ATE485524T1 - Sondeneinrichtung fuer hohe dichte - Google Patents
Sondeneinrichtung fuer hohe dichteInfo
- Publication number
- ATE485524T1 ATE485524T1 AT03791564T AT03791564T ATE485524T1 AT E485524 T1 ATE485524 T1 AT E485524T1 AT 03791564 T AT03791564 T AT 03791564T AT 03791564 T AT03791564 T AT 03791564T AT E485524 T1 ATE485524 T1 AT E485524T1
- Authority
- AT
- Austria
- Prior art keywords
- conductive plate
- housing
- high density
- probe device
- electrically
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/230,849 US6902416B2 (en) | 2002-08-29 | 2002-08-29 | High density probe device |
PCT/US2003/020631 WO2004021019A1 (en) | 2002-08-29 | 2003-07-01 | High density probe device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE485524T1 true ATE485524T1 (de) | 2010-11-15 |
Family
ID=31976604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03791564T ATE485524T1 (de) | 2002-08-29 | 2003-07-01 | Sondeneinrichtung fuer hohe dichte |
Country Status (7)
Country | Link |
---|---|
US (1) | US6902416B2 (de) |
EP (1) | EP1546740B1 (de) |
JP (2) | JP2005537481A (de) |
AT (1) | ATE485524T1 (de) |
AU (1) | AU2003247852A1 (de) |
DE (1) | DE60334634D1 (de) |
WO (1) | WO2004021019A1 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
WO2003052435A1 (en) | 2001-08-21 | 2003-06-26 | Cascade Microtech, Inc. | Membrane probing system |
US7154257B2 (en) * | 2002-09-30 | 2006-12-26 | Intel Corporation | Universal automated circuit board tester |
US6999888B2 (en) * | 2002-09-30 | 2006-02-14 | Intel Corporation | Automated circuit board test actuator system |
MXPA05012044A (es) | 2003-05-09 | 2006-02-03 | Lg Electronics Inc | Disco optico de una sola escritura, metodo y aparato par recuperacion de informacion de administracion de disco del disco optico de una sola escritura. |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
JP4053962B2 (ja) * | 2003-10-15 | 2008-02-27 | 株式会社東芝 | 半導体装置 |
WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
US7232340B2 (en) * | 2004-02-20 | 2007-06-19 | Adc Incorporated | Methods and systems for minimizing alien crosstalk between connectors |
US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7524214B2 (en) * | 2005-12-27 | 2009-04-28 | The Boeing Company | Electrical quick lock interconnect |
US7294024B2 (en) | 2006-01-06 | 2007-11-13 | Adc Telecommunications, Inc. | Methods and systems for minimizing alien crosstalk between connectors |
US7331795B2 (en) * | 2006-01-13 | 2008-02-19 | Raytheon Company | Spring probe-compliant pin connector |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7651355B2 (en) * | 2006-06-30 | 2010-01-26 | 3M Innovative Properties Company | Floating panel mount connection system |
US7498826B2 (en) * | 2006-08-25 | 2009-03-03 | Interconnect Devices, Inc. | Probe array wafer |
KR100901409B1 (ko) * | 2007-07-06 | 2009-06-05 | 현대자동차주식회사 | 동축 케이블 커넥터 |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
JP5125407B2 (ja) * | 2007-10-26 | 2013-01-23 | 住友電装株式会社 | コネクタ |
US20090134898A1 (en) * | 2007-11-26 | 2009-05-28 | Carlsen Richard D | Coaxial Spring Probe Grounding Method |
MY151561A (en) * | 2007-12-06 | 2014-06-13 | Test Tooling Solutions M Sdn Bhd | Eco contactor |
US7795890B2 (en) * | 2008-06-09 | 2010-09-14 | Integrated Test Arizona | Reduced ground spring probe array and method for controlling signal spring probe impedance |
US7740508B2 (en) * | 2008-09-08 | 2010-06-22 | 3M Innovative Properties Company | Probe block assembly |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US7867032B2 (en) * | 2008-10-13 | 2011-01-11 | Tyco Electronics Corporation | Connector assembly having signal and coaxial contacts |
US7740489B2 (en) * | 2008-10-13 | 2010-06-22 | Tyco Electronics Corporation | Connector assembly having a compressive coupling member |
US7736183B2 (en) * | 2008-10-13 | 2010-06-15 | Tyco Electronics Corporation | Connector assembly with variable stack heights having power and signal contacts |
US7637777B1 (en) | 2008-10-13 | 2009-12-29 | Tyco Electronics Corporation | Connector assembly having a noise-reducing contact pattern |
US7896698B2 (en) * | 2008-10-13 | 2011-03-01 | Tyco Electronics Corporation | Connector assembly having multiple contact arrangements |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
DE202009003966U1 (de) * | 2009-03-20 | 2009-06-04 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Messspitzen |
IT1395368B1 (it) * | 2009-08-28 | 2012-09-14 | St Microelectronics Srl | Schermatura elettromagnetica per il collaudo di circuiti integrati |
US7918683B1 (en) | 2010-03-24 | 2011-04-05 | Tyco Electronics Corporation | Connector assemblies and daughter card assemblies configured to engage each other along a side interface |
JP5538107B2 (ja) * | 2010-07-09 | 2014-07-02 | 日置電機株式会社 | 回路基板検査用プローブユニットおよび回路基板検査装置 |
US8052470B1 (en) * | 2011-01-12 | 2011-11-08 | Cheng Uei Precision Industry Co., Ltd. | Probe connector |
US8083548B1 (en) * | 2011-01-13 | 2011-12-27 | Cheng Uei Precision Industry Co., Ltd. | Probe connector |
DE102012205352B4 (de) * | 2012-02-24 | 2022-12-08 | Rohde & Schwarz GmbH & Co. Kommanditgesellschaft | Adapter für einen Tastkopf zur Messung eines differenziellen Signals |
CN102981094B (zh) * | 2012-11-23 | 2016-04-13 | 深圳莱宝高科技股份有限公司 | 一种面板测试装置 |
CN104360112B (zh) * | 2014-10-30 | 2018-04-06 | 通富微电子股份有限公司 | 半导体测试治具及其形成方法 |
US9979112B2 (en) * | 2016-03-29 | 2018-05-22 | Aces Electronics Co., Ltd. | Press-type connector |
US11187723B2 (en) * | 2016-10-31 | 2021-11-30 | Rohde & Schwarz Gmbh & Co. Kg | Differential test probe |
SG11202000654VA (en) * | 2017-07-28 | 2020-02-27 | Nhk Spring Co Ltd | Contact probe and probe unit |
WO2019051421A1 (en) * | 2017-09-11 | 2019-03-14 | Smiths Interconnect Americas, Inc. | SPRING PROBE CONNECTOR FOR INTERFACING PRINTED CIRCUIT BOARD WITH BASKET BASKET |
US10476196B2 (en) * | 2018-02-28 | 2019-11-12 | Ohio Associated Enterprises, Llc | Electrical connector with contacts holding spring-loaded pins |
KR102377330B1 (ko) * | 2020-07-22 | 2022-03-22 | 신동익 | 인쇄회로기판 검사기용 핀블록 장치 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3852700A (en) * | 1969-04-18 | 1974-12-03 | Breston M | Grounding base for connector |
US3731254A (en) * | 1971-08-02 | 1973-05-01 | Thomas & Betts Corp | Jumper for interconnecting dual-in-line sockets |
US3806801A (en) | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
JPS6074062U (ja) * | 1983-10-27 | 1985-05-24 | セイコーエプソン株式会社 | プロ−ブ用レセプタクルの固定構造 |
US4593243A (en) | 1984-08-29 | 1986-06-03 | Magnavox Government And Industrial Electronics Company | Coplanar and stripline probe card apparatus |
JPS6177286A (ja) * | 1984-09-21 | 1986-04-19 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 同軸ケーブル用インターフェース装置 |
US4734046A (en) * | 1984-09-21 | 1988-03-29 | International Business Machines Corporation | Coaxial converter with resilient terminal |
US4712062A (en) | 1984-12-20 | 1987-12-08 | Hughes Aircraft Company | Ground shield apparatus for giga-hertz test jig |
US4724180A (en) | 1985-08-05 | 1988-02-09 | Teradyne, Inc. | Electrically shielded connectors |
US4783624A (en) * | 1986-04-14 | 1988-11-08 | Interconnect Devices, Inc. | Contact probe devices and method |
US4964814A (en) * | 1986-10-03 | 1990-10-23 | Minnesota Mining And Manufacturing Co. | Shielded and grounded connector system for coaxial cables |
US4827211A (en) | 1987-01-30 | 1989-05-02 | Cascade Microtech, Inc. | Wafer probe |
US4931726A (en) | 1987-06-22 | 1990-06-05 | Hitachi, Ltd. | Apparatus for testing semiconductor device |
JPH0178029U (de) * | 1987-11-13 | 1989-05-25 | ||
JPH06100635B2 (ja) * | 1989-03-08 | 1994-12-12 | 理化電子株式会社 | 配線板の検査装置のテストヘッド |
US4965514A (en) | 1989-06-05 | 1990-10-23 | Tektronix, Inc. | Apparatus for probing a microwave circuit |
US5144228A (en) | 1991-04-23 | 1992-09-01 | International Business Machines Corporation | Probe interface assembly |
US5194020A (en) * | 1991-06-17 | 1993-03-16 | W. L. Gore & Associates, Inc. | High-density coaxial interconnect system |
US5190472A (en) * | 1992-03-24 | 1993-03-02 | W. L. Gore & Associates, Inc. | Miniaturized high-density coaxial connector system with staggered grouper modules |
US5223787A (en) * | 1992-05-29 | 1993-06-29 | Tektronix, Inc. | High-speed, low-profile test probe |
US5308250A (en) | 1992-10-30 | 1994-05-03 | Hewlett-Packard Company | Pressure contact for connecting a coaxial shield to a microstrip ground plane |
US5477159A (en) | 1992-10-30 | 1995-12-19 | Hewlett-Packard Company | Integrated circuit probe fixture with detachable high frequency probe carrier |
US5367254A (en) * | 1993-02-01 | 1994-11-22 | International Business Machines Corporation | Test probe assembly using buckling wire probes within tubes having opposed overlapping slots |
KR0138618B1 (ko) | 1993-08-04 | 1998-06-15 | 이노우에 아끼라 | 프로브카드, 프로브카드용 동축 프로브빔 및 그 제조방법 |
JPH07218541A (ja) | 1994-01-31 | 1995-08-18 | Matsushita Electric Works Ltd | 回路基板検査装置 |
US5416429A (en) | 1994-05-23 | 1995-05-16 | Wentworth Laboratories, Inc. | Probe assembly for testing integrated circuits |
US5486770A (en) | 1994-06-27 | 1996-01-23 | Motorola, Inc. | High frequency wafer probe apparatus and method |
JPH08106944A (ja) * | 1994-10-03 | 1996-04-23 | Tokai Rika Co Ltd | 電気コネクタ及び同電気コネクタのハウジング |
US5625299A (en) | 1995-02-03 | 1997-04-29 | Uhling; Thomas F. | Multiple lead analog voltage probe with high signal integrity over a wide band width |
US5917330A (en) | 1996-01-17 | 1999-06-29 | Miley; David M. | Probe ring having electrical components affixed thereto and related apparatus and processes |
US5936415A (en) | 1996-12-20 | 1999-08-10 | Xilinx, Inc. | Method and apparatus for a pin-configurable integrated circuit tester board |
US6433562B1 (en) * | 1998-08-28 | 2002-08-13 | International Business Machines Corporation | Method and apparatus of interconnecting with a system board |
US6160412A (en) | 1998-11-05 | 2000-12-12 | Wentworth Laboratories, Inc. | Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment |
US6196866B1 (en) | 1999-04-30 | 2001-03-06 | International Business Machines Corporation | Vertical probe housing |
JP2001074814A (ja) * | 1999-09-07 | 2001-03-23 | Sony Corp | 回路基板検査装置 |
US6498506B1 (en) * | 2000-07-26 | 2002-12-24 | Gore Enterprise Holdings, Inc. | Spring probe assemblies |
US6447328B1 (en) | 2001-03-13 | 2002-09-10 | 3M Innovative Properties Company | Method and apparatus for retaining a spring probe |
US6551126B1 (en) * | 2001-03-13 | 2003-04-22 | 3M Innovative Properties Company | High bandwidth probe assembly |
-
2002
- 2002-08-29 US US10/230,849 patent/US6902416B2/en not_active Expired - Fee Related
-
2003
- 2003-07-01 JP JP2004532588A patent/JP2005537481A/ja active Pending
- 2003-07-01 EP EP03791564A patent/EP1546740B1/de not_active Expired - Lifetime
- 2003-07-01 DE DE60334634T patent/DE60334634D1/de not_active Expired - Lifetime
- 2003-07-01 AU AU2003247852A patent/AU2003247852A1/en not_active Abandoned
- 2003-07-01 AT AT03791564T patent/ATE485524T1/de not_active IP Right Cessation
- 2003-07-01 WO PCT/US2003/020631 patent/WO2004021019A1/en active Application Filing
-
2010
- 2010-04-15 JP JP2010094355A patent/JP2010156717A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JP2010156717A (ja) | 2010-07-15 |
EP1546740A1 (de) | 2005-06-29 |
JP2005537481A (ja) | 2005-12-08 |
DE60334634D1 (de) | 2010-12-02 |
US6902416B2 (en) | 2005-06-07 |
WO2004021019A1 (en) | 2004-03-11 |
US20040043653A1 (en) | 2004-03-04 |
AU2003247852A1 (en) | 2004-03-19 |
EP1546740B1 (de) | 2010-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |