JP2005252219A - 発光装置及び封止部材 - Google Patents

発光装置及び封止部材 Download PDF

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Publication number
JP2005252219A
JP2005252219A JP2004223889A JP2004223889A JP2005252219A JP 2005252219 A JP2005252219 A JP 2005252219A JP 2004223889 A JP2004223889 A JP 2004223889A JP 2004223889 A JP2004223889 A JP 2004223889A JP 2005252219 A JP2005252219 A JP 2005252219A
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JP
Japan
Prior art keywords
light emitting
light
emitting element
filler
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004223889A
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English (en)
Japanese (ja)
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JP2005252219A5 (https=
Inventor
Yoshinobu Suehiro
好伸 末広
Hideaki Kato
英昭 加藤
Seiji Takano
清二 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2004223889A priority Critical patent/JP2005252219A/ja
Priority to US11/050,432 priority patent/US7304326B2/en
Publication of JP2005252219A publication Critical patent/JP2005252219A/ja
Publication of JP2005252219A5 publication Critical patent/JP2005252219A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2004223889A 2004-02-06 2004-07-30 発光装置及び封止部材 Withdrawn JP2005252219A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004223889A JP2005252219A (ja) 2004-02-06 2004-07-30 発光装置及び封止部材
US11/050,432 US7304326B2 (en) 2004-02-06 2005-02-04 Light emitting device and sealing material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004031305 2004-02-06
JP2004223889A JP2005252219A (ja) 2004-02-06 2004-07-30 発光装置及び封止部材

Publications (2)

Publication Number Publication Date
JP2005252219A true JP2005252219A (ja) 2005-09-15
JP2005252219A5 JP2005252219A5 (https=) 2006-11-02

Family

ID=34829457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004223889A Withdrawn JP2005252219A (ja) 2004-02-06 2004-07-30 発光装置及び封止部材

Country Status (2)

Country Link
US (1) US7304326B2 (https=)
JP (1) JP2005252219A (https=)

Cited By (14)

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JP2007294974A (ja) * 2006-04-25 2007-11-08 Samsung Electro Mech Co Ltd 発光ダイオードモジュール
JP2007311663A (ja) * 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
JP2008085356A (ja) * 2006-09-28 2008-04-10 Philips Lumileds Lightng Co Llc マウントするために半導体構造体を準備するプロセス
JP2008251664A (ja) * 2007-03-29 2008-10-16 Toshiba Lighting & Technology Corp 照明装置
JP2008304611A (ja) * 2007-06-06 2008-12-18 Fujikura Ltd 光送受信装置
JP2010521805A (ja) * 2007-03-12 2010-06-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 低熱膨張係数を有する化合物を含む照明システム
JP2010532929A (ja) * 2007-07-06 2010-10-14 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
WO2011111334A1 (ja) * 2010-03-11 2011-09-15 株式会社 東芝 発光装置
US8064833B2 (en) 2007-05-17 2011-11-22 Kabushiki Kaisha Toshiba Radio communication apparatus and method
JP2012103732A (ja) * 2012-02-13 2012-05-31 Fujikura Ltd 光送受信装置の製造方法
JP2012238633A (ja) * 2011-05-10 2012-12-06 Rohm Co Ltd Ｌｅｄモジュール
JP2013511836A (ja) * 2009-11-23 2013-04-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 波長変換半導体発光ダイオード
JP2018182308A (ja) * 2017-04-12 2018-11-15 聯京光電股▲ふん▼有限公司 光電子パッケージ
JP2019021768A (ja) * 2017-07-18 2019-02-07 株式会社デンソー 電子装置

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CN101789482B (zh) * 2003-03-10 2013-04-17 丰田合成株式会社 固体元件装置及其制造方法
CN101061590B (zh) * 2004-11-18 2010-05-12 皇家飞利浦电子股份有限公司 发光器及其制造方法
US20060171152A1 (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
US20060198008A1 (en) * 2005-03-07 2006-09-07 Micron Technology, Inc. Formation of micro lens by using flowable oxide deposition
EP2280430B1 (en) * 2005-03-11 2020-01-01 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
JP2007027278A (ja) * 2005-07-13 2007-02-01 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US7863639B2 (en) * 2006-04-12 2011-01-04 Semileds Optoelectronics Co. Ltd. Light-emitting diode lamp with low thermal resistance
US8373195B2 (en) 2006-04-12 2013-02-12 SemiLEDs Optoelectronics Co., Ltd. Light-emitting diode lamp with low thermal resistance
KR100731678B1 (ko) * 2006-05-08 2007-06-22 서울반도체 주식회사 칩형 발광 다이오드 패키지 및 그것을 갖는 발광 장치
TWI321857B (en) * 2006-07-21 2010-03-11 Epistar Corp A light emitting device
TWI418054B (zh) * 2006-08-08 2013-12-01 Ｌｇ電子股份有限公司 發光裝置封裝與製造此封裝之方法
KR100772113B1 (ko) * 2006-09-28 2007-11-01 주식회사 하이닉스반도체 입체 인쇄회로 기판
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
TWI329934B (en) * 2007-01-17 2010-09-01 Chi Mei Lighting Tech Corp Lead frame structure of light emitting diode
US7968900B2 (en) * 2007-01-19 2011-06-28 Cree, Inc. High performance LED package
US7791096B2 (en) * 2007-06-08 2010-09-07 Koninklijke Philips Electronics N.V. Mount for a semiconductor light emitting device
US20090032827A1 (en) * 2007-07-30 2009-02-05 Philips Lumileds Lighting Company, Llc Concave Wide Emitting Lens for LED Useful for Backlighting
EP2195864A4 (en) * 2007-08-27 2010-10-13 Lg Electronics Inc LUMINOUS ELEMENT ENCLOSURE AND LIGHTING DEVICE THEREFOR
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
EP2348551A2 (en) * 2008-10-01 2011-07-27 Samsung LED Co., Ltd. Light-emitting diode package using a liquid crystal polymer
TWI385834B (zh) * 2009-02-06 2013-02-11 沈育濃 Light emitting diode chip package and manufacturing method thereof
US8530990B2 (en) 2009-07-20 2013-09-10 Sunpower Corporation Optoelectronic device with heat spreader unit
JP5744386B2 (ja) * 2009-10-07 2015-07-08 日東電工株式会社 光半導体封止材
JP2011082339A (ja) * 2009-10-07 2011-04-21 Nitto Denko Corp 光半導体封止用キット
KR101163850B1 (ko) * 2009-11-23 2012-07-09 엘지이노텍 주식회사 발광 소자 패키지
US8541793B2 (en) * 2010-02-04 2013-09-24 Yu-Nung Shen Light emitting diode device and method for fabricating the same
CN102414851B (zh) * 2010-03-11 2016-06-22 松下知识产权经营株式会社 发光模块、光源装置、液晶显示装置和发光模块的制造方法
JP5515992B2 (ja) * 2010-04-07 2014-06-11 日亜化学工業株式会社 発光装置
CN105720180B (zh) * 2010-04-09 2018-05-29 罗姆股份有限公司 Led模块
DE102010021791A1 (de) 2010-05-27 2011-12-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements und eines Verbunds
US8563849B2 (en) 2010-08-03 2013-10-22 Sunpower Corporation Diode and heat spreader for solar module
JP5049382B2 (ja) * 2010-12-21 2012-10-17 パナソニック株式会社 発光装置及びそれを用いた照明装置
US8697541B1 (en) * 2010-12-24 2014-04-15 Ananda H. Kumar Methods and structures for preparing single crystal silicon wafers for use as substrates for epitaxial growth of crack-free gallium nitride films and devices
US9048396B2 (en) 2012-06-11 2015-06-02 Cree, Inc. LED package with encapsulant having planar surfaces
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
TW201312807A (zh) 2011-07-21 2013-03-16 克里股份有限公司 光發射器元件封裝與部件及改良化學抵抗性的方法與相關方法
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US20150001570A1 (en) * 2011-09-02 2015-01-01 King Dragon International Inc. LED Package and Method of the Same
US9117941B2 (en) * 2011-09-02 2015-08-25 King Dragon International Inc. LED package and method of the same
US9562171B2 (en) * 2011-09-22 2017-02-07 Sensor Electronic Technology, Inc. Ultraviolet device encapsulant
US10490713B2 (en) 2011-09-22 2019-11-26 Sensor Electronic Technology, Inc. Ultraviolet device encapsulant
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9343441B2 (en) * 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US9240530B2 (en) * 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US20130240934A1 (en) * 2012-03-14 2013-09-19 Samsung Electronics Co., Ltd. Light emitting element package and method of manufacturing the same
US9887327B2 (en) 2012-06-11 2018-02-06 Cree, Inc. LED package with encapsulant having curved and planar surfaces
US10468565B2 (en) 2012-06-11 2019-11-05 Cree, Inc. LED package with multiple element light source and encapsulant having curved and/or planar surfaces
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
US8636198B1 (en) 2012-09-28 2014-01-28 Sunpower Corporation Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells
KR102019499B1 (ko) * 2012-11-05 2019-09-06 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
USD758976S1 (en) 2013-08-08 2016-06-14 Cree, Inc. LED package
JP6195760B2 (ja) * 2013-08-16 2017-09-13 シチズン電子株式会社 Ｌｅｄ発光装置
HK1222879A1 (zh) * 2013-11-13 2017-07-14 Nanoco Technologies Ltd 包含量子点荧光体的led盖
TW201616689A (zh) 2014-06-25 2016-05-01 皇家飛利浦有限公司 經封裝之波長轉換發光裝置
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JP6619641B2 (ja) * 2015-12-14 2019-12-11 株式会社小糸製作所 光源ユニット、及び、それを用いた灯具
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Cited By (20)

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Publication number Priority date Publication date Assignee Title
JP2007294974A (ja) * 2006-04-25 2007-11-08 Samsung Electro Mech Co Ltd 発光ダイオードモジュール
JP2007311663A (ja) * 2006-05-19 2007-11-29 Sharp Corp 発光装置の製造方法、発光装置、および発光装置の製造装置
JP2008085356A (ja) * 2006-09-28 2008-04-10 Philips Lumileds Lightng Co Llc マウントするために半導体構造体を準備するプロセス
US9899578B2 (en) 2006-09-28 2018-02-20 Lumileds Llc Process for preparing a semiconductor structure for mounting
JP2010521805A (ja) * 2007-03-12 2010-06-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 低熱膨張係数を有する化合物を含む照明システム
JP2008251664A (ja) * 2007-03-29 2008-10-16 Toshiba Lighting & Technology Corp 照明装置
US8064833B2 (en) 2007-05-17 2011-11-22 Kabushiki Kaisha Toshiba Radio communication apparatus and method
JP2008304611A (ja) * 2007-06-06 2008-12-18 Fujikura Ltd 光送受信装置
JP2010532929A (ja) * 2007-07-06 2010-10-14 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
US9368697B2 (en) 2007-07-06 2016-06-14 Lg Innotek Co., Ltd. Light emitting device package
US8890297B2 (en) 2007-07-06 2014-11-18 Lg Innotek Co., Ltd. Light emitting device package
US8610255B2 (en) 2007-07-06 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
JP2013511836A (ja) * 2009-11-23 2013-04-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 波長変換半導体発光ダイオード
JP5716010B2 (ja) * 2010-03-11 2015-05-13 株式会社東芝 発光装置
US8933475B2 (en) 2010-03-11 2015-01-13 Kabushiki Kaisha Toshiba Light emitting device
WO2011111334A1 (ja) * 2010-03-11 2011-09-15 株式会社 東芝 発光装置
JP2012238633A (ja) * 2011-05-10 2012-12-06 Rohm Co Ltd Ｌｅｄモジュール
JP2012103732A (ja) * 2012-02-13 2012-05-31 Fujikura Ltd 光送受信装置の製造方法
JP2018182308A (ja) * 2017-04-12 2018-11-15 聯京光電股▲ふん▼有限公司 光電子パッケージ
JP2019021768A (ja) * 2017-07-18 2019-02-07 株式会社デンソー 電子装置

Also Published As

Publication number Publication date
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