TW200603298A - Bonding equipment - Google Patents

Bonding equipment

Info

Publication number
TW200603298A
TW200603298A TW094112334A TW94112334A TW200603298A TW 200603298 A TW200603298 A TW 200603298A TW 094112334 A TW094112334 A TW 094112334A TW 94112334 A TW94112334 A TW 94112334A TW 200603298 A TW200603298 A TW 200603298A
Authority
TW
Taiwan
Prior art keywords
motor
bonding equipment
supporting mechanism
axially supporting
trolley table
Prior art date
Application number
TW094112334A
Other languages
English (en)
Chinese (zh)
Inventor
Osamu Kakutani
Toru Maeda
Original Assignee
Shinkawa K K
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa K K filed Critical Shinkawa K K
Publication of TW200603298A publication Critical patent/TW200603298A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0247—Driving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Machine Tool Units (AREA)
TW094112334A 2004-06-10 2005-04-19 Bonding equipment TW200603298A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004172895A JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置

Publications (1)

Publication Number Publication Date
TW200603298A true TW200603298A (en) 2006-01-16

Family

ID=35459461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112334A TW200603298A (en) 2004-06-10 2005-04-19 Bonding equipment

Country Status (4)

Country Link
US (1) US20050274771A1 (enExample)
JP (1) JP2005353839A (enExample)
KR (1) KR100648492B1 (enExample)
TW (1) TW200603298A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472404B (zh) * 2011-07-15 2015-02-11 日立先端科技儀器股份有限公司 2-axis drive mechanism and wafer bonding machine
CN115244668A (zh) * 2021-02-22 2022-10-25 株式会社新川 打线接合装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624192B (zh) * 2013-11-07 2015-09-02 深圳市综科邦达机电设备有限公司 焊线机
CN103612036B (zh) * 2013-11-13 2015-06-17 深圳市综科邦达机电设备有限公司 焊线机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH636740A5 (fr) * 1980-05-19 1983-06-15 Far Fab Assortiments Reunies Dispositif pour l'alignement d'une piece et d'un substrat.
JPH1110467A (ja) * 1997-06-18 1999-01-19 Yaskawa Electric Corp Ｘｙテーブル
JP3454234B2 (ja) * 1999-09-27 2003-10-06 日産自動車株式会社 分割コアモータ
JP4018057B2 (ja) * 2003-03-31 2007-12-05 株式会社新川 ボンディング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472404B (zh) * 2011-07-15 2015-02-11 日立先端科技儀器股份有限公司 2-axis drive mechanism and wafer bonding machine
CN115244668A (zh) * 2021-02-22 2022-10-25 株式会社新川 打线接合装置

Also Published As

Publication number Publication date
JP2005353839A (ja) 2005-12-22
KR20060047805A (ko) 2006-05-18
KR100648492B1 (ko) 2006-11-27
US20050274771A1 (en) 2005-12-15

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