JP2005266347A - レジストパターン形成方法および回路形成方法 - Google Patents
レジストパターン形成方法および回路形成方法 Download PDFInfo
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- JP2005266347A JP2005266347A JP2004079063A JP2004079063A JP2005266347A JP 2005266347 A JP2005266347 A JP 2005266347A JP 2004079063 A JP2004079063 A JP 2004079063A JP 2004079063 A JP2004079063 A JP 2004079063A JP 2005266347 A JP2005266347 A JP 2005266347A
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- resist pattern
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- forming
- photosensitive resin
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- 238000000034 method Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 238000007747 plating Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 64
- 101710108306 Bifunctional dihydroflavonol 4-reductase/flavanone 4-reductase Proteins 0.000 description 18
- 101710170824 Dihydroflavonol 4-reductase Proteins 0.000 description 18
- 238000011161 development Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 13
- 239000002585 base Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 239000011241 protective layer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 8
- -1 polyethylene Polymers 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000012212 insulator Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 229960003280 cupric chloride Drugs 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 235000009065 Taxus cuspidata Nutrition 0.000 description 1
- 244000162450 Taxus cuspidata Species 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910001424 calcium ion Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000008237 rinsing water Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004079063A JP2005266347A (ja) | 2004-03-18 | 2004-03-18 | レジストパターン形成方法および回路形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004079063A JP2005266347A (ja) | 2004-03-18 | 2004-03-18 | レジストパターン形成方法および回路形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005266347A true JP2005266347A (ja) | 2005-09-29 |
| JP2005266347A5 JP2005266347A5 (enrdf_load_stackoverflow) | 2007-04-12 |
Family
ID=35090953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004079063A Pending JP2005266347A (ja) | 2004-03-18 | 2004-03-18 | レジストパターン形成方法および回路形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005266347A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006251458A (ja) * | 2005-03-11 | 2006-09-21 | Asahi Kasei Electronics Co Ltd | 長尺状の感光性樹脂付き積層板 |
| JP2017032828A (ja) * | 2015-08-03 | 2017-02-09 | 日立化成株式会社 | レジスト、及び、構造体の製造方法 |
| WO2017213056A1 (ja) * | 2016-06-10 | 2017-12-14 | 富士フイルム株式会社 | パターン付き基材の製造方法、及び、回路基板の製造方法 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06349727A (ja) * | 1993-06-11 | 1994-12-22 | Fuji Photo Film Co Ltd | 感光層積層方法 |
| JPH07261407A (ja) * | 1994-03-23 | 1995-10-13 | Mitsubishi Rayon Co Ltd | 可視光硬化型レジストの形成方法 |
| JPH09130016A (ja) * | 1995-10-30 | 1997-05-16 | Matsushita Electric Works Ltd | 回路形成方法 |
| JPH10142795A (ja) * | 1996-11-14 | 1998-05-29 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| JPH10293404A (ja) * | 1993-04-16 | 1998-11-04 | Kansai Paint Co Ltd | 感光性組成物及びパターンの形成方法 |
| JP2001209178A (ja) * | 2000-01-26 | 2001-08-03 | Nippon Kayaku Co Ltd | 光カチオン硬化型ドライフィルムレジスト及びその硬化物 |
| JP2002131899A (ja) * | 2000-10-24 | 2002-05-09 | Fuji Photo Film Co Ltd | ネガ型感光性熱硬化性樹脂組成物、ネガ型感光性熱硬化性転写材料、層間絶縁膜の形成方法、ハイアパーチャー型液晶表示装置及びその製造方法 |
| JP2002138258A (ja) * | 2000-11-01 | 2002-05-14 | Nitto Denko Corp | 感圧性接着シートの製造方法およびその装置 |
| JP2002148796A (ja) * | 2001-08-06 | 2002-05-22 | Hitachi Chem Co Ltd | 印刷回路板およびそれに用いる感光性樹脂組成物、感光性フィルム |
| JP2002232117A (ja) * | 2000-12-19 | 2002-08-16 | Kolon Ind Inc | ドライフィルムレジストを用いた印刷回路基板の製造方法 |
| JP2003066625A (ja) * | 2001-06-13 | 2003-03-05 | Asahi Kasei Corp | 感光性樹脂層への露光方法 |
| JP2003140335A (ja) * | 2001-11-02 | 2003-05-14 | Asahi Kasei Corp | 感光性樹脂積層体及びその用途 |
| JP2003202665A (ja) * | 2002-01-08 | 2003-07-18 | Fujikura Ltd | ドライフィルムレジスト及びパターン形成方法 |
-
2004
- 2004-03-18 JP JP2004079063A patent/JP2005266347A/ja active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10293404A (ja) * | 1993-04-16 | 1998-11-04 | Kansai Paint Co Ltd | 感光性組成物及びパターンの形成方法 |
| JPH06349727A (ja) * | 1993-06-11 | 1994-12-22 | Fuji Photo Film Co Ltd | 感光層積層方法 |
| JPH07261407A (ja) * | 1994-03-23 | 1995-10-13 | Mitsubishi Rayon Co Ltd | 可視光硬化型レジストの形成方法 |
| JPH09130016A (ja) * | 1995-10-30 | 1997-05-16 | Matsushita Electric Works Ltd | 回路形成方法 |
| JPH10142795A (ja) * | 1996-11-14 | 1998-05-29 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
| JP2001209178A (ja) * | 2000-01-26 | 2001-08-03 | Nippon Kayaku Co Ltd | 光カチオン硬化型ドライフィルムレジスト及びその硬化物 |
| JP2002131899A (ja) * | 2000-10-24 | 2002-05-09 | Fuji Photo Film Co Ltd | ネガ型感光性熱硬化性樹脂組成物、ネガ型感光性熱硬化性転写材料、層間絶縁膜の形成方法、ハイアパーチャー型液晶表示装置及びその製造方法 |
| JP2002138258A (ja) * | 2000-11-01 | 2002-05-14 | Nitto Denko Corp | 感圧性接着シートの製造方法およびその装置 |
| JP2002232117A (ja) * | 2000-12-19 | 2002-08-16 | Kolon Ind Inc | ドライフィルムレジストを用いた印刷回路基板の製造方法 |
| JP2003066625A (ja) * | 2001-06-13 | 2003-03-05 | Asahi Kasei Corp | 感光性樹脂層への露光方法 |
| JP2002148796A (ja) * | 2001-08-06 | 2002-05-22 | Hitachi Chem Co Ltd | 印刷回路板およびそれに用いる感光性樹脂組成物、感光性フィルム |
| JP2003140335A (ja) * | 2001-11-02 | 2003-05-14 | Asahi Kasei Corp | 感光性樹脂積層体及びその用途 |
| JP2003202665A (ja) * | 2002-01-08 | 2003-07-18 | Fujikura Ltd | ドライフィルムレジスト及びパターン形成方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006251458A (ja) * | 2005-03-11 | 2006-09-21 | Asahi Kasei Electronics Co Ltd | 長尺状の感光性樹脂付き積層板 |
| JP2017032828A (ja) * | 2015-08-03 | 2017-02-09 | 日立化成株式会社 | レジスト、及び、構造体の製造方法 |
| WO2017213056A1 (ja) * | 2016-06-10 | 2017-12-14 | 富士フイルム株式会社 | パターン付き基材の製造方法、及び、回路基板の製造方法 |
| JPWO2017213056A1 (ja) * | 2016-06-10 | 2019-03-07 | 富士フイルム株式会社 | パターン付き基材の製造方法、及び、回路基板の製造方法 |
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