JP2005533254A - 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体 - Google Patents
被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体 Download PDFInfo
- Publication number
- JP2005533254A JP2005533254A JP2004521866A JP2004521866A JP2005533254A JP 2005533254 A JP2005533254 A JP 2005533254A JP 2004521866 A JP2004521866 A JP 2004521866A JP 2004521866 A JP2004521866 A JP 2004521866A JP 2005533254 A JP2005533254 A JP 2005533254A
- Authority
- JP
- Japan
- Prior art keywords
- contactor
- electrical
- interposer
- assembly
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/197,133 US6853209B1 (en) | 2002-07-16 | 2002-07-16 | Contactor assembly for testing electrical circuits |
US10/197,104 US6867608B2 (en) | 2002-07-16 | 2002-07-16 | Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component |
PCT/US2003/022125 WO2004008163A2 (fr) | 2002-07-16 | 2003-07-15 | Ensemble conçu pour relier electriquement un composant de verification a une machine de verification servant a verifier les circuits electriques se trouvant sur ledit composant de verification |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005533254A true JP2005533254A (ja) | 2005-11-04 |
JP2005533254A5 JP2005533254A5 (fr) | 2006-08-17 |
Family
ID=30117843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004521866A Pending JP2005533254A (ja) | 2002-07-16 | 2003-07-15 | 被試験部品上の電気回路を試験するために被試験部品を試験機械に電気的に接続するための組立体 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1523685A2 (fr) |
JP (1) | JP2005533254A (fr) |
KR (1) | KR20050029215A (fr) |
CN (1) | CN100523826C (fr) |
AU (1) | AU2003249276A1 (fr) |
WO (1) | WO2004008163A2 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020505584A (ja) * | 2017-01-09 | 2020-02-20 | デルタ・デザイン・インコーポレイテッドDelta Design, Inc. | ソケット側表面熱システム |
US11774486B2 (en) | 2021-06-30 | 2023-10-03 | Delta Design Inc. | Temperature control system including contactor assembly |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI339737B (en) | 2005-04-27 | 2011-04-01 | Aehr Test Systems | Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device |
CN101051067B (zh) * | 2006-04-03 | 2010-08-11 | 航天科工防御技术研究试验中心 | 电连接器综合检测控制装置设计方法 |
MY152599A (en) | 2007-02-14 | 2014-10-31 | Eles Semiconductor Equipment S P A | Test of electronic devices at package level using test boards without sockets |
EP1959265A1 (fr) * | 2007-02-16 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Test de circuits intégrés sur une tranche avec une cartouche laissant leur surface exposée |
US7557594B2 (en) * | 2007-08-14 | 2009-07-07 | Electro Scientific Industries, Inc. | Automated contact alignment tool |
US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
CN101545926B (zh) * | 2008-03-25 | 2011-05-11 | 旺矽科技股份有限公司 | 探针测试装置 |
DE102009012021B4 (de) * | 2009-03-10 | 2011-02-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Messvorrichtung zur elektrischen Vermessung einer einseitig an einer Messseite elektrisch kontaktierbaren Messstruktur |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
TWI440412B (zh) * | 2011-12-28 | 2014-06-01 | Princo Corp | 超薄多層基板之封裝方法 |
CN103808979A (zh) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | 用于承载待测试电子装置的治具 |
CN103808969A (zh) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | 用于承载待测试电子装置的治具 |
CN105548859A (zh) * | 2015-12-09 | 2016-05-04 | 上海精密计量测试研究所 | 用于环境测试的测试设备及方法 |
CN106200239B (zh) * | 2016-09-14 | 2019-03-15 | 海信集团有限公司 | 光机照明系统 |
WO2018160557A1 (fr) | 2017-03-03 | 2018-09-07 | Aehr Test Systems | Testeur électronique |
EP4226165A1 (fr) | 2020-10-07 | 2023-08-16 | AEHR Test Systems | Appareil d'essai électronique |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
JPH0763788A (ja) * | 1993-08-21 | 1995-03-10 | Hewlett Packard Co <Hp> | プローブおよび電気部品/回路検査装置ならびに電気部品/回路検査方法 |
US6028437A (en) * | 1997-05-19 | 2000-02-22 | Si Diamond Technology, Inc. | Probe head assembly |
US6137297A (en) * | 1999-01-06 | 2000-10-24 | Vertest Systemsn Corp. | Electronic test probe interface assembly and method of manufacture |
JP2001013208A (ja) * | 1999-06-30 | 2001-01-19 | Mitsubishi Electric Corp | 半導体テスト治工具 |
-
2003
- 2003-07-15 CN CNB038166755A patent/CN100523826C/zh not_active Expired - Fee Related
- 2003-07-15 JP JP2004521866A patent/JP2005533254A/ja active Pending
- 2003-07-15 WO PCT/US2003/022125 patent/WO2004008163A2/fr active Application Filing
- 2003-07-15 KR KR1020057000799A patent/KR20050029215A/ko not_active Application Discontinuation
- 2003-07-15 EP EP03764698A patent/EP1523685A2/fr not_active Withdrawn
- 2003-07-15 AU AU2003249276A patent/AU2003249276A1/en not_active Abandoned
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020505584A (ja) * | 2017-01-09 | 2020-02-20 | デルタ・デザイン・インコーポレイテッドDelta Design, Inc. | ソケット側表面熱システム |
JP2022188088A (ja) * | 2017-01-09 | 2022-12-20 | デルタ・デザイン・インコーポレイテッド | ソケット側表面熱システム |
US11879910B2 (en) | 2017-01-09 | 2024-01-23 | Delta Design, Inc. | Socket side thermal system |
US11774486B2 (en) | 2021-06-30 | 2023-10-03 | Delta Design Inc. | Temperature control system including contactor assembly |
Also Published As
Publication number | Publication date |
---|---|
AU2003249276A8 (en) | 2004-02-02 |
CN1668929A (zh) | 2005-09-14 |
WO2004008163A2 (fr) | 2004-01-22 |
CN100523826C (zh) | 2009-08-05 |
AU2003249276A1 (en) | 2004-02-02 |
EP1523685A2 (fr) | 2005-04-20 |
WO2004008163A3 (fr) | 2004-06-10 |
KR20050029215A (ko) | 2005-03-24 |
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Legal Events
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