JP2005509282A - メモリ構造体用電極、方法および装置 - Google Patents

メモリ構造体用電極、方法および装置 Download PDF

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Publication number
JP2005509282A
JP2005509282A JP2003543032A JP2003543032A JP2005509282A JP 2005509282 A JP2005509282 A JP 2005509282A JP 2003543032 A JP2003543032 A JP 2003543032A JP 2003543032 A JP2003543032 A JP 2003543032A JP 2005509282 A JP2005509282 A JP 2005509282A
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JP
Japan
Prior art keywords
electrode
thin film
electrodes
layer
insulating
Prior art date
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Abandoned
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JP2003543032A
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English (en)
Japanese (ja)
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JP2005509282A5 (enExample
Inventor
グデセン、ハンス、グデ
レイスタッド、ゲイール、アイ．
Original Assignee
シン フイルム エレクトロニクス エイエスエイ
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Application filed by シン フイルム エレクトロニクス エイエスエイ filed Critical シン フイルム エレクトロニクス エイエスエイ
Publication of JP2005509282A publication Critical patent/JP2005509282A/ja
Publication of JP2005509282A5 publication Critical patent/JP2005509282A5/ja
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B51/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors
    • H10B51/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/202—Integrated devices comprising a common active layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
JP2003543032A 2001-11-09 2002-11-08 メモリ構造体用電極、方法および装置 Abandoned JP2005509282A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20015509A NO20015509D0 (no) 2001-11-09 2001-11-09 Elektrodeanordning, fremgangsmåte til dets fremstilling, apparat omfattende elektrodeanordningene, samt bruk av sistnevnte
PCT/NO2002/000414 WO2003041084A1 (en) 2001-11-09 2002-11-08 Electrodes, method and apparatus for memory structure

Publications (2)

Publication Number Publication Date
JP2005509282A true JP2005509282A (ja) 2005-04-07
JP2005509282A5 JP2005509282A5 (enExample) 2006-01-05

Family

ID=19913010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003543032A Abandoned JP2005509282A (ja) 2001-11-09 2002-11-08 メモリ構造体用電極、方法および装置

Country Status (12)

Country Link
EP (1) EP1446805B8 (enExample)
JP (1) JP2005509282A (enExample)
KR (1) KR100577544B1 (enExample)
CN (1) CN1582481A (enExample)
AT (1) ATE295990T1 (enExample)
AU (1) AU2002339770B2 (enExample)
CA (1) CA2466267C (enExample)
DE (1) DE60204239T2 (enExample)
ES (1) ES2242883T3 (enExample)
NO (1) NO20015509D0 (enExample)
RU (1) RU2275697C2 (enExample)
WO (1) WO2003041084A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6833593B2 (en) 2001-11-09 2004-12-21 Thin Film Electronics Asa Electrode means, a method for its manufacture, an apparatus comprising the electrode means as well as use of the latter
US6724028B2 (en) 2001-12-10 2004-04-20 Hans Gude Gudesen Matrix-addressable array of integrated transistor/memory structures
US6649504B2 (en) 2001-12-14 2003-11-18 Thin Film Electronics Asa Method for fabricating high aspect ratio electrodes
NO321280B1 (no) 2004-07-22 2006-04-18 Thin Film Electronics Asa Organisk, elektronisk krets og fremgangsmate til dens fremstilling
US7808024B2 (en) 2004-09-27 2010-10-05 Intel Corporation Ferroelectric polymer memory module
EP2979294A4 (en) * 2013-03-29 2016-11-30 Applied Materials Inc SUBSTRATE WITH PATTERNED EMBODIMENT FOR FORMING INSULATED AREAS OF A DEVICE
US10199386B2 (en) * 2015-07-23 2019-02-05 Toshiba Memory Corporation Semiconductor memory device and method for manufacturing same
KR102408494B1 (ko) * 2019-08-13 2022-06-15 브이메모리 주식회사 전기장을 이용한 전류 경로 제어 방법 및 전자 소자
CN114582632B (zh) * 2022-01-11 2024-05-17 华东师范大学 一种应用于动态目标提取的铁电电容阵列及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952031A (en) * 1987-06-19 1990-08-28 Victor Company Of Japan, Ltd. Liquid crystal display device
US5017515A (en) * 1989-10-02 1991-05-21 Texas Instruments Incorporated Process for minimizing lateral distance between elements in an integrated circuit by using sidewall spacers
JPH07106450A (ja) * 1993-10-08 1995-04-21 Olympus Optical Co Ltd 強誘電体ゲートトランジスタメモリ
NO972803D0 (no) * 1997-06-17 1997-06-17 Opticom As Elektrisk adresserbar logisk innretning, fremgangsmåte til elektrisk adressering av samme og anvendelse av innretning og fremgangsmåte
EP0902465B1 (en) * 1997-08-27 2008-10-15 STMicroelectronics S.r.l. Process for manufacturing electronic virtual-ground memory devices
US6072716A (en) * 1999-04-14 2000-06-06 Massachusetts Institute Of Technology Memory structures and methods of making same
US6473388B1 (en) * 2000-08-31 2002-10-29 Hewlett Packard Company Ultra-high density information storage device based on modulated cathodoconductivity

Also Published As

Publication number Publication date
RU2004116275A (ru) 2005-10-27
KR20040063929A (ko) 2004-07-14
EP1446805A1 (en) 2004-08-18
EP1446805B1 (en) 2005-05-18
ES2242883T3 (es) 2005-11-16
KR100577544B1 (ko) 2006-05-10
DE60204239D1 (de) 2005-06-23
CA2466267A1 (en) 2003-05-15
EP1446805B8 (en) 2006-06-14
RU2275697C2 (ru) 2006-04-27
CN1582481A (zh) 2005-02-16
ATE295990T1 (de) 2005-06-15
DE60204239T2 (de) 2006-01-26
WO2003041084A1 (en) 2003-05-15
NO20015509D0 (no) 2001-11-09
CA2466267C (en) 2006-05-23
AU2002339770B2 (en) 2006-01-05

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