JP2008094088A - インプリンティング用スタンパーの製造方法 - Google Patents
インプリンティング用スタンパーの製造方法 Download PDFInfo
- Publication number
- JP2008094088A JP2008094088A JP2007234030A JP2007234030A JP2008094088A JP 2008094088 A JP2008094088 A JP 2008094088A JP 2007234030 A JP2007234030 A JP 2007234030A JP 2007234030 A JP2007234030 A JP 2007234030A JP 2008094088 A JP2008094088 A JP 2008094088A
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- Prior art keywords
- stamper
- insulating layer
- imprinting
- manufacturing
- copper
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】本発明によるスタンパー製造方法は、絶縁層11に複数の凹状パターン13を形成する段階と、凹状パターンに銅27を充填してスタンパー30を完成する段階と、スタンパー30を絶縁層11から分離する段階と、スタンパー30の表面に粗度43を付与する段階とを含み、スタンパー30が絶縁層11から容易に分離されるので、これらを分離するための別途の工程を行う必要がなく、スタンパーの変形を防止することができ、絶縁層を反復的に使用して複数のスタンパーを製造することができる。
【選択図】図1
Description
13 凹状パターン
15 第1凹部
17 第2凹部
19 基材
21 従来のスタンパー
23 第1突出部
25 第2突出部
27 銅
30 スタンパー
31 第1突出部
33 第2突出部
35 本体部
Claims (7)
- 絶縁層に複数の凹状パターンを形成する(a)段階と、
前記凹状パターンに銅を充填してスタンパーを完成する(b)段階と、
前記スタンパーを前記絶縁層から分離する(c)段階と、
前記スタンパーの表面に粗度を付与する(d)段階とを含むインプリンティング用スタンパーの製造方法。 - 前記凹状パターンが、第1凹部、及び前記第1凹部と連通され前記第1凹部に比して小さい直径を有する第2凹部からなることを特徴とする請求項1に記載のインプリンティング用スタンパーの製造方法。
- 前記第1凹部及び前記第2凹部が、前記絶縁層を貫通することを特徴とする請求項2に記載のインプリンティング用スタンパーの製造方法。
- 前記絶縁層の裏面には、基材が積層されていることを特徴とする請求項3に記載のインプリンティング用スタンパーの製造方法。
- 前記スタンパーが、前記凹状パターンに対応する形状を有する突出部及び前記突出部と一体で形成される本体部を備えることを特徴とする請求項1に記載のインプリンティング用スタンパーの製造方法。
- 前記(b)段階が、銅メッキまたは電気メッキにより前記凹状パターンを銅で充填することを特徴とする請求項1に記載のインプリンティング用スタンパーの製造方法。
- 前記(d)段階が、黒化処理を用いて前記スタンパーの表面に粗度を付与することを特徴とする請求項1に記載のインプリンティング用スタンパーの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0099449 | 2006-10-12 | ||
KR1020060099449A KR100772441B1 (ko) | 2006-10-12 | 2006-10-12 | 임프린팅용 스탬퍼 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008094088A true JP2008094088A (ja) | 2008-04-24 |
JP4698650B2 JP4698650B2 (ja) | 2011-06-08 |
Family
ID=39060524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007234030A Expired - Fee Related JP4698650B2 (ja) | 2006-10-12 | 2007-09-10 | インプリンティング用スタンパーの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7644496B2 (ja) |
JP (1) | JP4698650B2 (ja) |
KR (1) | KR100772441B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012030475A (ja) * | 2010-07-30 | 2012-02-16 | Fujikura Ltd | インプリントモールドの製造方法 |
JP2016046346A (ja) * | 2014-08-21 | 2016-04-04 | 株式会社東芝 | テンプレート、テンプレート形成方法および半導体装置の製造方法 |
WO2022124002A1 (ja) * | 2020-12-11 | 2022-06-16 | 東洋合成工業株式会社 | インプリント成型物の製造方法、パターン形成方法及び部品の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100811768B1 (ko) * | 2007-04-23 | 2008-03-07 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
KR100941302B1 (ko) | 2008-01-14 | 2010-02-11 | 고려대학교 산학협력단 | 광결정 광학 소자의 제조 방법 |
KR100987456B1 (ko) | 2008-08-06 | 2010-10-14 | 엘지전자 주식회사 | 곡면스탬퍼의 제작방법 |
JP5661666B2 (ja) * | 2012-02-29 | 2015-01-28 | 株式会社東芝 | パターン形成装置及び半導体装置の製造方法 |
Citations (4)
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JP2004504718A (ja) * | 2000-07-18 | 2004-02-12 | ナノネックス コーポレーション | 流体圧力インプリント・リソグラフィ |
JP2005133166A (ja) * | 2003-10-31 | 2005-05-26 | Tdk Corp | パターン転写用スタンパ及びその製造方法 |
JP2006082477A (ja) * | 2004-09-17 | 2006-03-30 | Seiko Instruments Inc | 電鋳型とその製造方法 |
JP2006128309A (ja) * | 2004-10-27 | 2006-05-18 | Shinko Electric Ind Co Ltd | キャパシタ装置及びその製造方法 |
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JP3410608B2 (ja) * | 1995-06-16 | 2003-05-26 | 株式会社クラレ | 導光体の製造方法 |
US5772905A (en) * | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
US6309580B1 (en) * | 1995-11-15 | 2001-10-30 | Regents Of The University Of Minnesota | Release surfaces, particularly for use in nanoimprint lithography |
US6027595A (en) * | 1998-07-02 | 2000-02-22 | Samsung Electronics Co., Ltd. | Method of making optical replicas by stamping in photoresist and replicas formed thereby |
US6277666B1 (en) * | 1999-06-24 | 2001-08-21 | Honeywell Inc. | Precisely defined microelectromechanical structures and associated fabrication methods |
TW508440B (en) * | 1999-12-27 | 2002-11-01 | Hoya Co Ltd | Probe structure and manufacturing method thereof |
US6875695B2 (en) * | 2002-04-05 | 2005-04-05 | Mems Optical Inc. | System and method for analog replication of microdevices having a desired surface contour |
KR20040013200A (ko) * | 2002-08-05 | 2004-02-14 | 엘지.필립스 엘시디 주식회사 | 요철형 스탬퍼 및 이를 이용한 액정표시장치 제조방법 |
US7071088B2 (en) * | 2002-08-23 | 2006-07-04 | Molecular Imprints, Inc. | Method for fabricating bulbous-shaped vias |
KR100496520B1 (ko) * | 2002-09-13 | 2005-06-22 | 주식회사 릿츠 | 포토리소그라피 방식을 이용한 스템퍼 제조방법 및 이 방법에 의해 제조된 스템퍼 |
KR100581152B1 (ko) * | 2004-09-15 | 2006-05-17 | 태산엘시디 주식회사 | 도광판 사출용 스템퍼 제조방법 |
JP4718946B2 (ja) * | 2004-09-27 | 2011-07-06 | 株式会社東芝 | 板状構造体の製造装置 |
-
2006
- 2006-10-12 KR KR1020060099449A patent/KR100772441B1/ko not_active IP Right Cessation
-
2007
- 2007-09-10 JP JP2007234030A patent/JP4698650B2/ja not_active Expired - Fee Related
- 2007-10-10 US US11/907,288 patent/US7644496B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004504718A (ja) * | 2000-07-18 | 2004-02-12 | ナノネックス コーポレーション | 流体圧力インプリント・リソグラフィ |
JP2005133166A (ja) * | 2003-10-31 | 2005-05-26 | Tdk Corp | パターン転写用スタンパ及びその製造方法 |
JP2006082477A (ja) * | 2004-09-17 | 2006-03-30 | Seiko Instruments Inc | 電鋳型とその製造方法 |
JP2006128309A (ja) * | 2004-10-27 | 2006-05-18 | Shinko Electric Ind Co Ltd | キャパシタ装置及びその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012030475A (ja) * | 2010-07-30 | 2012-02-16 | Fujikura Ltd | インプリントモールドの製造方法 |
JP2016046346A (ja) * | 2014-08-21 | 2016-04-04 | 株式会社東芝 | テンプレート、テンプレート形成方法および半導体装置の製造方法 |
WO2022124002A1 (ja) * | 2020-12-11 | 2022-06-16 | 東洋合成工業株式会社 | インプリント成型物の製造方法、パターン形成方法及び部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4698650B2 (ja) | 2011-06-08 |
KR100772441B1 (ko) | 2007-11-01 |
US20080086877A1 (en) | 2008-04-17 |
US7644496B2 (en) | 2010-01-12 |
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