Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
  • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the present invention relates to a forced convection type cooling device for electronic equipment that uses a heat sink and a fan.
• FIG. 4 is an explanatory view showing an example of a conventional general cooling device, in which (a) is a top view and (b) is a side view.
• reference numeral 101 denotes a heat sink closely attached to a heat generating component 102.
• the heat sink 101 has flat fins 103, and a fan 104 is attached near the heat sink 101, and cooling air 105 discharged from the fan 104 flows between the flat fins 103.
• the heat generated from the heat generating component 102 is transmitted to the flat fins 103 of the heat sink 101, and the surface force of the flat fins 103 is also radiated by the cooling air.
• Patent Document 1 JP-A-11 97872
• Patent Document 2 JP-A-10-154889
• the cooling air discharged from the fan is a swirling flow, so that the cooling air hits the fins and generates turbulent flow, so that the cooling air cannot be efficiently guided between the fins.
• the ventilation resistance of the entire heat sink increases, and the flow rate of cooling air from the fan decreases.
• the present invention has been made in view of such a problem, and provides a cooling device capable of improving cooling capacity by efficiently guiding a fan-powered air flow between fins to reduce the size of the device.
• the purpose is.
• the present invention is configured as follows.
• the invention according to claim 1 is a cooling device for a forced convection type electronic device that also has a heat sink and a fan force, wherein the heat sink includes a pin fin and a plate fin, and the fan directs cooling air toward the pin fin force to the plate fin.
• the fan, the pin fins, and the flat plate fins are arranged in series, and the cooling air of the fan is caused to flow in parallel to the heat sink. It is a feature.
• the invention according to claim 3 is characterized in that the fan is disposed above the heat sink, and the cooling air flows vertically downward toward the pin fins.
• the invention according to claim 4 is characterized in that the fan is disposed above the heat sink, and the cooling air flows obliquely downward at a depression angle of 45 ° toward the pin fins.
• the pin fins are arranged in the vicinity of the fan, and the pin fin force allows the cooling air to flow toward the flat plate fins, thereby reducing ventilation resistance and cooling from the fan.
• the cooling capacity can be improved, and the entire cooling device can be downsized.
• the cooling air is blown vertically downward toward the pin fins.
• the flow velocity near the fan and the cooling air can be guided to the pin fin and the base surface of the heat sink, so that the cooling capacity can be further improved.
• FIG. 1 is an explanatory view of a cooling device showing a first embodiment of the present invention, wherein (a) is a top view and (b) is a side view.
• FIG. 2 is an explanatory view of a cooling device showing a second embodiment of the present invention, wherein (a) is a top view and (b) is a side view.
• FIG. 3 is an explanatory view of a cooling device showing a third embodiment of the present invention, where (a) is a top view and (b) is a side view.
• FIG. 4 is an explanatory view of a cooling device showing an example of the prior art, wherein (a) is a top view and (b) is a side view.
• FIG. 1 is an explanatory view of a cooling device showing a first embodiment of the present invention, wherein (a) is a top view and (b) is a side view.
• 1 is a heat sink.
• the heat sink 1 is provided with a pin fin 2 and a plate fin 3 as radiation fins.
• Reference numeral 4 denotes a fan, the ventilation direction of which is the same as the ventilation direction of the heat sink 1, and which is fixed to the vicinity of the pin fin 2.
• 5 is a heating component. The heat generating component 5 is in close contact with the heat sink 1 and transfers heat to the heat sink 1. 6 is a fan 4 force blow Cooling wind coming out.
• the cooling air 6 discharged from the fan 4 is blown to the pin fins 2 and flows between the pin fins.
• the cooling air with a large flow velocity near the fan flows, and the heat is efficiently radiated.
• the cooling air 6 is rectified while passing through the pin fins 2, and the rectified cooling air 6 smoothly flows into the flat plate fins 3.
• the heat transmitted to the heat sink 1 is radiated from the flat fins 3 to the cooling air 6, and the cooling air 6 escapes from the heat sink 1.
• FIG. 2 is an explanatory view of a cooling device according to a second embodiment of the present invention, wherein (a) is a top view and (b) is a side view.
• the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
• the fan 4 is fixed in the vicinity of the tip of the pin fin 2 on the upper part of the heat sink 1, and blows the cooling air 6 vertically downward toward the pin fin 2 and the base surface 7 of the heat sink 1. Therefore, the cooling air having a high flow velocity in the vicinity of the fan 4 flows between the pin fins 2 and on the base surface 7 of the heat sink 1, and the heat is efficiently radiated. Further, the cooling air 6 is rectified while passing through the pin fins 2, and the rectified cooling air 6 smoothly flows into the flat plate fins 3. At this time, the heat transmitted to the heat sink 1 is radiated to the surface force cooling air 6 of the flat plate fin 3, and the cooling air 6 escapes from the heat sink 1!
• FIG. 3 is an explanatory view of a cooling device according to a third embodiment of the present invention, wherein (a) is a top view and (b) is a side view. Components common to the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted.
• the fan 4 is fixed at an oblique angle of 45 ° in the vicinity of the tip of the pin fin 2 above the heat sink 1, and one of the pin fins 2 is higher and the other is lower according to the inclination of the fan 4.
• the fan 4 blows the cooling air 6 downward toward the pin fins 2 and the base surface 7 of the heat sink 1 at a 45 ° depression angle. Therefore, the cooling air 6 having a large flow velocity in the immediate vicinity of the fan 4 flows between the pin fins 2 and on the base surface 7 of the heat sink 1, and heat is efficiently radiated.
• the cooling air 6 is rectified while passing through the pin fins 2, and the rectified cooling air 6 smoothly flows into the flat fins 3. At this time, the heat transmitted to the heat sink 1 is The heat is radiated by the cooling air 6, and the cooling air 6 escapes from the heat sink 1.
• the present invention is applied to a cooling device for electronic devices of a forced convection type in which a heat sink and a fan force are provided, and the cooling capacity can be improved by effectively utilizing the cooling air from the fan, thereby reducing the size of the entire cooling device
• the present invention can be used in the field of manufacturing and providing a cooling device for electronic equipment that can be used.

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• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)

Applications Claiming Priority (2)

Publications (1)

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Cited By (2)

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Citations (3)

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• 2003
  • 2003-12-02 JP JP2003403233A patent/JP2005166923A/ja active Pending
• 2004
  • 2004-11-26 WO PCT/JP2004/017559 patent/WO2005055689A1/ja not_active Ceased

Patent Citations (3)

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