JP2005508767A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005508767A5 JP2005508767A5 JP2002593135A JP2002593135A JP2005508767A5 JP 2005508767 A5 JP2005508767 A5 JP 2005508767A5 JP 2002593135 A JP2002593135 A JP 2002593135A JP 2002593135 A JP2002593135 A JP 2002593135A JP 2005508767 A5 JP2005508767 A5 JP 2005508767A5
- Authority
- JP
- Japan
- Prior art keywords
- layered
- thermally conductive
- fibers
- interface
- interface material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 52
- 239000000835 fiber Substances 0.000 claims 26
- 150000001875 compounds Chemical class 0.000 claims 9
- 239000000853 adhesive Substances 0.000 claims 8
- 230000001070 adhesive effect Effects 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 8
- 239000000203 mixture Substances 0.000 claims 7
- 229920000877 Melamine resin Polymers 0.000 claims 5
- 239000004640 Melamine resin Substances 0.000 claims 5
- 229920001971 elastomer Polymers 0.000 claims 5
- 239000005060 rubber Substances 0.000 claims 5
- 150000001412 amines Chemical class 0.000 claims 4
- 239000008393 encapsulating agent Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 229920006395 saturated elastomer Polymers 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 239000011231 conductive filler Substances 0.000 claims 3
- 150000002009 diols Chemical class 0.000 claims 3
- 150000007974 melamines Chemical class 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000012782 phase change material Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000005062 Polybutadiene Substances 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 239000003054 catalyst Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920002857 polybutadiene Polymers 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 239000001993 wax Substances 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- -1 boron nitride compound Chemical class 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 238000004132 cross linking Methods 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000012188 paraffin wax Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29443301P | 2001-05-30 | 2001-05-30 | |
| US10/047,617 US6673434B2 (en) | 1999-12-01 | 2002-01-14 | Thermal interface materials |
| PCT/US2002/017331 WO2002096636A1 (en) | 2001-05-30 | 2002-05-30 | Interface materials and methods of production and use thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005508767A JP2005508767A (ja) | 2005-04-07 |
| JP2005508767A5 true JP2005508767A5 (enExample) | 2006-01-05 |
| JP4237505B2 JP4237505B2 (ja) | 2009-03-11 |
Family
ID=26725250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002593135A Expired - Fee Related JP4237505B2 (ja) | 2001-05-30 | 2002-05-30 | インターフェース材料、ならびにその製造方法および使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1401641A4 (enExample) |
| JP (1) | JP4237505B2 (enExample) |
| KR (1) | KR20040002866A (enExample) |
| CN (1) | CN1267268C (enExample) |
| CA (1) | CA2433637A1 (enExample) |
| TW (1) | TWI286514B (enExample) |
| WO (1) | WO2002096636A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| CN1868736A (zh) | 2001-05-30 | 2006-11-29 | 霍尼韦尔国际公司 | 界面材料及其生产方法和应用 |
| CN1841713A (zh) | 2005-03-31 | 2006-10-04 | 清华大学 | 热界面材料及其制作方法 |
| CN100358132C (zh) * | 2005-04-14 | 2007-12-26 | 清华大学 | 热界面材料制备方法 |
| JP2007251002A (ja) * | 2006-03-17 | 2007-09-27 | Toshiba Corp | ヒートシンク、電子デバイス、ヒートシンクの製造方法及び電子デバイスの製造方法 |
| US9279178B2 (en) | 2007-04-27 | 2016-03-08 | Honeywell International Inc. | Manufacturing design and processing methods and apparatus for sputtering targets |
| US7808099B2 (en) | 2008-05-06 | 2010-10-05 | International Business Machines Corporation | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method |
| US9269603B2 (en) | 2013-05-09 | 2016-02-23 | Globalfoundries Inc. | Temporary liquid thermal interface material for surface tension adhesion and thermal control |
| CN105980512A (zh) | 2014-02-13 | 2016-09-28 | 霍尼韦尔国际公司 | 可压缩热界面材料 |
| DE102015223443A1 (de) | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Umhüllmasse |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| WO2019202964A1 (ja) * | 2018-04-17 | 2019-10-24 | 三井化学株式会社 | 熱硬化性樹脂組成物、プレコートメタル用コート材、硬化物および積層体 |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5250600A (en) * | 1992-05-28 | 1993-10-05 | Johnson Matthey Inc. | Low temperature flexible die attach adhesive and articles using same |
| US5852548A (en) * | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
| US5725707A (en) * | 1995-04-10 | 1998-03-10 | Northrop Grumman Corporation | Enhanced conductive joints from fiber flocking |
| CN1213476C (zh) * | 1998-06-24 | 2005-08-03 | 约翰逊·马太电子公司 | 具有纤维接合层的电子器件 |
| WO2000033628A1 (en) * | 1998-12-02 | 2000-06-08 | Intel Corporation | A fibrous thermal interface adaptor |
| JP2000273196A (ja) * | 1999-03-24 | 2000-10-03 | Polymatech Co Ltd | 熱伝導性樹脂基板および半導体パッケージ |
-
2002
- 2002-05-30 EP EP02729331A patent/EP1401641A4/en not_active Withdrawn
- 2002-05-30 CN CNB028111036A patent/CN1267268C/zh not_active Expired - Fee Related
- 2002-05-30 WO PCT/US2002/017331 patent/WO2002096636A1/en not_active Ceased
- 2002-05-30 CA CA002433637A patent/CA2433637A1/en not_active Abandoned
- 2002-05-30 JP JP2002593135A patent/JP4237505B2/ja not_active Expired - Fee Related
- 2002-05-30 KR KR10-2003-7010597A patent/KR20040002866A/ko not_active Ceased
- 2002-05-31 TW TW091111709A patent/TWI286514B/zh not_active IP Right Cessation
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005508767A5 (enExample) | ||
| US10184734B2 (en) | Heat dissipation structure and heat dissipation system adopting the same | |
| CN1213476C (zh) | 具有纤维接合层的电子器件 | |
| Otiaba et al. | Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges | |
| US6886625B1 (en) | Elastomeric heat sink with a pressure sensitive adhesive backing | |
| CN1288668C (zh) | 柔顺且可交联的热界面材料 | |
| US20100172101A1 (en) | Thermal interface material and method for manufacturing the same | |
| JP6119950B2 (ja) | 中空構造電子部品 | |
| US20070054105A1 (en) | Thermal interface material and method for making same | |
| RU2006109478A (ru) | Силиконовая клеящая композиция для тонкой поверхности склеивания и способ ее получения | |
| CN102027091B (zh) | 热增强的电绝缘粘合胶 | |
| JPH05179210A (ja) | 熱伝導性接着フィルム、熱伝導性接着剤層を有する積層品及びそれらの使用品 | |
| KR20080092966A (ko) | 열적 상호연결 및 인터페이스 시스템, 이들의 제조 방법 및용도 | |
| JP6467689B2 (ja) | 中空構造電子部品 | |
| KR970006227B1 (ko) | 열 전도성 세라믹/중합체 복합재 | |
| JP2014152299A (ja) | 熱硬化性樹脂組成物、熱伝導性樹脂シート、その製造方法及びそれを備えるパワーモジュール | |
| CN1267268C (zh) | 界面材料及其生产方法和应用 | |
| CN1868736A (zh) | 界面材料及其生产方法和应用 | |
| KR101653369B1 (ko) | 열전도성 점착제 조성물 및 이로부터 제조된 열전도성 박막 점착시트 | |
| JP2002093969A (ja) | 異方性伝熱シートおよびその製造方法 | |
| KR20100055492A (ko) | 혼합된 실버 필러에 의해 개선된 열 전도성을 가지는 접착제 | |
| JP4115024B2 (ja) | 導電性と熱伝導性を備えたシート | |
| JPH05299545A (ja) | 放熱体 | |
| JPH1041444A (ja) | ヒートシンク材及び本ヒートシンク材と半導体との接着方法 | |
| KR102141722B1 (ko) | 열전도성 시트용 점착제 조성물 및 이로부터 제조된 열전도성 시트 |