JP2005352075A - 光半導体素子モジュール - Google Patents
光半導体素子モジュール Download PDFInfo
- Publication number
- JP2005352075A JP2005352075A JP2004171587A JP2004171587A JP2005352075A JP 2005352075 A JP2005352075 A JP 2005352075A JP 2004171587 A JP2004171587 A JP 2004171587A JP 2004171587 A JP2004171587 A JP 2004171587A JP 2005352075 A JP2005352075 A JP 2005352075A
- Authority
- JP
- Japan
- Prior art keywords
- spherical lens
- semiconductor element
- optical semiconductor
- coupling efficiency
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 101
- 230000003287 optical effect Effects 0.000 title claims abstract description 52
- 239000013307 optical fiber Substances 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims abstract description 8
- 230000002457 bidirectional effect Effects 0.000 claims description 4
- 230000014509 gene expression Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 abstract description 54
- 238000010168 coupling process Methods 0.000 abstract description 54
- 238000005859 coupling reaction Methods 0.000 abstract description 54
- 230000004075 alteration Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000005308 flint glass Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】 光ファイバー10に光結合する半導体レーザダイオード1は、ステム6上に搭載されている。また、ステム6に固定されたキャップ8は、光ファイバー10と、半導体レーザダイオード1との間に光透過穴部を有していて、この光透過穴部には球レンズ7が取り付けられている。球レンズ7の屈折率は1.9以上であり、その直径は1.5mm以上2.5mm以下である。
【選択図】 図1
Description
2 第1のマウント
3 ヒートシンク
4,304 半導体フォトダイオード
5 第2のマウント
6,106,206 ステム
7,107,207,307,3018 球レンズ
8,108 キャップ
9 第1の筐体
10,3010 光ファイバー
11 フェルール
12 ネジ
13 第2の筐体
14 光線軌跡
16 低融点ガラス
3017 波長回折フィルタ
Claims (4)
- 光ファイバーに光結合する光半導体素子と、
前記光半導体素子を搭載するステムと、
前記光ファイバーと前記光半導体素子との間に光透過穴部を有し、前記ステムに固定されるキャップと、
前記光透過穴部に取り付けられる球レンズとを備えた光半導体素子モジュールであって、
前記球レンズは、屈折率が1.9以上であり、直径が1.5mm以上2.5mm以下であることを特徴とする光半導体素子モジュール。 - 前記光半導体素子は半導体レーザダイオードである請求項1または2に記載の光半導体素子モジュール。
- 前記光半導体素子モジュールは双方向モジュールであって、
前記光ファイバーの端面が、該光ファイバーの中心軸に対して4度以上20度以下の角度をなしている請求項1〜3に記載の光半導体素子モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004171587A JP2005352075A (ja) | 2004-06-09 | 2004-06-09 | 光半導体素子モジュール |
TW094113879A TWI301676B (en) | 2004-06-09 | 2005-04-29 | Optical semiconductor device module and bidirectional module |
US11/119,909 US7266139B2 (en) | 2004-06-09 | 2005-05-03 | Optical semiconductor device module and bidirectional module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004171587A JP2005352075A (ja) | 2004-06-09 | 2004-06-09 | 光半導体素子モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005352075A true JP2005352075A (ja) | 2005-12-22 |
Family
ID=35460478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004171587A Pending JP2005352075A (ja) | 2004-06-09 | 2004-06-09 | 光半導体素子モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US7266139B2 (ja) |
JP (1) | JP2005352075A (ja) |
TW (1) | TWI301676B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140196A1 (ja) * | 2009-06-01 | 2010-12-09 | 三菱電機株式会社 | 光送受信モジュール及び光送受信モジュールの製造方法 |
CN102193156A (zh) * | 2011-06-29 | 2011-09-21 | 索尔思光电(成都)有限公司 | 一种单纤双向收发模块及其封装 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130272018A1 (en) * | 2011-11-29 | 2013-10-17 | Vladimir Khubiryants | Light Source Including a Ball Lens for Use With a Scope |
TWI611231B (zh) * | 2016-08-22 | 2018-01-11 | 年益實業股份有限公司 | 光組件定位調整裝置 |
JP6828364B2 (ja) * | 2016-10-13 | 2021-02-10 | 三菱電機株式会社 | 半導体受光モジュール |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08130320A (ja) | 1994-10-31 | 1996-05-21 | Mitsubishi Electric Corp | 光半導体素子モジュールおよびその製造方法 |
US5638475A (en) | 1995-10-06 | 1997-06-10 | Lucent Technologies Inc. | Apparatus for minimizing spherical aberration of light beam emitted into an optical fiber |
JP3489323B2 (ja) * | 1996-03-25 | 2004-01-19 | 三菱電機株式会社 | レーザダイオードモジユール、集光部品並びに光結合方法 |
US5911021A (en) | 1997-04-02 | 1999-06-08 | Lucent Technologies Inc. | Subassembly and method for coupling optical devices |
JP3726640B2 (ja) * | 2000-05-19 | 2005-12-14 | 住友電気工業株式会社 | 発光装置 |
US20040119988A1 (en) * | 2002-10-28 | 2004-06-24 | Finisar Corporation | System and method for measuring concentricity of laser to cap |
-
2004
- 2004-06-09 JP JP2004171587A patent/JP2005352075A/ja active Pending
-
2005
- 2005-04-29 TW TW094113879A patent/TWI301676B/zh active
- 2005-05-03 US US11/119,909 patent/US7266139B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140196A1 (ja) * | 2009-06-01 | 2010-12-09 | 三菱電機株式会社 | 光送受信モジュール及び光送受信モジュールの製造方法 |
JPWO2010140196A1 (ja) * | 2009-06-01 | 2012-11-15 | 三菱電機株式会社 | 光受信モジュール及び光受信モジュールの製造方法 |
US8885992B2 (en) | 2009-06-01 | 2014-11-11 | Mitsubishi Electric Corporation | Optical reception module and method of manufacturing optical reception module |
CN102193156A (zh) * | 2011-06-29 | 2011-09-21 | 索尔思光电(成都)有限公司 | 一种单纤双向收发模块及其封装 |
Also Published As
Publication number | Publication date |
---|---|
US7266139B2 (en) | 2007-09-04 |
TW200541087A (en) | 2005-12-16 |
US20050276304A1 (en) | 2005-12-15 |
TWI301676B (en) | 2008-10-01 |
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