JP2006059928A - プリント基板 - Google Patents

プリント基板 Download PDF

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Publication number
JP2006059928A
JP2006059928A JP2004238690A JP2004238690A JP2006059928A JP 2006059928 A JP2006059928 A JP 2006059928A JP 2004238690 A JP2004238690 A JP 2004238690A JP 2004238690 A JP2004238690 A JP 2004238690A JP 2006059928 A JP2006059928 A JP 2006059928A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
distance
wiring patterns
chip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004238690A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006059928A5 (enExample
Inventor
Toshio Ishimoto
敏男 石本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orion Electric Co Ltd
Original Assignee
Orion Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orion Electric Co Ltd filed Critical Orion Electric Co Ltd
Priority to JP2004238690A priority Critical patent/JP2006059928A/ja
Priority to US11/205,331 priority patent/US20060038264A1/en
Publication of JP2006059928A publication Critical patent/JP2006059928A/ja
Publication of JP2006059928A5 publication Critical patent/JP2006059928A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2004238690A 2004-08-18 2004-08-18 プリント基板 Pending JP2006059928A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004238690A JP2006059928A (ja) 2004-08-18 2004-08-18 プリント基板
US11/205,331 US20060038264A1 (en) 2004-08-18 2005-08-17 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004238690A JP2006059928A (ja) 2004-08-18 2004-08-18 プリント基板

Publications (2)

Publication Number Publication Date
JP2006059928A true JP2006059928A (ja) 2006-03-02
JP2006059928A5 JP2006059928A5 (enExample) 2007-03-15

Family

ID=35908869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004238690A Pending JP2006059928A (ja) 2004-08-18 2004-08-18 プリント基板

Country Status (2)

Country Link
US (1) US20060038264A1 (enExample)
JP (1) JP2006059928A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770514B2 (ja) * 2006-02-27 2011-09-14 株式会社デンソー 電子装置
JP5339968B2 (ja) * 2009-03-04 2013-11-13 パナソニック株式会社 実装構造体及びモータ
CN105069215A (zh) * 2015-07-31 2015-11-18 中国人民解放军国防科学技术大学 一种基于宽线的双轨信号布线方法
CN112135414A (zh) * 2020-09-11 2020-12-25 浪潮电子信息产业股份有限公司 一种印刷电路板及其挖空区布线调整方法、装置及设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JPH09237962A (ja) * 1995-12-28 1997-09-09 Sanyo Electric Co Ltd 電子回路装置
JP3349133B2 (ja) * 2000-04-07 2002-11-20 エヌイーシートーキン株式会社 チップ型コンデンサ及びその製造方法並びにモールド金型
JP2002359461A (ja) * 2001-06-01 2002-12-13 Nec Corp 電子部品の実装方法および実装構造体、メタルマスク
JP2003101173A (ja) * 2001-09-27 2003-04-04 Olympus Optical Co Ltd フレキシブルプリント基板
JP2004071977A (ja) * 2002-08-08 2004-03-04 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
US20060038264A1 (en) 2006-02-23

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