JP2005537481A - 高密度プローブデバイス - Google Patents

高密度プローブデバイス Download PDF

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Publication number
JP2005537481A
JP2005537481A JP2004532588A JP2004532588A JP2005537481A JP 2005537481 A JP2005537481 A JP 2005537481A JP 2004532588 A JP2004532588 A JP 2004532588A JP 2004532588 A JP2004532588 A JP 2004532588A JP 2005537481 A JP2005537481 A JP 2005537481A
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JP
Japan
Prior art keywords
housing
probe
conductive plate
front surface
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004532588A
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English (en)
Japanese (ja)
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JP2005537481A5 (https=
Inventor
スティーブン・フェルドマン
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3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2005537481A publication Critical patent/JP2005537481A/ja
Publication of JP2005537481A5 publication Critical patent/JP2005537481A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2004532588A 2002-08-29 2003-07-01 高密度プローブデバイス Pending JP2005537481A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/230,849 US6902416B2 (en) 2002-08-29 2002-08-29 High density probe device
PCT/US2003/020631 WO2004021019A1 (en) 2002-08-29 2003-07-01 High density probe device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010094355A Division JP2010156717A (ja) 2002-08-29 2010-04-15 高密度プローブデバイス

Publications (2)

Publication Number Publication Date
JP2005537481A true JP2005537481A (ja) 2005-12-08
JP2005537481A5 JP2005537481A5 (https=) 2006-08-03

Family

ID=31976604

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004532588A Pending JP2005537481A (ja) 2002-08-29 2003-07-01 高密度プローブデバイス
JP2010094355A Withdrawn JP2010156717A (ja) 2002-08-29 2010-04-15 高密度プローブデバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010094355A Withdrawn JP2010156717A (ja) 2002-08-29 2010-04-15 高密度プローブデバイス

Country Status (7)

Country Link
US (1) US6902416B2 (https=)
EP (1) EP1546740B1 (https=)
JP (2) JP2005537481A (https=)
AT (1) ATE485524T1 (https=)
AU (1) AU2003247852A1 (https=)
DE (1) DE60334634D1 (https=)
WO (1) WO2004021019A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009110669A (ja) * 2007-10-26 2009-05-21 Sumitomo Wiring Syst Ltd コネクタ
KR20120007003A (ko) * 2009-03-20 2012-01-19 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 테스트 프로드
JP2012018116A (ja) * 2010-07-09 2012-01-26 Hioki Ee Corp 回路基板検査用プローブユニットおよび回路基板検査装置
CN102981094A (zh) * 2012-11-23 2013-03-20 深圳莱宝高科技股份有限公司 一种面板测试装置
CN104360112A (zh) * 2014-10-30 2015-02-18 南通富士通微电子股份有限公司 半导体测试治具及其形成方法

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US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
JP2005527823A (ja) 2002-05-23 2005-09-15 カスケード マイクロテック インコーポレイテッド デバイスのテスト用プローブ
US7154257B2 (en) * 2002-09-30 2006-12-26 Intel Corporation Universal automated circuit board tester
US6999888B2 (en) * 2002-09-30 2006-02-14 Intel Corporation Automated circuit board test actuator system
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US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP4053962B2 (ja) * 2003-10-15 2008-02-27 株式会社東芝 半導体装置
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US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7651355B2 (en) * 2006-06-30 2010-01-26 3M Innovative Properties Company Floating panel mount connection system
US7498826B2 (en) * 2006-08-25 2009-03-03 Interconnect Devices, Inc. Probe array wafer
KR100901409B1 (ko) * 2007-07-06 2009-06-05 현대자동차주식회사 동축 케이블 커넥터
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US20090134898A1 (en) * 2007-11-26 2009-05-28 Carlsen Richard D Coaxial Spring Probe Grounding Method
MY151561A (en) * 2007-12-06 2014-06-13 Test Tooling Solutions M Sdn Bhd Eco contactor
US7795890B2 (en) * 2008-06-09 2010-09-14 Integrated Test Arizona Reduced ground spring probe array and method for controlling signal spring probe impedance
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US7736183B2 (en) * 2008-10-13 2010-06-15 Tyco Electronics Corporation Connector assembly with variable stack heights having power and signal contacts
US7896698B2 (en) * 2008-10-13 2011-03-01 Tyco Electronics Corporation Connector assembly having multiple contact arrangements
US7867032B2 (en) * 2008-10-13 2011-01-11 Tyco Electronics Corporation Connector assembly having signal and coaxial contacts
US7637777B1 (en) 2008-10-13 2009-12-29 Tyco Electronics Corporation Connector assembly having a noise-reducing contact pattern
US7740489B2 (en) * 2008-10-13 2010-06-22 Tyco Electronics Corporation Connector assembly having a compressive coupling member
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
IT1395368B1 (it) * 2009-08-28 2012-09-14 St Microelectronics Srl Schermatura elettromagnetica per il collaudo di circuiti integrati
US7918683B1 (en) 2010-03-24 2011-04-05 Tyco Electronics Corporation Connector assemblies and daughter card assemblies configured to engage each other along a side interface
US8052470B1 (en) * 2011-01-12 2011-11-08 Cheng Uei Precision Industry Co., Ltd. Probe connector
US8083548B1 (en) * 2011-01-13 2011-12-27 Cheng Uei Precision Industry Co., Ltd. Probe connector
DE102012205352B4 (de) * 2012-02-24 2022-12-08 Rohde & Schwarz GmbH & Co. Kommanditgesellschaft Adapter für einen Tastkopf zur Messung eines differenziellen Signals
US9979112B2 (en) * 2016-03-29 2018-05-22 Aces Electronics Co., Ltd. Press-type connector
US11187723B2 (en) * 2016-10-31 2021-11-30 Rohde & Schwarz Gmbh & Co. Kg Differential test probe
US11422156B2 (en) * 2017-07-28 2022-08-23 Nhk Spring Co., Ltd. Contact probe and probe unit
US11031713B2 (en) 2017-09-11 2021-06-08 Smiths Interconnect Americas, Inc. Spring probe connector for interfacing a printed circuit board with a backplane
US10476196B2 (en) * 2018-02-28 2019-11-12 Ohio Associated Enterprises, Llc Electrical connector with contacts holding spring-loaded pins
KR102377330B1 (ko) * 2020-07-22 2022-03-22 신동익 인쇄회로기판 검사기용 핀블록 장치
US12601762B2 (en) * 2024-04-17 2026-04-14 F Time Technology Industrial Co., Ltd. Test terminal

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Publication number Priority date Publication date Assignee Title
JPS6074062U (ja) * 1983-10-27 1985-05-24 セイコーエプソン株式会社 プロ−ブ用レセプタクルの固定構造
JPS6177286A (ja) * 1984-09-21 1986-04-19 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 同軸ケーブル用インターフェース装置
JPH0178029U (https=) * 1987-11-13 1989-05-25
JPH02257075A (ja) * 1989-03-08 1990-10-17 Rika Denshi Kogyo Kk 配線板の検査装置のテストヘッド
JPH06213934A (ja) * 1992-05-29 1994-08-05 Sony Tektronix Corp テストプローブ
JPH08106944A (ja) * 1994-10-03 1996-04-23 Tokai Rika Co Ltd 電気コネクタ及び同電気コネクタのハウジング
JP2001074814A (ja) * 1999-09-07 2001-03-23 Sony Corp 回路基板検査装置

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JPS6074062U (ja) * 1983-10-27 1985-05-24 セイコーエプソン株式会社 プロ−ブ用レセプタクルの固定構造
JPS6177286A (ja) * 1984-09-21 1986-04-19 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 同軸ケーブル用インターフェース装置
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009110669A (ja) * 2007-10-26 2009-05-21 Sumitomo Wiring Syst Ltd コネクタ
KR20120007003A (ko) * 2009-03-20 2012-01-19 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 테스트 프로드
KR101634258B1 (ko) 2009-03-20 2016-06-28 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 테스트 프로드
JP2012018116A (ja) * 2010-07-09 2012-01-26 Hioki Ee Corp 回路基板検査用プローブユニットおよび回路基板検査装置
CN102981094A (zh) * 2012-11-23 2013-03-20 深圳莱宝高科技股份有限公司 一种面板测试装置
CN102981094B (zh) * 2012-11-23 2016-04-13 深圳莱宝高科技股份有限公司 一种面板测试装置
CN104360112A (zh) * 2014-10-30 2015-02-18 南通富士通微电子股份有限公司 半导体测试治具及其形成方法
CN104360112B (zh) * 2014-10-30 2018-04-06 通富微电子股份有限公司 半导体测试治具及其形成方法

Also Published As

Publication number Publication date
ATE485524T1 (de) 2010-11-15
DE60334634D1 (de) 2010-12-02
JP2010156717A (ja) 2010-07-15
AU2003247852A1 (en) 2004-03-19
WO2004021019A1 (en) 2004-03-11
EP1546740A1 (en) 2005-06-29
US20040043653A1 (en) 2004-03-04
US6902416B2 (en) 2005-06-07
EP1546740B1 (en) 2010-10-20

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