JP2006128309A - キャパシタ装置及びその製造方法 - Google Patents
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Abstract
【解決手段】 基板10上に絶縁層16を形成する工程と、絶縁層16にインプリント法により凹部16x、16yを形成する工程と、絶縁層16の凹部16x,16yに金属層を埋め込んで下部電極20を得る工程と、下部電極20上に感光性の誘電体層を形成する工程と、誘電体層上に上部電極24を形成する工程と、上部電極24をマスクにして誘電体層を露光・現像して上部電極24の下に誘電体層パターン22を形成する工程とを含む。
【選択図】 図6
Description
図7〜図9は本発明の第2実施形態のキャパシタ装置の製造方法を示す断面図である。第2実施形態は、インプリント法に基づいて絶縁層にキャパシタの誘電体層パターンを埋め込んで形成する形態である。第1実施形態と同一工程については、その詳しい説明を省略する。
Claims (12)
- 基板と、
前記基板上に形成された絶縁層と、
前記絶縁層に形成された凹部と、
前記絶縁層の凹部に埋め込まれて形成された下部電極と、
前記下部電極上に形成された誘電体層パターンと、
前記誘電体層パターン上に形成された上部電極とを有することを特徴とするキャパシタ装置。 - 基板と、
前記基板の上方に形成された下部電極と、
前記下部電極の上に形成された絶縁層と、
前記下部電極上の前記絶縁層の部分に形成された開口部と、
前記絶縁層の開口部に埋め込まれて形成された誘電体層パターンと、
前記誘電体層パターン上に形成された上部電極とを有することを特徴とするキャパシタ装置。 - 前記下部電極の上面と前記絶縁層の上面とは同一面となっていることを特徴とする請求項1に記載のキャパシタ装置。
- 前記誘電体層パターンの上面と前記絶縁層の上面とは同一面となっていることを特徴とする請求項2に記載のキャパシタ装置。
- 基板上に絶縁層を形成する工程と、
前記絶縁層にインプリント法により凹部を形成する工程と、
前記絶縁層の凹部に金属層を埋め込んで下部電極を得る工程と、
前記下部電極上に誘電体層パターン及び上部電極が積層された構造を形成する工程とを有することを特徴とするキャパシタ装置の製造方法。 - 前記下部電極上に誘電体層パターン及び上部電極が積層された構造を形成する工程は、
前記下部電極及び前記絶縁層の上に感光性の誘電体層を形成する工程と、
前記下部電極上の誘電体層上の部分に上部電極をパターン化して形成する工程と、
前記上部電極をマスクにして前記誘電体層を露光・現像することにより、前記上部電極の下に前記誘電体層パターンを形成する工程とを含むことを特徴とする請求項5に記載のキャパシタ装置の製造方法。 - 前記下部電極を得る工程において、前記下部電極の上面と前記絶縁層の上面とは同一面となって形成されることを特徴とする請求項5又は6に記載のキャパシタ装置の製造方法。
- 前記絶縁層の凹部に金属層を埋め込んで下部電極を得る工程は、
前記絶縁層上及び前記凹部内にシード層を形成する工程と、
前記シード層をめっき給電層に利用する電解めっきにより前記凹部を埋め込む前記金属層を前記シード層上に形成する工程と、
前記金属層及び前記シード層を、前記絶縁層の上面が露出するまで研磨することにより、前記凹部内に前記金属層及び前記シード層を埋め込んで前記下部電極を得る工程とを含むことを特徴とする請求項5又は6に記載のキャパシタ装置の製造方法。 - 基板の上方に下部電極を形成する工程と、
前記下部電極上に絶縁層を形成する工程と、
前記下部電極上の前記絶縁層の部分に、インプリント法により前記下部電極が露出する開口部を形成する工程と、
前記絶縁層の開口部に誘電体層パターンを埋め込んで形成する工程と、
前記誘電体層パターン上に上部電極を形成する工程とを有することを特徴とするキャパシタ装置の製造方法。 - 前記絶縁層の開口部に誘電体層パターンを埋め込んで形成する工程は、
前記絶縁層の前記開口部を埋め込む誘電体層を前記絶縁層上に形成する工程と、
前記誘電体層を前記絶縁層の上面が露出するまで研磨することにより、前記凹部に前記誘電体層を埋め込んで前記誘電体層パターンを得る工程とを含むことを特徴とする請求項9に記載のキャパシタ装置の製造方法。 - 前記絶縁層の開口部に誘電体層パターンを埋め込んで形成する工程において、前記誘電体層パターンの上面と前記絶縁層の上面は同一面となって形成されることを特徴とする請求項9又は10に記載のキャパシタ装置の製造方法。
- 前記誘電体層を形成する工程において、前記誘電体層は、ローラコータ、スクリーン印刷、又はスピンコートによって形成されることを特徴とする請求項6又は10に記載のキャパシタ装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2004312744A JP2006128309A (ja) | 2004-10-27 | 2004-10-27 | キャパシタ装置及びその製造方法 |
KR1020050098049A KR20060054072A (ko) | 2004-10-27 | 2005-10-18 | 커패시터 장치 및 그 제조 방법 |
US11/252,597 US7678660B2 (en) | 2004-10-27 | 2005-10-19 | Capacitor device and method of manufacturing the same |
TW094136893A TW200621102A (en) | 2004-10-27 | 2005-10-21 | Capacitor device and method of manufacturing the same |
US12/656,221 US20100134952A1 (en) | 2004-10-27 | 2010-01-21 | Capacitor device and method of manufacturing the same |
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JP2004312744A JP2006128309A (ja) | 2004-10-27 | 2004-10-27 | キャパシタ装置及びその製造方法 |
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US (2) | US7678660B2 (ja) |
JP (1) | JP2006128309A (ja) |
KR (1) | KR20060054072A (ja) |
TW (1) | TW200621102A (ja) |
Cited By (4)
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JP2008094088A (ja) * | 2006-10-12 | 2008-04-24 | Samsung Electro Mech Co Ltd | インプリンティング用スタンパーの製造方法 |
JP2012030475A (ja) * | 2010-07-30 | 2012-02-16 | Fujikura Ltd | インプリントモールドの製造方法 |
KR101204890B1 (ko) | 2008-03-06 | 2012-11-26 | 삼성테크윈 주식회사 | 임베디드 회로 기판의 제조 방법 |
WO2017110808A1 (ja) * | 2015-12-24 | 2017-06-29 | 大日本印刷株式会社 | 配線構造体とその製造方法および電子装置 |
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US7608538B2 (en) * | 2007-01-05 | 2009-10-27 | International Business Machines Corporation | Formation of vertical devices by electroplating |
KR100835086B1 (ko) * | 2007-01-30 | 2008-06-03 | 삼성전기주식회사 | 박막 캐패시터 제조방법, 및 박막 캐패시터 내장형인쇄회로기판의 제조방법 |
CN102347522B (zh) * | 2010-08-04 | 2013-12-18 | 国立清华大学 | 高频滤波器 |
JP5687336B2 (ja) * | 2011-05-24 | 2015-03-18 | 三菱電機株式会社 | 高周波パッケージ |
JP2015095587A (ja) * | 2013-11-13 | 2015-05-18 | 日本特殊陶業株式会社 | 多層配線基板 |
US9577025B2 (en) * | 2014-01-31 | 2017-02-21 | Qualcomm Incorporated | Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device |
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2004
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2005
- 2005-10-18 KR KR1020050098049A patent/KR20060054072A/ko not_active Application Discontinuation
- 2005-10-19 US US11/252,597 patent/US7678660B2/en active Active
- 2005-10-21 TW TW094136893A patent/TW200621102A/zh unknown
-
2010
- 2010-01-21 US US12/656,221 patent/US20100134952A1/en not_active Abandoned
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JPH07335830A (ja) * | 1994-06-08 | 1995-12-22 | Sumitomo Metal Ind Ltd | 多層配線基板における酸化タンタル内蔵コンデンサの作製方法 |
JPH09116247A (ja) * | 1995-10-16 | 1997-05-02 | Oki Purintetsudo Circuit Kk | コンデンサー内蔵ビルドアップ型プリント配線基板の製造方法及びそのプリント配線基板並びにこの基板へのコンデンサーの実装構造 |
JP2002171048A (ja) * | 2000-12-01 | 2002-06-14 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
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JP2004103617A (ja) * | 2002-07-18 | 2004-04-02 | Hitachi Chem Co Ltd | 多層配線板、およびその製造方法、ならびに半導体装置および無線電子装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008094088A (ja) * | 2006-10-12 | 2008-04-24 | Samsung Electro Mech Co Ltd | インプリンティング用スタンパーの製造方法 |
JP4698650B2 (ja) * | 2006-10-12 | 2011-06-08 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | インプリンティング用スタンパーの製造方法 |
KR101204890B1 (ko) | 2008-03-06 | 2012-11-26 | 삼성테크윈 주식회사 | 임베디드 회로 기판의 제조 방법 |
JP2012030475A (ja) * | 2010-07-30 | 2012-02-16 | Fujikura Ltd | インプリントモールドの製造方法 |
WO2017110808A1 (ja) * | 2015-12-24 | 2017-06-29 | 大日本印刷株式会社 | 配線構造体とその製造方法および電子装置 |
Also Published As
Publication number | Publication date |
---|---|
US20060086964A1 (en) | 2006-04-27 |
TW200621102A (en) | 2006-06-16 |
KR20060054072A (ko) | 2006-05-22 |
US7678660B2 (en) | 2010-03-16 |
US20100134952A1 (en) | 2010-06-03 |
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