JP2005538535A5 - - Google Patents
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- Publication number
- JP2005538535A5 JP2005538535A5 JP2004521992A JP2004521992A JP2005538535A5 JP 2005538535 A5 JP2005538535 A5 JP 2005538535A5 JP 2004521992 A JP2004521992 A JP 2004521992A JP 2004521992 A JP2004521992 A JP 2004521992A JP 2005538535 A5 JP2005538535 A5 JP 2005538535A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- compound
- resin
- thermal
- layered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 21
- 239000000463 material Substances 0.000 claims 19
- 239000011347 resin Substances 0.000 claims 17
- 229920005989 resin Polymers 0.000 claims 17
- 150000001875 compounds Chemical class 0.000 claims 16
- 229910052751 metal Inorganic materials 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 12
- 238000004132 cross linking Methods 0.000 claims 9
- 229910000679 solder Inorganic materials 0.000 claims 8
- 229910052782 aluminium Inorganic materials 0.000 claims 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 6
- 150000001412 amines Chemical class 0.000 claims 6
- 229920001296 polysiloxane Polymers 0.000 claims 6
- -1 siloxane compound Chemical class 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 239000004971 Cross linker Substances 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- 229910052797 bismuth Inorganic materials 0.000 claims 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 229920001971 elastomer Polymers 0.000 claims 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 4
- 229910052738 indium Inorganic materials 0.000 claims 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 4
- 239000004332 silver Substances 0.000 claims 4
- 229910052718 tin Inorganic materials 0.000 claims 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 4
- 229920002554 vinyl polymer Polymers 0.000 claims 4
- 239000011231 conductive filler Substances 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 229910000962 AlSiC Inorganic materials 0.000 claims 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 2
- 229910052733 gallium Inorganic materials 0.000 claims 2
- 150000004678 hydrides Chemical class 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229920006395 saturated elastomer Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000012782 phase change material Substances 0.000 claims 1
- 230000003068 static effect Effects 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39629402P | 2002-07-15 | 2002-07-15 | |
| PCT/US2003/022710 WO2004008497A2 (en) | 2002-07-15 | 2003-07-15 | Thermal interconnect and interface systems, methods of production and uses thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005538535A JP2005538535A (ja) | 2005-12-15 |
| JP2005538535A5 true JP2005538535A5 (enExample) | 2006-08-31 |
Family
ID=30116003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004521992A Pending JP2005538535A (ja) | 2002-07-15 | 2003-07-15 | 熱的インターコネクトおよびインターフェースシステム、製造方法およびその使用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20060040112A1 (enExample) |
| EP (1) | EP1531985A4 (enExample) |
| JP (1) | JP2005538535A (enExample) |
| CN (1) | CN1681648A (enExample) |
| AU (1) | AU2003254046A1 (enExample) |
| TW (1) | TW200409246A (enExample) |
| WO (1) | WO2004008497A2 (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7210227B2 (en) * | 2002-11-26 | 2007-05-01 | Intel Corporation | Decreasing thermal contact resistance at a material interface |
| DE10319888A1 (de) | 2003-04-25 | 2004-11-25 | Siemens Ag | Lotmaterial auf SnAgCu-Basis |
| JP4551074B2 (ja) * | 2003-10-07 | 2010-09-22 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| US7261389B2 (en) * | 2003-11-26 | 2007-08-28 | Fuji Xerox Co., Ltd. | Systems and methods for dissipating heat into a fluid ejector carriage device |
| US7192116B2 (en) * | 2003-11-26 | 2007-03-20 | Fuji Xerox Co., Ltd. | Systems and methods for dissipating heat from a fluid ejector carriage |
| EP1731002A4 (en) * | 2004-03-30 | 2010-05-26 | Honeywell Int Inc | HEAT DISTRIBUTION STRUCTURES, INTEGRATED CIRCUITS, METHOD FOR GENERATING HEAT DISTRIBUTION CONSTRUCTIONS, AND METHOD FOR GENERATING INTEGRATED CIRCUITS |
| JP2005317796A (ja) * | 2004-04-28 | 2005-11-10 | Toshiba Corp | ポンプ、冷却装置および電子機器 |
| CN100389166C (zh) * | 2004-04-29 | 2008-05-21 | 鸿富锦精密工业（深圳）有限公司 | 一种热界面材料及其制造方法 |
| US7319048B2 (en) * | 2004-09-03 | 2008-01-15 | Intel Corporation | Electronic assemblies having a low processing temperature |
| DE102005045767B4 (de) * | 2005-09-23 | 2012-03-29 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse |
| US20070069373A1 (en) * | 2005-09-29 | 2007-03-29 | Roth Arti P | Device with surface cooling and method of making |
| WO2007076014A2 (en) * | 2005-12-23 | 2007-07-05 | World Properties, Inc. | Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom |
| US8344523B2 (en) | 2006-05-08 | 2013-01-01 | Diemat, Inc. | Conductive composition |
| US20070256783A1 (en) * | 2006-05-08 | 2007-11-08 | Dietz Raymond L | Thermally enhanced adhesive paste |
| US20080296756A1 (en) * | 2007-05-30 | 2008-12-04 | Koch James L | Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| US20100328895A1 (en) * | 2007-09-11 | 2010-12-30 | Dorab Bhagwagar | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use |
| KR20100069667A (ko) * | 2007-09-11 | 2010-06-24 | 다우 코닝 코포레이션 | 열계면재료, 열계면재료를 포함하는 전자장치, 그리고 이들의 제조방법 및 용도 |
| US20090111925A1 (en) * | 2007-10-31 | 2009-04-30 | Burnham Kikue S | Thermal interface materials, methods of production and uses thereof |
| US20100319898A1 (en) * | 2008-03-13 | 2010-12-23 | Underwood Patrick K | Thermal interconnect and integrated interface systems, methods of production and uses thereof |
| KR20100062550A (ko) * | 2008-12-02 | 2010-06-10 | 삼성전기주식회사 | 패턴부가 형성된 솔더 레지스트층을 구비한 패키지 기판 및그 제조방법 |
| WO2010104542A1 (en) | 2009-03-02 | 2010-09-16 | Honeywell International Inc. | Thermal interface material and method of making and using the same |
| WO2014074538A1 (en) * | 2012-11-09 | 2014-05-15 | 3M Innovative Properties Company | Thermal interface compositions and methods for making and using same |
| CN105229763B (zh) * | 2013-02-27 | 2019-06-14 | 翱旭公司 | 能量存储装置组件 |
| US9738976B2 (en) | 2013-02-27 | 2017-08-22 | Ioxus, Inc. | Energy storage device assembly |
| US9899643B2 (en) | 2013-02-27 | 2018-02-20 | Ioxus, Inc. | Energy storage device assembly |
| US9892868B2 (en) | 2013-06-21 | 2018-02-13 | Ioxus, Inc. | Energy storage device assembly |
| EP3077578A4 (en) | 2013-12-05 | 2017-07-26 | Honeywell International Inc. | Stannous methansulfonate solution with adjusted ph |
| US9826662B2 (en) * | 2013-12-12 | 2017-11-21 | General Electric Company | Reusable phase-change thermal interface structures |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| CN112080258A (zh) | 2014-12-05 | 2020-12-15 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
| JP6320331B2 (ja) * | 2015-03-16 | 2018-05-09 | 三菱電機株式会社 | 電力用半導体装置 |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| CN105441034A (zh) * | 2015-12-03 | 2016-03-30 | 深圳德邦界面材料有限公司 | 一种橡胶改性的相变导热界面材料及制备方法 |
| WO2017152353A1 (en) * | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| FR3061989B1 (fr) * | 2017-01-18 | 2020-02-14 | Safran | Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| CN108235666B (zh) * | 2018-02-11 | 2024-03-01 | 中国科学院工程热物理研究所 | 表面调控的柔性微槽群热沉、散热装置和方法 |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| CN116640366A (zh) * | 2023-06-27 | 2023-08-25 | 广东力王新材料有限公司 | 一种橡胶相变材料及其制备工艺 |
| US20250214088A1 (en) * | 2023-12-28 | 2025-07-03 | Lenovo Enterprise Solutions (Singapore) Pte Ltd. | Removing a ferromagnetic liquid from a surface |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2228814B1 (enExample) * | 1973-05-11 | 1975-11-21 | Rhone Poulenc Ind | |
| EP0042693B1 (en) * | 1980-06-21 | 1985-03-27 | LUCAS INDUSTRIES public limited company | Semi-conductor power device assembly and method of manufacture thereof |
| US4584336A (en) * | 1984-10-29 | 1986-04-22 | Sws Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
| US5440230A (en) * | 1993-04-02 | 1995-08-08 | Heflinger; Bruce L. | Combinatorial signature for component identification |
| US5679457A (en) * | 1995-05-19 | 1997-10-21 | The Bergquist Company | Thermally conductive interface for electronic devices |
| US5847929A (en) * | 1996-06-28 | 1998-12-08 | International Business Machines Corporation | Attaching heat sinks directly to flip chips and ceramic chip carriers |
| US6084775A (en) * | 1998-12-09 | 2000-07-04 | International Business Machines Corporation | Heatsink and package structures with fusible release layer |
| US6238596B1 (en) * | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
| US6605238B2 (en) * | 1999-09-17 | 2003-08-12 | Honeywell International Inc. | Compliant and crosslinkable thermal interface materials |
| US6653730B2 (en) * | 2000-12-14 | 2003-11-25 | Intel Corporation | Electronic assembly with high capacity thermal interface |
-
2003
- 2003-07-15 AU AU2003254046A patent/AU2003254046A1/en not_active Abandoned
- 2003-07-15 US US10/519,337 patent/US20060040112A1/en not_active Abandoned
- 2003-07-15 TW TW92119265A patent/TW200409246A/zh unknown
- 2003-07-15 CN CNA038218844A patent/CN1681648A/zh active Pending
- 2003-07-15 WO PCT/US2003/022710 patent/WO2004008497A2/en not_active Ceased
- 2003-07-15 EP EP03764825A patent/EP1531985A4/en not_active Withdrawn
- 2003-07-15 JP JP2004521992A patent/JP2005538535A/ja active Pending
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