JP2005538210A5 - - Google Patents
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- Publication number
- JP2005538210A5 JP2005538210A5 JP2004534230A JP2004534230A JP2005538210A5 JP 2005538210 A5 JP2005538210 A5 JP 2005538210A5 JP 2004534230 A JP2004534230 A JP 2004534230A JP 2004534230 A JP2004534230 A JP 2004534230A JP 2005538210 A5 JP2005538210 A5 JP 2005538210A5
- Authority
- JP
- Japan
- Prior art keywords
- thermal interface
- interface material
- compound
- paste
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 31
- 238000000034 method Methods 0.000 claims 14
- 239000000203 mixture Substances 0.000 claims 10
- 229920005989 resin Polymers 0.000 claims 9
- 239000011347 resin Substances 0.000 claims 9
- 229920001971 elastomer Polymers 0.000 claims 8
- 239000005060 rubber Substances 0.000 claims 8
- 150000001875 compounds Chemical class 0.000 claims 7
- 239000002904 solvent Substances 0.000 claims 7
- 239000004215 Carbon black (E152) Substances 0.000 claims 6
- 229930195733 hydrocarbon Natural products 0.000 claims 6
- 150000002430 hydrocarbons Chemical class 0.000 claims 6
- 229920000877 Melamine resin Polymers 0.000 claims 5
- 239000004640 Melamine resin Substances 0.000 claims 5
- 150000001412 amines Chemical class 0.000 claims 4
- 150000001923 cyclic compounds Chemical class 0.000 claims 4
- 238000007639 printing Methods 0.000 claims 4
- 239000011231 conductive filler Substances 0.000 claims 3
- 150000002009 diols Chemical class 0.000 claims 3
- 150000007974 melamines Chemical class 0.000 claims 3
- 239000012782 phase change material Substances 0.000 claims 3
- 229920006395 saturated elastomer Polymers 0.000 claims 3
- 239000005062 Polybutadiene Substances 0.000 claims 2
- 150000007824 aliphatic compounds Chemical class 0.000 claims 2
- 150000001491 aromatic compounds Chemical class 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229920002857 polybutadiene Polymers 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 238000007650 screen-printing Methods 0.000 claims 2
- 239000001993 wax Substances 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- -1 boron nitride compound Chemical class 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000012188 paraffin wax Substances 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/242,139 US6797382B2 (en) | 1999-12-01 | 2002-09-09 | Thermal interface materials |
| PCT/US2003/019665 WO2004022330A1 (en) | 2002-09-09 | 2003-06-19 | Thermal interface materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005538210A JP2005538210A (ja) | 2005-12-15 |
| JP2005538210A5 true JP2005538210A5 (enExample) | 2006-04-20 |
Family
ID=31977760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004534230A Pending JP2005538210A (ja) | 2002-09-09 | 2003-06-19 | サーマルインターフェース材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6797382B2 (enExample) |
| EP (1) | EP1542862A4 (enExample) |
| JP (1) | JP2005538210A (enExample) |
| KR (4) | KR100773656B1 (enExample) |
| CN (1) | CN1307048C (enExample) |
| AU (1) | AU2003243715A1 (enExample) |
| WO (1) | WO2004022330A1 (enExample) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| CN1868736A (zh) * | 2001-05-30 | 2006-11-29 | 霍尼韦尔国际公司 | 界面材料及其生产方法和应用 |
| DE10324156A1 (de) * | 2003-05-22 | 2004-12-16 | Siemens Ag | Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät |
| TWI268526B (en) * | 2003-12-05 | 2006-12-11 | Au Optronics Corp | Plasma display |
| US6927249B1 (en) * | 2004-02-11 | 2005-08-09 | Lg Chem, Ltd. | Heat absorb-release plastic resin composition and molded product thereof |
| US7312261B2 (en) * | 2004-05-11 | 2007-12-25 | International Business Machines Corporation | Thermal interface adhesive and rework |
| US20060014309A1 (en) * | 2004-07-13 | 2006-01-19 | Sachdev Krishna G | Temporary chip attach method using reworkable conductive adhesive interconnections |
| US7269015B2 (en) * | 2005-02-01 | 2007-09-11 | Tyco Electronics Corporation | Heat sink interface insert |
| US8384210B1 (en) | 2005-06-07 | 2013-02-26 | Advanced Micro Devices, Inc. | Thermal interface material and semiconductor component including the thermal interface material |
| US20070051773A1 (en) * | 2005-09-02 | 2007-03-08 | Ruchert Brian D | Thermal interface materials, methods of preparation thereof and their applications |
| US20070097651A1 (en) * | 2005-11-01 | 2007-05-03 | Techfilm, Llc | Thermal interface material with multiple size distribution thermally conductive fillers |
| TWI291480B (en) * | 2005-12-20 | 2007-12-21 | Ind Tech Res Inst | Composition for thermal interface materials |
| US20070178255A1 (en) * | 2006-01-31 | 2007-08-02 | Farrow Timothy S | Apparatus, system, and method for thermal conduction interfacing |
| US20080063873A1 (en) * | 2006-09-08 | 2008-03-13 | Russell Stapleton | Flexible microelectronics adhesive |
| US20080166552A1 (en) * | 2006-11-06 | 2008-07-10 | Arlon, Inc. | Silicone based compositions for thermal interface materials |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| US8143523B2 (en) | 2008-10-21 | 2012-03-27 | Baker Hughes Incorporated | Downhole cable with thermally conductive polymer composites |
| US20100112360A1 (en) * | 2008-10-31 | 2010-05-06 | Delano Andrew D | Layered thermal interface systems methods of production and uses thereof |
| US7816785B2 (en) * | 2009-01-22 | 2010-10-19 | International Business Machines Corporation | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
| CN102639102B (zh) * | 2009-08-31 | 2015-03-25 | 高露洁-棕榄公司 | 表面改性颜料 |
| AU2009351622B2 (en) | 2009-08-31 | 2013-03-14 | Colgate-Palmolive Company | Surface modified pigment |
| JP5218375B2 (ja) * | 2009-11-04 | 2013-06-26 | 横浜ゴム株式会社 | 熱伝導性組成物 |
| TWI475103B (zh) * | 2009-12-15 | 2015-03-01 | 財團法人工業技術研究院 | 散熱結構 |
| US9771508B2 (en) | 2010-02-23 | 2017-09-26 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
| US9260645B2 (en) * | 2010-02-23 | 2016-02-16 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
| US10087351B2 (en) | 2010-02-23 | 2018-10-02 | Laird Technologies, Inc. | Materials including thermally reversible gels |
| US8471575B2 (en) | 2010-04-30 | 2013-06-25 | International Business Machines Corporation | Methodologies and test configurations for testing thermal interface materials |
| US8686749B2 (en) * | 2010-04-30 | 2014-04-01 | International Business Machines Corporation | Thermal interface material, test structure and method of use |
| JP2013540353A (ja) * | 2010-09-29 | 2013-10-31 | エンパイア テクノロジー ディベロップメント エルエルシー | セラミックナノチューブ複合体中の相変化エネルギー貯蔵 |
| US8916419B2 (en) * | 2012-03-29 | 2014-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lid attach process and apparatus for fabrication of semiconductor packages |
| US9515004B2 (en) * | 2013-03-15 | 2016-12-06 | Laird Technologies, Inc. | Thermal interface materials |
| EP3077578A4 (en) | 2013-12-05 | 2017-07-26 | Honeywell International Inc. | Stannous methansulfonate solution with adjusted ph |
| CN105980512A (zh) * | 2014-02-13 | 2016-09-28 | 霍尼韦尔国际公司 | 可压缩热界面材料 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| CN112080258A (zh) | 2014-12-05 | 2020-12-15 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
| EP3271168A4 (en) * | 2015-03-18 | 2019-03-13 | Mustafa Akbulut | FLEXIBLE AND SUCCESSIVE MATERIALS FOR THERMAL INTERMEDIATE POSITION |
| ITUB20154204A1 (it) * | 2015-10-07 | 2017-04-07 | Bridgestone Corp | Pneumatico con migliorata resistenza alla degradazione termica |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| WO2020190350A1 (en) * | 2019-03-15 | 2020-09-24 | Insolcorp, Llc | Phase change material products |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5194480A (en) * | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
| DE69921695T2 (de) * | 1998-12-15 | 2005-08-11 | Parker-Hannifin Corp., Cleveland | Verfahren zum anbringen eines thermischen phasenveränderlichen verbindungsmaterials |
| US6238596B1 (en) * | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
| US5989459A (en) * | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
| US6451422B1 (en) * | 1999-12-01 | 2002-09-17 | Johnson Matthey, Inc. | Thermal interface materials |
| US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
-
2002
- 2002-09-09 US US10/242,139 patent/US6797382B2/en not_active Expired - Lifetime
-
2003
- 2003-06-19 AU AU2003243715A patent/AU2003243715A1/en not_active Abandoned
- 2003-06-19 KR KR1020077002449A patent/KR100773656B1/ko not_active Expired - Lifetime
- 2003-06-19 EP EP03794427A patent/EP1542862A4/en not_active Withdrawn
- 2003-06-19 JP JP2004534230A patent/JP2005538210A/ja active Pending
- 2003-06-19 WO PCT/US2003/019665 patent/WO2004022330A1/en not_active Ceased
- 2003-06-19 KR KR1020057003989A patent/KR100747363B1/ko not_active Expired - Lifetime
- 2003-06-19 KR KR1020077014326A patent/KR100854178B1/ko not_active Expired - Lifetime
- 2003-06-19 KR KR1020077027988A patent/KR20080006639A/ko not_active Ceased
- 2003-06-19 CN CNB038245396A patent/CN1307048C/zh not_active Expired - Lifetime
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