JP2005276931A5 - - Google Patents
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- Publication number
- JP2005276931A5 JP2005276931A5 JP2004085052A JP2004085052A JP2005276931A5 JP 2005276931 A5 JP2005276931 A5 JP 2005276931A5 JP 2004085052 A JP2004085052 A JP 2004085052A JP 2004085052 A JP2004085052 A JP 2004085052A JP 2005276931 A5 JP2005276931 A5 JP 2005276931A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004085052A JP2005276931A (ja) | 2004-03-23 | 2004-03-23 | 半導体装置およびその製造方法 |
| US11/086,379 US7265022B2 (en) | 2004-03-23 | 2005-03-23 | Method of fabricating semiconductor device with STI structure |
| US11/829,491 US7572713B2 (en) | 2004-03-23 | 2007-07-27 | Method of fabricating semiconductor device with STI structure |
| US11/829,521 US7557422B2 (en) | 2004-03-23 | 2007-07-27 | Semiconductor device with STI structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004085052A JP2005276931A (ja) | 2004-03-23 | 2004-03-23 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005276931A JP2005276931A (ja) | 2005-10-06 |
| JP2005276931A5 true JP2005276931A5 (enExample) | 2006-03-16 |
Family
ID=35095431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004085052A Pending JP2005276931A (ja) | 2004-03-23 | 2004-03-23 | 半導体装置およびその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US7265022B2 (enExample) |
| JP (1) | JP2005276931A (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005276931A (ja) * | 2004-03-23 | 2005-10-06 | Toshiba Corp | 半導体装置およびその製造方法 |
| KR100607326B1 (ko) * | 2005-06-30 | 2006-08-01 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
| KR100649315B1 (ko) * | 2005-09-20 | 2006-11-24 | 동부일렉트로닉스 주식회사 | 플래시 메모리의 소자분리막 제조 방법 |
| KR100660551B1 (ko) * | 2005-09-22 | 2006-12-22 | 삼성전자주식회사 | 불휘발성 메모리 소자 및 그 제조 방법 |
| KR100772704B1 (ko) * | 2005-09-29 | 2007-11-02 | 주식회사 하이닉스반도체 | 테이퍼형태의 트렌치를 갖는 반도체소자의 제조 방법 |
| JP2007109966A (ja) * | 2005-10-14 | 2007-04-26 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| JP2009164558A (ja) * | 2007-12-10 | 2009-07-23 | Toyota Central R&D Labs Inc | 半導体装置とその製造方法、並びにトレンチゲートの製造方法 |
| JP2009277774A (ja) * | 2008-05-13 | 2009-11-26 | Sharp Corp | 半導体装置及びその製造方法 |
| US20100181639A1 (en) * | 2009-01-19 | 2010-07-22 | Vanguard International Semiconductor Corporation | Semiconductor devices and fabrication methods thereof |
| JP4886801B2 (ja) * | 2009-03-02 | 2012-02-29 | 株式会社東芝 | 半導体装置の製造方法 |
| TWI462175B (zh) * | 2011-09-07 | 2014-11-21 | 華亞科技股份有限公司 | 調整半導體基板槽深的製造方法 |
| JP6059048B2 (ja) * | 2013-03-11 | 2017-01-11 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
| US9230819B2 (en) * | 2013-04-05 | 2016-01-05 | Lam Research Corporation | Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing |
| US9245761B2 (en) | 2013-04-05 | 2016-01-26 | Lam Research Corporation | Internal plasma grid for semiconductor fabrication |
| CN104517890A (zh) * | 2013-09-30 | 2015-04-15 | 中芯国际集成电路制造(上海)有限公司 | 快闪存储器的浅沟槽隔离结构的形成方法 |
| KR102459430B1 (ko) * | 2018-01-08 | 2022-10-27 | 삼성전자주식회사 | 반도체 소자 및 그 제조방법 |
| CN116230529B (zh) * | 2023-05-06 | 2023-07-11 | 合肥晶合集成电路股份有限公司 | 一种半导体结构的制造方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3717897A (en) * | 1970-06-18 | 1973-02-27 | H Amos | Tacky floor pad |
| US3658578A (en) * | 1970-07-22 | 1972-04-25 | Phillips Petroleum Co | Dust-retentive article |
| JPS5943546A (ja) * | 1982-09-06 | 1984-03-10 | Hitachi Ltd | 半導体集積回路装置およびその製法 |
| US4774907A (en) * | 1984-01-26 | 1988-10-04 | Patrick Yananton | Nonwoven screen for odorless animal litter unit |
| US4800677A (en) * | 1987-09-21 | 1989-01-31 | Colgate-Palmolive Company | Animal waste collection pad |
| US4913954A (en) * | 1987-10-26 | 1990-04-03 | Colgate-Palmolive Company | Disposable pad for odor prevention in cat litter boxes |
| US5876792A (en) * | 1988-03-14 | 1999-03-02 | Nextec Applications, Inc. | Methods and apparatus for controlled placement of a polymer composition into a web |
| US4861632A (en) * | 1988-04-19 | 1989-08-29 | Caggiano Michael A | Laminated bag |
| US4963431A (en) * | 1988-06-17 | 1990-10-16 | Aquarium Pharmaceuticals, Inc. | Zeolite-impregnated pads |
| US5338340A (en) * | 1990-02-10 | 1994-08-16 | D-Mark, Inc. | Filter and method of making same |
| US5173346A (en) * | 1990-06-18 | 1992-12-22 | Breck Middleton | Foldable sponge mat for surgical applications |
| AU3927193A (en) * | 1992-04-02 | 1993-11-08 | Procter & Gamble Company, The | Absorbent article having a nonwoven topsheet with fluid impervious areas |
| DE69516769T2 (de) * | 1994-03-15 | 2000-12-28 | National Semiconductor Corp., Sunnyvale | Planarisierter isolationsgraben und feldoxid-isolationsstruktur |
| US5834104A (en) * | 1994-05-05 | 1998-11-10 | Cordani; Peter J. | Fluid absorption mat |
| US5819688A (en) * | 1997-04-21 | 1998-10-13 | Walker; Robert T. | Pet animal odor adsorbing and liquid absorbing mat |
| US5961763A (en) * | 1997-05-07 | 1999-10-05 | Air Products And Chemicals, Inc. | Sealable nonwoven web |
| US6569274B1 (en) * | 1997-05-07 | 2003-05-27 | Air Products And Chemicals, Inc. | Sealable nonwoven web |
| US5846603A (en) * | 1997-07-28 | 1998-12-08 | Superior Fibers, Inc. | Uniformly tacky filter media |
| US6440819B1 (en) * | 1998-03-03 | 2002-08-27 | Advanced Micro Devices, Inc. | Method for differential trenching in conjunction with differential fieldox growth |
| US6458442B1 (en) * | 2000-06-22 | 2002-10-01 | Mckay William D. | Cleaning mat with a plurality of disposable sheets |
| JP2000156402A (ja) | 1998-09-18 | 2000-06-06 | Sony Corp | 半導体装置およびその製造方法 |
| US6746974B1 (en) * | 1999-03-10 | 2004-06-08 | 3M Innovative Properties Company | Web material comprising a tackifier |
| US6219876B1 (en) * | 1999-05-04 | 2001-04-24 | Tech Mats, L.L.C. | Floor mat |
| JP3407023B2 (ja) * | 1999-05-10 | 2003-05-19 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US6583065B1 (en) * | 1999-08-03 | 2003-06-24 | Applied Materials Inc. | Sidewall polymer forming gas additives for etching processes |
| US6569494B1 (en) * | 2000-05-09 | 2003-05-27 | 3M Innovative Properties Company | Method and apparatus for making particle-embedded webs |
| JP3403372B2 (ja) * | 2000-05-26 | 2003-05-06 | 松下電器産業株式会社 | 有機膜のエッチング方法、半導体装置の製造方法及びパターンの形成方法 |
| JP2002009178A (ja) * | 2000-06-21 | 2002-01-11 | Toshiba Corp | 半導体装置の製造方法 |
| JP2002043246A (ja) * | 2000-07-27 | 2002-02-08 | Nec Corp | 半導体装置の製造方法 |
| JP2005276931A (ja) * | 2004-03-23 | 2005-10-06 | Toshiba Corp | 半導体装置およびその製造方法 |
-
2004
- 2004-03-23 JP JP2004085052A patent/JP2005276931A/ja active Pending
-
2005
- 2005-03-23 US US11/086,379 patent/US7265022B2/en not_active Expired - Fee Related
-
2007
- 2007-07-27 US US11/829,521 patent/US7557422B2/en not_active Expired - Fee Related
- 2007-07-27 US US11/829,491 patent/US7572713B2/en not_active Expired - Fee Related