JP2005353839A - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

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Publication number
JP2005353839A
JP2005353839A JP2004172895A JP2004172895A JP2005353839A JP 2005353839 A JP2005353839 A JP 2005353839A JP 2004172895 A JP2004172895 A JP 2004172895A JP 2004172895 A JP2004172895 A JP 2004172895A JP 2005353839 A JP2005353839 A JP 2005353839A
Authority
JP
Japan
Prior art keywords
motor
moving table
bonding apparatus
axis
mover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004172895A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005353839A5 (enExample
Inventor
Osamu Sumiya
修 角谷
Toru Maeda
前田　　徹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004172895A priority Critical patent/JP2005353839A/ja
Priority to TW094112334A priority patent/TW200603298A/zh
Priority to KR1020050039663A priority patent/KR100648492B1/ko
Priority to US11/150,415 priority patent/US20050274771A1/en
Publication of JP2005353839A publication Critical patent/JP2005353839A/ja
Publication of JP2005353839A5 publication Critical patent/JP2005353839A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0247—Driving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Machine Tool Units (AREA)
JP2004172895A 2004-06-10 2004-06-10 ボンディング装置 Pending JP2005353839A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004172895A JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置
TW094112334A TW200603298A (en) 2004-06-10 2005-04-19 Bonding equipment
KR1020050039663A KR100648492B1 (ko) 2004-06-10 2005-05-12 본딩 장치
US11/150,415 US20050274771A1 (en) 2004-06-10 2005-06-10 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004172895A JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置

Publications (2)

Publication Number Publication Date
JP2005353839A true JP2005353839A (ja) 2005-12-22
JP2005353839A5 JP2005353839A5 (enExample) 2006-09-21

Family

ID=35459461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004172895A Pending JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置

Country Status (4)

Country Link
US (1) US20050274771A1 (enExample)
JP (1) JP2005353839A (enExample)
KR (1) KR100648492B1 (enExample)
TW (1) TW200603298A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013026268A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ
CN103624192B (zh) * 2013-11-07 2015-09-02 深圳市综科邦达机电设备有限公司 焊线机
CN103612036B (zh) * 2013-11-13 2015-06-17 深圳市综科邦达机电设备有限公司 焊线机
JP7236782B2 (ja) * 2021-02-22 2023-03-10 株式会社新川 ワイヤボンディング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH636740A5 (fr) * 1980-05-19 1983-06-15 Far Fab Assortiments Reunies Dispositif pour l'alignement d'une piece et d'un substrat.
JPH1110467A (ja) * 1997-06-18 1999-01-19 Yaskawa Electric Corp Ｘｙテーブル
JP3454234B2 (ja) * 1999-09-27 2003-10-06 日産自動車株式会社 分割コアモータ
JP4018057B2 (ja) * 2003-03-31 2007-12-05 株式会社新川 ボンディング装置

Also Published As

Publication number Publication date
KR20060047805A (ko) 2006-05-18
KR100648492B1 (ko) 2006-11-27
US20050274771A1 (en) 2005-12-15
TW200603298A (en) 2006-01-16

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