JP2006114671A - 樹脂封止型発光装置 - Google Patents
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- JP2006114671A JP2006114671A JP2004300059A JP2004300059A JP2006114671A JP 2006114671 A JP2006114671 A JP 2006114671A JP 2004300059 A JP2004300059 A JP 2004300059A JP 2004300059 A JP2004300059 A JP 2004300059A JP 2006114671 A JP2006114671 A JP 2006114671A
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- 229910052710 silicon Inorganic materials 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
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- 229910052802 copper Inorganic materials 0.000 description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
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- 235000005811 Viola adunca Nutrition 0.000 description 1
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- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
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- -1 rare earth aluminate Chemical class 0.000 description 1
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- 238000005070 sampling Methods 0.000 description 1
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- 239000002470 thermal conductor Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
【解決手段】樹脂封止型発光装置において、各一端部が対向した第1のリード部材11および第2のリード部材12と、第1のリード部材上にダイボンディングされた発光素子10の上面側の第1の電極と第1のリード部材のインナーリード部111 とにボンディング接続された第1の導電性ワイヤ13と、発光素子の上面側の第2の電極と第2のリード部材12のインナーリード部121 とにボンディング接続された第2の導電性ワイヤ14と、発光素子、各リード部材の一部、各導電性ワイヤを被覆するように透光性樹脂がトランスファモールド成型されてなる樹脂パッケージ15とを具備し、第2のリード部材は、インナーリード部の両側面の上下方向に第1の溝123 が形成され、底面の幅方向に第2の溝124 が形成され、各溝内に樹脂パッケージの一部が埋め込まれている。
【選択図】 図1
Description
図1は、本発明の樹脂封止型発光装置の第1の実施形態に係る一例を概略的に示す部分断面側面図である。図2(a)、(b)は、図1中のリード部材を取り出して折り曲げ前の状態を拡大して示す上面図および側面図である。
図3は、本発明の樹脂封止型発光装置の第2の実施形態に係る一例を概略的に示す部分断面側面図である。
Claims (6)
- 金属部材が用いられてなり、長さ方向の一端部がダイ・パッド部となり、長さ方向の中間部が第1のインナーリード部となり、長さ方向の他端部が第1のアウターリード部となる第1のリード部材と、
金属部材が用いられてなり、長さ方向の一端部が第2のインナーリード部となり、長さ方向の他端部が第2のアウターリード部となり、前記第1のリード部材とは各一端同士が所定の間隙をあけて対向している第2のリード部材と、
一対の電極を有し、前記第1のリード部材のダイ・パッド部上に搭載されて固着された発光素子と、
前記発光素子の一対の電極のうちの1つの電極と前記第2のリード部材の第2のインナーリード部との間を電気的に接続するように両端がボンディング接続された導電性ワイヤと、
前記発光素子、第1のリード部材のダイ・パッド部、第1のリード部材の第1のインナーリード部、第2のリード部材の第2のインナーリード部、導電性ワイヤを被覆するように透光性樹脂がトランスファモールド成型されてなる樹脂パッケージ
とを有する樹脂封止型発光装置であって、前記第2のリード部材は、前記第2のインナーリード部の両側面の上下方向にそれぞれ第1の溝が少なくとも1本形成されており、前記第2のインナーリード部の底面の幅方向に第2の溝が少なくとも1本形成されており、これらの各溝の内部に前記樹脂パッケージの一部が埋め込まれていることを特徴とする樹脂封止型発光装置。 - 前記第1のリード部材は、長さ方向の一端部が肉厚の平板状であって上面にカップ状の凹部を有するダイ・パッド部となり、長さ方向の中間部が前記ダイ・パッド部に連なる肉厚の平板状であって前記第1のインナーリード部となり、長さ方向の他端部が前記第1のインナーリード部より薄い平板状であって前記第1のアウターリード部となり、前記ダイ・パッド部の凹部の底面上に前記発光素子が搭載されており、
前記第2のリード部材は、長さ方向の一端部が肉厚の平板状であって前記第2のインナーリード部となり、長さ方向の他端部が前記第2のインナーリード部より薄い平板状であって前記第2のアウターリード部となることを特徴とする請求項1記載の樹脂封止型発光装置。 - 前記第2の溝は、前記第1の溝よりも幅が狭いスリット状であることを特徴とする請求項1または2記載の樹脂封止型発光装置。
- 前記第1のリード部材の第1のインナーリード部の底面の幅方向に少なくとも1本のスリット状の第3の溝が形成されており、前記第3の溝の内部に前記樹脂パッケージの一部が埋め込まれていることを特徴とする請求項1乃至3のいずれか1項に記載の樹脂封止型発光装置。
- 前記第1のリード部材および第2のリード部材は、前記樹脂パッケージからそれぞれ突出したアウターリード部が前記樹脂パッケージの側面に沿い、さらに前記アウターリード部の先端部が前記樹脂パッケージの底面側に折り曲げられて表面実装接続用の外部端子を構成していることを特徴とする請求項1乃至4のいずれか1項に記載の樹脂封止型発光装置。
- 前記樹脂パッケージは、前記発光素子の上側方向に突出する凸レンズ形状の光放射面を有することを特徴とする請求項1乃至5のいずれか1項に記載の樹脂封止型発光装置。
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JP2004300059A JP4895493B2 (ja) | 2004-10-14 | 2004-10-14 | 樹脂封止型発光装置 |
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Publications (2)
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JP2006114671A true JP2006114671A (ja) | 2006-04-27 |
JP4895493B2 JP4895493B2 (ja) | 2012-03-14 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008041923A (ja) * | 2006-08-07 | 2008-02-21 | Matsushita Electric Ind Co Ltd | 発光装置 |
JP2008047712A (ja) * | 2006-08-16 | 2008-02-28 | Nichia Chem Ind Ltd | 発光装置 |
JP2009049352A (ja) * | 2007-08-22 | 2009-03-05 | Yiguang Electronic Ind Co Ltd | 電子デバイス装置およびその製造方法 |
JP2015079854A (ja) * | 2013-10-17 | 2015-04-23 | 日亜化学工業株式会社 | 発光装置 |
CN113972307A (zh) * | 2020-07-24 | 2022-01-25 | 鸿盛国际有限公司 | 具有双面胶体的发光二极管封装结构 |
Citations (9)
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JPH0621307A (ja) * | 1992-07-06 | 1994-01-28 | Matsushita Electron Corp | 樹脂封止型半導体装置のリードフレーム |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
JPH11307675A (ja) * | 1998-04-20 | 1999-11-05 | Matsushita Electron Corp | 樹脂封止型半導体装置及びその製造方法 |
JPH11345912A (ja) * | 1998-05-29 | 1999-12-14 | Rohm Co Ltd | 面実装型半導体装置 |
JP2000012911A (ja) * | 1998-06-23 | 2000-01-14 | Nichia Chem Ind Ltd | 半導体装置及び発光ダイオード |
JP2002198570A (ja) * | 2000-12-26 | 2002-07-12 | Toyoda Gosei Co Ltd | 固体光素子 |
JP2003008079A (ja) * | 2001-06-27 | 2003-01-10 | Toyoda Gosei Co Ltd | 反射型光学デバイス及びその製造方法 |
JP2003110145A (ja) * | 2001-09-27 | 2003-04-11 | Harvatek Corp | 発光ダイオード用の翼形表面実装パッケージ |
JP2003174200A (ja) * | 2001-12-07 | 2003-06-20 | Hitachi Cable Ltd | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
-
2004
- 2004-10-14 JP JP2004300059A patent/JP4895493B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0621307A (ja) * | 1992-07-06 | 1994-01-28 | Matsushita Electron Corp | 樹脂封止型半導体装置のリードフレーム |
JPH1187778A (ja) * | 1997-09-02 | 1999-03-30 | Toshiba Corp | 半導体発光素子、半導体発光装置およびその製造方法 |
JPH11307675A (ja) * | 1998-04-20 | 1999-11-05 | Matsushita Electron Corp | 樹脂封止型半導体装置及びその製造方法 |
JPH11345912A (ja) * | 1998-05-29 | 1999-12-14 | Rohm Co Ltd | 面実装型半導体装置 |
JP2000012911A (ja) * | 1998-06-23 | 2000-01-14 | Nichia Chem Ind Ltd | 半導体装置及び発光ダイオード |
JP2002198570A (ja) * | 2000-12-26 | 2002-07-12 | Toyoda Gosei Co Ltd | 固体光素子 |
JP2003008079A (ja) * | 2001-06-27 | 2003-01-10 | Toyoda Gosei Co Ltd | 反射型光学デバイス及びその製造方法 |
JP2003110145A (ja) * | 2001-09-27 | 2003-04-11 | Harvatek Corp | 発光ダイオード用の翼形表面実装パッケージ |
JP2003174200A (ja) * | 2001-12-07 | 2003-06-20 | Hitachi Cable Ltd | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008041923A (ja) * | 2006-08-07 | 2008-02-21 | Matsushita Electric Ind Co Ltd | 発光装置 |
JP2008047712A (ja) * | 2006-08-16 | 2008-02-28 | Nichia Chem Ind Ltd | 発光装置 |
JP2009049352A (ja) * | 2007-08-22 | 2009-03-05 | Yiguang Electronic Ind Co Ltd | 電子デバイス装置およびその製造方法 |
JP2015079854A (ja) * | 2013-10-17 | 2015-04-23 | 日亜化学工業株式会社 | 発光装置 |
US9831402B2 (en) | 2013-10-17 | 2017-11-28 | Nichia Corporation | Light emitting device |
CN113972307A (zh) * | 2020-07-24 | 2022-01-25 | 鸿盛国际有限公司 | 具有双面胶体的发光二极管封装结构 |
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