JP2005218202A - アクチュエータ及びボンディング装置 - Google Patents

アクチュエータ及びボンディング装置 Download PDF

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Publication number
JP2005218202A
JP2005218202A JP2004020434A JP2004020434A JP2005218202A JP 2005218202 A JP2005218202 A JP 2005218202A JP 2004020434 A JP2004020434 A JP 2004020434A JP 2004020434 A JP2004020434 A JP 2004020434A JP 2005218202 A JP2005218202 A JP 2005218202A
Authority
JP
Japan
Prior art keywords
rotating body
rectilinear
bonding apparatus
along
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004020434A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005218202A5 (https=
Inventor
Manabu Haraguchi
学 原口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004020434A priority Critical patent/JP2005218202A/ja
Publication of JP2005218202A publication Critical patent/JP2005218202A/ja
Publication of JP2005218202A5 publication Critical patent/JP2005218202A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2004020434A 2004-01-28 2004-01-28 アクチュエータ及びボンディング装置 Pending JP2005218202A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004020434A JP2005218202A (ja) 2004-01-28 2004-01-28 アクチュエータ及びボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004020434A JP2005218202A (ja) 2004-01-28 2004-01-28 アクチュエータ及びボンディング装置

Publications (2)

Publication Number Publication Date
JP2005218202A true JP2005218202A (ja) 2005-08-11
JP2005218202A5 JP2005218202A5 (https=) 2006-04-06

Family

ID=34904354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004020434A Pending JP2005218202A (ja) 2004-01-28 2004-01-28 アクチュエータ及びボンディング装置

Country Status (1)

Country Link
JP (1) JP2005218202A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036669A1 (en) * 2004-09-22 2006-04-06 Kulicke And Soffa Industries, Inc. Motion control device for wire bonder bondhead
WO2019151340A1 (ja) * 2018-01-30 2019-08-08 株式会社新川 アクチュエータ及びワイヤボンディング装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036669A1 (en) * 2004-09-22 2006-04-06 Kulicke And Soffa Industries, Inc. Motion control device for wire bonder bondhead
WO2019151340A1 (ja) * 2018-01-30 2019-08-08 株式会社新川 アクチュエータ及びワイヤボンディング装置
CN111656502A (zh) * 2018-01-30 2020-09-11 株式会社新川 致动器以及打线接合装置
JPWO2019151340A1 (ja) * 2018-01-30 2021-01-07 株式会社新川 アクチュエータ及びワイヤボンディング装置
JP7002148B2 (ja) 2018-01-30 2022-01-20 株式会社新川 アクチュエータ及びワイヤボンディング装置
CN111656502B (zh) * 2018-01-30 2023-05-26 株式会社新川 致动器以及打线接合装置

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