WO2008114973A1 - Sonde possédant des moyens de planarisation - Google Patents

Sonde possédant des moyens de planarisation Download PDF

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Publication number
WO2008114973A1
WO2008114973A1 PCT/KR2008/001468 KR2008001468W WO2008114973A1 WO 2008114973 A1 WO2008114973 A1 WO 2008114973A1 KR 2008001468 W KR2008001468 W KR 2008001468W WO 2008114973 A1 WO2008114973 A1 WO 2008114973A1
Authority
WO
WIPO (PCT)
Prior art keywords
planarization
circuit board
printed circuit
probe
probe substrate
Prior art date
Application number
PCT/KR2008/001468
Other languages
English (en)
Inventor
Jong Hyeon Chae
Original Assignee
M2N Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M2N Inc. filed Critical M2N Inc.
Publication of WO2008114973A1 publication Critical patent/WO2008114973A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Definitions

  • the present disclosure relates to a probe card; and, more particularly, to a probe card capable of adjusting the planarization thereof.
  • a probe card is an apparatus to be used in testing a semiconductor device such as a semiconductor memory, a display, and the like during or after a manufacturing process thereof.
  • the probe card electrically connects a wafer with a semiconductor device inspection apparatus to transmit electrical signals from the inspection apparatus to semiconductor dies formed on the wafer and, also, to transmit electrical signals from the semiconductor dies to the inspection apparatus.
  • FIG. 1 is a cross sectional view of a conventional probe card.
  • the conventional probe card includes a printed circuit board 30, a space transformer
  • an interposer 40 which electrically connects the printed circuit board 30 with the space transformer 10
  • an orientation adjusting member 60 which adjusts the orientation of the space transformer 10 by applying a pulling force or a pressing force to an outer peripheral area of the space transformer 10
  • a deformation compensating member 50 for compensating for a geometrical deformation of the space transformer 10 by applying a pulling force or a pressing force to a central area of the space transformer 10.
  • the printed circuit board 30 receives an electrical signal transmitted from a semiconductor inspection apparatus, and then relays the received signal to the probes 20.
  • the space transformer 10 serves to change pitches. That is, an interval between a plurality of contact terminals formed on an upper surface of the space transformer 10 is set to be different from an interval between a multiplicity of contact terminals formed on a lower surface of the space transformer 10. For example, the pitch on the lower surface is narrower than that on the upper surface.
  • the space transformer 10 has the probes 20 mounted thereon.
  • the probes 20 make one-to-one contact with a plurality of pads on a wafer so as to transmit electrical signals transmitted from the semiconductor inspection apparatus to semiconductor dies on the wafer.
  • the probes 20 generally have elasticity and have various shapes such as a cantilever beam shape, a bump shape, or the like.
  • the interposer 40 serves to electrically connect the printed circuit board 30 with the space transformer 10.
  • the interposer 40 has elastic contact structures disposed on upper and lower surfaces of a board.
  • the orientation adjusting member 60 adjusts the orientation of the space transformer 10 so that all of the probes may come into contact with the pads on the wafer.
  • the deformation compensating member 50 compensates for such distortion or deformation so that all of the probes may come into contact with the pads on the wafer.
  • the conventional probe card includes the orientation adjusting member 60 and the deformation compensating member 50 as a means to achieve the planarization of the probes.
  • the orientation of the space transformer 10 is adjusted by using the orientation adjusting member 60 mounted on the outer peripheral area of the space transformer 10 so that the space transformer 10 becomes parallel to the wafer.
  • the deformation compensating member 50 compensates for the deformation of the space transformer 10, which is geometrically deformed due to the distortion or the like, by applying a pulling force or a pressing force to the central area of the space transformer 10.
  • the deformation compensating member 50 employs a spring element so as to allow freedom against momentum which is applied to the deformation compensating member 50 when the orientation of the space transformer 10 is adjusted by the orientation adjusting member 60.
  • the spring element also needs to stand the pressure from the interposer 40 while allowing such freedom, the degree of freedom in adjusting the orientation of the space transformer 10 is restricted.
  • the present disclosure provides a probe card capable of easily adjusting the planarization thereof by means of an orientation adjustment member and a deformation compensation member which are separated from each other so that, even for a large-size probe card, planarization can be carried out easily by using the orientation adjustment member and the deformation compensation member independently without being restricted by an interference therebetween.
  • a probe card for probing a semiconductor device which comprises a printed circuit board; a probe substrate electrically connected to the printed circuit board and having a plurality of probes; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the probe substrate to be spaced apart from the printed circuit board, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.
  • a probe card for probing a semiconductor device which comprises a printed circuit board; a probe substrate electrically connected to the printed circuit board and having a plurality of probes; a reinforcing plate disposed on the printed circuit board to reinforce the printed circuit board; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the probe substrate to be spaced apart from the reinforcing plate, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.
  • a probe card for probing a semiconductor device which comprises a printed circuit board; a space transformer electrically connected to the printed circuit board; a probe substrate electrically connected to the space transformer and having a plurality of probes; a coupling member for coupling the probe substrate with the space transformer; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the coupling member and spaced apart from the printed circuit board, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.
  • a probe card for probing a semiconductor device which comprises a printed circuit board; a space transformer electrically connected to the printed circuit board; a probe substrate electrically connected to the space transformer and having a plurality of probes; a coupling member for coupling the probe substrate with the space transformer; a reinforcing plate disposed on the printed circuit board to reinforce the printed circuit board; a first planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to a central area of the probe substrate; a second planarization adjusting member for adjusting the planarization of the probe substrate by applying a force to an outer peripheral area of the probe substrate; and a floating mounting member disposed on the coupling member to be spaced apart from the reinforcing plate, wherein the first planarization adjusting member is disposed at a central area of the floating mounting member.
  • FIG. 1 is a cross sectional view of a probe card having a mechanism for adjusting the planarization of probes in a conventional probe card;
  • FIG. 3 is a plan view of a probe card for probing a semiconductor device in accordance with a second embodiment of the present invention.
  • FIG. 4 is a cross sectional view of a probe card for probing a semiconductor device in accordance with a third embodiment of the present invention
  • Fig. 5 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a fourth embodiment of the present invention
  • FIG. 6 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a fifth embodiment of the present invention.
  • FIG. 7 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a sixth embodiment of the present invention.
  • FIG. 8 is a cross sectional view of a first planarization adjusting member in a probe card for probing a semiconductor device in accordance with a seventh embodiment of the present invention.
  • FIG. 9 is a cross sectional view of a first planarization adjusting member in a probe card for probing a semiconductor device in accordance with an eighth embodiment of the present invention.
  • FIG. 10 is a cross sectional view of a floating mounting member in a probe card for probing a semiconductor device in accordance with a ninth embodiment of the present invention.
  • FIG. 11 is a cross sectional view of a printed circuit board unit in a probe card for probing a semiconductor device in accordance with a tenth embodiment of the present invention.
  • FIG. 12 is a cross sectional view of a printed circuit board unit in a probe card for probing a semiconductor device in accordance with an eleventh embodiment of the present invention.
  • FIG. 2 is a cross sectional view of a probe card for inspecting a semiconductor device in accordance with a first embodiment of the present invention.
  • a plurality of contact probes 101 are coupled to a wafer contact surface on a
  • the contact probes 101 receive electrical signals of an external inspection apparatus from the MEMS probe substrate 102 and transmit the received electrical signals to a wafer. Also, the contact probes 101 receive signals sent from the wafer and transmit them to the MEMS probe substrate 102. The contact probes 101 make direct contact with pads on the wafer to inspect the wafer. Preferably, the contact probes 101 are made of an elastic material so as to prevent the wafer from being damaged when the contact probes 101 make contact with the pads on the wafer.
  • the MEMS probe substrate 102 is coupled to the contact probes 101 and a space transformer 103.
  • the MEMS probe substrate 102 receives the electrical signals of the external inspection apparatus from the space transformer 103 and transmits the received electrical signals to the contact probes 101. Also, the MEMS probe substrate 102 receives the signals sent from the wafer from the contact probes 101 and transmits them to the space transformer 103.
  • the space transformer 103 is coupled to the MEMS probe substrate 102 and an interposer 104.
  • the space transformer 103 receives the electrical signals of the external inspection apparatus from the interposer 104 and transmits the signals to the MEMS probe substrate 102. Also, the space transformer 103 receives the signals sent from the wafer from the MEMS probe substrate 102 and transmits them to the interposer 104.
  • the interposer 104 is coupled to a printed circuit board 109 and the space transformer 103.
  • the interposer 104 receives the electrical signals of the external inspection apparatus from the printed circuit board 109 and transmits the signals to the space transformer 103.
  • the interposer 104 receives the signals sent from the wafer from the space transformer 103 and transmits them to the printed circuit board 109.
  • portions of the interposer 104 being in contact with the printed circuit board 109 and the space transformer 103 are made up of an elastic material.
  • the interposer 104 serves to facilitate the planarization adjustment of the MEMS probe substrate 102 and the space transformer 103 by means of a first planarization bolt 110 or a second planarization bolt 115 while the printed circuit board 109 is fixed.
  • the interposer 104 includes one or more pathways through which the first planarization bolt 110, a planarization adaptor 111 or a planarization screw 112 can be inserted.
  • a frame 105 is coupled to the MEMS probe substrate 102 and the space transformer
  • the frame 105 fixes the MEMS probe substrate 102 and the space transformer 103.
  • the frame 105 is also coupled to a floating substrate post 114, the second planarization bolt 115 and a clamping spring 106.
  • the spring 106 is coupled to the frame 105 and a lower reinforcing plate 107.
  • the spring 106 applies an elastic force between the frame 105 and the lower reinforcing plate 107 such that the influence of the lower reinforcing plate 107 is reduced when the frame 105 is moved due to a pressing force or a pulling force applied thereto by the first planarization bolt 110 or the second planarization bolt 115.
  • the lower reinforcing plate 107 is coupled to the spring 106 and the printed circuit board 109.
  • the lower reinforcing plate 107 fixes the printed circuit board 109 and connects the printed circuit board 109 to the frame 105 via the spring 106.
  • the lower reinforcing plate 107 prevents a direct application of a force to the printed circuit board 19 when the planarization adjustment is carried out by the second planarization bolt 115.
  • An upper reinforcing plate 108 is coupled to the printed circuit board 109.
  • the upper reinforcing plate 108 prevents the printed circuit board 109 from being bent or broken by fixing the printed circuit board 109.
  • the upper reinforcing plate 108 includes a plurality of pathways through which the first planarization bolt 110, the planarization adaptor 111, the planarization screw 112, the floating substrate post 114 and the second planarization bolt 115 can be inserted.
  • the printed circuit board 109 is coupled to the interposer 104, the lower reinforcing plate 107 and the upper reinforcing plate 108.
  • the printed circuit board 109 is fixed by the lower reinforcing plate 107 and the upper reinforcing plate 108.
  • the printed circuit board 109 receives the electrical signals from the external inspection apparatus and transmits them to the interposer 104. Also, the printed circuit board 109 receives the signals sent from the wafer from the interposer 104 and transmits them to the external inspection apparatus.
  • the printed circuit board 109 includes a plurality of pathways through which the first planarization bolt 110, the planarization adaptor 111, the planarization screw 112, the floating substrate post 114 and the second planarization bolt 115 can be inserted.
  • the first planarization bolt 110 is coupled to the space transformer 103 and the planarization adaptor 111.
  • the first planarization bolt 110 is coupled to the space transformer 103 through a coupling structure in the space transformer 103, or by bonding in case the space transformer 103 is not provided with the coupling structure.
  • the planarization adaptor 111 is coupled to the first planarization bolt 110 and the planarization screw 112.
  • the planarization adaptor 111 transfers the pressing force or the pulling force, which is generated by the planarization screw 112, to the first planarization bolt 110.
  • the planarization screw 112 is coupled to the planarization adaptor 111 and a floating substrate 113.
  • the planarization screw 112 has a spiral shape. Therefore, the pressing force or the pulling force can be applied to the space transformer 103 by turning the planarization screw 112 in clockwise or counterclockwise direction.
  • the first planarization bolt 110, the planarization adaptor 111 and the planarization screw 112 are placed at central areas of the respective substrates.
  • more than one first planarization bolts 110, more than one planarization adaptors 111 and more than one planarization screws 112 may be provided.
  • the central area refers to an area of each substrate other than an outer peripheral area thereof.
  • the floating substrate 113 is coupled to the planarization screw 112 and the floating substrate post 114.
  • the floating substrate 113 is spaced apart from the upper reinforcing plate 108 and is coupled to the floating substrate post 114 so as to connect the planarization screw 112 to the frame 105.
  • the floating substrate post 114 is coupled to the floating substrate 113 and the frame 105.
  • the floating substrate post 114 is not connected to any parts other than the floating substrate 113 and the frame 105.
  • the second planarization bolt 115 adjusts the planarization of the MEMS probe substrate 102 and the space transformer 103 by applying the pulling force or the pressing force to the frame 105.
  • the second planarization bolt 115 is inserted through the upper reinforcing plate 108 and the printed circuit board 109 to be connected only to the frame 105. In other words, the second planarization bolt 115 is not connected to any other members than the upper reinforcing plate 108 and the printed circuit board 109.
  • the second planarization bolt 115 is separated from the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112. More than one second planarization bolt 115 can be used for more accurate adjustment of planarization.
  • the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112 are exclusively coupled to the space transformer 103 via the floating substrate 113 and the floating substrate post 114, and the second planarization bolt 115 is directly coupled only to the frame 105.
  • the planarization adjustment of the MEMS probe substrate 102 and the space transformer 103 by the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112 does not exert any influence upon the planarization adjustment of the MEMS probe substrate 102 and the space transformer 103 by the second planarization bolt 115, and vice versa. That is, the degree of freedom in carrying out the planarization adjustment by the second planarization bolt 115 is not restricted by the first planarization bolts 110, the planarization adaptor 111 and the planarization screw 112.
  • FIG. 3 is a plan view of a probe card for probing a semiconductor device in accordance with a second embodiment of the present invention.
  • planarization screws 121 are placed at central areas of a floating substrate 122 and an upper reinforcing plate 124. Preferably, more than one pla- narization screws 121 are placed to adjust the planarization more accurately.
  • the floating substrate 122 is supported by a floating substrate post and is spaced apart from the upper reinforcing plate 124.
  • the floating substrate 122 is provided with, in its central area, one or more pathways through which the planarization screws 121 can be inserted, wherein the number of the pathways is equal to the number of the planarization screws 121.
  • a plurality of second planarization bolts 123 are placed at an outer peripheral area of the upper reinforcing plate 124. Preferably, three or more second planarization bolts 123 are provided.
  • the upper reinforcing plate 124 is coupled to a printed circuit board and is spaced apart from the floating substrate 122.
  • the upper reinforcing plate 124 is provided with, in its outer peripheral area, a plurality of pathways through which the second planarization bolts 123 can be inserted, wherein the number of the pathways is equal to the number of the second planarization bolts 123.
  • FIG. 4 is a cross sectional view of a probe card for probing a semiconductor device in accordance with a third embodiment of the present invention.
  • a probe substrate 211 makes contact with pads on a wafer so as to transmit electrical signals of an external inspection apparatus to the wafer, and then to transmit the signals received from the wafer to a printed circuit board unit 212.
  • the probe substrate 211 is coupled to a first planarization adjusting member 213, a floating mounting member 214 and the printed circuit board unit 212.
  • the first planarization adjusting member 213 adjusts the planarization of the probe substrate 211 by applying a pulling force or a pressing force to a central area of the probe substrate 211.
  • the first planarization adjusting member 213 is connected to the probe substrate 211 through a floating mounting member 214 without being connected to any other parts.
  • the first planarization adjusting member 213 is separated from a second planarization adjusting member 215. More than one first planarization adjusting members may be used to adjust the planarization more accurately.
  • the first planarization adjusting member 213 is exclusively coupled to the probe substrate 211 through the floating mounting member 214, and the second planarization adjusting member 215 is directly coupled only to the probe substrate 211. Accordingly, since the first planarization adjusting member 213 is separated from the second planarization adjusting member 215, the planarization adjustment of the probe substrate 211 by the first planarization bolts 110 does not exert any influence upon the planarization adjustment of the probe substrate 211 by the second planarization adjusting member 215, and vice versa. That is, the degree of freedom in carrying out the planarization adjustment by the second planarization adjusting member 215 is not restricted by the first planarization adjusting member 213.
  • FIG. 5 is a cross sectional view of a probe substrate in a probe card for probing a semiconductor device in accordance with a fourth embodiment of the present invention.
  • the contact probes 311 are coupled to a wafer contact surface on the spacer transformer 313 at a constant interval.
  • the contact probes 311 make direct contact with a wafer to inspect the wafer.
  • the contact probes 311 are made of an elastic material so as to prevent the wafer from being damaged when the contact probes 311 make contact with the wafer.
  • the spacer transformer 313 is coupled to the MEMS probe substrate 312 and the frame 314.
  • the spacer transformer 313 receives the electrical signals of the external inspection apparatus from a printed circuit board and transmits the signals to the MEMS probe substrate 312. Also, the spacer transformer 313 receives the signals of the wafer from the MEMS probe substrate 312 and transmits them to the printed circuit board.
  • the frame 314 is coupled to the MEMS probe substrate 312 and the spacer transformer 313.
  • the frame 314 fixes the MEMS probe substrate 312 and the spacer transformer 313.
  • the frame 314 is also coupled to a floating mounting member and a second planarization adjusting member.
  • the contact probes 321 are coupled to a wafer contact surface on the spacer transformer 323 at constant intervals.
  • the contact probes 321 make direct contact with a wafer to inspect the wafer.
  • the contact probes 321 are made of an elastic material so as to prevent the wafer from being damaged when the contact probes 321 make contact with the wafer.
  • FIG. 10 is a cross sectional view of a floating mounting member in a probe card for probing a semiconductor device in accordance with a ninth embodiment of the present invention.
  • the upper reinforcing plate 613 is coupled to the printed circuit board 611.
  • the upper reinforcing plate 613 prevents the printed circuit board 611 from being bent or broken by fixing the printed circuit board 611.
  • the upper reinforcing plate 613 includes a plurality of pathways (not shown) through which the first planarization adjusting member, the floating mounting member and the second planarization adjusting member can be inserted.
  • the first planarization adjusting member and the second planarization adjusting member are coupled to the probe substrate while the first planarization adjusting member and the second planarization adjusting member are separated from each other. Therefore, there occurs no interference between the first planarization adjusting member and the second planarization adjusting member, so that the degree of planarization is not restricted, and the freedom in adjusting the planarization can be obtained. Accordingly, even for a large-size probe card, its planarization can be easily achieved by using more than one planarization adjusting member independently.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention concerne une carte sonde à planarisation ajustable. La carte de sonde comprend une carte de circuit imprimé; un substrat de sonde connecté électriquement à la carte de circuit imprimé et possédant plusieurs sondes; un premier élément d'ajustement de planarisation servant à ajuster la planarisation du substrat de sonde par l'application d'une force à une région centrale du substrat de sonde; un deuxième élément d'ajustement de planarisation servant à ajuster la planarisation du substrat de sonde par l'application d'une force à une région périphérique externe du substrat de sonde; et un élément de montage flottant disposé sur le substrat de sonde de manière à être espacé par rapport à la carte de circuit imprimé, le premier élément d'ajustement de planarisation étant disposé dans une région centrale de l'élément de montage flottant.
PCT/KR2008/001468 2007-03-16 2008-03-14 Sonde possédant des moyens de planarisation WO2008114973A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070026000A KR100851392B1 (ko) 2007-03-16 2007-03-16 평탄화 수단을 구비한 프로브 카드
KR10-2007-0026000 2007-03-16

Publications (1)

Publication Number Publication Date
WO2008114973A1 true WO2008114973A1 (fr) 2008-09-25

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Application Number Title Priority Date Filing Date
PCT/KR2008/001468 WO2008114973A1 (fr) 2007-03-16 2008-03-14 Sonde possédant des moyens de planarisation

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KR (1) KR100851392B1 (fr)
WO (1) WO2008114973A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102998497A (zh) * 2012-12-11 2013-03-27 北京确安科技股份有限公司 一种跳格式探针卡制作方法
JP2013167461A (ja) * 2012-02-14 2013-08-29 Micronics Japan Co Ltd 電気的接続装置及びその組立方法
US9234917B2 (en) 2011-09-16 2016-01-12 Mpi Corporation Probing device and manufacturing method thereof

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Publication number Priority date Publication date Assignee Title
KR100911661B1 (ko) 2007-07-11 2009-08-10 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
KR100954451B1 (ko) * 2009-06-19 2010-04-27 박영주 반도체 웨이퍼 테스트용 프로브 카드의 평탄화 장치 및 평탄화 장치의 평탄 조절체 인서트 적층방법
KR101134662B1 (ko) 2010-01-27 2012-04-09 (주)엠투엔 평탄 조절 수단을 구비하는 프로브 카드
KR101801605B1 (ko) * 2011-07-11 2017-11-27 (주)샘씨엔에스 프로브 카드

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JP2004150927A (ja) * 2002-10-30 2004-05-27 Fujitsu Ltd プロービング装置
JP2006317302A (ja) * 2005-05-13 2006-11-24 Tokyo Electron Ltd プローブカードの調整機構及びプローブ装置
JP2007024533A (ja) * 2005-07-12 2007-02-01 Tokyo Electron Ltd プローブカード

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JPH1031034A (ja) 1996-07-17 1998-02-03 Denki Kagaku Kogyo Kk 平行度調整器付きプローブカード
KR20040022647A (ko) * 2002-09-09 2004-03-16 삼성전자주식회사 집적 회로 칩 테스트를 위한 캔티레버형 푸르브 카드
US7071715B2 (en) * 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates

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Publication number Priority date Publication date Assignee Title
JP2004150927A (ja) * 2002-10-30 2004-05-27 Fujitsu Ltd プロービング装置
JP2006317302A (ja) * 2005-05-13 2006-11-24 Tokyo Electron Ltd プローブカードの調整機構及びプローブ装置
JP2007024533A (ja) * 2005-07-12 2007-02-01 Tokyo Electron Ltd プローブカード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9234917B2 (en) 2011-09-16 2016-01-12 Mpi Corporation Probing device and manufacturing method thereof
JP2013167461A (ja) * 2012-02-14 2013-08-29 Micronics Japan Co Ltd 電気的接続装置及びその組立方法
CN102998497A (zh) * 2012-12-11 2013-03-27 北京确安科技股份有限公司 一种跳格式探针卡制作方法

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Publication number Publication date
KR100851392B1 (ko) 2008-08-11

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