JP2005311358A - 電子機器組立体並びにそれを組立てるための装置及び方法 - Google Patents
電子機器組立体並びにそれを組立てるための装置及び方法 Download PDFInfo
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- JP2005311358A JP2005311358A JP2005116484A JP2005116484A JP2005311358A JP 2005311358 A JP2005311358 A JP 2005311358A JP 2005116484 A JP2005116484 A JP 2005116484A JP 2005116484 A JP2005116484 A JP 2005116484A JP 2005311358 A JP2005311358 A JP 2005311358A
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- 238000000034 method Methods 0.000 title abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000002591 computed tomography Methods 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J43/00—Implements for preparing or holding food, not provided for in other groups of this subclass
- A47J43/14—Devices or machines for opening raw eggs or separating the contents thereof
- A47J43/145—Machines therefor
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
- A61B6/032—Transmission computed tomography [CT]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2221/00—Applications of separation devices
- B01D2221/02—Small separation devices for domestic application, e.g. for canteens, industrial kitchen, washing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D36/00—Filter circuits or combinations of filters with other separating devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/381—Pitch distance
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- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medical Informatics (AREA)
- Radiology & Medical Imaging (AREA)
- Molecular Biology (AREA)
- Biophysics (AREA)
- High Energy & Nuclear Physics (AREA)
- Theoretical Computer Science (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Optics & Photonics (AREA)
- Pathology (AREA)
- Pulmonology (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Physics & Mathematics (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Mechanical Engineering (AREA)
- Food Science & Technology (AREA)
- Measurement Of Radiation (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
【解決手段】 第1の層(110)と第2の層(120)とを有する電子機器組立体(100)を開示している。第1の層(110)は、第1の接合面(112)と第1の接合面(112)に形成された複数の空洞(114)とを有する。第2の層(120)は、第2の接合面(122)と第2の接合面(122)に配置された複数の突起(124)とを有し、複数の突起(124)は、複数の空洞(114)と位置合わせされかつ該複数の空洞(114)に配置される。導電性接続材料(130)は、該接続材料が複数の突起(124)をそれぞれの複数の空洞(114)に接続するように複数の空洞(114)に配置される。
【選択図】 図2
Description
110 第1の層
112 第1の接合面
114 空洞
120 第2の層
121 光ダイオード
122 第2の接合面
124 突起
130 導電性接続材料
140 銅製導体
d 空洞の深さ
g 接合面間のギャップ
h 突起の長さ
p 突起のピッチ
s 光ダイオードの端部間隔
w 突起の幅
Claims (10)
- 第1の接合面(112)と前記第1の接合面(112)に形成された複数の空洞(114)とを有する第1の層(110)と、
第2の接合面(122)と前記第2の接合面(122)に配置され、前記複数の空洞(114)と位置合わせされかつ該複数の空洞(114)に配置された複数の突起(124)とを有する第2の層(120)と、
前記複数の突起を前記それぞれの複数の空洞(114)に接続するように該複数の空洞(114)に配置された導電性接続材料(130)と、
を含む電子機器組立体(100)。 - 前記複数の空洞(114)が、前記第1の接合面(112)内に深さdを有する状態で形成され、
前記第1の接合面(112)が、前記第2の接合面(122)からギャップgだけ離れた状態で配置され、
前記複数の突起(124)が深さd及びギャップgの合計に等しいか又はそれよりも小さい長さhを有する、
請求項1記載の組立体。 - 前記複数の突起(124)が、約100ミクロンに等しいか又はそれよりも大きくかつ約700ミクロンに等しいか又はそれよりも小さい範囲の幅wを有し、
前記複数の突起(124)のピッチが、幅wの約1.1倍に等しいか又はそれよりも大きくかつ幅wの約3倍に等しいか又はそれよりも小さい範囲にある、
請求項1記載の組立体。 - 前記第1の層(110)がセラミック基板を含み、
前記第2の層(120)が、前記複数の突起(124)に電気的に接続した複数のバックライト光ダイオード(121)を有するダイオード・アレイを含み、
前記接続材料が、導電性エポキシ、導電性はんだ又はそれら材料の少なくとも1つを含む任意の組合せを含み、
該組立体が、医用診断装置に用いる光検出器を構成する、
請求項1記載の組立体。 - 前記第1の層(110)がセラミック基板を含み、
前記第2の層(120)が、前記複数の突起(124)に電気的に接続した複数のバックライト光ダイオード(121)を有するダイオード・アレイを含み、
前記接続材料が導電性エポキシ、導電性はんだ又はそれら材料の少なくとも1つを含む任意の組合せを含み、
前記複数の光ダイオード(121)が、約100ミクロンに等しいか又はそれよりも小さい端部間隔で前記第1の層(110)上に間隔をおいて配置されている、
請求項1記載の組立体。 - 上部層を含む電子機器組立体(100)を組立てるための装置(150)であって、
厚さ及び支持面(162)を有する多孔剛体要素(160)と、
前記多孔剛体要素(160)を保持しかつ該多孔剛体要素(160)にポジティブ・バキュームを供給するように構成されたハウジング(170)と、
を含み、
前記ポジティブ・バキュームを適用することにより、前記上部層をピックアップするためのポジティブ・バキュームが前記支持層(162)に形成される、
装置(150)。 - 前記ハウジング(170)が、前記支持面(162)を除いて前記多孔剛体要素(160)の全面に配置され、
前記多孔剛体要素(160)の厚さの一部が露出され、
前記多孔剛体要素(160)の支持面(162)が、約10ミクロンに等しいか又はそれよりも小さい平面度を有する、
請求項6記載の装置(150)。 - 前記支持面(162)が、前記上部層の2つの関連する全体寸法にほぼ一致する2つの全体寸法を有する、請求項6記載の装置(150)。
- 前記多孔剛体要素(160)が、複数の加熱要素(180)をその中に配置した複数のキャビティ(166)を含む、請求項6記載の装置(150)。
- 前記支持面(162)及び該支持面(162)に生じたポジティブ・バキュームが、約100ミクロンに等しいか又はそれよりも大きい初期平面度を有する上部層を約10ミクロンに等しいか又はそれよりも小さい最終平面度に平坦化するのに十分である、請求項6記載の装置(150)。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/709,175 US6988899B2 (en) | 2004-04-19 | 2004-04-19 | Electronic assembly, and apparatus and method for the assembly thereof |
Publications (1)
Publication Number | Publication Date |
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JP2005311358A true JP2005311358A (ja) | 2005-11-04 |
Family
ID=34940921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005116484A Pending JP2005311358A (ja) | 2004-04-19 | 2005-04-14 | 電子機器組立体並びにそれを組立てるための装置及び方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6988899B2 (ja) |
EP (1) | EP1588665A3 (ja) |
JP (1) | JP2005311358A (ja) |
KR (1) | KR20060045804A (ja) |
CN (1) | CN1697178A (ja) |
TW (1) | TW200541419A (ja) |
Families Citing this family (6)
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US7170062B2 (en) * | 2002-03-29 | 2007-01-30 | Oy Ajat Ltd. | Conductive adhesive bonded semiconductor substrates for radiation imaging devices |
US7523546B2 (en) * | 2005-05-04 | 2009-04-28 | Nokia Corporation | Method for manufacturing a composite layer for an electronic device |
JP2007234782A (ja) * | 2006-02-28 | 2007-09-13 | Toyota Industries Corp | 複合回路基板 |
US8399847B2 (en) | 2010-11-11 | 2013-03-19 | General Electric Company | Ruggedized enclosure for a radiographic device |
TW201240169A (en) * | 2011-03-18 | 2012-10-01 | Lextar Electronics Corp | Semiconductor devices |
US10970921B2 (en) | 2016-09-30 | 2021-04-06 | University Hospitals Cleveland Medical Center | Apparatus and method for constructing a virtual 3D model from a 2D ultrasound video |
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JPH05198621A (ja) * | 1992-01-21 | 1993-08-06 | Matsushita Electric Ind Co Ltd | フリップチップicの実装装置 |
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JPH06349892A (ja) * | 1993-06-10 | 1994-12-22 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
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-
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- 2004-04-19 US US10/709,175 patent/US6988899B2/en not_active Expired - Fee Related
-
2005
- 2005-04-06 TW TW94110900A patent/TW200541419A/zh unknown
- 2005-04-14 JP JP2005116484A patent/JP2005311358A/ja active Pending
- 2005-04-18 KR KR20050031766A patent/KR20060045804A/ko not_active Application Discontinuation
- 2005-04-19 EP EP20050252448 patent/EP1588665A3/en not_active Withdrawn
- 2005-04-19 CN CNA2005100672122A patent/CN1697178A/zh active Pending
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JPH03218037A (ja) * | 1990-01-23 | 1991-09-25 | Sumitomo Electric Ind Ltd | 半導体素子実装用基板 |
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Also Published As
Publication number | Publication date |
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EP1588665A3 (en) | 2006-03-08 |
US20050233605A1 (en) | 2005-10-20 |
EP1588665A2 (en) | 2005-10-26 |
CN1697178A (zh) | 2005-11-16 |
TW200541419A (en) | 2005-12-16 |
US6988899B2 (en) | 2006-01-24 |
KR20060045804A (ko) | 2006-05-17 |
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