JP2005167214A - 磁気記憶装置のフリー層における磁気歪を制御する方法および装置 - Google Patents
磁気記憶装置のフリー層における磁気歪を制御する方法および装置 Download PDFInfo
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 150
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Abstract
【解決手段】 ピン層610,分離層620,フリー層630を有する磁気記憶装置のフリー層に対し,第一層厚t1を有す第一フリー層632と第2層厚t2を有す第2フリー層634を設ける。磁気抵抗比ΔR/Rを変更せずに所望の磁気歪を得るため第一,第2フリー層632,634のターゲット組成物を変更せずに,相対厚さ値を修正することにより,フリー層630の磁気歪を制御する。
【選択図】 図6
Description
110…変換器、
120…アクチュエータ、
130…磁気媒体、
140…データチャンネル、
150…信号処理器、
160…媒体トランスレータ、
170…外部入力/出力(I/O)、
200…記憶システム、
210…スピンドル、
220、410…磁気ディスク、
230…モータコントローラ、
240…アクチュエータアーム、
250、322…サスペンション、
260、320、400…スライダ、
270、410…読取り/書込み磁気ヘッド、
280…モータ、
302、304、306、308…はんだ付接続、
310、312、314、316…リード線、
318…センサ、
420…センタレール、
430、460…サイドレール、
440…クロスレール、
450…スライダの前縁、
470…スライダの後縁、
500…GMRセンサ、
510…基板、
512、514…端部、
516…中央部、
518…フリー層(強磁性自由層)、
520、610…ピン層、
522、620…分離層、
524…反強磁性(AFM)層、
526、528…ハードバイアス層、
550…シード層構造、
530、532…リード、
534…電流源、
540…信号検出器、
600…層構造、
610…ピン層、
630…CoFe/NiFeフリー層、
632…第1フリー層・CoFe層、
634…第2フリー層・NiFe層、
640…t1、
642…t2。
Claims (17)
- ピン層を形成し、前記ピン層を覆う分離層を形成し、第1層厚を有す第1フリー層を形成し、第2層厚を有す第2フリー層を形成し、所望の磁気歪を実現するように前記第1層厚と第2層厚との比を選択することを特徴とする磁気記憶装置のフリー層における磁気歪を制御する方法。
- 前記第1フリー層がCoFeを含み、前記第2フリー層がNiFeを含むことを特徴とする請求項1記載の磁気記憶装置のフリー層における磁気歪を制御する方法。
- 前記分離層が導体層であることを特徴とする請求項1記載の磁気記憶装置のフリー層における磁気歪を制御する方法。
- 前記分離層が絶縁層であることを特徴とする請求項1記載の磁気記憶装置のフリー層における磁気歪を制御する方法。
- ピン層と、前記ピン層を覆う分離層と、前記分離層を覆って形成された第1層厚を有す第1フリー層と、前記第1フリー層を覆って形成された第2層厚を有す第2フリー層とを備えた磁気センサであって、所望の磁気歪を実現するように前記第1層厚と第2層厚との比を選択することを特徴とする磁気センサ。
- 前記第1フリー層がCoFeを含み、前記第2フリー層がNiFeを含むことを特徴とする請求項5記載の磁気センサ。
- 前記分離層が導体層であることを特徴とする請求項5記載の磁気センサ。
- 前記分離層は絶縁層であることを特徴とする請求項5記載の磁気センサ。
- ピン層と前記ピン層を覆って形成された絶縁層と所望の磁気歪を実現するように第1層厚および第2層厚の比が選択された前記絶縁層を覆って形成された第1層厚を有す第1フリー層および前記第1フリー層を覆って形成された第2層厚を有す第2フリー層とを備えた磁気トンネル接合デバイスと、
前記磁気トンネル接合デバイスに連結された電流源と、
前記第1および第2フリー層の磁気配向に基づく前記磁気トンネル接合デバイスを介して電気抵抗を検出するために前記磁気トンネル接合デバイスに連結された磁気抵抗検出器とを備えた磁気トンネル接合センサ。 - 前記第1フリー層がCoFeを含み、前記第2フリー層がNiFeを含むことを特徴とする請求項9記載の磁気トンネル接合センサ。
- 可動磁気記録媒体と、
ピン層と前記ピン層を覆って形成された分離層と所望の磁気歪を実現するように第1層厚および第2層厚の比が選択された前記分離層を覆って形成された第1層厚を有す第1フリー層および前記第1フリー層を覆って形成された第2層厚を有す第2フリー層とを備えた前記可動記録媒体の磁気信号を検知する磁気センサと、
前記第1および第2フリー層の磁気配向に基づき前記磁気センサを介して電気抵抗を検出するために前記磁気センサに連結された磁気抵抗検出器と、
前記媒体に応じて前記センサを移動させるため前記磁気センサに結合されたアクチュエータとを備えた磁気記憶システム。 - 前記第1フリー層がCoFeを含み、前記第2フリー層がNiFeを含むことを特徴とする請求項11記載の磁気記憶システム。
- 所望の磁気歪を実現するように第1層厚および第2層厚の比が選択された第1層厚を有す第1フリー層および前記第1フリー層を覆って形成された第2層厚を有す第2フリー層を含んだ二重フリー層構造と、
磁気モーメントを有す強磁性ピン層構造と、
前記フリー層構造と前記ピン層構造との間に配置された非磁性導電性分離層と、
前記ピン層構造の前記磁気モーメントを固定させる前記ピン層構造に連結した反強磁性ピニング層と、
前記フリー層構造の両側に前記フリー層構造と隣接する関係にある硬質磁気薄膜と、
前記ピニング層構造に隣接するシード層構造とを備えたスピンバルブセンサ。 - 前記第1フリー層がCoFeを含み、前記第2フリー層がNiFeを含むことを特徴とする請求項13記載のスピンバルブセンサ。
- 所望の磁気歪を実現するように第1層厚および第2層厚の比が選択された第1層厚を有す第1フリー層および前記第1フリー層を覆って形成された第2層厚を有す第2フリー層を含んだ二重フリー層構造と、
磁気モーメントを有す自己固定層構造と、
前記フリー層構造と前記自己固定層構造との間に配置された非磁性導電性分離層と、
前記フリー層構造の両側に前記フリー層構造と隣接する関係にある硬質磁気薄膜と、
この固定させる層構造に隣接するシード層構造とを備えたスピンバルブセンサ。 - 前記第1フリー層がCoFeを含み、前記第2フリー層がNiFeを含むことを特徴とする請求項15記載のスピンバルブセンサ。
- 固定された磁気配向を提供する手段と、
磁界を検知する第1層厚を第1手段が有し磁界を検知する第2層厚を第2手段が有すような回転自由な磁化を提供する第1および第2手段を備えた、磁界を検知し固定された磁気配向を提供するために前記手段を覆って配置された二重層の手段と、
前記二重層の手段から磁界を固定させる手段を分離する手段とからなる磁気センサであり、第1層厚および第2層厚の比が所望の磁気歪を実現するように選択された磁気センサ。
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US7323215B2 (en) * | 2004-05-14 | 2008-01-29 | Headway Technologies, Inc. | Free layer design for CPP GMR enhancement |
JP2006245229A (ja) * | 2005-03-02 | 2006-09-14 | Alps Electric Co Ltd | 磁気検出素子及びその製造方法 |
US7848061B2 (en) * | 2006-03-14 | 2010-12-07 | Hitachi Global Storage Technologies Netherlands B.V. | Current perpendicular to plane (CPP) magnetoresistive sensor with back flux guide |
US7564110B2 (en) * | 2006-04-19 | 2009-07-21 | Hitachi Global Storage Technologies Netherlands B.V. | Electrical lapping guides made from tunneling magnetoresistive (TMR) material |
TWI307507B (en) * | 2006-10-20 | 2009-03-11 | Ind Tech Res Inst | Magnetic tunnel junction devices and magnetic random access memory |
KR100834811B1 (ko) * | 2006-11-28 | 2008-06-09 | 고려대학교 산학협력단 | 수직 자기 이방성을 가지는 코발트-철-실리콘-보론/플래티늄 다층박막 |
US9196270B1 (en) | 2006-12-07 | 2015-11-24 | Western Digital (Fremont), Llc | Method for providing a magnetoresistive element having small critical dimensions |
US8316527B2 (en) | 2008-04-01 | 2012-11-27 | Western Digital (Fremont), Llc | Method for providing at least one magnetoresistive device |
US8349195B1 (en) | 2008-06-27 | 2013-01-08 | Western Digital (Fremont), Llc | Method and system for providing a magnetoresistive structure using undercut free mask |
US8218271B2 (en) * | 2009-07-22 | 2012-07-10 | Hitachi Global Storage Technologies Netherlands B.V. | TMR sensor with a multilayered reference layer |
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US7505235B2 (en) | 2009-03-17 |
US20070217088A1 (en) | 2007-09-20 |
CN1617230A (zh) | 2005-05-18 |
US20050099740A1 (en) | 2005-05-12 |
US7230802B2 (en) | 2007-06-12 |
CN100338652C (zh) | 2007-09-19 |
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