JP2006047575A5 - - Google Patents

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Publication number
JP2006047575A5
JP2006047575A5 JP2004226993A JP2004226993A JP2006047575A5 JP 2006047575 A5 JP2006047575 A5 JP 2006047575A5 JP 2004226993 A JP2004226993 A JP 2004226993A JP 2004226993 A JP2004226993 A JP 2004226993A JP 2006047575 A5 JP2006047575 A5 JP 2006047575A5
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JP
Japan
Prior art keywords
substrates
substrate
holding
holding table
bonding
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Granted
Application number
JP2004226993A
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English (en)
Japanese (ja)
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JP4482395B2 (ja
JP2006047575A (ja
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Publication date
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Priority claimed from JP2004226993A external-priority patent/JP4482395B2/ja
Priority to JP2004226993A priority Critical patent/JP4482395B2/ja
Priority to TW094125389A priority patent/TWI379129B/zh
Priority to KR1020050070728A priority patent/KR101170942B1/ko
Priority to CN2010102275284A priority patent/CN101900912B/zh
Priority to CN2005100890593A priority patent/CN1737672B/zh
Publication of JP2006047575A publication Critical patent/JP2006047575A/ja
Publication of JP2006047575A5 publication Critical patent/JP2006047575A5/ja
Publication of JP4482395B2 publication Critical patent/JP4482395B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004226993A 2004-08-03 2004-08-03 基板の貼り合わせ方法及び貼り合わせ装置 Expired - Lifetime JP4482395B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004226993A JP4482395B2 (ja) 2004-08-03 2004-08-03 基板の貼り合わせ方法及び貼り合わせ装置
TW094125389A TWI379129B (en) 2004-08-03 2005-07-27 Method of bonding substrates and apparatus for bonding substrates
KR1020050070728A KR101170942B1 (ko) 2004-08-03 2005-08-02 기판의 접합 방법 및 접합 장치
CN2005100890593A CN1737672B (zh) 2004-08-03 2005-08-03 基板的贴合方法及贴合装置
CN2010102275284A CN101900912B (zh) 2004-08-03 2005-08-03 基板的贴合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004226993A JP4482395B2 (ja) 2004-08-03 2004-08-03 基板の貼り合わせ方法及び貼り合わせ装置

Publications (3)

Publication Number Publication Date
JP2006047575A JP2006047575A (ja) 2006-02-16
JP2006047575A5 true JP2006047575A5 (enrdf_load_stackoverflow) 2007-09-06
JP4482395B2 JP4482395B2 (ja) 2010-06-16

Family

ID=36026215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004226993A Expired - Lifetime JP4482395B2 (ja) 2004-08-03 2004-08-03 基板の貼り合わせ方法及び貼り合わせ装置

Country Status (4)

Country Link
JP (1) JP4482395B2 (enrdf_load_stackoverflow)
KR (1) KR101170942B1 (enrdf_load_stackoverflow)
CN (2) CN101900912B (enrdf_load_stackoverflow)
TW (1) TWI379129B (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007119409A1 (ja) * 2006-03-31 2007-10-25 Citizen Holdings Co., Ltd. 大型基板及びそれを用いた液晶装置並びにその製造方法
JP4786693B2 (ja) 2008-09-30 2011-10-05 三菱重工業株式会社 ウェハ接合装置およびウェハ接合方法
CN102654668B (zh) * 2011-08-01 2014-11-19 北京京东方光电科技有限公司 真空对盒设备及对盒系统
KR101311369B1 (ko) * 2011-11-25 2013-09-25 (주)다이솔티모 전해액 주입홀 실링장치 및 그를 이용한 염료 감응형 태양전지 제조방법
KR101623325B1 (ko) * 2012-07-30 2016-05-20 시바우라 메카트로닉스 가부시끼가이샤 기판 접합 장치 및 기판 접합 방법
CN105189119B (zh) 2013-04-30 2017-03-29 旭硝子株式会社 层叠体的制造装置及层叠体的制造方法
JP5705937B2 (ja) * 2013-09-13 2015-04-22 信越エンジニアリング株式会社 貼合デバイスの製造装置及び製造方法
JP2015158603A (ja) * 2014-02-24 2015-09-03 株式会社Sat 基板の貼り合せ装置
CN104267494B (zh) * 2014-09-29 2017-10-10 华南师范大学 一种电润湿显示器件液面下精密对位与贴合的制程设备和方法
CN104849936B (zh) * 2015-04-15 2018-04-10 华南师范大学 一种封装电润湿显示器件的方法
TWI582411B (zh) * 2015-09-10 2017-05-11 由田新技股份有限公司 面板按壓檢查機
CN109581707B (zh) * 2018-11-15 2021-02-26 惠科股份有限公司 贴合显示面板的方法、控制装置及真空贴合机
US11604372B2 (en) 2018-11-15 2023-03-14 HKC Corporation Limited Method and control device for laminating display panel as well as vacuum laminator
US11231604B2 (en) * 2019-02-20 2022-01-25 Jvckenwood Corporation Manufacturing apparatus and manufacturing method of liquid crystal device
CN112937058B (zh) * 2021-03-24 2024-05-24 滁州惠科光电科技有限公司 一种真空贴合机的抽气控制方法、系统及真空贴合机

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002098975A (ja) 2000-09-21 2002-04-05 Seiko Epson Corp 液晶装置の製造方法
JP4224959B2 (ja) 2001-08-21 2009-02-18 株式会社日立プラントテクノロジー 液晶基板の組立装置
JP2003131241A (ja) 2001-10-24 2003-05-08 Matsushita Electric Ind Co Ltd 液晶基板の貼り合わせ方法
US6991699B2 (en) 2002-02-05 2006-01-31 Lg.Philips Lcd Co., Ltd. LCD bonding machine and method for fabricating LCD by using the same
US6784970B2 (en) * 2002-02-27 2004-08-31 Lg.Philips Lcd Co., Ltd. Method of fabricating LCD
US6833901B2 (en) * 2002-02-27 2004-12-21 Lg. Philips Lcd Co., Ltd. Method for fabricating LCD having upper substrate coated with sealant
KR100720414B1 (ko) * 2002-02-27 2007-05-22 엘지.필립스 엘시디 주식회사 액정 표시 장치의 제조 방법
CN1325981C (zh) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 粘合机中的工作台结构及其控制方法
US7341641B2 (en) * 2002-03-20 2008-03-11 Lg.Philips Lcd Co., Ltd. Bonding device for manufacturing liquid crystal display device
KR100493384B1 (ko) * 2002-11-07 2005-06-07 엘지.필립스 엘시디 주식회사 액정표시소자 제조 공정용 기판 합착 장치의 기판을로딩하기 위한 구조
CN1183955C (zh) * 2003-04-09 2005-01-12 李保刚 用杜仲叶连续生产杜仲浸膏粉、杜仲胶、杜仲树脂和有机肥的生产方法

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