JP2005285109A - 半導体装置、ｉｃカード - Google Patents

半導体装置、ｉｃカード Download PDF

Info

Publication number
JP2005285109A
JP2005285109A JP2005059938A JP2005059938A JP2005285109A JP 2005285109 A JP2005285109 A JP 2005285109A JP 2005059938 A JP2005059938 A JP 2005059938A JP 2005059938 A JP2005059938 A JP 2005059938A JP 2005285109 A JP2005285109 A JP 2005285109A
Authority
JP
Japan
Prior art keywords
integrated circuit
emitting element
antenna
light
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005059938A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005285109A5 (enExample
Inventor
Shunpei Yamazaki
舜平 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005059938A priority Critical patent/JP2005285109A/ja
Publication of JP2005285109A publication Critical patent/JP2005285109A/ja
Publication of JP2005285109A5 publication Critical patent/JP2005285109A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0728—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being an optical or sound-based communication interface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
    • G06K19/14—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being sensed by radiation
    • G06K19/145—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being sensed by radiation at least one of the further markings being adapted for galvanic or wireless sensing, e.g. an RFID tag with both a wireless and an optical interface or memory, or a contact type smart card with ISO 7816 contacts and an optical interface or memory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
    • H10F55/15—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/923—Active solid-state devices, e.g. transistors, solid-state diodes with means to optimize electrical conductor current carrying capacity, e.g. particular conductor aspect ratio

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Thin Film Transistor (AREA)
JP2005059938A 2004-03-04 2005-03-04 半導体装置、ｉｃカード Withdrawn JP2005285109A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005059938A JP2005285109A (ja) 2004-03-04 2005-03-04 半導体装置、ｉｃカード

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004060103 2004-03-04
JP2005059938A JP2005285109A (ja) 2004-03-04 2005-03-04 半導体装置、ｉｃカード

Publications (2)

Publication Number Publication Date
JP2005285109A true JP2005285109A (ja) 2005-10-13
JP2005285109A5 JP2005285109A5 (enExample) 2008-04-10

Family

ID=34918006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005059938A Withdrawn JP2005285109A (ja) 2004-03-04 2005-03-04 半導体装置、ｉｃカード

Country Status (5)

Country Link
US (3) US8030745B2 (enExample)
JP (1) JP2005285109A (enExample)
KR (1) KR101098777B1 (enExample)
CN (1) CN100478986C (enExample)
WO (1) WO2005086088A1 (enExample)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007172592A (ja) * 2005-11-25 2007-07-05 Semiconductor Energy Lab Co Ltd 半導体装置
WO2007077850A1 (en) * 2005-12-27 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2008013007A1 (fr) * 2006-07-27 2008-01-31 Kabushiki Kaisha Toshiba Procédé de fabrication d'entrée de carte sans fil, procédé de fabrication de carte sans fil, entrée de carte sans fil et carte sans fil
WO2008065993A1 (fr) * 2006-11-28 2008-06-05 Philtech Inc. Particule de poudre rf, poudre rf et procédé d'excitation de poudre rf
KR100968489B1 (ko) 2008-06-17 2010-07-07 재단법인서울대학교산학협력재단 데이터 저장 입자 및 데이터 전송 시스템
WO2010086904A1 (ja) * 2009-02-02 2010-08-05 新田工業株式会社 Ｉｃタグ
CN102135577A (zh) * 2010-12-29 2011-07-27 中山达华智能科技股份有限公司 一种跟踪电子电器产品使用寿命的方法及装置
US8178415B2 (en) 2006-11-27 2012-05-15 Philtech, Inc. Method for manufacturing RF powder
US8237622B2 (en) 2006-12-28 2012-08-07 Philtech Inc. Base sheet
US8318047B2 (en) 2006-11-28 2012-11-27 Philtech, Inc. Method for providing RF powder and RF powder-containing liquid
WO2013039395A1 (en) * 2011-09-14 2013-03-21 Ec Solution Group B.V. Active matrix display smart card
JP5294042B2 (ja) * 2009-09-28 2013-09-18 アイシン精機株式会社 ドア開閉装置
US8766853B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Method for adding RF powder and RF powder-added base sheet
US8766802B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Base data management system
US8933784B2 (en) 2006-11-28 2015-01-13 Philtech Inc. RF powder particle, RF powder, and RF powder-containing base

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8030745B2 (en) * 2004-03-04 2011-10-04 Semiconductor Energy Laboratory Co., Ltd. ID chip and IC card
US7681232B2 (en) * 2004-03-08 2010-03-16 Cardlab Aps Credit card and a secured data activation system
WO2006001287A1 (en) * 2004-06-24 2006-01-05 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit
US8835907B2 (en) * 2005-01-21 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
US7605056B2 (en) * 2005-05-31 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device including separation by physical force
US7799654B2 (en) * 2005-08-31 2010-09-21 Taiwan Semiconductor Manufacturing Company, Ltd. Reduced refractive index and extinction coefficient layer for enhanced photosensitivity
US8232621B2 (en) * 2006-07-28 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7714535B2 (en) 2006-07-28 2010-05-11 Semiconductor Energy Laboratory Co., Ltd. Power storage device
JP2008136019A (ja) * 2006-11-29 2008-06-12 Philtech Inc 磁界結合装置および読取り装置
US7750852B2 (en) * 2007-04-13 2010-07-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2009087928A (ja) * 2007-09-13 2009-04-23 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US7999388B2 (en) 2007-09-24 2011-08-16 Research Triangle Institute Preventing breakage of long metal signal conductors on semiconductor substrates
US20090159703A1 (en) * 2007-12-24 2009-06-25 Dynamics Inc. Credit, security, debit cards and the like with buttons
WO2011022099A2 (en) * 2009-05-29 2011-02-24 Arizona Board Of Regents, For And On Behalf Of Arizona State University Flexible identification systems and related methods
TWI424574B (zh) * 2009-07-28 2014-01-21 元太科技工業股份有限公司 數位ｘ光探測面板及其製作方法
DE102010019615A1 (de) * 2010-05-06 2011-11-10 Rat Asset & Trading Ag Karte zur elektronischen Zugangskontrolle
KR101235942B1 (ko) * 2010-08-13 2013-02-21 임은석 인레이 시트 및 그 제조 방법
JP2012043689A (ja) * 2010-08-20 2012-03-01 Toshiba Tec Corp 有機ｅｌ装置の製造方法
US9781783B2 (en) * 2011-04-15 2017-10-03 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, light-emitting system, and display system
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8763914B2 (en) * 2012-01-17 2014-07-01 On Track Innovations Ltd. Decoupled contactless bi-directional systems and methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9269032B2 (en) * 2012-10-28 2016-02-23 Zlotech Llc Glass-containing transaction card and method of making the same
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
AU2014253050B2 (en) 2013-04-12 2019-10-03 Cardlab Aps A card, an assembly, a method of assembling the card and a method of outputting information
SG11201509290WA (en) 2013-04-12 2015-12-30 Cardlab Aps A card with an offset filed generator
DE102014018393A1 (de) * 2014-10-14 2016-04-14 Infineon Technologies Ag Chipkartenmodul-Anordnung, Chipkarten-Anordnung und Verfahren zum Herstellen einer Chipkarten-Anordnung
CN104485334B (zh) * 2014-12-16 2018-02-13 京东方科技集团股份有限公司 阵列基板及其制作方法、显示装置
EP3035230A1 (en) 2014-12-19 2016-06-22 Cardlab ApS A method and an assembly for generating a magnetic field
US10095968B2 (en) 2014-12-19 2018-10-09 Cardlabs Aps Method and an assembly for generating a magnetic field and a method of manufacturing an assembly
US9436941B1 (en) * 2015-02-18 2016-09-06 Calay Venture S.à.r.l. Smart payment instruments
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
EP3082071A1 (en) 2015-04-17 2016-10-19 Cardlab ApS Device for and method of outputting a magnetic field
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
TWI655394B (zh) * 2017-09-29 2019-04-01 凱祿光電股份有限公司 發光裝置及其驅動方法
CN109993243A (zh) * 2019-03-05 2019-07-09 浙江大学 一种基于透明薄膜rfid芯片的商品防伪追溯系统
CN215814237U (zh) * 2021-08-26 2022-02-11 捷德(中国)科技有限公司 智能卡

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425497A (ja) * 1990-05-21 1992-01-29 Casio Comput Co Ltd Ｉｃカード
JPH1120360A (ja) * 1997-07-03 1999-01-26 Seiko Epson Corp Ｉｃカード及び薄膜集積回路装置並びにそれらの製造方法
JP2001155134A (ja) * 1999-11-30 2001-06-08 Seiko Epson Corp 半導体回路内蔵構造体
JP2001257292A (ja) * 2000-03-10 2001-09-21 Hitachi Maxell Ltd 半導体装置
JP2002083894A (ja) * 2000-06-21 2002-03-22 Hitachi Maxell Ltd 半導体チップ及びこれを用いた半導体装置
JP2002231909A (ja) * 2001-01-31 2002-08-16 Canon Inc 薄膜半導体装置の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575621A (en) * 1984-03-07 1986-03-11 Corpra Research, Inc. Portable electronic transaction device and system therefor
US4695859A (en) * 1986-10-20 1987-09-22 Energy Conversion Devices, Inc. Thin film light emitting diode, photonic circuit employing said diode imager employing said circuits
US4829166A (en) 1986-12-01 1989-05-09 Froelich Ronald W Computerized data-bearing card and reader/writer therefor
EP0292505A4 (en) 1986-12-01 1989-08-16 Ronald W Froelich COMPUTERIZED CARD CARRYING DATA, AND ITS READ / WRITE UNIT.
JP3448450B2 (ja) 1996-04-26 2003-09-22 三洋電機株式会社 発光素子およびその製造方法
US5789733A (en) * 1996-09-20 1998-08-04 Motorola, Inc. Smart card with contactless optical interface
JPH10270535A (ja) * 1997-03-25 1998-10-09 Nikon Corp 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法
JPH10321883A (ja) * 1997-05-16 1998-12-04 Semiconductor Energy Lab Co Ltd 太陽電池およびその作製方法
EP0975027A2 (en) * 1998-07-23 2000-01-26 Sony Corporation Light emitting device and process for producing the same
JP4562844B2 (ja) * 2000-02-23 2010-10-13 浜松ホトニクス株式会社 光電陰極及び電子管
US20010030511A1 (en) * 2000-04-18 2001-10-18 Shunpei Yamazaki Display device
DE10196382T1 (de) * 2000-06-21 2003-12-04 Hitachi Maxell Halbleiterchip und Halbleitervorrichtung, für die der Halbleiterchip verwendet wird
JP4703883B2 (ja) * 2001-04-09 2011-06-15 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3886339B2 (ja) * 2001-04-11 2007-02-28 シャープ株式会社 半導体装置
US7218349B2 (en) * 2001-08-09 2007-05-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7204425B2 (en) * 2002-03-18 2007-04-17 Precision Dynamics Corporation Enhanced identification appliance
JP4366921B2 (ja) * 2002-07-12 2009-11-18 セイコーエプソン株式会社 本人照合装置、カード型情報記録媒体及びそれを用いた情報処理システム
JP4401657B2 (ja) * 2003-01-10 2010-01-20 株式会社半導体エネルギー研究所 発光装置の製造方法
US8030745B2 (en) * 2004-03-04 2011-10-04 Semiconductor Energy Laboratory Co., Ltd. ID chip and IC card

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425497A (ja) * 1990-05-21 1992-01-29 Casio Comput Co Ltd Ｉｃカード
JPH1120360A (ja) * 1997-07-03 1999-01-26 Seiko Epson Corp Ｉｃカード及び薄膜集積回路装置並びにそれらの製造方法
JP2001155134A (ja) * 1999-11-30 2001-06-08 Seiko Epson Corp 半導体回路内蔵構造体
JP2001257292A (ja) * 2000-03-10 2001-09-21 Hitachi Maxell Ltd 半導体装置
JP2002083894A (ja) * 2000-06-21 2002-03-22 Hitachi Maxell Ltd 半導体チップ及びこれを用いた半導体装置
JP2002231909A (ja) * 2001-01-31 2002-08-16 Canon Inc 薄膜半導体装置の製造方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007172592A (ja) * 2005-11-25 2007-07-05 Semiconductor Energy Lab Co Ltd 半導体装置
KR101233639B1 (ko) 2005-12-27 2013-02-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조방법
WO2007077850A1 (en) * 2005-12-27 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2007200291A (ja) * 2005-12-27 2007-08-09 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US9177242B2 (en) 2005-12-27 2015-11-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8476632B2 (en) 2005-12-27 2013-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2008013007A1 (fr) * 2006-07-27 2008-01-31 Kabushiki Kaisha Toshiba Procédé de fabrication d'entrée de carte sans fil, procédé de fabrication de carte sans fil, entrée de carte sans fil et carte sans fil
US8766802B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Base data management system
US8766853B2 (en) 2006-11-27 2014-07-01 Philtech Inc. Method for adding RF powder and RF powder-added base sheet
US8178415B2 (en) 2006-11-27 2012-05-15 Philtech, Inc. Method for manufacturing RF powder
US8704202B2 (en) 2006-11-28 2014-04-22 Philtech Inc. RF powder particles including an inductance element, a capacitance element, and a photovoltaic cell and method for exciting RF powder
US8318047B2 (en) 2006-11-28 2012-11-27 Philtech, Inc. Method for providing RF powder and RF powder-containing liquid
US8933784B2 (en) 2006-11-28 2015-01-13 Philtech Inc. RF powder particle, RF powder, and RF powder-containing base
WO2008065993A1 (fr) * 2006-11-28 2008-06-05 Philtech Inc. Particule de poudre rf, poudre rf et procédé d'excitation de poudre rf
US8237622B2 (en) 2006-12-28 2012-08-07 Philtech Inc. Base sheet
KR100968489B1 (ko) 2008-06-17 2010-07-07 재단법인서울대학교산학협력재단 데이터 저장 입자 및 데이터 전송 시스템
WO2010086904A1 (ja) * 2009-02-02 2010-08-05 新田工業株式会社 Ｉｃタグ
JP5294042B2 (ja) * 2009-09-28 2013-09-18 アイシン精機株式会社 ドア開閉装置
CN102135577A (zh) * 2010-12-29 2011-07-27 中山达华智能科技股份有限公司 一种跟踪电子电器产品使用寿命的方法及装置
WO2013039395A1 (en) * 2011-09-14 2013-03-21 Ec Solution Group B.V. Active matrix display smart card

Also Published As

Publication number Publication date
US20070176622A1 (en) 2007-08-02
KR101098777B1 (ko) 2011-12-28
US20120007096A1 (en) 2012-01-12
US20170004393A1 (en) 2017-01-05
US8030745B2 (en) 2011-10-04
CN1926561A (zh) 2007-03-07
WO2005086088A1 (en) 2005-09-15
CN100478986C (zh) 2009-04-15
KR20070007134A (ko) 2007-01-12
US9449999B2 (en) 2016-09-20

Similar Documents

Publication Publication Date Title
CN100478986C (zh) Id芯片和ic卡
KR101161361B1 (ko) 반도체장치
JP5323382B2 (ja) 半導体装置
US8546912B2 (en) Semiconductor device
US9935363B2 (en) Semiconductor device
US20070159335A1 (en) Semiconductor device
CN100521117C (zh) 半导体器件及其制造方法
JP4610348B2 (ja) 半導体装置
JP2005340791A (ja) Ｍｏｓ容量素子及び半導体装置
JP4566794B2 (ja) 半導体装置
JP4718863B2 (ja) 半導体装置及び半導体装置の作製方法
JP4989854B2 (ja) 半導体装置の作製方法
JP4545617B2 (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080225

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080225

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101102

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101213

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110322

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20110405