JP2006027108A - 素子基板およびその製造方法 - Google Patents
素子基板およびその製造方法 Download PDFInfo
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- JP2006027108A JP2006027108A JP2004210086A JP2004210086A JP2006027108A JP 2006027108 A JP2006027108 A JP 2006027108A JP 2004210086 A JP2004210086 A JP 2004210086A JP 2004210086 A JP2004210086 A JP 2004210086A JP 2006027108 A JP2006027108 A JP 2006027108A
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- 239000000758 substrate Substances 0.000 title claims abstract description 103
- 238000004519 manufacturing process Methods 0.000 title abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000007788 liquid Substances 0.000 claims description 63
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 2
- 230000035515 penetration Effects 0.000 claims 2
- 230000008569 process Effects 0.000 abstract description 13
- 230000015572 biosynthetic process Effects 0.000 abstract description 9
- 230000006872 improvement Effects 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 24
- 239000010410 layer Substances 0.000 description 13
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 238000001312 dry etching Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000001454 recorded image Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
【解決手段】素子基板10は、基板11と、基板11を貫通するインク供給口13と、基板11上に設けられ、インク供給口13から流入したインクに吐出エネルギーを供給するエネルギー供給手段16とを有している。素子基板10の製造方法は、基板11上にエネルギー供給手段16を形成する工程と、その後に、基板11を薄化する工程と、その後に、基板11にインク供給口13を形成するインク供給口形成工程とを有している。
【選択図】 図2
Description
10 素子基板
11 基板
12 貫通電極
13 インク供給口
14 液流路
15 電極
16 発熱抵抗体
18 吐出口
20 オリフィス
21 オリフィスプレート
22 貫通穴
26 パターン
27 エポキシ膜
28 樹脂膜
100 記録ヘッドカートリッジ
101 インクタンク
102 インクホルダ
103 ベースプレート
104 記録ヘッド
Claims (10)
- 基板と、該基板を貫通するインク供給口と、該基板上に設けられ、該インク供給口から流入したインクに吐出エネルギーを供給するエネルギー供給手段とを有する素子基板の形成方法であって、
前記基板上に前記エネルギー供給手段を形成する工程と、
その後に、前記基板を薄化する工程と、
その後に、前記基板に前記インク供給口を形成するインク供給口形成工程とを有する、素子基板の形成方法。 - 前記素子基板は、前記基板を貫通して前記エネルギー供給手段に接続し、前記エネルギー供給手段に駆動電流を供給する貫通電極をさらに有し、
前記インク供給口形成工程は、前記基板に前記インク供給口と前記貫通電極とを形成する貫通部形成工程を有する、請求項1に記載の素子基板の形成方法。 - 前記貫通部形成工程は、
前記貫通電極の形成のための貫通穴を形成する工程と、
その後に、前記貫通穴に導電性材料を充填し前記貫通電極を形成する工程と、
その後に、前記インク供給口を形成する工程とを有する、
請求項2に記載の素子基板の形成方法。 - 前記貫通部形成工程は、
前記インク供給口と、前記貫通電極の形成のための貫通穴とを同時に形成する工程と、
その後に、前記貫通穴に導電性材料を充填し前記貫通電極を形成する工程とを有する、
請求項2に記載の素子基板の形成方法。 - 請求項1から4のいずれか1項に記載の素子基板の形成方法によって素子基板を形成する工程と、
前記インク供給口と接続し、前記素子基板の前記エネルギー供給手段が設けられた面上を延びる液流路と、該液流路と接続し前記エネルギー供給手段によって吐出エネルギーを与えられたインクを記録媒体に吐出させるオリフィスとを形成するオリフィスプレートを形成する工程と
を有する、液体吐出素子の形成方法。 - 基板と、
前記基板を貫通するインク供給口と、
前記基板上に設けられ、前記インク供給口から流入したインクに吐出エネルギーを供給するエネルギー供給手段とを有する素子基板において、
前記基板は50μm〜300μmの厚さであることを特徴とする、素子基板。 - 前記基板を貫通して前記エネルギー供給手段に接続し、前記エネルギー供給手段に駆動電流を供給する貫通電極を有する、請求項6に記載の素子基板。
- 請求項6または7に記載の素子基板と、
前記インク供給口と接続し、前記素子基板の前記エネルギー供給手段が設けられた面上を延びる液流路と、前記液流路と接続し前記エネルギー供給手段によって吐出エネルギーを与えられたインクを記録媒体に吐出させるオリフィスとを形成するオリフィスプレートと
を有する液体吐出素子。 - 請求項8に記載の少なくとも1つの液体吐出素子と、
前記液体吐出素子を支持するベースプレートと
を有する記録ヘッド。 - 請求項9に記載の記録ヘッドと、
前記液体吐出素子に供給するインクを保有するインクタンクと
とを有する記録ヘッドカートリッジ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004210086A JP4274554B2 (ja) | 2004-07-16 | 2004-07-16 | 素子基板および液体吐出素子の形成方法 |
US11/179,543 US7757397B2 (en) | 2004-07-16 | 2005-07-13 | Method for forming an element substrate |
TW094124154A TWI273983B (en) | 2004-07-16 | 2005-07-15 | Liquid ejection element and manufacturing method therefor |
KR1020050064023A KR100790605B1 (ko) | 2004-07-16 | 2005-07-15 | 소자 기판의 제조 방법 및 액체 토출 소자의 제조 방법 |
CNB200510084876XA CN100418773C (zh) | 2004-07-16 | 2005-07-18 | 用于形成喷液元件基质的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004210086A JP4274554B2 (ja) | 2004-07-16 | 2004-07-16 | 素子基板および液体吐出素子の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006027108A true JP2006027108A (ja) | 2006-02-02 |
JP4274554B2 JP4274554B2 (ja) | 2009-06-10 |
Family
ID=35598986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004210086A Expired - Fee Related JP4274554B2 (ja) | 2004-07-16 | 2004-07-16 | 素子基板および液体吐出素子の形成方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7757397B2 (ja) |
JP (1) | JP4274554B2 (ja) |
KR (1) | KR100790605B1 (ja) |
CN (1) | CN100418773C (ja) |
TW (1) | TWI273983B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7686423B2 (en) | 2006-06-07 | 2010-03-30 | Canon Kabushiki Kaisha | Liquid discharge head and manufacturing method thereof |
JP2010188572A (ja) * | 2009-02-17 | 2010-09-02 | Canon Inc | インクジェット記録ヘッド及びそのクリーニング方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4274555B2 (ja) * | 2004-07-16 | 2009-06-10 | キヤノン株式会社 | 液体吐出素子基板の製造方法および液体吐出素子の製造方法 |
JP4274556B2 (ja) * | 2004-07-16 | 2009-06-10 | キヤノン株式会社 | 液体吐出素子の製造方法 |
JP4274554B2 (ja) | 2004-07-16 | 2009-06-10 | キヤノン株式会社 | 素子基板および液体吐出素子の形成方法 |
US11161351B2 (en) * | 2018-09-28 | 2021-11-02 | Canon Kabushiki Kaisha | Liquid ejection head |
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JP2002301824A (ja) | 2001-04-05 | 2002-10-15 | Fuji Xerox Co Ltd | インクジェット記録ヘッドおよびその作製方法、ならびにインクジェット記録装置 |
JP4136523B2 (ja) * | 2001-08-10 | 2008-08-20 | キヤノン株式会社 | 液体吐出ヘッドの製造方法、液体吐出ヘッド用基板および基板加工方法 |
CN1408550A (zh) * | 2001-09-28 | 2003-04-09 | 飞赫科技股份有限公司 | 压电式喷墨打印头及其制造方法 |
US7381341B2 (en) * | 2002-07-04 | 2008-06-03 | Seiko Epson Corporation | Method of manufacturing liquid jet head |
US20040134881A1 (en) * | 2002-07-04 | 2004-07-15 | Seiko Epson Corporation | Method of manufacturing liquid jet head |
JP2004181651A (ja) | 2002-11-29 | 2004-07-02 | Seiko Epson Corp | 液体吐出ヘッドの製造方法並びに液体吐出ヘッド及びこれを備えたデバイスの製造装置、インクジェット式記録装置 |
JP4274554B2 (ja) | 2004-07-16 | 2009-06-10 | キヤノン株式会社 | 素子基板および液体吐出素子の形成方法 |
JP4274556B2 (ja) * | 2004-07-16 | 2009-06-10 | キヤノン株式会社 | 液体吐出素子の製造方法 |
JP4274555B2 (ja) * | 2004-07-16 | 2009-06-10 | キヤノン株式会社 | 液体吐出素子基板の製造方法および液体吐出素子の製造方法 |
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2004
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2005
- 2005-07-13 US US11/179,543 patent/US7757397B2/en not_active Expired - Fee Related
- 2005-07-15 KR KR1020050064023A patent/KR100790605B1/ko not_active IP Right Cessation
- 2005-07-15 TW TW094124154A patent/TWI273983B/zh not_active IP Right Cessation
- 2005-07-18 CN CNB200510084876XA patent/CN100418773C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7686423B2 (en) | 2006-06-07 | 2010-03-30 | Canon Kabushiki Kaisha | Liquid discharge head and manufacturing method thereof |
JP2010188572A (ja) * | 2009-02-17 | 2010-09-02 | Canon Inc | インクジェット記録ヘッド及びそのクリーニング方法 |
US8573758B2 (en) | 2009-02-17 | 2013-11-05 | Canon Kabushiki Kaisha | Liquid jet recording head and liquid supply method |
Also Published As
Publication number | Publication date |
---|---|
US7757397B2 (en) | 2010-07-20 |
KR20060050197A (ko) | 2006-05-19 |
JP4274554B2 (ja) | 2009-06-10 |
CN1721189A (zh) | 2006-01-18 |
TWI273983B (en) | 2007-02-21 |
KR100790605B1 (ko) | 2008-01-02 |
US20060012641A1 (en) | 2006-01-19 |
CN100418773C (zh) | 2008-09-17 |
TW200607653A (en) | 2006-03-01 |
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