ATE485524T1 - Sondeneinrichtung fuer hohe dichte - Google Patents

Sondeneinrichtung fuer hohe dichte

Info

Publication number
ATE485524T1
ATE485524T1 AT03791564T AT03791564T ATE485524T1 AT E485524 T1 ATE485524 T1 AT E485524T1 AT 03791564 T AT03791564 T AT 03791564T AT 03791564 T AT03791564 T AT 03791564T AT E485524 T1 ATE485524 T1 AT E485524T1
Authority
AT
Austria
Prior art keywords
conductive plate
housing
high density
probe device
electrically
Prior art date
Application number
AT03791564T
Other languages
German (de)
English (en)
Inventor
Steven Feldman
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE485524T1 publication Critical patent/ATE485524T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AT03791564T 2002-08-29 2003-07-01 Sondeneinrichtung fuer hohe dichte ATE485524T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/230,849 US6902416B2 (en) 2002-08-29 2002-08-29 High density probe device
PCT/US2003/020631 WO2004021019A1 (en) 2002-08-29 2003-07-01 High density probe device

Publications (1)

Publication Number Publication Date
ATE485524T1 true ATE485524T1 (de) 2010-11-15

Family

ID=31976604

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03791564T ATE485524T1 (de) 2002-08-29 2003-07-01 Sondeneinrichtung fuer hohe dichte

Country Status (7)

Country Link
US (1) US6902416B2 (https=)
EP (1) EP1546740B1 (https=)
JP (2) JP2005537481A (https=)
AT (1) ATE485524T1 (https=)
AU (1) AU2003247852A1 (https=)
DE (1) DE60334634D1 (https=)
WO (1) WO2004021019A1 (https=)

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US7736183B2 (en) * 2008-10-13 2010-06-15 Tyco Electronics Corporation Connector assembly with variable stack heights having power and signal contacts
US7896698B2 (en) * 2008-10-13 2011-03-01 Tyco Electronics Corporation Connector assembly having multiple contact arrangements
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US7637777B1 (en) 2008-10-13 2009-12-29 Tyco Electronics Corporation Connector assembly having a noise-reducing contact pattern
US7740489B2 (en) * 2008-10-13 2010-06-22 Tyco Electronics Corporation Connector assembly having a compressive coupling member
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US7918683B1 (en) 2010-03-24 2011-04-05 Tyco Electronics Corporation Connector assemblies and daughter card assemblies configured to engage each other along a side interface
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US8052470B1 (en) * 2011-01-12 2011-11-08 Cheng Uei Precision Industry Co., Ltd. Probe connector
US8083548B1 (en) * 2011-01-13 2011-12-27 Cheng Uei Precision Industry Co., Ltd. Probe connector
DE102012205352B4 (de) * 2012-02-24 2022-12-08 Rohde & Schwarz GmbH & Co. Kommanditgesellschaft Adapter für einen Tastkopf zur Messung eines differenziellen Signals
CN102981094B (zh) * 2012-11-23 2016-04-13 深圳莱宝高科技股份有限公司 一种面板测试装置
CN104360112B (zh) * 2014-10-30 2018-04-06 通富微电子股份有限公司 半导体测试治具及其形成方法
US9979112B2 (en) * 2016-03-29 2018-05-22 Aces Electronics Co., Ltd. Press-type connector
US11187723B2 (en) * 2016-10-31 2021-11-30 Rohde & Schwarz Gmbh & Co. Kg Differential test probe
US11422156B2 (en) * 2017-07-28 2022-08-23 Nhk Spring Co., Ltd. Contact probe and probe unit
US11031713B2 (en) 2017-09-11 2021-06-08 Smiths Interconnect Americas, Inc. Spring probe connector for interfacing a printed circuit board with a backplane
US10476196B2 (en) * 2018-02-28 2019-11-12 Ohio Associated Enterprises, Llc Electrical connector with contacts holding spring-loaded pins
KR102377330B1 (ko) * 2020-07-22 2022-03-22 신동익 인쇄회로기판 검사기용 핀블록 장치
US12601762B2 (en) * 2024-04-17 2026-04-14 F Time Technology Industrial Co., Ltd. Test terminal

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Also Published As

Publication number Publication date
DE60334634D1 (de) 2010-12-02
JP2010156717A (ja) 2010-07-15
AU2003247852A1 (en) 2004-03-19
WO2004021019A1 (en) 2004-03-11
EP1546740A1 (en) 2005-06-29
US20040043653A1 (en) 2004-03-04
JP2005537481A (ja) 2005-12-08
US6902416B2 (en) 2005-06-07
EP1546740B1 (en) 2010-10-20

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties