JP2005347428A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2005347428A JP2005347428A JP2004163908A JP2004163908A JP2005347428A JP 2005347428 A JP2005347428 A JP 2005347428A JP 2004163908 A JP2004163908 A JP 2004163908A JP 2004163908 A JP2004163908 A JP 2004163908A JP 2005347428 A JP2005347428 A JP 2005347428A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- circuit board
- semiconductor chip
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/4917—Crossed wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
【解決手段】複数のダイパッド2a、2bに搭載面の垂直方向に一定以上の段差を設けることにより、半導体チップ3a、3bや回路基板3cをオーバーラップさせて搭載することができるため、半導体チップや回路基板3cの搭載領域を縮小することができると共に配線の自由度を向上させることができる。
【選択図】図1
Description
図5(a)は従来の半導体装置における要部の構成を示す断面図である。
図5(a)に示すように、従来の半導体装置は、リードフレームのダイパッド2の部分に半導体チップ3が接着剤4を介してダイボンディングにより搭載され、半導体チップ3のボンディングパッド(図示せず)とリードフレームのインナーリード部1aの先端とが金属細線(金線)5でワイヤーボンディングされて電気的接続がなされた状態で、所定の形状を有する金型にて封止樹脂6でモールドされる。そして、樹脂の硬化後は、金型から取り出された半導体装置のリードフレームのアウターリード部1bが、リードフォーミング金型にて所定のリード形状に加工されたものである。
近年、LSIの発達はメモリ/ロジック混載あるいはアナログ/デジタル混載が急速に進行しているが、市場のコスト競争力はさらに進み、今や、単に1チップ化してチップ拡散プロセスにより混載化することは、市場競争に勝つ条件ではなくなってきている。
請求項2記載の半導体装置は、複数の半導体チップを搭載する半導体装置であって、前記半導体装置の電極となるリードフレームと、前記複数の半導体チップおよびリードフレームを互いに電気的に接続するワイヤー配線と、前記リードフレームに保持されその搭載面の垂直方向に前記半導体チップの厚みより大きな段差を設け前記複数の半導体チップを搭載する複数のダイパッドとを有し、前記複数の半導体チップの一部を互いにオーバーラップさせて前記ダイパッドに搭載可能であることを特徴とする。
また、回路基板上に形成した電源領域およびGND領域上に半導体チップを搭載する事によっても、信号配線と半導体チップへの電源およびGNDの供給が容易となり、配線の自由度を向上させることができる。
(実施の形態1)
図1(a)は本発明の実施の形態1における半導体装置の構成を説明するための断面図であり、マルチチップ型と積層チップ型の複合半導体装置を例示している。
(実施の形態2)
図1(b)は本発明の実施の形態2における半導体装置の構成を説明するための断面図であり、マルチチップ型と積層チップ型の複合半導体装置を例示している。
(実施の形態3)
図1(c)は本発明の実施の形態3における半導体装置の構成を説明するための断面図であり、マルチチップ型と積層チップ型の複合半導体装置を例示している。
(実施の形態4)
図1(d)は本発明の実施の形態4における半導体装置の構成を説明するための断面図であり、マルチチップ型の半導体装置を例示している。
図2(a)は本発明の実施の形態5における半導体装置の構成を説明するための断面図であり、マルチチップ型と積層チップ型の複合半導体装置を例示している。図2(b)は本発明の実施の形態5における回路基板の構成を説明するための平面図,図2(c)は本発明の実施の形態5における回路基板の構成を説明するための断面図である。
(実施の形態6)
図3(a)は本発明の実施の形態6における半導体装置の構成を説明するための断面図であり、マルチチップ型と積層チップ型の複合半導体装置を例示している。図3(b)は本発明の実施の形態6における回路基板の構成を説明するための平面図,図3(c)は本発明の実施の形態6における回路基板の構成を説明するための断面図である。
(実施の形態7)
図4(a)は本発明の実施の形態7における半導体装置の構成を説明するための断面図であり、マルチチップ型の半導体装置を例示している。図4(b)は本発明の実施の形態7におけるワイヤー配線を説明するための平面図である。
1b アウターリード部
2 ダイパッド
2a ダイパッド
2b ダイパッド
3 半導体チップ
3a 第1の半導体チップ
3b 第2の半導体チップ
3b−1 チップ搭載エリア
3b−2 ボンディングパッド
3c−1 配線層
3c−3 電源またはGND
3c 回路基板
4 接着剤
4a 接着ペースト
4b 接着シート
5 金属細線
6 封止樹脂
7 実装基板
Claims (7)
- 複数の半導体チップを搭載する半導体装置であって、
前記半導体装置の電極となるリードフレームと、
前記複数の半導体チップおよびリードフレームを互いに電気的に接続するワイヤー配線と、
前記リードフレームに保持されその搭載面の垂直方向に段差を設け前記複数の半導体チップを搭載する複数のダイパッドと
を有することを特徴とする半導体装置。 - 前記段差が前記半導体チップの厚みより大きく、前記複数の半導体チップの一部を互いにオーバーラップさせて前記ダイパッドに搭載可能であることを特徴とする請求項1記載の半導体装置。
- 複数の半導体チップを搭載する半導体装置であって、
前記半導体装置の電極となるリードフレームと、
前記半導体チップの内の1または2以上の半導体チップと積層させる1または2以上の回路基板と、
前記複数の半導体チップおよびリードフレームならびに前記1または2以上の回路基板を互いに電気的に接続するワイヤー配線と、
前記リードフレームに保持されその搭載面の垂直方向に前記半導体チップと前記回路基板を積層した厚みより大きな段差を設け前記複数の半導体チップを搭載する複数のダイパッドと
を有し、前記複数の半導体チップまたは前記回路基板の一部を互いにオーバーラップさせて前記ダイパッドに搭載可能であることを特徴とする半導体装置。 - 前記半導体チップの内の1または2以上の半導体チップがワイヤー配線用電極をチップ中央部に備える事を特徴とする請求項1または請求項2または請求項3のいずれかに記載の半導体装置。
- 前記回路基板上に電源供給用のワイヤー配線用電極を有することを特徴とする請求項3または請求項4のいずれかに記載の半導体装置。
- 前記回路基板上の半導体チップ搭載領域に電源領域を有することを特徴とする請求項3または請求項4のいずれかに記載の半導体装置。
- 前記ワイヤー配線は互いに電気的に独立し、平面的にはクロスすることを特徴とする請求項1または請求項2または請求項3または請求項4または請求項5または請求項6のいずれかに記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004163908A JP4278568B2 (ja) | 2004-06-02 | 2004-06-02 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004163908A JP4278568B2 (ja) | 2004-06-02 | 2004-06-02 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005347428A true JP2005347428A (ja) | 2005-12-15 |
JP4278568B2 JP4278568B2 (ja) | 2009-06-17 |
Family
ID=35499534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004163908A Expired - Fee Related JP4278568B2 (ja) | 2004-06-02 | 2004-06-02 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4278568B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7829995B2 (en) | 2008-05-09 | 2010-11-09 | Panasonic Corporation | Semiconductor device and method of fabrication |
WO2012011210A1 (ja) * | 2010-07-22 | 2012-01-26 | パナソニック株式会社 | 半導体装置及びその製造方法 |
CN115656789A (zh) * | 2022-12-26 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | 一种台阶焊盘结构及其测试方法 |
-
2004
- 2004-06-02 JP JP2004163908A patent/JP4278568B2/ja not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7829995B2 (en) | 2008-05-09 | 2010-11-09 | Panasonic Corporation | Semiconductor device and method of fabrication |
US8072057B2 (en) | 2008-05-09 | 2011-12-06 | Panasonic Corporation | Semiconductor device and method of fabrication |
WO2012011210A1 (ja) * | 2010-07-22 | 2012-01-26 | パナソニック株式会社 | 半導体装置及びその製造方法 |
CN102893396A (zh) * | 2010-07-22 | 2013-01-23 | 松下电器产业株式会社 | 半导体装置及其制造方法 |
JPWO2012011210A1 (ja) * | 2010-07-22 | 2013-09-09 | パナソニック株式会社 | 半導体装置及びその製造方法 |
CN115656789A (zh) * | 2022-12-26 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | 一种台阶焊盘结构及其测试方法 |
CN115656789B (zh) * | 2022-12-26 | 2024-04-09 | 惠州市金百泽电路科技有限公司 | 一种台阶焊盘结构及其测试方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4278568B2 (ja) | 2009-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5320611B2 (ja) | スタックダイパッケージ | |
JP5707902B2 (ja) | 半導体装置及びその製造方法 | |
US9385072B2 (en) | Method of manufacturing semiconductor device and semiconductor device | |
JP6125332B2 (ja) | 半導体装置 | |
JP2004063767A (ja) | 半導体装置 | |
JP4635202B2 (ja) | 両面電極パッケージの製造方法 | |
JP2008103685A (ja) | 半導体装置及びその製造方法 | |
JP2001156251A (ja) | 半導体装置 | |
US20080246129A1 (en) | Method of manufacturing semiconductor device and semiconductor device | |
JP5259369B2 (ja) | 半導体装置及びその製造方法 | |
US7193331B2 (en) | Semiconductor device and manufacturing process thereof | |
US20040021231A1 (en) | Semiconductor device and its manufacturing method | |
JP2007221045A (ja) | マルチチップ構造を採用した半導体装置 | |
JP4278568B2 (ja) | 半導体装置 | |
JP4435074B2 (ja) | 半導体装置およびその製造方法 | |
TWM534895U (zh) | 多層晶片封裝結構 | |
JP3842241B2 (ja) | 半導体装置 | |
JP2010050288A (ja) | 樹脂封止型半導体装置およびその製造方法 | |
JP2005311099A (ja) | 半導体装置及びその製造方法 | |
JP3702152B2 (ja) | 半導体装置 | |
JP2008027994A (ja) | 半導体装置及びその製造方法 | |
JP2005142284A (ja) | 半導体装置 | |
KR20010068514A (ko) | 칩 스케일 패키지를 적층한 적층 패키지 | |
US20070215989A1 (en) | Semiconductor chip assembly | |
JP4275109B2 (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061218 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20080430 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081209 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090115 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090210 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090310 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120319 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120319 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |