weight portion 281b made integral with the holding portion 281a, having weight larger than that of the holding portion 281a, and capable of being turned around the pivotal support portion 282. Since the weight of the weight portion 281b is larger than that of the holding portion 281a, the weight portion 281b is positioned low and the holding portions 281a high when the spinner table 20 is stationary as shown in Fig. 3.

In order to wash the wafer W1 , the wafer W1 made integral with the frame F1 via the tape T1 is placed on the spinner table 20 as shown in Fig. 4, and the spinner table 20 is lowered. When the spinner table 20 is rotated at a high speed (100 rpm to 3000 rpm), as shown in Fig. 4, the weight portions 281b are turned toward the side of the outer circumference around the pivotal support portions 282 as fulcrums due to a centrifugal force occurring during the rotation of the spinner table. Therefore, the holding portions 281 a are turned to the inner circumferential side of the frame F1 , and hold the frame F1 between itself and frame support portion 26. During this time, the wafer W1 is suction-held on the wafer region support portion 27 via the tape T1.

When the washing water supply nozzle 21 is turned in the horizontal direction and directed at a free end portion 210 thereof toward the surface of the wafer W as shown in Fig. 4 with the spinner table 20 rotated at a high speed, washing water is blown out from the washing water supply nozzle 21 and chips deposited on the wafer W are removed. After the ejection of the washing water finishes, the air nozzle 22 is turned horizontally, directed at a free end portion thereof to the surface of the wafer W (not shown), and made to blow out high-pressure air, so that the washing water is removed. As a result, the wafer is dried.

When the wafer W1 made integral with the lager-diameter frame F1 is supported and washed as shown in Fig. 4, the frame F1 is fixed by the first holding means 280. During this time, it is necessary that the second holding means 285 shown in Fig. 2 do not obstruct the supporting of the large-diameter frame F1. Therefore, the second holding means 285 is provided with stopper 288, as shown in Fig. 5, for restricting the turning of the second holding pendulum 286. Each stopper 288 is provided with holes 288a for loosely fitting bolts 289 therein, and adapted to be slidable horizontally in these holes 288a by a distance equal to the width of the same holes 288a. As shown in Fig. 5, when the stopper 288 is slid to the outer circumferential side (in the direction of an arrow in Fig. 5) of the frame support portion 26, the second holding pendulum 286 is fixed without causing the pendulum 286 to be turned. In the condition shown in Fig. 5, the holding portion 286a is fixed in a position lower than the frame support portion 26. Therefore, even when the large-diameter frame F1 is supported in this condition, the frame F1 does not contact the holding portion 286a. Accordingly, when the larger-diameter frame F1 is supported, the second holding means 285 does not get in the way.

The second holding pendulum 286 is pivotably supported on a pivot portion 287. The second holding pendulum 286 includes a holding portion 286a for holding the frame F2 between the holding portion 286a and frame support portion 26, and a weight portion 286b made integral with the holding portion 286a and having weight larger than that of the holding portion 286a. Such a structure is identical with that of the first holding means 280.

In order to support the small-diameter frame F2, as shown in Fig. 6, the stopper 288 is slid toward the inner circumference of the frame support portion 26 (in the direction of an arrow in Fig. 6). As a result, the second holding pendulum 286 is released from a fixed state to cause the second holding pendulum 286 to be turned due to the weight of the weight portion 286b, and the holding portion 286a is necessarily positioned above the frame support portion 26. When the spinner table 20 is rotated at a high speed, the second holding pendulum 286 is further turned in the same direction by the centrifugal force of the spinner table. The turning of the pendulum 286 continues to a position shown by two-dot chain line in Fig. 6. Thus, the frame F2 is held between the holding portion 286a and frame support portion 26.

In this manner, the first holding means 280 hold the larger-diameter frame F1, and the second holding means 285 hold the small-diameter frame F2. Therefore, two kinds of frames and wafers of different outer diameters can be held and washed on one spinner table 20. This enables an operation for exchanging the spinner table 20 in accordance with the 0uter diameter of the frame to be rendered unnecessary, and the productivity to be improved.

In the above example, a case where the spinner washing apparatus is mounted on a dicing apparatus is described, but it can be used independently and also can be mounted on other apparatuses. Moreover, not only the first holding means and second holding means but also a third holding means adapted to hold a frame having another outer diameter, a fourth frame means and so forth can further be provided.

Claims

171557/2 CLAIMS:

1. A spinner washing apparatus comprising at least a rotatable spinner table adapted to hold a wafer made integral with a frame via a tape, and a nozzle for supplying washing water to the wafer held on the spinner table, wherein the spinner table is provided with a frame support portion to support the frame, and a wafer region support portion, and a holding means having holding pendulums adapted to hold the frame between the, pendulums and frame support portion by a centrifugal force occurring due to rotation of the spinner table is provided at an outer circumference of the frame support portion, and the holding means is provided with at least a first holding means having first holding pendulums to hold a large-diameter frame, and a second holding means having second holding pendulums to hold a small-diameter frame.

2. A spinner washing apparatus according to Claim 1 , wherein the first holding means is provided on four portions of an outer circumference of the frame support portion at equal intervals, and the second holding means is provided at equal intervals in positions in which the second holding pendulums do not contact the first holding pendulums.

3. A spinner washing apparatus according to Claim 2, wherein the outer circumference of the frame support portion is provided with recesses extending toward the inner circumference thereof, and the second holding means is provided in the recesses.

4. A spinner washing apparatus according to any one of Claims 1 , 2 or 3, wherein the second holding means is provided with stoppers to restrict swinging of the second holding pendulums.

5. A dicing apparatus comprising at least a chuck table for holding a wafer made integral with a frame via a tape, a means for cutting the wafer held on the chuck table, a spinner washing apparatus defined in any one of Claims 1 , 2, 3 or 4, and a means for transferring the wafer finished being cut to the spinner washing apparatus.

6. A spinner washing apparatus according to claim 1, substantially as hereinbefore described and with reference to the accompanying drawings.

7. A dicing apparatus according to claim 5, substantially as hereinbefore described and with reference to the accompanying drawings. For the Applicant WOLFF, BREGMAN AND GOLLER