AU2003254046A1 - Thermal interconnect and interface systems, methods of production and uses thereof - Google Patents

Thermal interconnect and interface systems, methods of production and uses thereof

Info

Publication number
AU2003254046A1
AU2003254046A1 AU2003254046A AU2003254046A AU2003254046A1 AU 2003254046 A1 AU2003254046 A1 AU 2003254046A1 AU 2003254046 A AU2003254046 A AU 2003254046A AU 2003254046 A AU2003254046 A AU 2003254046A AU 2003254046 A1 AU2003254046 A1 AU 2003254046A1
Authority
AU
Australia
Prior art keywords
production
methods
interface systems
thermal interconnect
interconnect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003254046A
Other languages
English (en)
Other versions
AU2003254046A8 (en
Inventor
Dan Curran
Nancy Dean
Colin Edie
Paula Knoll
My Nguyen
Robert Townsend
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2003254046A8 publication Critical patent/AU2003254046A8/xx
Publication of AU2003254046A1 publication Critical patent/AU2003254046A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
AU2003254046A 2002-07-15 2003-07-15 Thermal interconnect and interface systems, methods of production and uses thereof Abandoned AU2003254046A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39629402P 2002-07-15 2002-07-15
US60/396,294 2002-07-15
PCT/US2003/022710 WO2004008497A2 (en) 2002-07-15 2003-07-15 Thermal interconnect and interface systems, methods of production and uses thereof

Publications (2)

Publication Number Publication Date
AU2003254046A8 AU2003254046A8 (en) 2004-02-02
AU2003254046A1 true AU2003254046A1 (en) 2004-02-02

Family

ID=30116003

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003254046A Abandoned AU2003254046A1 (en) 2002-07-15 2003-07-15 Thermal interconnect and interface systems, methods of production and uses thereof

Country Status (7)

Country Link
US (1) US20060040112A1 (enExample)
EP (1) EP1531985A4 (enExample)
JP (1) JP2005538535A (enExample)
CN (1) CN1681648A (enExample)
AU (1) AU2003254046A1 (enExample)
TW (1) TW200409246A (enExample)
WO (1) WO2004008497A2 (enExample)

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US7210227B2 (en) * 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP4551074B2 (ja) * 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US7261389B2 (en) * 2003-11-26 2007-08-28 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat into a fluid ejector carriage device
US7192116B2 (en) * 2003-11-26 2007-03-20 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat from a fluid ejector carriage
EP1731002A4 (en) * 2004-03-30 2010-05-26 Honeywell Int Inc HEAT DISTRIBUTION STRUCTURES, INTEGRATED CIRCUITS, METHOD FOR GENERATING HEAT DISTRIBUTION CONSTRUCTIONS, AND METHOD FOR GENERATING INTEGRATED CIRCUITS
JP2005317796A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
CN100389166C (zh) * 2004-04-29 2008-05-21 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
US7319048B2 (en) * 2004-09-03 2008-01-15 Intel Corporation Electronic assemblies having a low processing temperature
DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
US20070069373A1 (en) * 2005-09-29 2007-03-29 Roth Arti P Device with surface cooling and method of making
WO2007076014A2 (en) * 2005-12-23 2007-07-05 World Properties, Inc. Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
US8344523B2 (en) 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
US20070256783A1 (en) * 2006-05-08 2007-11-08 Dietz Raymond L Thermally enhanced adhesive paste
US20080296756A1 (en) * 2007-05-30 2008-12-04 Koch James L Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
US20100328895A1 (en) * 2007-09-11 2010-12-30 Dorab Bhagwagar Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use
KR20100069667A (ko) * 2007-09-11 2010-06-24 다우 코닝 코포레이션 열계면재료, 열계면재료를 포함하는 전자장치, 그리고 이들의 제조방법 및 용도
US20090111925A1 (en) * 2007-10-31 2009-04-30 Burnham Kikue S Thermal interface materials, methods of production and uses thereof
US20100319898A1 (en) * 2008-03-13 2010-12-23 Underwood Patrick K Thermal interconnect and integrated interface systems, methods of production and uses thereof
KR20100062550A (ko) * 2008-12-02 2010-06-10 삼성전기주식회사 패턴부가 형성된 솔더 레지스트층을 구비한 패키지 기판 및그 제조방법
WO2010104542A1 (en) 2009-03-02 2010-09-16 Honeywell International Inc. Thermal interface material and method of making and using the same
WO2014074538A1 (en) * 2012-11-09 2014-05-15 3M Innovative Properties Company Thermal interface compositions and methods for making and using same
CN105229763B (zh) * 2013-02-27 2019-06-14 翱旭公司 能量存储装置组件
US9738976B2 (en) 2013-02-27 2017-08-22 Ioxus, Inc. Energy storage device assembly
US9899643B2 (en) 2013-02-27 2018-02-20 Ioxus, Inc. Energy storage device assembly
US9892868B2 (en) 2013-06-21 2018-02-13 Ioxus, Inc. Energy storage device assembly
EP3077578A4 (en) 2013-12-05 2017-07-26 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
CN112080258A (zh) 2014-12-05 2020-12-15 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
JP6320331B2 (ja) * 2015-03-16 2018-05-09 三菱電機株式会社 電力用半導体装置
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105441034A (zh) * 2015-12-03 2016-03-30 深圳德邦界面材料有限公司 一种橡胶改性的相变导热界面材料及制备方法
WO2017152353A1 (en) * 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
FR3061989B1 (fr) * 2017-01-18 2020-02-14 Safran Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
CN108235666B (zh) * 2018-02-11 2024-03-01 中国科学院工程热物理研究所 表面调控的柔性微槽群热沉、散热装置和方法
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN116640366A (zh) * 2023-06-27 2023-08-25 广东力王新材料有限公司 一种橡胶相变材料及其制备工艺
US20250214088A1 (en) * 2023-12-28 2025-07-03 Lenovo Enterprise Solutions (Singapore) Pte Ltd. Removing a ferromagnetic liquid from a surface

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US5440230A (en) * 1993-04-02 1995-08-08 Heflinger; Bruce L. Combinatorial signature for component identification
US5679457A (en) * 1995-05-19 1997-10-21 The Bergquist Company Thermally conductive interface for electronic devices
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
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US6653730B2 (en) * 2000-12-14 2003-11-25 Intel Corporation Electronic assembly with high capacity thermal interface

Also Published As

Publication number Publication date
EP1531985A4 (en) 2008-03-19
EP1531985A2 (en) 2005-05-25
AU2003254046A8 (en) 2004-02-02
JP2005538535A (ja) 2005-12-15
US20060040112A1 (en) 2006-02-23
TW200409246A (en) 2004-06-01
WO2004008497A3 (en) 2004-04-01
WO2004008497A2 (en) 2004-01-22
WO2004008497B1 (en) 2004-05-06
CN1681648A (zh) 2005-10-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase