JP2005294842A - 段差型ダイを有する半導体パッケージとその製造方法 - Google Patents
段差型ダイを有する半導体パッケージとその製造方法 Download PDFInfo
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- JP2005294842A JP2005294842A JP2005103706A JP2005103706A JP2005294842A JP 2005294842 A JP2005294842 A JP 2005294842A JP 2005103706 A JP2005103706 A JP 2005103706A JP 2005103706 A JP2005103706 A JP 2005103706A JP 2005294842 A JP2005294842 A JP 2005294842A
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Abstract
【解決手段】 半導体ダイは、最大幅W0、最大長さL0及び第1凹部Rlを有し、W0において第1凹部深さDrla減少されて第1短軸幅Wlaが形成され、L0において第1凹部長さLrla減少されて第1短軸長さLlaが形成される。
【選択図】 図5A
Description
例えば、少なくとも二つのダイの凹部が相互補完的であるか、または外周面に沿って実質的に一定距離を置いて配置され得る。或いは少なくとも二つのダイの凹部が相互補完的でないことも、またダイの外周面の隣接部分に沿って互いに異なる地点から実質的に互に異なる距離へと離隔され得る。
41 基板
82a,82b,82c 凹部
182a 凹部
282a,288a 凹部
382a,388a 凹部
482a,488a 凹部
Claims (34)
- 変形された矩形の外周を有する半導体ダイにおいて、
最大幅W0と、
最大長さL0と、
第1凹部
とを有し、
前記W0において第1凹部深さDrla減少されて第1短軸幅Wlaが形成され、前記L0において第1凹部長さLrla減少されて第1短軸長さLlaが形成されることを特徴とする半導体ダイ。 - 第2凹部をさらに有し、
前記W0において第2凹部深さDRr2a減少されて第2幅W2aが形成され、前記L0において第2凹部長さLr2a減少されて第2長さL2aが形成されることを特徴とする請求項1に記載の半導体ダイ。 - 偶数個Nの凹部をさらに有し、
前記W0においてN番目凹部深さDrNaに減少されて第N幅WNaが形成され、前記L0がN番目凹部長さLrNaに減少されて第N長さLNaが形成されることを特徴とする請求項2に記載の半導体ダイ。 - 前記N個の凹部は、中心縦軸を基準にして対称に配列することを特徴とする請求項3に記載の半導体ダイ。
- 前記N個の凹部は、中心水平軸を基準にして対称に配列することを特徴とする請求項3に記載の半導体ダイ。
- 前記N個の凹部は、中心縦軸を基準にして対称に配列することを特徴とする請求項5に記載の半導体ダイ。
- 前記N個の凹部は、第1対角線軸を基準にして対称に配列することを特徴とする請求項3に記載の半導体ダイ。
- 前記凹部は、前記半導体ダイの角を取り囲むことを特徴とする請求項1に記載の半導体ダイ。
- 前記凹部は、前記半導体ダイの第1面に沿って中間地点に形成することを特徴とする請求項1に記載の半導体ダイ。
- 前記第1凹部及び第2凹部は、互いに噛み合って前記半導体ダイの一方の角を取り囲むことを特徴とする請求項2に記載の半導体ダイ。
- 前記第1凹部及び第2凹部は、前記半導体ダイの周辺領域により互いに離隔されることを特徴とする請求項2に記載の半導体ダイ。
- 前記第1凹部は、前記半導体ダイの第1角を取り囲み、
前記第2凹部は、前記半導体ダイの第1角と異なる第2角を取り囲むことを特徴とする請求項2に記載の半導体ダイ。 - 前記第1角及び第2角は、対角線に向かい合っていることを特徴とする請求項12に記載の半導体ダイ。
- 前記第1角及び第2角は、前記半導体ダイの一方面の両先端に位置することを特徴とする請求項12に記載の半導体ダイ。
- 外周に凹部が形成された複数のダイを半導体ウエハに形成する段階と、
前記ウエハにおいて個別ダイを分離する段階と
を有することを特徴とする半導体素子製造方法。 - 前記分離段階は、前記ダイの外周面をレーザスクライビングしてウエハで脆弱な部分を形成する段階と、
前記脆弱な部分に沿って隣接するダイから個別ダイを分離する段階と、
を有することを特徴とする請求項15に記載の半導体素子製造方法。 - 前記分離段階は、前記ダイの外周面の外側において前記凹部に近接するするウエハの上部を除去して前記ウエハの活性面に開放口を形成する段階と、
前記活性面の反対面においてウエハの下部を除去して上下部がウエハの元来の厚さと少なくとも同じくする段階と、
ダイ間の切断線に沿って前記ウエハの残り部分を除去する段階と、
を有することを特徴とする請求項15に記載の半導体素子製造方法。 - 半導体ウエハに複数のダイを形成する段階は、隣接する少なくとも二つのダイの凹部が相互補完的でかつダイの外周面に沿って一定間隔に離隔されるようにダイを配列する段階を含むことを特徴とする請求項15に記載の半導体素子製造方法。
- 半導体ウエハに複数のダイを形成する段階は、隣接する少なくとも二つのダイの凹部が完全に相互補完的でなくダイの外周面の隣接部分に沿って互いに異なる地点から互いに異なる間隔に離隔されるようにダイを配列する段階を含むことを特徴とする請求項15に記載の半導体素子製造方法。
- 半導体ウエハに複数のダイを形成する段階は、凹部と境界をなすダイの外周面の一部にはボンドパッドが形成されないように複数のボンドパッドを、ダイの外周面に隣接して配置させる段階を含むことを特徴とする請求項15に記載の半導体素子製造方法。
- 前記複数のボンドパッドは、ダイの外周面の一直線に沿って配列することを特徴とする請求項20に記載の半導体素子製造方法。
- 接触部を有する基板と、
外周面に凹部を有する第1半導体ダイと、
を備える半導体素子パッケージにおいて、
前記接触部が凹部を介して露出するように前記基板に第1半導体ダイを実装することを特徴とする半導体素子パッケージ。 - 前記基板は下部半導体ダイであって、前記接触部は少なくとも一つのボンドパッドを備えて、
複数のボンドパッドは、前記第1半導体ダイの活性面に形成することを特徴とする請求項22に記載の半導体素子パッケージ。 - 前記第1半導体ダイの活性面に形成されるボンドパッドは、延長領域のみに位置することを特徴とする請求項23に記載の半導体素子パッケージ。
- 接触面を有する基板と、
外周面に凹部が形成された第1半導体ダイと、
を備える半導体素子パッケージにおいて、
前記接触部が凹部を介して露出するように前記基板に第1半導体ダイが実装されることを特徴とする請求項22に記載の半導体素子パッケージ。 - 基板を用意する段階と、
前記基板に複数の第1ボンドパッドを有する第1半導体ダイを実装する段階と、
外周面に第1凹部が形成された第2半導体ダイを形成する段階と、
前記複数の第1ボンドパッドが前記第1凹部を介して露出するように前記第1半導体ダイ上に前記第2半導体ダイを実装する段階と、
を有することを特徴とする半導体素子パッケージ製造方法。 - 変形された矩形の外周面に第2凹部が変形されている第3半導体素子を形成する段階と、
前記第2半導体素子の活性面に形成されている複数の第2ボンドパッドが、前記第2凹部を介して露出するように前記第2半導体ダイ上に前記第3半導体ダイを実装する段階と、
をさらに有することを特徴とする半導体素子パッケージ製造方法。 - 前記第1ボンドパッドと第2ボンドパッド及び基板を電気的に接続する段階をさらに有することを特徴とする請求項27に記載の半導体素子パッケージ製造方法。
- 前記第3半導体ダイの活性面に形成されている複数の第3ボンドパッドと基板とを電気的に接続する段階をさらに有することを特徴とする請求項28に記載の半導体素子パッケージ製造方法。
- 前記第1半導体ダイ、第2半導体ダイ及び第3半導体ダイは、実質的に同じ構造を有し、前記第2半導体ダイは、前記第1半導体ダイ及び第3半導体ダイを基準にして約180°回転されることを特徴とする請求項29に記載の半導体素子パッケージ製造方法。
- 前記第1半導体ダイ、第2半導体ダイ及び第3半導体ダイは、実質的に同じ構造を有し、前記第2半導体ダイは、前記第1半導体ダイ及び第3半導体ダイを基準にして約90°回転されることを特徴とする請求項29に記載の半導体素子パッケージ製造方法。
- 少なくとも二つの半導体ダイを備える半導体素子パッケージにおいて、
外周面に凹部が形成されており、基板に実装される第1半導体ダイと、
前記凹部内に位置するように前記第1半導体ダイと水平に実装され第2半導体ダイと、
を備えることを特徴とする半導体素子パッケージ。 - 前記第2半導体ダイは、実質的に前記凹部内に位置することを特徴とする請求項32に記載の半導体素子。
- 前記第2半導体ダイは、前記凹部内に完全に位置することを特徴とする請求項32に記載の半導体素子。
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JPH11224864A (ja) * | 1998-02-06 | 1999-08-17 | Mitsubishi Electric Corp | 半導体ウエハチップ分離方法 |
Cited By (8)
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JP2011146718A (ja) * | 2010-01-18 | 2011-07-28 | Semiconductor Components Industries Llc | 半導体ダイを形成する方法 |
US9165833B2 (en) | 2010-01-18 | 2015-10-20 | Semiconductor Components Industries, Llc | Method of forming a semiconductor die |
US9275957B2 (en) | 2010-01-18 | 2016-03-01 | Semiconductor Components Industries, Llc | EM protected semiconductor die |
US9299664B2 (en) | 2010-01-18 | 2016-03-29 | Semiconductor Components Industries, Llc | Method of forming an EM protected semiconductor die |
US9437493B2 (en) | 2010-01-18 | 2016-09-06 | Semiconductor Components Industries, Llc | Method of forming a semiconductor die |
JP2011228711A (ja) * | 2010-04-19 | 2011-11-10 | Tokyo Electron Ltd | 半導体集積回路チップを分離および搬送する方法 |
JP2014017413A (ja) * | 2012-07-10 | 2014-01-30 | Denso Corp | 半導体装置及びその製造方法 |
JP2014072239A (ja) * | 2012-09-27 | 2014-04-21 | Rohm Co Ltd | チップ部品 |
Also Published As
Publication number | Publication date |
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JP4832782B2 (ja) | 2011-12-07 |
KR100627006B1 (ko) | 2006-09-25 |
DE102005016439A1 (de) | 2005-10-20 |
US20050205975A1 (en) | 2005-09-22 |
US7485955B2 (en) | 2009-02-03 |
DE102005016439B4 (de) | 2011-07-28 |
KR20050097586A (ko) | 2005-10-10 |
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