TW200409246A - Thermal interconnect and interface systems, methods of production and uses thereof - Google Patents

Thermal interconnect and interface systems, methods of production and uses thereof Download PDF

Info

Publication number
TW200409246A
TW200409246A TW92119265A TW92119265A TW200409246A TW 200409246 A TW200409246 A TW 200409246A TW 92119265 A TW92119265 A TW 92119265A TW 92119265 A TW92119265 A TW 92119265A TW 200409246 A TW200409246 A TW 200409246A
Authority
TW
Taiwan
Prior art keywords
thermal
component
laminated
resin
compound
Prior art date
Application number
TW92119265A
Other languages
English (en)
Chinese (zh)
Inventor
Nancy Dean
Paula Knoll
Richard Townsend
My Nguyen
Colin Edie
Curran Dan
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Publication of TW200409246A publication Critical patent/TW200409246A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW92119265A 2002-07-15 2003-07-15 Thermal interconnect and interface systems, methods of production and uses thereof TW200409246A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US39629402P 2002-07-15 2002-07-15

Publications (1)

Publication Number Publication Date
TW200409246A true TW200409246A (en) 2004-06-01

Family

ID=30116003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92119265A TW200409246A (en) 2002-07-15 2003-07-15 Thermal interconnect and interface systems, methods of production and uses thereof

Country Status (7)

Country Link
US (1) US20060040112A1 (enExample)
EP (1) EP1531985A4 (enExample)
JP (1) JP2005538535A (enExample)
CN (1) CN1681648A (enExample)
AU (1) AU2003254046A1 (enExample)
TW (1) TW200409246A (enExample)
WO (1) WO2004008497A2 (enExample)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7210227B2 (en) * 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP4551074B2 (ja) * 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US7261389B2 (en) * 2003-11-26 2007-08-28 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat into a fluid ejector carriage device
US7192116B2 (en) * 2003-11-26 2007-03-20 Fuji Xerox Co., Ltd. Systems and methods for dissipating heat from a fluid ejector carriage
EP1731002A4 (en) * 2004-03-30 2010-05-26 Honeywell Int Inc HEAT DISTRIBUTION STRUCTURES, INTEGRATED CIRCUITS, METHOD FOR GENERATING HEAT DISTRIBUTION CONSTRUCTIONS, AND METHOD FOR GENERATING INTEGRATED CIRCUITS
JP2005317796A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
CN100389166C (zh) * 2004-04-29 2008-05-21 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
US7319048B2 (en) * 2004-09-03 2008-01-15 Intel Corporation Electronic assemblies having a low processing temperature
DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
US20070069373A1 (en) * 2005-09-29 2007-03-29 Roth Arti P Device with surface cooling and method of making
WO2007076014A2 (en) * 2005-12-23 2007-07-05 World Properties, Inc. Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
US8344523B2 (en) 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
US20070256783A1 (en) * 2006-05-08 2007-11-08 Dietz Raymond L Thermally enhanced adhesive paste
US20080296756A1 (en) * 2007-05-30 2008-12-04 Koch James L Heat spreader compositions and materials, integrated circuitry, methods of production and uses thereof
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
US20100328895A1 (en) * 2007-09-11 2010-12-30 Dorab Bhagwagar Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use
KR20100069667A (ko) * 2007-09-11 2010-06-24 다우 코닝 코포레이션 열계면재료, 열계면재료를 포함하는 전자장치, 그리고 이들의 제조방법 및 용도
US20090111925A1 (en) * 2007-10-31 2009-04-30 Burnham Kikue S Thermal interface materials, methods of production and uses thereof
US20100319898A1 (en) * 2008-03-13 2010-12-23 Underwood Patrick K Thermal interconnect and integrated interface systems, methods of production and uses thereof
KR20100062550A (ko) * 2008-12-02 2010-06-10 삼성전기주식회사 패턴부가 형성된 솔더 레지스트층을 구비한 패키지 기판 및그 제조방법
WO2010104542A1 (en) 2009-03-02 2010-09-16 Honeywell International Inc. Thermal interface material and method of making and using the same
WO2014074538A1 (en) * 2012-11-09 2014-05-15 3M Innovative Properties Company Thermal interface compositions and methods for making and using same
CN105229763B (zh) * 2013-02-27 2019-06-14 翱旭公司 能量存储装置组件
US9738976B2 (en) 2013-02-27 2017-08-22 Ioxus, Inc. Energy storage device assembly
US9899643B2 (en) 2013-02-27 2018-02-20 Ioxus, Inc. Energy storage device assembly
US9892868B2 (en) 2013-06-21 2018-02-13 Ioxus, Inc. Energy storage device assembly
EP3077578A4 (en) 2013-12-05 2017-07-26 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
CN112080258A (zh) 2014-12-05 2020-12-15 霍尼韦尔国际公司 具有低热阻的高性能热界面材料
JP6320331B2 (ja) * 2015-03-16 2018-05-09 三菱電機株式会社 電力用半導体装置
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105441034A (zh) * 2015-12-03 2016-03-30 深圳德邦界面材料有限公司 一种橡胶改性的相变导热界面材料及制备方法
WO2017152353A1 (en) * 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
FR3061989B1 (fr) * 2017-01-18 2020-02-14 Safran Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
CN108235666B (zh) * 2018-02-11 2024-03-01 中国科学院工程热物理研究所 表面调控的柔性微槽群热沉、散热装置和方法
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN116640366A (zh) * 2023-06-27 2023-08-25 广东力王新材料有限公司 一种橡胶相变材料及其制备工艺
US20250214088A1 (en) * 2023-12-28 2025-07-03 Lenovo Enterprise Solutions (Singapore) Pte Ltd. Removing a ferromagnetic liquid from a surface

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2228814B1 (enExample) * 1973-05-11 1975-11-21 Rhone Poulenc Ind
EP0042693B1 (en) * 1980-06-21 1985-03-27 LUCAS INDUSTRIES public limited company Semi-conductor power device assembly and method of manufacture thereof
US4584336A (en) * 1984-10-29 1986-04-22 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US5440230A (en) * 1993-04-02 1995-08-08 Heflinger; Bruce L. Combinatorial signature for component identification
US5679457A (en) * 1995-05-19 1997-10-21 The Bergquist Company Thermally conductive interface for electronic devices
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US6084775A (en) * 1998-12-09 2000-07-04 International Business Machines Corporation Heatsink and package structures with fusible release layer
US6238596B1 (en) * 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6653730B2 (en) * 2000-12-14 2003-11-25 Intel Corporation Electronic assembly with high capacity thermal interface

Also Published As

Publication number Publication date
EP1531985A4 (en) 2008-03-19
EP1531985A2 (en) 2005-05-25
AU2003254046A8 (en) 2004-02-02
JP2005538535A (ja) 2005-12-15
AU2003254046A1 (en) 2004-02-02
US20060040112A1 (en) 2006-02-23
WO2004008497A3 (en) 2004-04-01
WO2004008497A2 (en) 2004-01-22
WO2004008497B1 (en) 2004-05-06
CN1681648A (zh) 2005-10-12

Similar Documents

Publication Publication Date Title
TW200409246A (en) Thermal interconnect and interface systems, methods of production and uses thereof
TWI308171B (en) Thermal interface materials
JP6800129B2 (ja) フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
TWI474923B (zh) Thermal conductive laminate and method of manufacturing the same
EP1376689B1 (en) Radiating structural body of electronic part and radiating sheet used for the radiating structural body
JP2006522491A (ja) 熱相互接続および界面システム、製造方法、およびその使用方法
TWI574837B (zh) Thermally conductive composite silicone rubber sheet
US20070241303A1 (en) Thermally conductive composition and method for preparing the same
CN100407415C (zh) 热传导性复合片及其制造方法
TW200906975A (en) Heat-conductive cured material and method for producing the same
TW200930782A (en) Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same
JP2012503890A (ja) 熱伝導性ゲルパック
TW200302557A (en) Heat-dissipating member, manufacturing method and installation method
JP4507488B2 (ja) 接合材料
JP4237505B2 (ja) インターフェース材料、ならびにその製造方法および使用方法
US20070098971A1 (en) Interface materials and methods of production and use thereof
JP4994743B2 (ja) フィルム状接着剤及びそれを使用する半導体パッケージの製造方法
JP2005060594A (ja) 粘着層付熱伝導性シート
JP7194667B2 (ja) 補強層含有熱伝導性シリコーン複合シートの製造方法
TW201811961A (zh) 熱傳導性複合薄片
JP7661275B2 (ja) 熱伝導性シリコーン接着テープ用組成物及び熱伝導性シリコーン接着テープ
JP2022119196A (ja) 熱伝導性シート積層体及びこれを用いた電子機器
CN108350341B (zh) 粘接剂组合物和结构体
TW202328391A (zh) 導熱性矽酮接著劑組成物及導熱性複合體
TWI906612B (zh) 接著劑用組成物及膜狀接著劑、以及使用了膜狀接著劑之半導體封裝及其製造方法