JP2005354041A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005354041A5 JP2005354041A5 JP2005130914A JP2005130914A JP2005354041A5 JP 2005354041 A5 JP2005354041 A5 JP 2005354041A5 JP 2005130914 A JP2005130914 A JP 2005130914A JP 2005130914 A JP2005130914 A JP 2005130914A JP 2005354041 A5 JP2005354041 A5 JP 2005354041A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- insulating film
- processing method
- substrate processing
- releasing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 24
- 238000003672 processing method Methods 0.000 claims 13
- 125000001153 fluoro group Chemical group F* 0.000 claims 8
- 230000001681 protective effect Effects 0.000 claims 8
- 229910052731 fluorine Inorganic materials 0.000 claims 6
- 239000007789 gas Substances 0.000 claims 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 229910003481 amorphous carbon Inorganic materials 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 229910052786 argon Inorganic materials 0.000 claims 1
- 125000004429 atom Chemical group 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
- 229910052743 krypton Inorganic materials 0.000 claims 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005121 nitriding Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910052724 xenon Inorganic materials 0.000 claims 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005130914A JP4555143B2 (ja) | 2004-05-11 | 2005-04-28 | 基板の処理方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004141022 | 2004-05-11 | ||
JP2005130914A JP4555143B2 (ja) | 2004-05-11 | 2005-04-28 | 基板の処理方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005354041A JP2005354041A (ja) | 2005-12-22 |
JP2005354041A5 true JP2005354041A5 (enrdf_load_stackoverflow) | 2008-04-10 |
JP4555143B2 JP4555143B2 (ja) | 2010-09-29 |
Family
ID=35320470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005130914A Expired - Fee Related JP4555143B2 (ja) | 2004-05-11 | 2005-04-28 | 基板の処理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4555143B2 (enrdf_load_stackoverflow) |
KR (1) | KR100887439B1 (enrdf_load_stackoverflow) |
CN (1) | CN100485884C (enrdf_load_stackoverflow) |
WO (1) | WO2005109483A1 (enrdf_load_stackoverflow) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101185757B1 (ko) * | 2005-06-20 | 2012-09-25 | 고에키자이단호진 고쿠사이카가쿠 신고우자이단 | 층간 절연막 및 배선 구조와 그것들의 제조 방법 |
JP5119606B2 (ja) * | 2006-03-31 | 2013-01-16 | 東京エレクトロン株式会社 | 半導体装置及び半導体装置の製造方法 |
JP5194393B2 (ja) * | 2006-06-23 | 2013-05-08 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
JP2008270706A (ja) * | 2007-03-26 | 2008-11-06 | Tokyo Electron Ltd | 窒化珪素膜および不揮発性半導体メモリ装置 |
JPWO2008117798A1 (ja) * | 2007-03-26 | 2010-07-15 | 東京エレクトロン株式会社 | 窒化珪素膜の形成方法、不揮発性半導体メモリ装置の製造方法、不揮発性半導体メモリ装置およびプラズマ処理装置 |
US8021975B2 (en) * | 2007-07-24 | 2011-09-20 | Tokyo Electron Limited | Plasma processing method for forming a film and an electronic component manufactured by the method |
US8197913B2 (en) * | 2007-07-25 | 2012-06-12 | Tokyo Electron Limited | Film forming method for a semiconductor |
JP2009088267A (ja) * | 2007-09-28 | 2009-04-23 | Tokyo Electron Ltd | 成膜方法、成膜装置、記憶媒体及び半導体装置 |
TW201044462A (en) | 2009-01-22 | 2010-12-16 | Tokyo Electron Ltd | A method for manufacturing semiconductor devices |
JP5600885B2 (ja) * | 2009-03-19 | 2014-10-08 | 凸版印刷株式会社 | 有機el用乾燥装置 |
JP5304759B2 (ja) * | 2010-09-15 | 2013-10-02 | 東京エレクトロン株式会社 | 成膜方法及び半導体装置 |
JP5700513B2 (ja) * | 2010-10-08 | 2015-04-15 | 国立大学法人東北大学 | 半導体装置の製造方法および半導体装置 |
JP2012164922A (ja) * | 2011-02-09 | 2012-08-30 | Yuutekku:Kk | 圧電体の製造方法、圧電体及び電子装置 |
JP5364765B2 (ja) * | 2011-09-07 | 2013-12-11 | 東京エレクトロン株式会社 | 半導体装置及び半導体装置の製造方法 |
JP6559087B2 (ja) * | 2016-03-31 | 2019-08-14 | 東京エレクトロン株式会社 | 基板処理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3409984B2 (ja) * | 1996-11-14 | 2003-05-26 | 東京エレクトロン株式会社 | 半導体装置及び半導体装置の製造方法 |
JP3469761B2 (ja) * | 1997-10-30 | 2003-11-25 | 東京エレクトロン株式会社 | 半導体デバイスの製造方法 |
JP3429171B2 (ja) * | 1997-11-20 | 2003-07-22 | 東京エレクトロン株式会社 | プラズマ処理方法及び半導体デバイスの製造方法 |
JP4355039B2 (ja) * | 1998-05-07 | 2009-10-28 | 東京エレクトロン株式会社 | 半導体装置及び半導体装置の製造方法 |
JP3921917B2 (ja) * | 2000-03-31 | 2007-05-30 | セイコーエプソン株式会社 | 微細構造体の製造方法 |
WO2002058130A1 (en) * | 2001-01-22 | 2002-07-25 | Tokyo Electron Limited | Method for producing material of electronic device |
JP4413556B2 (ja) * | 2003-08-15 | 2010-02-10 | 東京エレクトロン株式会社 | 成膜方法、半導体装置の製造方法 |
JP4194521B2 (ja) * | 2004-04-07 | 2008-12-10 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
-
2005
- 2005-04-28 JP JP2005130914A patent/JP4555143B2/ja not_active Expired - Fee Related
- 2005-05-10 KR KR1020067023454A patent/KR100887439B1/ko not_active Expired - Fee Related
- 2005-05-10 CN CNB2005800110299A patent/CN100485884C/zh not_active Expired - Fee Related
- 2005-05-10 WO PCT/JP2005/008506 patent/WO2005109483A1/ja active Application Filing
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2005354041A5 (enrdf_load_stackoverflow) | ||
Lee et al. | The effect of VUV radiation from Ar/O2 plasmas on low-k SiOCH films | |
Baklanov et al. | Characterization of Cu surface cleaning by hydrogen plasma | |
TW476131B (en) | Methods of pre-cleaning dielectric layers of substrates | |
Hua et al. | Damage of ultralow k materials during photoresist mask stripping process | |
JP2008538257A5 (enrdf_load_stackoverflow) | ||
JP5261629B2 (ja) | ストップ−オン−アルミニウム処理を含むウェーハ処理のためのシステム及び方法 | |
TW200952119A (en) | Semiconductor device and method of manufacturing same | |
JPH0982696A (ja) | 半導体装置の製造方法および半導体製造装置 | |
Chung et al. | Ion and vacuum ultraviolet photon beam effects in 193 nm photoresist surface roughening: the role of the adamantyl pendant group | |
US9660185B2 (en) | Pattern fortification for HDD bit patterned media pattern transfer | |
KR20180133224A (ko) | 붕소막의 제거 방법 및 붕소막에 의한 패턴 형성 방법 | |
Kim et al. | Anisotropic atomic layer etching of W using fluorine radicals/oxygen ion beam | |
US20140073139A1 (en) | Etching gas and etching method | |
JP2012212706A (ja) | 半導体装置及びその製法において用いられるアモルファスカーボン膜の製造法 | |
JP2006332619A5 (enrdf_load_stackoverflow) | ||
JP2003173968A5 (enrdf_load_stackoverflow) | ||
Choi et al. | Comparison of the removal efficiency for organic contaminants on silicon wafers stored in plastic boxes between UV/O3 and ECR oxygen plasma cleaning methods | |
JP4359847B2 (ja) | 低k誘電体フィルムのための乾燥処理 | |
JP2005203569A5 (enrdf_load_stackoverflow) | ||
JP2006086500A (ja) | 半導体装置の製造方法 | |
JP2006024641A5 (enrdf_load_stackoverflow) | ||
KR100945928B1 (ko) | 스페이서를 이용한 반도체 소자의 패턴 형성방법 | |
Mori et al. | Pattern collapse in the top surface imaging process after dry development | |
Kaspar et al. | Role of O (1 D) in the oxidation of Si (100) |