JP2005506691A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005506691A5 JP2005506691A5 JP2003535253A JP2003535253A JP2005506691A5 JP 2005506691 A5 JP2005506691 A5 JP 2005506691A5 JP 2003535253 A JP2003535253 A JP 2003535253A JP 2003535253 A JP2003535253 A JP 2003535253A JP 2005506691 A5 JP2005506691 A5 JP 2005506691A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- clip
- contact
- drain
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- 125000003700 epoxy group Chemical group 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 238000002161 passivation Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- -1 for example Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 230000000873 masking Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32836201P | 2001-10-10 | 2001-10-10 | |
US10/267,142 US6784540B2 (en) | 2001-10-10 | 2002-10-08 | Semiconductor device package with improved cooling |
PCT/US2002/032678 WO2003032388A1 (en) | 2001-10-10 | 2002-10-09 | Semiconductor device package with improved cooling |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005506691A JP2005506691A (ja) | 2005-03-03 |
JP2005506691A5 true JP2005506691A5 (de) | 2008-02-07 |
JP4195380B2 JP4195380B2 (ja) | 2008-12-10 |
Family
ID=26952244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003535253A Expired - Fee Related JP4195380B2 (ja) | 2001-10-10 | 2002-10-09 | 冷却を改善した半導体デバイスのパッケージ |
Country Status (5)
Country | Link |
---|---|
US (2) | US6784540B2 (de) |
JP (1) | JP4195380B2 (de) |
CN (1) | CN1311548C (de) |
TW (1) | TW574749B (de) |
WO (1) | WO2003032388A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1575520A (zh) * | 2000-11-14 | 2005-02-02 | 霍尼韦尔国际公司 | 微电子罩结构、散热器结构及半导体封装件 |
US6930397B2 (en) * | 2001-03-28 | 2005-08-16 | International Rectifier Corporation | Surface mounted package with die bottom spaced from support board |
US7416922B2 (en) * | 2003-03-31 | 2008-08-26 | Intel Corporation | Heat sink with preattached thermal interface material and method of making same |
US7014093B2 (en) * | 2003-06-26 | 2006-03-21 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
US7527090B2 (en) * | 2003-06-30 | 2009-05-05 | Intel Corporation | Heat dissipating device with preselected designed interface for thermal interface materials |
US7098082B2 (en) * | 2004-04-13 | 2006-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Microelectronics package assembly tool and method of manufacture therewith |
US7678680B2 (en) * | 2004-06-03 | 2010-03-16 | International Rectifier Corporation | Semiconductor device with reduced contact resistance |
CN100437991C (zh) * | 2004-12-08 | 2008-11-26 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及其制备方法 |
US20070013053A1 (en) * | 2005-07-12 | 2007-01-18 | Peter Chou | Semiconductor device and method for manufacturing a semiconductor device |
US7504733B2 (en) | 2005-08-17 | 2009-03-17 | Ciclon Semiconductor Device Corp. | Semiconductor die package |
US7560808B2 (en) * | 2005-10-19 | 2009-07-14 | Texas Instruments Incorporated | Chip scale power LDMOS device |
US7446375B2 (en) * | 2006-03-14 | 2008-11-04 | Ciclon Semiconductor Device Corp. | Quasi-vertical LDMOS device having closed cell layout |
US20070215997A1 (en) * | 2006-03-17 | 2007-09-20 | Martin Standing | Chip-scale package |
US7812437B2 (en) * | 2006-05-19 | 2010-10-12 | Fairchild Semiconductor Corporation | Flip chip MLP with folded heat sink |
US7719096B2 (en) * | 2006-08-11 | 2010-05-18 | Vishay General Semiconductor Llc | Semiconductor device and method for manufacturing a semiconductor device |
US20080036078A1 (en) | 2006-08-14 | 2008-02-14 | Ciclon Semiconductor Device Corp. | Wirebond-less semiconductor package |
DE102007002157A1 (de) * | 2007-01-15 | 2008-07-17 | Infineon Technologies Ag | Halbleiteranordnung und zugehörige Herstellungsverfahren |
US7447041B2 (en) * | 2007-03-01 | 2008-11-04 | Delphi Technologies, Inc. | Compression connection for vertical IC packages |
US7838985B2 (en) * | 2007-07-12 | 2010-11-23 | Vishay General Semiconductor Llc | Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers |
US8421214B2 (en) * | 2007-10-10 | 2013-04-16 | Vishay General Semiconductor Llc | Semiconductor device and method for manufacturing a semiconductor device |
US7955893B2 (en) | 2008-01-31 | 2011-06-07 | Alpha & Omega Semiconductor, Ltd | Wafer level chip scale package and process of manufacture |
US8373257B2 (en) * | 2008-09-25 | 2013-02-12 | Alpha & Omega Semiconductor Incorporated | Top exposed clip with window array |
DE102008049188A1 (de) * | 2008-09-26 | 2010-04-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul mit einem Trägersubstrat und einer Mehrzahl von strahlungsemittierenden Halbleiterbauelementen und Verfahren zu dessen Herstellung |
US7898067B2 (en) * | 2008-10-31 | 2011-03-01 | Fairchild Semiconductor Corporaton | Pre-molded, clip-bonded multi-die semiconductor package |
US8049312B2 (en) * | 2009-01-12 | 2011-11-01 | Texas Instruments Incorporated | Semiconductor device package and method of assembly thereof |
JP5343574B2 (ja) * | 2009-01-20 | 2013-11-13 | トヨタ自動車株式会社 | ヒートシンクのろう付け方法 |
US8222078B2 (en) | 2009-07-22 | 2012-07-17 | Alpha And Omega Semiconductor Incorporated | Chip scale surface mounted semiconductor device package and process of manufacture |
US8213180B2 (en) * | 2010-01-21 | 2012-07-03 | Broadcom Corporation | Electromagnetic interference shield with integrated heat sink |
US8362606B2 (en) * | 2010-07-29 | 2013-01-29 | Alpha & Omega Semiconductor, Inc. | Wafer level chip scale package |
JP5511621B2 (ja) * | 2010-10-13 | 2014-06-04 | 三菱電機株式会社 | 半導体装置 |
US20120175688A1 (en) * | 2011-01-10 | 2012-07-12 | International Rectifier Corporation | Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor Packaging |
US8536697B2 (en) * | 2011-11-30 | 2013-09-17 | Freescale Semiconductor, Inc. | Packaged die for heat dissipation and method therefor |
US20160265853A1 (en) * | 2013-12-06 | 2016-09-15 | Marchesi Metal Technology (Suzhou) Co., Ltd | A heat dissipating enclosure with integrated cooling fins |
US9536800B2 (en) | 2013-12-07 | 2017-01-03 | Fairchild Semiconductor Corporation | Packaged semiconductor devices and methods of manufacturing |
CN107346348A (zh) * | 2016-05-06 | 2017-11-14 | 上海海拉电子有限公司 | 一种电子助力转向系统的散热效率计算方法 |
DE102018201326B4 (de) * | 2018-01-29 | 2022-06-15 | Vitesco Technologies Germany Gmbh | Kontaktanordnung, elektronisches Leistungsmodul und Verfahren zur Herstellung eines elektronischen Leistungsmoduls |
Family Cites Families (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3403438A (en) | 1964-12-02 | 1968-10-01 | Corning Glass Works | Process for joining transistor chip to printed circuit |
US3871014A (en) | 1969-08-14 | 1975-03-11 | Ibm | Flip chip module with non-uniform solder wettable areas on the substrate |
US3972062A (en) | 1973-10-04 | 1976-07-27 | Motorola, Inc. | Mounting assemblies for a plurality of transistor integrated circuit chips |
GB1487945A (en) | 1974-11-20 | 1977-10-05 | Ibm | Semiconductor integrated circuit devices |
US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
JPS6020943Y2 (ja) | 1979-08-29 | 1985-06-22 | 三菱電機株式会社 | 半導体装置 |
US4415025A (en) * | 1981-08-10 | 1983-11-15 | International Business Machines Corporation | Thermal conduction element for semiconductor devices |
US4454454A (en) | 1983-05-13 | 1984-06-12 | Motorola, Inc. | MOSFET "H" Switch circuit for a DC motor |
US4646129A (en) | 1983-09-06 | 1987-02-24 | General Electric Company | Hermetic power chip packages |
US4604644A (en) | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
JPH0744243B2 (ja) * | 1985-09-27 | 1995-05-15 | 株式会社日立製作所 | 半導体集積回路モジユ−ル |
US4639760A (en) | 1986-01-21 | 1987-01-27 | Motorola, Inc. | High power RF transistor assembly |
JPS6413142A (en) | 1987-07-06 | 1989-01-18 | Fuji Photo Film Co Ltd | Photopolymerizable composition |
US5184211A (en) * | 1988-03-01 | 1993-02-02 | Digital Equipment Corporation | Apparatus for packaging and cooling integrated circuit chips |
US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
US5075759A (en) | 1989-07-21 | 1991-12-24 | Motorola, Inc. | Surface mounting semiconductor device and method |
US5182632A (en) | 1989-11-22 | 1993-01-26 | Tactical Fabs, Inc. | High density multichip package with interconnect structure and heatsink |
US5057909A (en) * | 1990-01-29 | 1991-10-15 | International Business Machines Corporation | Electronic device and heat sink assembly |
JP2984068B2 (ja) | 1991-01-31 | 1999-11-29 | 株式会社日立製作所 | 半導体装置の製造方法 |
JPH0541471A (ja) * | 1991-08-07 | 1993-02-19 | Hitachi Ltd | 半導体集積回路装置 |
JPH05129516A (ja) | 1991-11-01 | 1993-05-25 | Hitachi Ltd | 半導体装置 |
CA2089435C (en) | 1992-02-14 | 1997-12-09 | Kenzi Kobayashi | Semiconductor device |
JP2833326B2 (ja) | 1992-03-03 | 1998-12-09 | 松下電器産業株式会社 | 電子部品実装接続体およびその製造方法 |
JPH065401A (ja) | 1992-06-23 | 1994-01-14 | Mitsubishi Electric Corp | チップ型抵抗素子及び半導体装置 |
JPH0637143A (ja) | 1992-07-15 | 1994-02-10 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
US5394490A (en) | 1992-08-11 | 1995-02-28 | Hitachi, Ltd. | Semiconductor device having an optical waveguide interposed in the space between electrode members |
US5313366A (en) | 1992-08-12 | 1994-05-17 | International Business Machines Corporation | Direct chip attach module (DCAM) |
JPH06244231A (ja) | 1993-02-01 | 1994-09-02 | Motorola Inc | 気密半導体デバイスおよびその製造方法 |
US5371404A (en) | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
JP2795788B2 (ja) | 1993-02-18 | 1998-09-10 | シャープ株式会社 | 半導体チップの実装方法 |
US5703405A (en) | 1993-03-15 | 1997-12-30 | Motorola, Inc. | Integrated circuit chip formed from processing two opposing surfaces of a wafer |
JPH06275677A (ja) * | 1993-03-23 | 1994-09-30 | Shinko Electric Ind Co Ltd | 半導体装置用パッケージおよび半導体装置 |
US5510758A (en) | 1993-04-07 | 1996-04-23 | Matsushita Electric Industrial Co., Ltd. | Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps |
JP3258764B2 (ja) | 1993-06-01 | 2002-02-18 | 三菱電機株式会社 | 樹脂封止型半導体装置の製造方法ならびに外部引出用電極およびその製造方法 |
US5397921A (en) | 1993-09-03 | 1995-03-14 | Advanced Semiconductor Assembly Technology | Tab grid array |
US5455456A (en) | 1993-09-15 | 1995-10-03 | Lsi Logic Corporation | Integrated circuit package lid |
US5368094A (en) * | 1993-11-02 | 1994-11-29 | Hung; Chin-Ping | Bipartite heat sink positioning device for computer chips |
US5734201A (en) | 1993-11-09 | 1998-03-31 | Motorola, Inc. | Low profile semiconductor device with like-sized chip and mounting substrate |
US5367435A (en) | 1993-11-16 | 1994-11-22 | International Business Machines Corporation | Electronic package structure and method of making same |
US5454160A (en) | 1993-12-03 | 1995-10-03 | Ncr Corporation | Apparatus and method for stacking integrated circuit devices |
JPH07193184A (ja) | 1993-12-27 | 1995-07-28 | Fujitsu Ltd | マルチチップモジュールの製造方法及びマルチチップモジュール |
JP3073644B2 (ja) | 1993-12-28 | 2000-08-07 | 株式会社東芝 | 半導体装置 |
US5578869A (en) | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
JP3377867B2 (ja) | 1994-08-12 | 2003-02-17 | 京セラ株式会社 | 半導体素子収納用パッケージ |
JP2546192B2 (ja) | 1994-09-30 | 1996-10-23 | 日本電気株式会社 | フィルムキャリア半導体装置 |
US5532512A (en) | 1994-10-03 | 1996-07-02 | General Electric Company | Direct stacked and flip chip power semiconductor device structures |
JP3138159B2 (ja) | 1994-11-22 | 2001-02-26 | シャープ株式会社 | 半導体装置、半導体装置実装体、及び半導体装置の交換方法 |
JPH08335653A (ja) | 1995-04-07 | 1996-12-17 | Nitto Denko Corp | 半導体装置およびその製法並びに上記半導体装置の製造に用いる半導体装置用テープキャリア |
JP3004578B2 (ja) * | 1995-05-12 | 2000-01-31 | 財団法人工業技術研究院 | 熱放散増強のための多熱導伝路とパッケージ統合性及び信頼性向上のための縁の周りを囲むキャップからなる集積回路パッケージ |
US5655703A (en) | 1995-05-25 | 1997-08-12 | International Business Machines Corporation | Solder hierarchy for chip attachment to substrates |
US5674785A (en) | 1995-11-27 | 1997-10-07 | Micron Technology, Inc. | Method of producing a single piece package for semiconductor die |
US5578841A (en) * | 1995-12-18 | 1996-11-26 | Motorola, Inc. | Vertical MOSFET device having frontside and backside contacts |
US5977629A (en) * | 1996-01-24 | 1999-11-02 | Micron Technology, Inc. | Condensed memory matrix |
US5726502A (en) | 1996-04-26 | 1998-03-10 | Motorola, Inc. | Bumped semiconductor device with alignment features and method for making the same |
US6051888A (en) | 1997-04-07 | 2000-04-18 | Texas Instruments Incorporated | Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package |
JPH1154673A (ja) | 1997-07-31 | 1999-02-26 | Nec Kansai Ltd | 半導体装置 |
GB9725960D0 (en) | 1997-12-08 | 1998-02-04 | Westinghouse Brake & Signal | Encapsulating semiconductor chips |
JP3097644B2 (ja) | 1998-01-06 | 2000-10-10 | 日本電気株式会社 | 半導体装置接続構造及び接続方法 |
US6423623B1 (en) | 1998-06-09 | 2002-07-23 | Fairchild Semiconductor Corporation | Low Resistance package for semiconductor devices |
EP0966038A3 (de) | 1998-06-15 | 2001-02-28 | Ford Motor Company | Bonden von Leistungshalbleiteranordnungen |
EP0978871A3 (de) | 1998-08-05 | 2001-12-19 | Harris Corporation | Ein Packungsentwurf für eine Anordnung niedriger Leistung |
US6133634A (en) * | 1998-08-05 | 2000-10-17 | Fairchild Semiconductor Corporation | High performance flip chip package |
JP4408475B2 (ja) | 1999-02-23 | 2010-02-03 | 三洋電機株式会社 | ボンディングワイヤを採用しない半導体装置 |
US6093961A (en) * | 1999-02-24 | 2000-07-25 | Chip Coolers, Inc. | Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment |
US6262489B1 (en) | 1999-11-08 | 2001-07-17 | Delphi Technologies, Inc. | Flip chip with backside electrical contact and assembly and method therefor |
US6744124B1 (en) | 1999-12-10 | 2004-06-01 | Siliconix Incorporated | Semiconductor die package including cup-shaped leadframe |
US6219243B1 (en) | 1999-12-14 | 2001-04-17 | Intel Corporation | Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
US6212074B1 (en) | 2000-01-31 | 2001-04-03 | Sun Microsystems, Inc. | Apparatus for dissipating heat from a circuit board having a multilevel surface |
US6624522B2 (en) | 2000-04-04 | 2003-09-23 | International Rectifier Corporation | Chip scale surface mounted device and process of manufacture |
US6550531B1 (en) * | 2000-05-16 | 2003-04-22 | Intel Corporation | Vapor chamber active heat sink |
JP3467454B2 (ja) | 2000-06-05 | 2003-11-17 | Necエレクトロニクス株式会社 | 半導体装置の製造方法 |
US6391687B1 (en) | 2000-10-31 | 2002-05-21 | Fairchild Semiconductor Corporation | Column ball grid array package |
US6566164B1 (en) * | 2000-12-07 | 2003-05-20 | Amkor Technology, Inc. | Exposed copper strap in a semiconductor package |
-
2002
- 2002-10-08 US US10/267,142 patent/US6784540B2/en not_active Ceased
- 2002-10-09 TW TW91123353A patent/TW574749B/zh not_active IP Right Cessation
- 2002-10-09 JP JP2003535253A patent/JP4195380B2/ja not_active Expired - Fee Related
- 2002-10-09 WO PCT/US2002/032678 patent/WO2003032388A1/en active Application Filing
- 2002-10-09 CN CNB028201590A patent/CN1311548C/zh not_active Expired - Fee Related
-
2006
- 2006-08-31 US US11/514,327 patent/USRE41559E1/en not_active Expired - Lifetime
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4195380B2 (ja) | 冷却を改善した半導体デバイスのパッケージ | |
JP2005506691A5 (de) | ||
JP4343158B2 (ja) | 半導体デバイスのパッケージ製造方法 | |
JP5492367B2 (ja) | 窒化ガリウム半導体デバイス用のパッケージ | |
US5710695A (en) | Leadframe ball grid array package | |
JP4850184B2 (ja) | 標準占有面積を含む半導体ダイパッケージ及びその製造方法 | |
US8513059B2 (en) | Pre-molded clip structure | |
US7390698B2 (en) | Packaged semiconductor device and method of manufacture using shaped die | |
KR101561684B1 (ko) | 반도체 다이 패키지 및 그의 제조 방법 | |
EP2605276B1 (de) | Verpackte anschlussleitungslose Halbleitervorrichtung | |
US6566164B1 (en) | Exposed copper strap in a semiconductor package | |
JP6509885B2 (ja) | 半導体チップの端子を有するdc−dcコンバータ | |
KR20090052688A (ko) | 전력 소자 패키지 및 그 제조 방법 | |
US20090127677A1 (en) | Multi-Terminal Package Assembly For Semiconductor Devices | |
JPH04293259A (ja) | 半導体装置およびその製造方法 | |
US7579675B2 (en) | Semiconductor device having surface mountable external contact areas and method for producing the same |