JPH0459155U - - Google Patents
Info
- Publication number
- JPH0459155U JPH0459155U JP10014690U JP10014690U JPH0459155U JP H0459155 U JPH0459155 U JP H0459155U JP 10014690 U JP10014690 U JP 10014690U JP 10014690 U JP10014690 U JP 10014690U JP H0459155 U JPH0459155 U JP H0459155U
- Authority
- JP
- Japan
- Prior art keywords
- movable
- chuck plate
- movable piece
- center
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims description 2
Landscapes
- Jigs For Machine Tools (AREA)
- Coating Apparatus (AREA)
Description
図面は本考案の実施例を示し、第１図は平面図
、第２図は断面図、以下チヤツクプレートの端部
を拡大して示し、第３図は分解斜視図、第４図は
横断面図、第５図は縦断面図である。
１……チヤツクプレート、３……アーム、７…
…吸引孔、８……可動片、１１……保持爪、１５
……押圧レバー、１８……錘。
The drawings show an embodiment of the present invention; FIG. 1 is a plan view, FIG. 2 is a cross-sectional view, the end of the chuck plate is shown on an enlarged scale, FIG. 3 is an exploded perspective view, and FIG. 4 is a cross-sectional view. The top view and FIG. 5 are longitudinal sectional views. 1...chuck plate, 3...arm, 7...
...Suction hole, 8...Movable piece, 11...Holding claw, 15
...Press lever, 18... Weight.
Claims (1)
レートの周縁部に放射状に設けた可動片、該可動
片は、吸引作用で中心方向に移動可能に設けられ
、ウエーハの周縁を保持する保持爪を有する、及
び、上記チヤツクプレートが回転した際、遠心力
作用で上記可動片を中心方向へ押圧するよう上記
チヤツクプレートに枢着した押圧レバーを具備す
るウエーハのスピンチヤツク。 ２ 上記チヤツクプレートは、放射状にアームを
有し、各アームに形成した吸引孔に上記可動片は
嵌着されている請求項１に記載のスピンチヤツク
。 ３ 上記押圧レバーは可動片の外側に枢着され、
一端が上記可動片に対向し、他端を外方に移動可
能に設けた錘に対向させた請求項１または２に記
載のスピンチヤツク。[Claims for Utility Model Registration] 1. A rotatable chuck plate, movable pieces provided radially around the periphery of the chuck plate, the movable pieces being movable toward the center by suction action, and capable of moving toward the center of the wafer. A wafer spin chuck having a holding claw for holding the periphery, and a pressing lever pivotally connected to the chuck plate so as to press the movable piece toward the center by centrifugal force when the chuck plate rotates. . 2. The spin chuck according to claim 1, wherein the chuck plate has radial arms, and the movable piece is fitted into a suction hole formed in each arm. 3 The pressing lever is pivotally mounted on the outside of the movable piece,
3. The spin chuck according to claim 1, wherein one end faces the movable piece and the other end faces a weight movable outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10014690U JPH0735395Y2 (en) | 1990-09-27 | 1990-09-27 | Spin chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10014690U JPH0735395Y2 (en) | 1990-09-27 | 1990-09-27 | Spin chuck |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459155U true JPH0459155U (en) | 1992-05-21 |
| JPH0735395Y2 JPH0735395Y2 (en) | 1995-08-09 |
Family
ID=31842569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10014690U Expired - Fee Related JPH0735395Y2 (en) | 1990-09-27 | 1990-09-27 | Spin chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735395Y2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223195A (en) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | Sheet-type substrate washing method and device, and substrate washing system |
| JP2001223194A (en) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | Sheet-type substrate washing device and substrate washing system |
| JP2002164318A (en) * | 2000-11-27 | 2002-06-07 | Ishii Hyoki Corp | Substrate-spinning apparatus |
| JP2002319613A (en) * | 2001-04-23 | 2002-10-31 | Topcon Corp | Wafer holder |
| JP2006128359A (en) * | 2004-10-28 | 2006-05-18 | Disco Abrasive Syst Ltd | Spinner cleaning device and dicing device |
| JP2008060579A (en) * | 2006-08-30 | 2008-03-13 | Semes Co Ltd | Spin head, and substrate processing method utilizing the same |
| JP2008258484A (en) * | 2007-04-06 | 2008-10-23 | Tatsumo Kk | Wafer clamp device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9130002B2 (en) | 2010-05-07 | 2015-09-08 | Lam Research Ag | Device for holding wafer shaped articles |
| CN107393855B (en) * | 2016-05-17 | 2020-10-09 | 上海新昇半导体科技有限公司 | Wafer positioning device and method |
-
1990
- 1990-09-27 JP JP10014690U patent/JPH0735395Y2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223195A (en) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | Sheet-type substrate washing method and device, and substrate washing system |
| JP2001223194A (en) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | Sheet-type substrate washing device and substrate washing system |
| JP2002164318A (en) * | 2000-11-27 | 2002-06-07 | Ishii Hyoki Corp | Substrate-spinning apparatus |
| JP2002319613A (en) * | 2001-04-23 | 2002-10-31 | Topcon Corp | Wafer holder |
| JP4488646B2 (en) * | 2001-04-23 | 2010-06-23 | 株式会社トプコン | Wafer holding device |
| JP2006128359A (en) * | 2004-10-28 | 2006-05-18 | Disco Abrasive Syst Ltd | Spinner cleaning device and dicing device |
| JP4502260B2 (en) * | 2004-10-28 | 2010-07-14 | 株式会社ディスコ | Spinner cleaning device and dicing device |
| JP2008060579A (en) * | 2006-08-30 | 2008-03-13 | Semes Co Ltd | Spin head, and substrate processing method utilizing the same |
| JP2008258484A (en) * | 2007-04-06 | 2008-10-23 | Tatsumo Kk | Wafer clamp device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0735395Y2 (en) | 1995-08-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |