KR100648492B1 - 본딩 장치 - Google Patents

본딩 장치 Download PDF

Info

Publication number
KR100648492B1
KR100648492B1 KR1020050039663A KR20050039663A KR100648492B1 KR 100648492 B1 KR100648492 B1 KR 100648492B1 KR 1020050039663 A KR1020050039663 A KR 1020050039663A KR 20050039663 A KR20050039663 A KR 20050039663A KR 100648492 B1 KR100648492 B1 KR 100648492B1
Authority
KR
South Korea
Prior art keywords
motor
axis
bonding head
mover
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050039663A
Other languages
English (en)
Korean (ko)
Other versions
KR20060047805A (ko
Inventor
오사무 가쿠타니
도오루 마에다
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20060047805A publication Critical patent/KR20060047805A/ko
Application granted granted Critical
Publication of KR100648492B1 publication Critical patent/KR100648492B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0247—Driving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Machine Tool Units (AREA)
KR1020050039663A 2004-06-10 2005-05-12 본딩 장치 Expired - Fee Related KR100648492B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00172895 2004-06-10
JP2004172895A JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置

Publications (2)

Publication Number Publication Date
KR20060047805A KR20060047805A (ko) 2006-05-18
KR100648492B1 true KR100648492B1 (ko) 2006-11-27

Family

ID=35459461

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050039663A Expired - Fee Related KR100648492B1 (ko) 2004-06-10 2005-05-12 본딩 장치

Country Status (4)

Country Link
US (1) US20050274771A1 (enExample)
JP (1) JP2005353839A (enExample)
KR (1) KR100648492B1 (enExample)
TW (1) TW200603298A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013026268A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ
CN103624192B (zh) * 2013-11-07 2015-09-02 深圳市综科邦达机电设备有限公司 焊线机
CN103612036B (zh) * 2013-11-13 2015-06-17 深圳市综科邦达机电设备有限公司 焊线机
JP7236782B2 (ja) * 2021-02-22 2023-03-10 株式会社新川 ワイヤボンディング装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH636740A5 (fr) * 1980-05-19 1983-06-15 Far Fab Assortiments Reunies Dispositif pour l'alignement d'une piece et d'un substrat.
JPH1110467A (ja) * 1997-06-18 1999-01-19 Yaskawa Electric Corp Ｘｙテーブル
JP3454234B2 (ja) * 1999-09-27 2003-10-06 日産自動車株式会社 分割コアモータ
JP4018057B2 (ja) * 2003-03-31 2007-12-05 株式会社新川 ボンディング装置

Also Published As

Publication number Publication date
JP2005353839A (ja) 2005-12-22
KR20060047805A (ko) 2006-05-18
US20050274771A1 (en) 2005-12-15
TW200603298A (en) 2006-01-16

Similar Documents

Publication Publication Date Title
US4808892A (en) Bi-directional drive motor system
JPH1074685A (ja) 送り装置
JP2002328191A (ja) リニアモータを内蔵したステージ装置
KR20090110238A (ko) 스크라이브 장치 및 다축 스크라이브 장치
KR100648492B1 (ko) 본딩 장치
KR100545341B1 (ko) 본딩 장치
JP2005040917A (ja) 放電加工装置
US20020180386A1 (en) XY table for a semiconductor manufacturing apparatus
WO2001089774A2 (en) Manipulator/end effector for robotic assembly
JP5431295B2 (ja) Ｘｙステージ
EP0287786A3 (en) Orthogonal axis device with linear motors for positioning and processing workpieces, in particular for bonding wires onto electronic components
JP2003028973A (ja) ステージ装置
US20050194841A1 (en) Decoupling of actuators for positioning an object
KR19980703025A (ko) 단일 평면에서 직교 이동을 생성하는 모터 시스템
JPH11142556A5 (ja) ステージの制御方法、ステージ装置、露光装置及び露光方法
WO2011087453A1 (en) Direct drive xyz positioning system with reduced moving parts
JP2966655B2 (ja) 穴位置測定装置
JP2005129673A (ja) ボンディング装置
JPH10125593A (ja) ステージ装置
JPH1199422A (ja) 工作機械
JP2005169523A (ja) テーブル位置決め装置
CN112992704A (zh) 具有芯片固持器运动台的芯片键合头设备
JP2513374B2 (ja) 直交二方向移動テ―ブル装置
JP2793921B2 (ja) 穴加工方法およびその装置
KR100321704B1 (ko) 와이어본더장비의엑스와이(xy)축테이블구동장치및그의위치제어방법

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20091116

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20091116

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301