JP2005166923A - 電子機器用冷却装置 - Google Patents

電子機器用冷却装置 Download PDF

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Publication number
JP2005166923A
JP2005166923A JP2003403233A JP2003403233A JP2005166923A JP 2005166923 A JP2005166923 A JP 2005166923A JP 2003403233 A JP2003403233 A JP 2003403233A JP 2003403233 A JP2003403233 A JP 2003403233A JP 2005166923 A JP2005166923 A JP 2005166923A
Authority
JP
Japan
Prior art keywords
fan
fins
heat sink
cooling air
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003403233A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005166923A5 (enExample
Inventor
Gouji Kan
剛司 貫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP2003403233A priority Critical patent/JP2005166923A/ja
Priority to PCT/JP2004/017559 priority patent/WO2005055689A1/ja
Publication of JP2005166923A publication Critical patent/JP2005166923A/ja
Publication of JP2005166923A5 publication Critical patent/JP2005166923A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2003403233A 2003-12-02 2003-12-02 電子機器用冷却装置 Pending JP2005166923A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003403233A JP2005166923A (ja) 2003-12-02 2003-12-02 電子機器用冷却装置
PCT/JP2004/017559 WO2005055689A1 (ja) 2003-12-02 2004-11-26 電子機器用冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003403233A JP2005166923A (ja) 2003-12-02 2003-12-02 電子機器用冷却装置

Publications (2)

Publication Number Publication Date
JP2005166923A true JP2005166923A (ja) 2005-06-23
JP2005166923A5 JP2005166923A5 (enExample) 2007-01-18

Family

ID=34650063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003403233A Pending JP2005166923A (ja) 2003-12-02 2003-12-02 電子機器用冷却装置

Country Status (2)

Country Link
JP (1) JP2005166923A (enExample)
WO (1) WO2005055689A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011008983A (ja) * 2009-06-24 2011-01-13 U-Tec Corp イオン発生装置
JP2020057720A (ja) * 2018-10-03 2020-04-09 日産自動車株式会社 冷却装置
JPWO2019107358A1 (ja) * 2017-11-30 2021-01-14 株式会社村田製作所 密閉型電子装置
JP2021048199A (ja) * 2019-09-17 2021-03-25 日立オートモティブシステムズ株式会社 電子制御装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014104040U1 (de) * 2014-08-28 2014-09-29 ELMEKO GmbH + Co. KG Temperiereinrichtung zum Regulieren der Temperatur in einem Raum und Schaltschrank mit einer derartigen Temperiereinrichtung
CN215264351U (zh) * 2021-07-19 2021-12-21 中强光电股份有限公司 散热模块及投影装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183678A (ja) * 1993-12-24 1995-07-21 Nhk Spring Co Ltd ヒートシンク装置
JP2001102508A (ja) * 1999-10-01 2001-04-13 Mitsubishi Electric Corp ヒートシンク装置
JP2002359331A (ja) * 2001-05-15 2002-12-13 Gateway Inc 斜め取付け型ファンシンク

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347779A (ja) * 2002-05-27 2003-12-05 Mitsubishi Electric Corp ヒートシンク装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183678A (ja) * 1993-12-24 1995-07-21 Nhk Spring Co Ltd ヒートシンク装置
JP2001102508A (ja) * 1999-10-01 2001-04-13 Mitsubishi Electric Corp ヒートシンク装置
JP2002359331A (ja) * 2001-05-15 2002-12-13 Gateway Inc 斜め取付け型ファンシンク

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011008983A (ja) * 2009-06-24 2011-01-13 U-Tec Corp イオン発生装置
JPWO2019107358A1 (ja) * 2017-11-30 2021-01-14 株式会社村田製作所 密閉型電子装置
JP2020057720A (ja) * 2018-10-03 2020-04-09 日産自動車株式会社 冷却装置
JP7236235B2 (ja) 2018-10-03 2023-03-09 日産自動車株式会社 冷却装置
JP2021048199A (ja) * 2019-09-17 2021-03-25 日立オートモティブシステムズ株式会社 電子制御装置
JP7245756B2 (ja) 2019-09-17 2023-03-24 日立Astemo株式会社 電子制御装置
US12213279B2 (en) 2019-09-17 2025-01-28 Hitachi Astemo, Ltd. Electronic control device

Also Published As

Publication number Publication date
WO2005055689A1 (ja) 2005-06-16

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