JP2005347499A5 - - Google Patents

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Publication number
JP2005347499A5
JP2005347499A5 JP2004165188A JP2004165188A JP2005347499A5 JP 2005347499 A5 JP2005347499 A5 JP 2005347499A5 JP 2004165188 A JP2004165188 A JP 2004165188A JP 2004165188 A JP2004165188 A JP 2004165188A JP 2005347499 A5 JP2005347499 A5 JP 2005347499A5
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JP
Japan
Prior art keywords
layer
epitaxial wafer
type
type algaas
semi
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JP2004165188A
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English (en)
Japanese (ja)
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JP4770130B2 (ja
JP2005347499A (ja
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Priority to JP2004165188A priority Critical patent/JP4770130B2/ja
Priority claimed from JP2004165188A external-priority patent/JP4770130B2/ja
Publication of JP2005347499A publication Critical patent/JP2005347499A/ja
Publication of JP2005347499A5 publication Critical patent/JP2005347499A5/ja
Application granted granted Critical
Publication of JP4770130B2 publication Critical patent/JP4770130B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004165188A 2004-06-03 2004-06-03 電界効果トランジスタ用エピタキシャルウェハ及び高電子移動度トランジスタ用エピタキシャルウェハ Expired - Fee Related JP4770130B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004165188A JP4770130B2 (ja) 2004-06-03 2004-06-03 電界効果トランジスタ用エピタキシャルウェハ及び高電子移動度トランジスタ用エピタキシャルウェハ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004165188A JP4770130B2 (ja) 2004-06-03 2004-06-03 電界効果トランジスタ用エピタキシャルウェハ及び高電子移動度トランジスタ用エピタキシャルウェハ

Publications (3)

Publication Number Publication Date
JP2005347499A JP2005347499A (ja) 2005-12-15
JP2005347499A5 true JP2005347499A5 (enExample) 2006-10-12
JP4770130B2 JP4770130B2 (ja) 2011-09-14

Family

ID=35499593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004165188A Expired - Fee Related JP4770130B2 (ja) 2004-06-03 2004-06-03 電界効果トランジスタ用エピタキシャルウェハ及び高電子移動度トランジスタ用エピタキシャルウェハ

Country Status (1)

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JP (1) JP4770130B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9881877B2 (en) 2016-03-31 2018-01-30 Tdk Corporation Electronic circuit package using composite magnetic sealing material
US9818518B2 (en) 2016-03-31 2017-11-14 Tdk Corporation Composite magnetic sealing material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH076957A (ja) * 1993-01-13 1995-01-10 Sumitomo Chem Co Ltd 半導体エピタキシャル基板
JP2003234357A (ja) * 2002-02-07 2003-08-22 Hitachi Cable Ltd 電界効果トランジスタ

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