JP2005322730A5 - - Google Patents

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Publication number
JP2005322730A5
JP2005322730A5 JP2004138550A JP2004138550A JP2005322730A5 JP 2005322730 A5 JP2005322730 A5 JP 2005322730A5 JP 2004138550 A JP2004138550 A JP 2004138550A JP 2004138550 A JP2004138550 A JP 2004138550A JP 2005322730 A5 JP2005322730 A5 JP 2005322730A5
Authority
JP
Japan
Prior art keywords
semiconductor
forming
gate electrode
wiring
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004138550A
Other languages
English (en)
Japanese (ja)
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JP2005322730A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004138550A priority Critical patent/JP2005322730A/ja
Priority claimed from JP2004138550A external-priority patent/JP2005322730A/ja
Publication of JP2005322730A publication Critical patent/JP2005322730A/ja
Publication of JP2005322730A5 publication Critical patent/JP2005322730A5/ja
Pending legal-status Critical Current

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JP2004138550A 2004-05-07 2004-05-07 半導体装置及びその製造方法 Pending JP2005322730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004138550A JP2005322730A (ja) 2004-05-07 2004-05-07 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004138550A JP2005322730A (ja) 2004-05-07 2004-05-07 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2005322730A JP2005322730A (ja) 2005-11-17
JP2005322730A5 true JP2005322730A5 (enExample) 2007-06-07

Family

ID=35469788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004138550A Pending JP2005322730A (ja) 2004-05-07 2004-05-07 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2005322730A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7511360B2 (en) * 2005-12-14 2009-03-31 Freescale Semiconductor, Inc. Semiconductor device having stressors and method for forming
JP4764160B2 (ja) * 2005-12-21 2011-08-31 株式会社東芝 半導体装置
JP4899085B2 (ja) 2006-03-03 2012-03-21 富士通セミコンダクター株式会社 半導体装置およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01251750A (ja) * 1988-03-31 1989-10-06 Toshiba Corp 半導体装置及びその製造方法
JP3049255B2 (ja) * 1989-06-29 2000-06-05 セイコーインスツルメンツ株式会社 Ｃｍｉｓ半導体装置の製造方法
JP2805875B2 (ja) * 1989-08-10 1998-09-30 富士通株式会社 半導体装置の製造方法
JPH065603A (ja) * 1992-06-17 1994-01-14 Sony Corp 半導体装置
JP3833729B2 (ja) * 1994-12-14 2006-10-18 富士通株式会社 半導体メモリ集積回路
JPH0883852A (ja) * 1994-06-08 1996-03-26 Hyundai Electron Ind Co Ltd 半導体素子及びその製造方法
JP2003332457A (ja) * 1994-09-16 2003-11-21 Toshiba Corp 半導体装置
JP3263941B2 (ja) * 1994-10-05 2002-03-11 ソニー株式会社 半導体装置の製造方法
JPH1074846A (ja) * 1996-06-26 1998-03-17 Toshiba Corp 半導体装置及びその製造方法
JPH1050857A (ja) * 1996-08-02 1998-02-20 Sony Corp 半導体装置の製造方法
JPH11176949A (ja) * 1997-12-15 1999-07-02 Sony Corp 半導体装置
JP4000256B2 (ja) * 2001-12-11 2007-10-31 富士通株式会社 半導体装置及びその製造方法

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