JP5206204B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP5206204B2 JP5206204B2 JP2008199084A JP2008199084A JP5206204B2 JP 5206204 B2 JP5206204 B2 JP 5206204B2 JP 2008199084 A JP2008199084 A JP 2008199084A JP 2008199084 A JP2008199084 A JP 2008199084A JP 5206204 B2 JP5206204 B2 JP 5206204B2
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- 229910052725 zinc Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/181—Encapsulation
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Description
図1は、本発明の樹脂封止型発光装置の実施の形態に係る一例を概略的に示す端面側面図である。図2は、図1中のリード部材を取り出して折り曲げ前の状態を説明するための上面図である。また、図3(a)、(b)は、図1中のリードフレームの製造方法の一例を示す図であり、図4は、図1中のリード部材を取り出して示す部分上面図である。
このようにして、第1の隅部101および第4の隅部104に肉薄部110が形成されると、隅部の上面を平坦に加工することができ、ダイボンドやワイヤボンドの強度を高めることができる。また、上面の表面積を広げることができることから、保護素子載置領域や、ワイヤボンド領域を広くすることもでき、好ましい。本実施の形態において、肉薄部110は、図4に示すような領域に形成されるのが好ましい。
図5は、本発明の発光装置の実施の形態2に係る発光装置のリード部材を取り出して示す部分上面図であり、図6は実施の形態2に係る発光装置のリード部材を取り出して示す斜視図である。
各リード部材は、高熱伝導体を用いることが好ましく、鉄入り銅等の表面に銀、アルミニウム、金等の金属メッキを施し、その表面を平滑にして反射率を向上させることが好ましい。本例では、銅(Cu)合金板の表面に銀(Ag)メッキが施されている。これらの金属の熱膨張率は、銅(Cu)で16.7×10-6/℃、鉄(Fe)で11.8×10-6/℃である。
発光素子は、460nm近傍に発光ピーク波長を持つ青色発光の発光素子、410nm近傍に発光ピーク波長を持つ青紫色発光の発光素子、365nm近傍に発光ピーク波長を持つ紫外線発光の発光素子などを使用することができる。
例えば青色発光あるいは緑色発光を有し、サファイア基板上に窒化物半導体を成長させた発光素子をリード部材の発光素子載置部上に接合(ダイボンデイング)する場合には、接合部材としてエポキシ樹脂やシリコーン等を用いることができる。また、発光素子からの光や熱による劣化を考慮して、樹脂を使用せず、Au−Sn共晶半田や、低融点金属等のろう材を用いることもできる。
導電性ワイヤとしては、発光素子の電極とのオーミック性、機械的接続性、電気伝導性および熱伝導性が良いものが求められる。熱伝導率としては、0.01cal /(S )(cm2 )(℃/cm)以上が好ましく、より好ましくは、0.5cal/(S )(cm2 )(℃/cm)以上である。また、作業性などを考慮して導電性ワイヤの直径は、好ましくは10μm以上、45μm以下である。このような導電性ワイヤとして、具体的には、金、銅、白金、アルミニウム等の金属およびそれらの合金を用いたワイヤが挙げられる。このような導電性ワイヤは、ワイヤボンデイング装置によって、各発光素子と内部端子との間に容易にボンデイング接続させることができる。
透光性樹脂は、外力、水分等から発光素子を保護するように封止することができる。発光装置の製造工程中あるいは製造段階での保管中に透光性樹脂内に水分が含まれてしまった場合においては、100 ℃で14時間以上のべ−キングを行うことによって、樹脂内に含有された水分を外気へ逃がすことができるので、水蒸気爆発や、発光素子と封止部材との剥がれに起因する色調のずれ等の弊害を防ぐことができる。
100a、200a…第1のリード部材
100b、200b…第2のリード部材
101、201…第1の隅部
102、202…第2の隅部
103、203…第3の隅部
104、204…第4の隅部
105…発光素子載置部
106a…第1のインナーリード部
106b…第2のインナーリード部
107a…第1のアウターリード部
107b…第2のアウターリード部
108、208…外部端子
109…溝部
110、210…肉薄部
111…成形パンチ
112…発光素子
113…透光性樹脂
114…導電性ワイヤ
116…保護素子
117…平坦部
118…溝部
Claims (4)
- 発光素子と、
前記発光素子が載置される第1のリード部材と、
所定の間隙をあけて前記第1のリード部材と、その隅部が対向する第2のリード部材と、
前記発光素子の電極と前記第2のリード部材とを電気的に接続する導電性ワイヤと、
前記発光素子、第1のリード部材および第2のリード部材の隅部の端面、導電性ワイヤを被覆する透光性樹脂と、を有する発光装置であって、
前記第1のリード部材の第1の隅部が鋭角であり、第2の隅部が鈍角であり、
前記第2のリード部材の第3の隅部が鈍角であり、第4の隅部が鋭角であり、
前記第1の隅部と前記第3の隅部が対向しており、
前記第2の隅部と前記第4の隅部が対向しており、
前記第1の隅部と前記第4の隅部は、リード部材の厚みが肉薄であることを特徴とする発光装置。 - 前記第1の隅部に搭載された保護素子と、前記保護素子の電極と前記第2のリード部材とを電気的に接続する導電性ワイヤと、を有する請求項1に記載の発光装置。
- 前記第1のリード部材は、その上面に凹部を有し、該凹部に前記発光素子が載置されてなる請求項1または2に記載の発光装置。
- 発光素子と、
前記発光素子が載置される第1のリード部材と、
所定の間隙をあけて前記第1のリード部材と、その端部が対向する第2のリード部材と、
前記発光素子の電極と前記第2のリード部材とを電気的に接続する導電性ワイヤと、
前記発光素子、第1のリード部材および第2のリード部材の一部、導電性ワイヤを被覆する透光性樹脂とを有する発光装置を製造する方法であって、
金属部材の延長方向に対して前記金属部材を斜めに切断することにより前記第1および第2のリード部材の隅部をそれぞれ鈍角および鋭角に形成する工程と、
前記鋭角に形成された部分をプレス加工することにより、リード部材の厚みが肉薄となる部分を形成する工程と、
前記第1のリード部材に前記発光素子を載置する工程と、
前記発光素子の電極と前記第2のリード部材とを導電性ワイヤにて電気的に接続する工程と、
前記第1のリード部材および第2のリード部材の隅部の端面、前記発光素子、導電性ワイヤを前記透光性樹脂にて被覆する工程と、を有することを特徴とする発光装置の製造方法。
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JP2008199084A JP5206204B2 (ja) | 2008-07-31 | 2008-07-31 | 発光装置 |
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JP2008199084A JP5206204B2 (ja) | 2008-07-31 | 2008-07-31 | 発光装置 |
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JP2010040613A JP2010040613A (ja) | 2010-02-18 |
JP5206204B2 true JP5206204B2 (ja) | 2013-06-12 |
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